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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1418 条记录，以下是1-10 订阅

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SMACD / PRIME 2021 - International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design and 16th conference on PhD Research in microelectronics and Electronics

SMACD / PRIME 2021 - International Conference on Synthesis, ...

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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021

ISBN: (纸本)9783800755899

The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on FPGA;extending a RISC-V core with an AES hardware accelerator to meet IOT constraints;memristive logic-in-memory implementations: a comparison;a low-noise high-speed comparator for a 12-bit 200-MSps SAR ADC in a 28-nm CMOS process;A 2GS/s 10-bit time-interleaved capacitive DAC for self-interference-cancellation application;implementation of a low power decimation filter in a 180 nm HV-CMOS technology for a neural recording front-end;and analog baseband filter and variable-gain amplifier for automotive radars in 22 nm FD-SOI CMOS.

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modeling of FE Parasitic Inductance in BCD Power Switches

Modeling of FE Parasitic Inductance in BCD Power Switches

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Ștefan Ardeleanu Ioan Marius Purcar Cristian Boianceanu Electrotechnics and Measurements Department Technical University of Cluj-Napoca Cluj-Napoca Romania Design Enabling Services Infineon Technologies Romania Bucharest Romania

This paper proposes a calculation methodology for assessing the parasitic inductance within an IC package. As a case study, the BCD technology of one of the top IC suppliers was used. The results will be evaluated aga... 详细信息

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

关键词： Micromechanical devices Inductance Metallization Conductors Reliability engineering Software Finite element analysis microelectronics Transistors Optimization

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TCAD simulation of Radiation Effects on 180 nm Logic Inverters

TCAD Simulation of Radiation Effects on 180 nm Logic Inverte...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Eike Trumann Amen Allah Bahri Gia Bao Thieu Kirsten Weide-Zaage Dorian Von Wolff Andre Bausen Alexander Müller Guillermo Payá-Vayá Chair for Chip Design for Embedded Computing Technische Universität Braunschweig Braunschweig Germany RESRI Group Institute of Microelectronic Systems (IMS) Leibniz Universität Hannover Hannover Germany Bundeswehr Research Institute for Protective Technologies and CBRN Protection (WIS) Munster Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

This work presents a physically based simulation evaluation of the effects of single ionizing particles and displacement damage on logic inverter gates in a complementary metal-oxide semiconductor (CMOS) with 180 nm structure size. A technology computer-aided-design (TCAD) model is combined with a radiation model to allow the simulation of charged particles with a linear energy transfer (LET) between 1 and 100 $\frac{M e V \cdot c m^simulation}{m g}$ . For displacement damage simulation, proton energies between 1 and 10 MeV and neutron energies between 1.6 and 14 MeV have been evaluated to estimate the resulting transistor threshold voltages.

关键词： Semiconductor device modeling Protons Micromechanical devices Neutrons Pulse inverters Threshold voltage microelectronics Transistors Periodic structures MOS devices

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Reduced-Order Modelling for Efficient Chip-Package-Board design

Reduced-Order Modelling for Efficient Chip-Package-Board Des...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Chengdong Yuan Sönke Maeter Simon Kuttler Olaf Wittler Tamara Bechtold Jade University of Applied Sciences Wilhelmshaven Germany Cadfem GmbH Munich Germany Fraunhofer IZM Berlin Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

In the development cycle of microelectronic components and systems, comprehensive reliability assessments of the products in the virtual environment save the costs of manufacturing prototypes. In this simulation process, component manufacturers need to share component models with other partners along the value chain while at the same time safeguarding their intellectual property. Therefore, in this work, model order reduction methods are implemented to generate highly accurate compact models, which hide the details of the product, such as material properties and geometry. For system manufacturers, that integrate different components on a printed circuit board, these compact models can be re-integrated into their models for virtual reliability tests via the superelement techniques.

