检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

29 篇 会议
4 篇 期刊文献

馆藏范围

33 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

25 篇 工学
- 13 篇 电气工程
- 9 篇 材料科学与工程（可...
- 8 篇 电子科学与技术（可...
- 5 篇 计算机科学与技术...
- 3 篇 化学工程与技术
- 2 篇 仪器科学与技术
- 2 篇 信息与通信工程
- 1 篇 力学（可授工学、理...
- 1 篇 机械工程
- 1 篇 光学工程
- 1 篇 动力工程及工程热...
- 1 篇 控制科学与工程
- 1 篇 土木工程
- 1 篇 石油与天然气工程
- 1 篇 环境科学与工程（可...
- 1 篇 生物工程
16 篇 理学
- 14 篇 物理学
- 4 篇 化学
- 2 篇 生物学
- 1 篇 数学
1 篇 管理学
- 1 篇 管理科学与工程(可...

主题

5 篇 optical device f...
3 篇 microelectronics
3 篇 silicon
3 篇 accuracy
3 篇 cmos technology
2 篇 optical fiber ca...
2 篇 wafer bonding
2 篇 diodes
2 篇 nanostructures
2 篇 optical polymers
2 篇 nanotechnology
2 篇 optical waveguid...
2 篇 assembly
1 篇 bottom-cd
1 篇 radio signals mi...
1 篇 optical material...
1 篇 removal rate
1 篇 reliability
1 篇 slurries
1 篇 etching

机构

1 篇 bauman moscow st...
1 篇 institute of mic...
1 篇 fairchild korea ...
1 篇 network for comp...
1 篇 1center for micr...
1 篇 beijing inst tec...
1 篇 univ cambridge c...
1 篇 fairchild korea ...
1 篇 microelectronic ...
1 篇 ibm tj watson re...
1 篇 xi'an exa techno...
1 篇 univ tun hussein...
1 篇 aerospace inform...
1 篇 xi'an jiaotong u...
1 篇 department of mi...
1 篇 department of el...
1 篇 ibm t.j. watson ...
1 篇 ibm bromont brom...
1 篇 ibm research - t...
1 篇 rti internationa...

作者

2 篇 song cs
1 篇 tang lei
1 篇 arnold wh
1 篇 tymon barwicz
1 篇 boyer nicolas
1 篇 jin zhi
1 篇 renjie gu
1 篇 zhu rongzhen
1 篇 tsvetkov yury
1 篇 lueck matthew
1 篇 soon chin fhong
1 篇 m. luisier
1 篇 sebastian engelm...
1 篇 date s.
1 篇 park j.s.
1 篇 lyshevski sergey...
1 篇 lee sh
1 篇 faraone lorenzo
1 篇 h. thurman hende...
1 篇 shashurin vasily

语言

33 篇 英文

检索条件"任意字段=Conference on Advances in Microelectronic Device Technology"

共 33 条记录，以下是1-10 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Study on the Field-effect Carrier Transport of Epitaxial Graphene on SiC 1

Study on the Field-effect Carrier Transport of Epitaxial Gra...

引用

2022 1st International conference on advances in Modern Physics Sciences and Engineering technology, ICPSET 2022

作者： Cao, Jiaji Wei, Shuhua Jin, Zhi Peng, Songang Zhang, Jing Chen, Xiufang Institute of Microelectronic Chinese Academy of Sciences Beijing100029 China North China Universitys of Technology Beijing100144 China Shan-dong University Jinan250100 China

We have studied the field-effect carrier transport of graphene on 4H silicon carbide substrate. In order to extract the electrical parameters, the top-gated field effect transistor has been fabricated. By fitting the measured results with Kim's model, the field effect carrier mobility (μ) and the metal/graphene contact resistance (Rc) and the residual carrier concentration (n0) are derived to be 3382cm2/Vs, 2250ωμm and 2.18×1013cm-2, respectively. It is noted that the large contact resistance did not affect the high field effect carrier mobility of our device. The high carrier mobility suggests that the SiC epitaxial graphene may be quite suitable for the future high speed electronic applications. © Published under licence by IOP Publishing Ltd.

