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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1418 条记录，以下是1-10 订阅

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SMACD / PRIME 2021 - International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design and 16th conference on PhD Research in microelectronics and Electronics

SMACD / PRIME 2021 - International Conference on Synthesis, ...

引用

2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021

ISBN: (纸本)9783800755899

The proceedings contain 99 papers. The topics discussed include: run-time adaptive hardware accelerator for convolutional neural networks;design and analysis of a leading one detector-based approximate multiplier on FPGA;extending a RISC-V core with an AES hardware accelerator to meet IOT constraints;memristive logic-in-memory implementations: a comparison;a low-noise high-speed comparator for a 12-bit 200-MSps SAR ADC in a 28-nm CMOS process;A 2GS/s 10-bit time-interleaved capacitive DAC for self-interference-cancellation application;implementation of a low power decimation filter in a 180 nm HV-CMOS technology for a neural recording front-end;and analog baseband filter and variable-gain amplifier for automotive radars in 22 nm FD-SOI CMOS.

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Fully-Coupled Transient modeling of Highly Miniaturized Electrostatic Pull-In Driven Micropumps 24

Fully-Coupled Transient Modeling of Highly Miniaturized Elec...

引用

24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Hoelzl, Wolfgang Seidl, Martin Schrag, Gabriele Tech Univ Munich Munich Germany

ISBN: (纸本)9798350345971

We present a problem-adapted finite element model, which enables the design of a novel type of a MEMS membrane pump as well as the investigation and the optimization of its operation, which heavily relies on the electrostatic pull-in of a radial membrane. The electro-mechanical actuation scheme constitutes a strongly coupled problem, which causes convergence problems due to the singular behavior of the electrostatic loads at small distances, as well as the highly non-linear mechanical contact. We overcome these issues by introducing problem-adapted regularization functions. These drastically improve the convergence behavior and the computation time, while at the same time causing only very small approximation errors. The resulting simulation model allows to gain a better understanding of the device operation, in particular to identify a failure condition of previously manufactured prototypes, where fluid is trapped in the pump chamber. Furthermore, it allows to quickly assess a design optimization that prevents this trapping and improves the overall device operation.

关键词： Electrostatics

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modeling I-MOS Capacitor C-V Characteristic for Non-Linear Charge Sensitive Amplifiers 19

Modeling I-MOS Capacitor C-V Characteristic for Non-Linear C...

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19th conference on Ph.D Research in microelectronics and Electronics (PRIME)

作者： Giroletti, Simone Shojaei, Fatemeh Manghisoni, Massimo Ratti, Lodovico Vacchi, Carla Univ Pavia Dept Elect Comp & Biomed Engn Pavia Italy Univ Bergamo Dept Engn & Appl Sci Daimine Italy INFN Pavia Pavia Italy

ISBN: (纸本)9798350386301;9798350386318

An analytic model for the C-V characteristic of Inversion-Mode MOS (I-MOS) capacitors is defined, to be used in the design of Charge Sensitive Amplifiers (CSAs) with dynamic signal compression feature. The model is derived from the equations governing channel inversion in the two and four terminal metal-oxide-semiconductor structure. A comparison between the model predictions and the simulation results is provided for MOS capacitors and CSAs in a 65 nm CMOS technology.

关键词： MOS Capacitor Dynamic Signal Compression modeling Charge Sensitive Amplifiers

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A simple modeling of ferroelectric actuator based on phenomenological model 24

A simple modeling of ferroelectric actuator based on phenome...

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24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Nguyen, B. H. Zunic, M. Torri, G. B. Rochus, V. IMEC Sensor & Actuator Technol Dept B-3001 Leuven Belgium

ISBN: (纸本)9798350345971

This paper proposes a simplified phenomenological macroscopic model of a nonlinear ferroelectric actuator. The key ingredient of the proposed model is based on the assumption of direct relation between the irreversible strain and irreversible electric field, which not only reduces the number of internal variables but also facilitate finite element formulation. The model is implemented into a finite element framework, in which return mapping algorithm is employed to solve the evolution of internal variable, to simulate a micro-size ferroelectric actuator. Numerical results are compared with experimental data, demonstrating robustness of the proposed model for micro-actuator design.

关键词： Phenomenological Ferroelectric PZT Micro-actuator

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2-D Axisymmetric modeling of Circular PCB Coils and Solenoids in COMSOL Multiphysics 5

2-D Axisymmetric Modeling of Circular PCB Coils and Solenoid...

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5th Iranian International conference on microelectronics (IICM)

作者： Gozalpour, Farshad Yavari, Mohammad Amirkabir Univ Technol Dept Elect Engn Integrated Circuits Design Lab Tehran Polytech PO 15875-4413 Tehran 15914 Iran

ISBN: (纸本)9798350360196

In this paper, a 2-dimentional (2-D) axisymmetric modeling is presented for biomedical circular printed circuit board (PCB) coils and solenoids in COMSOL Multiphysics. With this model, the number of required meshes in finite element method (FEM) based simulations is reduced, which speeds up the iterative design procedure of inductive links in biomedical implants. While having a good accuracy, the presented 2-D axisymmetric modeling reduces the extraction time of electromagnetic parameters of PCB coils and solenoids by about 90%, compared to 3-D modeling. In order to investigate the accuracy of presented 2-D modeling, we have fabricated a PCB coil and a solenoid with suitable geometries for implantation in body. The measurement results of electromagnetic parameters have a good agreement with the 2D modeling based simulation results, and they verify each other. Finally, using the presented 2-D modeling, a comprehensive parametric simulation has been performed to study the behavior of coupling coefficient (k) and the maximum achievable k of PCB coils as a function of geometric parameters.