关键词： Micromechanical devices Printed circuits Virtual environments Prototypes Intellectual property microelectronics Manufacturing Integrated circuit modeling Integrated circuit reliability Material properties

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Physics-Based Compact modeling of an Ultrasonic Modulation MEMS Speaker Concept

Physics-Based Compact Modeling of an Ultrasonic Modulation M...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Christian Görner Tenorio Andreas Bogner Christian Bretthauer Heinrich Heiss Gabriele Schrag Infineon Technologies AG Neubiberg Germany Professorship of Microsensors and Actuators Technical University of Munich Munich Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Conventional microelectromechanical systems (MEMS) speakers suffer from low sound pressure in low frequency bands due to their limited range of motion in the low $\mu \mathrm{m}$ -scale. By adding pressure strokes in the ultrasonic (US) range and applying modulation and demodulation techniques high sound pressure in the low frequency bands is achieved. A physics-based lumped element model (LEM) of such an ultrasonic modulation (UM) speaker concept with dimensions getting close to the wavelength is presented. The model is successfully validated against finite element method (FEM) simulations of the respective components. Applying the LEM, the computational costs can be drastically decreased, which lays the foundation for proper system-level design. Exemplary results of design studies obtained by the LEM, such as the specific $1 / f$ -characteristic of an UM speaker simulated with a harmonic balance analysis, are presented.

关键词： Micromechanical devices Frequency modulation Computational modeling Harmonic analysis Acoustics Finite element analysis Computational efficiency Integrated circuit modeling System-level design Demodulation

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Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solder Balls

Nonlinear Superelement for the Reliability Assessment of Vis...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Mike Feuchter Hanna Baumgartl Martin Hanke Sven Rzepka CADFEM Germany GmbH Germany CADFEM Germany GmbH Berlin Germany Fraunhofer ENAS Chemnitz Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

The paper proposes a novel approach to the modeling of the thermo-mechanical behavior of ball grid array (BGA) packages on printed circuit boards in the metal housing of electronic control units, which is needed for optimizing the design for reliability. The new approach reduces the computational effort significantly without compromising the result accuracy. The method is based on a modular system of reduced-order models (ROMs). Specifically, the energy-conserving sampling and weighting method (ECSW) for capturing complex material behavior is discussed as a key enabler. After introducing the method for a single solder ball, it is extended to the representation of all solder balls of the BGA by the same ROM in order to enable its application for practical cases. The results obtained with this 'Combined ROM' are compared with those of regular FEA in terms of accuracy and computational effort.

关键词： Micromechanical devices Accuracy Thermomechanical processes Printed circuits Metals Reliability engineering Reduced order systems microelectronics Integrated circuit reliability Read only memory

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Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions

Physics-of-Failure based Lifetime Prediction for Power Elect...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Albrecht Jain Horn Tobias Daniel Leonhard Hertenstein Rzepka Sven Fraunhofer ENAS Technologie Chemnitz Zentrum für Mikrotechnologien Technische Universität Chemnitz Chemnitz Germany Mercedes-Benz AG Boeblingen Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

This study emphasizes the use of experimental and simulation methodologies to analyze the thermo-mechanical reliability of electronic components used in power electronics, particularly focusing on the Infineon 1200 V SiC halfbridge module under WLTP (Worldwide Harmonized Light Vehicles Test Procedure) driving cycle conditions. The paper highlights the discrepancies in traditional design studies which often overlook the interaction of load sequences during a component's lifetime. By employing a computational efficient approach that includes coupled simulations and validated lifetime models, the study provides a more realistic assessment of component degradation, which is crucial for ensuring the reliability of power modules in variable operational conditions. The results of the study validate the computational models against experimental data and demonstrate the potential for using these methods in future design for Reliability studies based on mission profiles, as well as providing a basis for the development of surrogate models towards a digital twin representation.

关键词： Analytical models Computational modeling Thermomechanical processes Multichip modules Predictive models Power electronics Data models Transient analysis Stress Load modeling

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Multi-Scale Electrothermal Co-simulation of GaN HEMTs at the Device and Packaging Levels

Multi-Scale Electrothermal Co-Simulation of GaN HEMTs at the...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Yi Zhang Ziyue Zhang Yuchao Wu Zhiying Chen Dong Lu Ke Xue Renjie Wang Smart Manufacturing Thrust HKUST(GZ) Guangzhou China Microelectronics Thrust HKUST(GZ) Guangzhou China College of Future Technology HKUST(GZ) Guangzhou China