关键词： Carrier mobility

来源：评论

学校读者我要写书评

暂无评论

A Latency-Aware Garbage Collection Strategy

A Latency-Aware Garbage Collection Strategy

引用

2022 IEEE International conference on advances in Electrical Engineering and Computer Applications, AEECA 2022

作者： Zhu, Rongzhen Lei, Tong Bai, Pengpeng Cai, Zhihang Wu, Weiguo Tang, Lei Xi'An Microelectronic Technology Institute Xi'an China Xi'An Jiaotong University School of Computer Science and Technology Xi'an China Xi'An EXA Technology Co. Ltd. Xi'an China

ISBN: (数字)9781665480901

ISBN: (纸本)9781665480901

Due to the erase-before-write feature of NAND flash memory, Solid-State Drive (SSD) performs out-of-place update to reduce write latency. However, the invalid pages caused by update request require periodic garbage collection (GC) operations, which interferes with normal user I/O and induces the long-tail latency issue. In addition, high-density flash memory that stores multiple bits in a cell is proposed by flash memory manufacturers to increase the capacity of SSD. Due to the physical structure of flash memory cells, the word-line of high-density flash memory consists of multiple physical pages with different performance and reliability. The chip test results show that the I/O latency of MSB pages is several times than that of LSB pages. The existing GC optimization strategy doesn't take into account the impact of the target page type in the GC procedure. A basic optimization idea is to migrate valid pages to high-performance LSB pages during the GC procedure to alleviate the long-tail latency problem. However, unrestrained usage of LSB pages can lead to problems such as wasted flash pages. We propose a latency-aware garbage collection strategy for multi-bit NAND flash memory. By monitoring the device queue depth and dynamically adjusting the page type allocated by GC tasks, it can effectively reduce the impact of GC on the overall performance of SSD. The experimental results show that the proposed algorithm reduces the average response time of read requests by 10.9% and the average response time of write requests by 15.8%, respectively. The proposed algorithm can significantly improve the I/O performance of SSD © 2022 IEEE.

关键词： NAND circuits

来源：评论

学校读者我要写书评

暂无评论

A FPGA Embedded DSP Supporting Parallel Multiple Low Bit-Width Multiply-Accumulate Operations 10

A FPGA Embedded DSP Supporting Parallel Multiple Low Bit-Wid...

引用

10th International conference on Industrial Engineering and Applications, ICIEA 2023

作者： Wang, Miao Huang, Zhihong Cai, Gang Wang, Junxuan School of Communications and Information Engineering Xi'an University of Posts and Telecommunications Xi'an710121 China Aerospace Information Research Institute Chinese Academy of Sciences Ehiway Microelectronic Science and Technology Co.Ltd. Beijing100094 China

ISBN: (纸本)9781643684086

With the continuous development of big data and hardware computing platforms, deep learning has been substantially applied in many intelligent scenarios. Recent studies have shown that using low bit-width networks in deep learning inference can effectively improve the overall performance of accelerator by reducing the computational ability requirements while maintaining the recognition accuracy of accelerator. Among them, low bit-width convolutional operations such as 8bit and 4bit are widely used in applications such as graph recognition. FPGA chip is the core key device of digital system, due to the excellent reconfigurability of FPGA, it has become one of the mainstream platforms in the field of deep learning accelerator. The current mainstream FPGAs are composed of higher bit-width multipliers due to the need to adapt to different computing application requirements, and the DSP module resources are used to perform low bit-width convolutional operations, which only occupy part of the multiplier bit-width, thus wasting a large amount of hardware on chip resources. Therefore, this paper proposes a DSP architecture of using large bit-width multipliers to compute low bit-width multiplications in parallel, so that the new DSP can realize double 8bit and 4bit multiply-accumulate operations without adding multipliers, and can support any combination of signed and unsigned data operations. The design is based on the commercial Stratix IV DSP architecture, and the overall circuit is designed with SMIC 14nm standard CMOS process. The experimental results show that when calculating the same number of 4-bit and 8-bit multiply-accumulate operations, the resource consumption area of the improved DSP is reduced by 43.5% and the speed is increased by 48%. © 2023 The authors and IOS Press.

