The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on F...
ISBN:
(纸本)9783800755899
The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on FPGA;extending a RISC-V core with an AES hardware accelerator to meet IOT constraints;memristive logic-in-memory implementations: a comparison;a low-noise high-speed comparator for a 12-bit 200-MSps SAR ADC in a 28-nm CMOS process;A 2GS/s 10-bit time-interleaved capacitive DAC for self-interference-cancellation application;implementation of a low power decimation filter in a 180 nm HV-CMOS technology for a neural recording front-end;and analog baseband filter and variable-gain amplifier for automotive radars in 22 nm FD-SOI CMOS.
We present a problem-adapted finite element model, which enables the design of a novel type of a MEMS membrane pump as well as the investigation and the optimization of its operation, which heavily relies on the elect...
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ISBN:
(纸本)9798350345971
We present a problem-adapted finite element model, which enables the design of a novel type of a MEMS membrane pump as well as the investigation and the optimization of its operation, which heavily relies on the electrostatic pull-in of a radial membrane. The electro-mechanical actuation scheme constitutes a strongly coupled problem, which causes convergence problems due to the singular behavior of the electrostatic loads at small distances, as well as the highly non-linear mechanical contact. We overcome these issues by introducing problem-adapted regularization functions. These drastically improve the convergence behavior and the computation time, while at the same time causing only very small approximation errors. The resulting simulation model allows to gain a better understanding of the device operation, in particular to identify a failure condition of previously manufactured prototypes, where fluid is trapped in the pump chamber. Furthermore, it allows to quickly assess a design optimization that prevents this trapping and improves the overall device operation.
An analytic model for the C-V characteristic of Inversion-Mode MOS (I-MOS) capacitors is defined, to be used in the design of Charge Sensitive Amplifiers (CSAs) with dynamic signal compression feature. The model is de...
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ISBN:
(纸本)9798350386301;9798350386318
An analytic model for the C-V characteristic of Inversion-Mode MOS (I-MOS) capacitors is defined, to be used in the design of Charge Sensitive Amplifiers (CSAs) with dynamic signal compression feature. The model is derived from the equations governing channel inversion in the two and four terminal metal-oxide-semiconductor structure. A comparison between the model predictions and the simulation results is provided for MOS capacitors and CSAs in a 65 nm CMOS technology.
This paper proposes a simplified phenomenological macroscopic model of a nonlinear ferroelectric actuator. The key ingredient of the proposed model is based on the assumption of direct relation between the irreversibl...
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ISBN:
(纸本)9798350345971
This paper proposes a simplified phenomenological macroscopic model of a nonlinear ferroelectric actuator. The key ingredient of the proposed model is based on the assumption of direct relation between the irreversible strain and irreversible electric field, which not only reduces the number of internal variables but also facilitate finite element formulation. The model is implemented into a finite element framework, in which return mapping algorithm is employed to solve the evolution of internal variable, to simulate a micro-size ferroelectric actuator. Numerical results are compared with experimental data, demonstrating robustness of the proposed model for micro-actuator design.
In this paper, a 2-dimentional (2-D) axisymmetric modeling is presented for biomedical circular printed circuit board (PCB) coils and solenoids in COMSOL Multiphysics. With this model, the number of required meshes in...
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ISBN:
(纸本)9798350360196
In this paper, a 2-dimentional (2-D) axisymmetric modeling is presented for biomedical circular printed circuit board (PCB) coils and solenoids in COMSOL Multiphysics. With this model, the number of required meshes in finite element method (FEM) based simulations is reduced, which speeds up the iterative design procedure of inductive links in biomedical implants. While having a good accuracy, the presented 2-D axisymmetric modeling reduces the extraction time of electromagnetic parameters of PCB coils and solenoids by about 90%, compared to 3-D modeling. In order to investigate the accuracy of presented 2-D modeling, we have fabricated a PCB coil and a solenoid with suitable geometries for implantation in body. The measurement results of electromagnetic parameters have a good agreement with the 2D modeling based simulation results, and they verify each other. Finally, using the presented 2-D modeling, a comprehensive parametric simulation has been performed to study the behavior of coupling coefficient (k) and the maximum achievable k of PCB coils as a function of geometric parameters.
Approximate computing (AC) is a paradigm that introduces errors for reduced design metrics. AC has been recommended for implementation in error-resilient applications. Previously proposed AC implementations can be mod...
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The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this ...
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As a typical representative technological route of chip technology, microsystems have gradually become one of the main solutions for the small-volume, speciality applications. Heat is the main limitation of the micros...
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Panel Level Packaging (PLP) is an integrated circuit (IC) packaging technology that is mainly used in fields such as mobile communications, consumer electronics, and industrial automation. Compared to wafer-level pack...
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ISBN:
(纸本)9798350345971
Panel Level Packaging (PLP) is an integrated circuit (IC) packaging technology that is mainly used in fields such as mobile communications, consumer electronics, and industrial automation. Compared to wafer-level packaging, the advantages of panel-level packaging include improving manufacturing efficiency, reducing costs, and improving product quality. However, because the overall area of panel-level packaging is larger, there may be some problems in the manufacturing process, such as insufficient flatness of the substrate surface, poor adhesion between the substrate and the components, and incorrect component positioning. These problems may lead to poor product quality, asymmetric warpage, and even packaging failure. This paper aims to discuss the factors that may cause warpage in the panel-level packaging (PLP) process, including material non-uniformity, thermal stress, and mechanical stress. To address these issues, design and optimization of the packaging, selection of appropriate materials and process parameters, and stress analysis and simulation of the packaging are required. Through simulation, the warpage variation and stress distribution during the manufacturing process can be analyzed more efficiently. Our research will investigate the effects of different process parameters, such as the temperature of the molding process and the heating/cooling rate, as well as the thickness, size, and distribution of the encapsulant chips and other layers on warpage.
In this paper, modeling and parameter extraction of semiconductor devices for simulation and design optimization of ESD protection circuits on BCD technologies were discussed. Concepts on developing optimal and advanc...
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