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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1413 条 记 录,以下是1-10 订阅
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SMACD / PRIME 2021 - International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design and 16th conference on PhD Research in microelectronics and Electronics
SMACD / PRIME 2021 - International Conference on Synthesis, ...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on F...
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Fully-Coupled Transient modeling of Highly Miniaturized Electrostatic Pull-In Driven Micropumps  24
Fully-Coupled Transient Modeling of Highly Miniaturized Elec...
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24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Hoelzl, Wolfgang Seidl, Martin Schrag, Gabriele Tech Univ Munich Munich Germany
We present a problem-adapted finite element model, which enables the design of a novel type of a MEMS membrane pump as well as the investigation and the optimization of its operation, which heavily relies on the elect... 详细信息
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modeling I-MOS Capacitor C-V Characteristic for Non-Linear Charge Sensitive Amplifiers  19
Modeling I-MOS Capacitor C-V Characteristic for Non-Linear C...
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19th conference on Ph.D Research in microelectronics and Electronics (PRIME)
作者: Giroletti, Simone Shojaei, Fatemeh Manghisoni, Massimo Ratti, Lodovico Vacchi, Carla Univ Pavia Dept Elect Comp & Biomed Engn Pavia Italy Univ Bergamo Dept Engn & Appl Sci Daimine Italy INFN Pavia Pavia Italy
An analytic model for the C-V characteristic of Inversion-Mode MOS (I-MOS) capacitors is defined, to be used in the design of Charge Sensitive Amplifiers (CSAs) with dynamic signal compression feature. The model is de... 详细信息
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A simple modeling of ferroelectric actuator based on phenomenological model  24
A simple modeling of ferroelectric actuator based on phenome...
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24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Nguyen, B. H. Zunic, M. Torri, G. B. Rochus, V. IMEC Sensor & Actuator Technol Dept B-3001 Leuven Belgium
This paper proposes a simplified phenomenological macroscopic model of a nonlinear ferroelectric actuator. The key ingredient of the proposed model is based on the assumption of direct relation between the irreversibl... 详细信息
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2-D Axisymmetric modeling of Circular PCB Coils and Solenoids in COMSOL Multiphysics  5
2-D Axisymmetric Modeling of Circular PCB Coils and Solenoid...
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5th Iranian International conference on microelectronics (IICM)
作者: Gozalpour, Farshad Yavari, Mohammad Amirkabir Univ Technol Dept Elect Engn Integrated Circuits Design Lab Tehran Polytech PO 15875-4413 Tehran 15914 Iran
In this paper, a 2-dimentional (2-D) axisymmetric modeling is presented for biomedical circular printed circuit board (PCB) coils and solenoids in COMSOL Multiphysics. With this model, the number of required meshes in... 详细信息
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Arithmetic Calculus modeling for Approximate Circuits
Arithmetic Calculus Modeling for Approximate Circuits
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2024 International conference on microelectronics, ICM 2024
作者: Aoun, Alain Masadeh, Mahmoud Hasan, Osman Tahar, Sofiene Concordia University Department of Electrical and Computer Engineering MontrealQC Canada Yarmouk University Computer Engineering Department Irbid Jordan National University of Sciences & Technology Department of Electrical Engineering Islamabad Pakistan
Approximate computing (AC) is a paradigm that introduces errors for reduced design metrics. AC has been recommended for implementation in error-resilient applications. Previously proposed AC implementations can be mod... 详细信息
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AI-assisted design for Reliability: Review and Perspectives  25
AI-assisted Design for Reliability: Review and Perspectives
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25th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024
作者: Yuan, Cadmus De Jong, S.D.M. Van Driel, Willem D. Department of Mechanical and Computer-aided Engineering Feng Chia University Taichung Taiwan No. 100 Wenhwa Rd. Seatwen Taichung40724 Taiwan Department of Microelectronics Delft University of Technology Delft Netherlands Mekelweg 4 CD Delft2628 Netherlands
The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this ... 详细信息
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Thermal Reliability simulation Analysis of Planar Microsystem  9
Thermal Reliability Simulation Analysis of Planar Microsyste...
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9th International conference on Integrated Circuits and Microsystems, ICICM 2024
作者: Sun, Shikai Chen, Lei Lu, Zhenlin Zhao, Xuan Liu, Lili Ren, Yongzheng School of Integrated Circuits Peking University Beijing Microelectronics Technology Institute Beijing China Beijing Microelectronics Technology Institute Beijing China
As a typical representative technological route of chip technology, microsystems have gradually become one of the main solutions for the small-volume, speciality applications. Heat is the main limitation of the micros... 详细信息
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Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process modeling Techniques and Viscoelasticity Theory  24
Studying Asymmetric Warpage Behavior of Panel-Level Packages...
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24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Shu, Z. Chiang, K. N. Adv Microsyst Packaging & Nanomech Res Lab Hsinchu Taiwan Natl Tsing Hua Univ Dept Power Mech Engn Hsinchu 300 Taiwan
Panel Level Packaging (PLP) is an integrated circuit (IC) packaging technology that is mainly used in fields such as mobile communications, consumer electronics, and industrial automation. Compared to wafer-level pack... 详细信息
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modeling and Parameter Extraction of Semiconductor Devices for simulation and design Optimization of ESD Protection Circuits on BCD Technologies for Automobile and Industry Applications  17
Modeling and Parameter Extraction of Semiconductor Devices f...
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17th IEEE International conference on Solid-State and Integrated Circuit Technology, ICSICT 2024
作者: Cheng, Yuhua Yu, Wei-Wei Worley, Eugene Shanghai Research Institute of Microelectronics Peking University Shanghai China Silicon Crossing LLC IrvineCA92620 United States
In this paper, modeling and parameter extraction of semiconductor devices for simulation and design optimization of ESD protection circuits on BCD technologies were discussed. Concepts on developing optimal and advanc... 详细信息
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