关键词： Field programmable gate arrays (FPGA)

来源：评论

学校读者我要写书评

暂无评论

microelectronics devices Optimal Design Methodology with Regard to Technological and Operation Factors 20th

Microelectronics Devices Optimal Design Methodology with Reg...

引用

20th Annual International Scientific conference on Energy Management of Municipal Facilities and Sustainable Energy Technologies (EMMFT)

作者： Meshkov, Sergey Makeev, Mstislav Shashurin, Vasily Tsvetkov, Yury Khlopov, Boris Bauman Moscow State Tech Univ Moscow 105005 Russia

ISBN: (纸本)9783030197568;9783030197551

microelectronic devices are the basis of sensor devices used to measure temperature, humidity, pressure, movement or acceleration, light, chemical elements concentration, etc. The aim of this work is to create a methodology of microelectronic devices integrated design, which, with the use of the existing group production technology, will achieve the optimal linkage of the main device quality indicators (target values, mass-availability) under given production conditions and reliability under given operating conditions and given restrictions on device purpose indicators. An additional stage of design and technological optimization, which receives the device design parameters from the circuit and engineering design stages, data on their technological errors from the technological production preparation stage and data on the kinetic of design parameters and purpose indicators of the device under given operating conditions, can be introduced into the traditional design scheme to solve the assigned task. As a result of the optimization, corrections for the device nominal design parameters maximizing the objective function are determined. The probability of device purpose indicators destination within the imposed limits or the probability of performing the specified functions during the operation time are used as the objective function. The proposed methodology is illustrated by the example of microelectronic SHF radio signals mixer and rectifier with a resonant-tunneling diode as a nonlinear element.

关键词： microelectronics device Key quality indicator Design and technological optimization Technological errors Degradation Reliability Radio signals mixer Rectifier Resonant-tunneling diode

来源：评论

学校读者我要写书评

暂无评论

Imaging sub-surface defects in power electronic modules using shear-force microscopy 70

Imaging sub-surface defects in power electronic modules usin...

引用

70th IEEE Electronic Components and technology conference (ECTC)

作者： Venkatesh, Vijay Joshi, Shailesh N. Sundaresan, Vishnu Baba Ohio State Univ Mech & Aerosp Engn Columbus OH 43210 USA Toyota Res Inst North Amer Ann Arbor MI USA

ISBN: (纸本)9781728161808

Recent advances in non-destructive evaluation (NDE) techniques have enhanced our understanding of failure mechanisms in power electronic systems. In this proceedings article, we demonstrate shear-force microscopy as a technique to map sub-surface voids in an electronic Si die soldered to a thermal sink. The proposed technique utilizes two piezoelectric wafers (dither and receiver) fitted to a scanning probe to monitor structural health of a substrate. The dither imparts high-frequency ultrasonic waves to a thin film of dielectric layer above the electronic device while the receiver detects attenuated reflected waves from the semiconductor device. The depth of penetration of ultrasonic waves in the device is controlled by varying the actuation frequency and input voltage to the dither. Presence of localized damages within the device affect mechanical boundary conditions of the vibrating probe which consequently manifests as a change in slope of the shear-force approach curve over the device. A shear-force regulated constant distance point scan is performed over a 1 mm(2) area of the electronic device, and the slope of the approach curve at each point is used as a metric to trace the contour of the void between the Si die and solder layer. The contour of the damage mapped using a grid scan bears close resemblance to that reproduced using a confocal scanning acoustic microscope. We expect that this technique can be scaled up to a NDE technique in which a spatially distributed array of piezoelectric actuation elements are kept in close proximity to the microelectronic device and separated by a dielectric gel. The shear force signature between the piezoelectric actuation elements and the surface can precisely detect structural problems during testing of accelerated aging and aggressive thermal cycling of power electronic devices.