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Gallium Nitride High Electron Mobility Transistors (GaN HEMTs) are critical for high-power and high-frequency applications but face challenges from self-heating and inadequate thermal management, which degrade performance and reliability. Existing tools like Technology Computer Aided design (TCAD) and finite element analysis (FEA) lack integrated electrothermal coupling capabilities. This study proposes a multi-scale electrothermal co-simulation framework to bridge device-level electrical behavior and packaging-level thermal dynamics. The methodology integrates 2D TCAD simulations for localized Joule heating in the two-dimensional electron gas (2DEG) region with 3D FEA modeling to evaluate heat dissipation across packaging structures. An iterative loop couples the electrical power density from TCAD into FEA as averaged heat sources, updating boundary conditions until thermal convergence is achieved. Key innovations include a deep neural network (DNN) to resolve highly localized heat distributions from TCAD data and an equivalent thermal conductivity model for computational efficiency. The multi-scale approach successfully captured electrothermal interactions, enabling optimized packaging designs and material adjustments to balance heat generation and power efficiency. This work demonstrates the necessity of a coupled simulation for accurate performance prediction and thermal management in GaN HEMTs, offering a pathway to enhance reliability in high-power applications.

关键词： Heating systems Performance evaluation Temperature distribution Solid modeling HEMTs Packaging Electronic packaging thermal management Thermal management MODFETs Gallium nitride

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Investigation of Methods for Expanding the Application of Integration Neural Network and Their Appropriate Structures

Investigation of Methods for Expanding the Application of In...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Yoshiharu Iwata Hidefumi Wakamtsu Osaka University Graduate School of Eng. Osaka Japan

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

simulation-based optimization is increasingly used in the thermal design of power devices. However, using highly accurate simulations such as FEM often takes too much time and makes sufficient optimization difficult. Therefore, surrogate model construction, which reduces the simulation time, is attracting attention. To address this problem, we focused on integration neural networks (INNs), which can construct highly accurate surrogate models with a small amount of training data by integrating deductive and inductive models. However, existing INNs cannot be applied as deductive models; they are only models that can be expressed by multiple regression analysis. Therefore, we extended the functionality of INNs to a model that can multiply and divide polynomial equations. As a result, we were able to construct a model with a coefficient of determination of 0.98 for the FEM simulation model.

关键词： Analytical models Thermal expansion Accuracy Neural networks Mathematical models Data models Finite element analysis Thermal analysis Regression analysis Integrated circuit modeling

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modeling and simulation of Cmut and Pmut Ultrasound Transducers and Package Using a Multiphysics Approach

Modeling and Simulation of Cmut and Pmut Ultrasound Transduc...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Nilavazhagan Subbiah Jash Banker Soundara Pandian Mohanraj Braig Dominik Erhard Landgraf Sebastian Pregl Bassou Khouya Alexandre Halbach Andrew Tweedie Infineon Technologies AG Infineon Technologies Dresden GmbH Quanscient Oy Finland

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Ultrasound transducers have diverse applications in medical imaging, consumer electronics, and automotive industries, offering advantages such as non-invasive medical imaging, reliable and non-mechanical transduction of input signals. Micro-Electro-Mechanical Systems (MEMS) based ultrasound transducer solutions, including Piezoelectric Micromachined Ultrasound Transducer (PMUT) and Capacitive Micromachined Ultrasound Transducer (CMUT) devices, exhibit superior performance compared to traditional piezo-ceramic based solutions due to their low cost, compact design, high efficiency and wideband operation capability, furthermore monolithic integration with electronics is possible. However, the development of these cutting-edge technologies requires sophisticated simulation tools to understand and manipulate the underlying ultrasound physics, which is essential for engineering applications. The newly developed simulation methodology will be utilized to model three-dimensional arrays of CMUT and PMUT cells. simulations are performed on cutting-edge designs of Infineon-developed chips using the Quanscient Allsolve software. The results obtained through resonance frequency measurements on PMUT devices and CMUT devices will be evaluated and compared with the simulation results obtained using the presented methodology. Additional capabilities on building ultrasound simulation models with multiphysics is elaborated in this work and demonstrated. Projections for further development in the simulation environment are also presented.

关键词： Performance evaluation Micromechanical devices Solid modeling Ultrasonic imaging Transducers simulation Software Resonance Wideband Biomedical imaging

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