关键词： shear-force power electronic device sub-surface imaging

来源：评论

学校读者我要写书评

暂无评论

Recent advances in IR imaging focal plane arrays technology at UWA

Recent advances in IR imaging focal plane arrays technology ...

引用

conference on Optoelectronic and microelectronic Materials and devices (COMMAD) Held Jointly with the 23rd Australian-Institute-of-Physics Congress, the Australian-Optical-Society conference and the 43rd Australian Conf on Optics and Fibre technology

作者： Gu, Renjie Kala, Hemendra Antoszewski, Jarek Umana-Membreno, Gilberto Dehdashtiakhavan, Nima Madni, Imtiaz Faraone, Lorenzo Univ Western Australia Dept EE&C Engn Perth WA 6009 Australia

ISBN: (纸本)9781538695241

Research and development of semiconducting HgCdTe material and devices commenced in 1959 [1]. Due to its outstanding natural properties, such as tuneable band gap and high quantum efficiency, HgCdTe has dominated the high performance end of the infrared detector market for decades. In this paper, we present recent advances in the material growth and device fabrication of HgCdTe infrared imaging focal plane arrays (IRFPAs) at The University of Western Australia (UWA). Also presented are some of the major achievements and future outlook.

关键词： Cadmium alloys

来源：评论

学校读者我要写书评

暂无评论

advances in thermal laser separation: process monitoring in a kerf-free laser-based cutting technology to ensure high yield 10

Advances in thermal laser separation: process monitoring in ...

引用

10th CIRP conference on Photonic Technologies (LANE)

作者： Barreto, Mercedes Cerezuela Roeder, Georg Steinhoff, Maximilian Schellenberger, Martin Bauer, Anton Fraunhofer Inst Integrated Syst & Device Technol Schottkystr 10 D-91058 Erlangen Germany

Thermal Laser Separation (TLS) is an ablation free and therefore kerf free laser based cutting technology. This novel dicing technology is utilized to separate microelectronic devices on semiconductor wafers. In order to broaden the use of TLS method towards smaller chips and new materials on the one side and towards an advanced process monitoring on the other side, a novel contact-free measuring method for monitoring the TLS process has been developed. This new method is based on heating the semiconductor wafer with a near-infrared (NIR) laser and analyzing the subsequent temperature gradients induced by heat diffusion with contact-less temperature measurement. Thus, the TLS-crack can be detected due to its isolating effect to heat flux. The feasibility of the method is presented and the influence of parameters like sample size, distance to the TLS-crack and the laser setup in the measurements is reported. (C) 2018 The Authors. Published by Elsevier Ltd.

关键词： Therma Laser Separation Laser dicing kerf-free laser-cutting technology process monitoring cut detection

来源：评论

学校读者我要写书评

暂无评论

Recent advances in IR imaging focal plane arrays technology at UWA

Recent advances in IR imaging focal plane arrays technology ...

引用

conference on Optoelectronic and microelectronic Materials and devices

作者： Renjie Gu Hemendra Kala Jarek Antoszewski Gilberto Umana-Membreno Nima Dehdashtiakhavan Imtiaz Madni Lorenzo Faraone Department of EE&C Engineering The University of Western Australia Perth WA Australia

ISBN: (纸本)9781538695258;9781538695241

Research and development of semiconducting HgCdTe material and devices commenced in 1959. Due to its outstanding natural properties, such as tuneable band gap and high quantum efficiency, HgCdTe has dominated the high performance end of the infrared detector market for decades. In this paper, we present recent advances in the material growth and device fabrication of HgCdTe infrared imaging focal plane arrays (IRFPAs) at The University of Western Australia (UWA). Also presented are some of the major achievements and future outlook.

关键词： II-VI semiconductor materials Cadmium compounds Australia Imaging Detectors Molecular beam epitaxial growth Fabrication

来源：评论

学校读者我要写书评

暂无评论

Development of a Microfluidic device System Using Adhesive Vinyl Template to Produce Calcium Alginate Microbeads for Microencapsulation of Cells 15th

Development of a Microfluidic Device System Using Adhesive V...

引用

15th International conference on Global Research and Education (Inter-Academia)

作者： Soon, Chin Fhong Yap, Hiung Yin Ahmad, Mohd Khairul Tee, Kian Sek Gan, Siew Hwa Univ Tun Hussein Onn Malaysia Fac Elect & Elect Engn Batu Pahat 83000 Johor Mexico Univ Tun Hussein Onn Malaysia MiNT SRC Biosensor & Bioengn Lab Batu Pahat 83000 Johor Mexico Univ Sains Malaysia Sch Med Sci Kubang Kerian Kelantan Malaysia

ISBN: (纸本)9783319464909;9783319464893

Microfabrication technique based on microelectronic technology is commonly used to produce microfluidic devices but this technique involves with costly and toxic chemicals. In this paper, we proposed the use of patterned adhesive vinyl template to produce a poly-dimethylsiloxane (PDMS) microfluidic device that was applied to generate microbeads of calcium alginate for microencapsulation of cells. In the microfluidic system, an infusion pump of high flow rate (2000 mu l/min) and a commercial syringe pump were used to emulsify the continuous and disperse phases of liquids in forming the microbeads. Microbeads of calcium alginate in the range of 438 +/- 38-799 +/- 20 mu m were successfully produced using this environmental friendly technique.

关键词： Microfluidic Vinyl adhesive template Infusion system Calcium alginate Microbeads

来源：评论

学校读者我要写书评

暂无评论

Assembly of Mechanically Compliant Interfaces between Optical Fibers and Nanophotonic Chips 64

Assembly of Mechanically Compliant Interfaces between Optica...

引用

IEEE 64th Electronic Components and technology conference (ECTC)

作者： Barwicz, Tymon Taira, Yoichi Numata, Hidetoshi Boyer, Nicolas Harel, Stephane Kamlapurkar, Swetha Takenobu, Shotaro Laflamme, Simon Engelmann, Sebastian Vlasov, Yurii Fortier, Paul IBM TJ Watson Res Ctr Yorktown Hts NY 10598 USA IBM Res Tokyo Saiwai Ku Kawasaki Kanagawa 2120032 Japan IBM Bromont Bromont PQ J2L 1A3 Canada Asahi Glass Co Ltd AGC Elect Div Gen Technol Kanagawa Ku Yokohama Kanagawa 2218755 Japan

ISBN: (纸本)9781479924073

Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by the difficulty of cost efficient optical inputs and outputs. To address this challenge, we have recently proposed a low- cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. Our concept promises better mechanical reliability and better optical performance than existing technology. To manage the cost of assembly, we show here that self- alignment features can be effectively used to bridge the gap between the accuracy required by single-mode optics (1-2 um) and the capability of high-throughput microelectronic assembly equipment (similar to 10 um). We describe the complaint interface, the assembly strategy, and the design of our re-alignment features. We demonstrate experimentally that misalignments at assembly as large as +/- 10 um are re-aligned by our self-alignment structures to +/- 1 to 2 um. Our approach enables existing microelectronics equipment to be used for single-mode optics assembly.

关键词： Accuracy Assembly Optical device fabrication Optical fiber cables Optical polymers Optical waveguides

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共4页 << < 1 2 3 4 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：