关键词： 2-dimentional (2-D) axisymmetric modeling circular PCB coil solenoid biomedical inductive link electromagnetic parameters COMSOL Multiphysics

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Arithmetic Calculus modeling for Approximate Circuits

Arithmetic Calculus Modeling for Approximate Circuits

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2024 International conference on microelectronics, ICM 2024

作者： Aoun, Alain Masadeh, Mahmoud Hasan, Osman Tahar, Sofiene Concordia University Department of Electrical and Computer Engineering MontrealQC Canada Yarmouk University Computer Engineering Department Irbid Jordan National University of Sciences & Technology Department of Electrical Engineering Islamabad Pakistan

ISBN: (纸本)9798350379396

Approximate computing (AC) is a paradigm that introduces errors for reduced design metrics. AC has been recommended for implementation in error-resilient applications. Previously proposed AC implementations can be modified to generate new configurations and thus result in a large design space of AC. In this paper, we propose a mathematical modeling technique that allows a fast analysis of hardware designs with the aim of studying the quality of large design spaces. Mathematically modeling the AC circuits facilitates the quality to be assessed using various error metrics while reducing the assessment time. The proposed approach has been applied to various arithmetic units, including an array multiplier, a multiply accumulate unit and a divider. The experimental results showed a quality assessment equivalent to the one obtained by the Monte-Carlo simulation, while offering a remarkable reduction in CPU time. © 2024 IEEE.

关键词： Monte Carlo methods

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AI-assisted design for Reliability: Review and Perspectives 25

AI-assisted Design for Reliability: Review and Perspectives

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25th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024

作者： Yuan, Cadmus De Jong, S.D.M. Van Driel, Willem D. Department of Mechanical and Computer-aided Engineering Feng Chia University Taichung Taiwan No. 100 Wenhwa Rd. Seatwen Taichung40724 Taiwan Department of Microelectronics Delft University of Technology Delft Netherlands Mekelweg 4 CD Delft2628 Netherlands

ISBN: (纸本)9798350393637

The demand for rapid advancement in AI, mobile and automotive markets is pushing the boundaries of electronic packaging, including heterogeneous integration, high-power packages, and large-die packaging. Against this backdrop, machine learning technologies emerge as dynamic tools for correlation building and classification, revolutionizing the traditional approaches to design, manufacturing, and testing in electronic packaging, as well as the design for Reliability (DfR) *** paper reviews the most recent AI-assisted approach for electronic packaging and then focuses on the AI-assisted DfR (AI-DfR) approaches. Our examination reveals that AI methods have been adapted to meet the specific needs of electronic packaging. The industry's anticipation for AI-DfR stems from its potential to address prevailing reliability design challenges, yet its multidisciplinary essence poses hurdles to swift progress. This review proposes future directions for AI-DfR's development, spotlighting critical areas such as the quality and efficiency of finite element modeling, design and optimization of training models, selection of AI models, and maintenance and value enhancement strategies. © 2024 IEEE.

关键词： AI model design for reliability Electronic Packaging: design Machine learning Manufacturing Testing and Reliability

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Thermal Reliability simulation Analysis of Planar Microsystem 9

Thermal Reliability Simulation Analysis of Planar Microsyste...

引用

9th International conference on Integrated Circuits and Microsystems, ICICM 2024

作者： Sun, Shikai Chen, Lei Lu, Zhenlin Zhao, Xuan Liu, Lili Ren, Yongzheng School of Integrated Circuits Peking University Beijing Microelectronics Technology Institute Beijing China Beijing Microelectronics Technology Institute Beijing China

ISBN: (纸本)9798331509453

As a typical representative technological route of chip technology, microsystems have gradually become one of the main solutions for the small-volume, speciality applications. Heat is the main limitation of the microsystem in speciality applications. This paper takes the planar microsystem as the research object, a finite element simulation is established by ANSYS to evaluate the maximum temperature of the different dies under different heat source distribution. The simulation results are of great significance for the high-reliability design and applications of planar microsystems. © 2024 IEEE.

关键词： Thermal modeling

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Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process modeling Techniques and Viscoelasticity Theory 24

Studying Asymmetric Warpage Behavior of Panel-Level Packages...

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24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Shu, Z. Chiang, K. N. Adv Microsyst Packaging & Nanomech Res Lab Hsinchu Taiwan Natl Tsing Hua Univ Dept Power Mech Engn Hsinchu 300 Taiwan

ISBN: (纸本)9798350345971

Panel Level Packaging (PLP) is an integrated circuit (IC) packaging technology that is mainly used in fields such as mobile communications, consumer electronics, and industrial automation. Compared to wafer-level packaging, the advantages of panel-level packaging include improving manufacturing efficiency, reducing costs, and improving product quality. However, because the overall area of panel-level packaging is larger, there may be some problems in the manufacturing process, such as insufficient flatness of the substrate surface, poor adhesion between the substrate and the components, and incorrect component positioning. These problems may lead to poor product quality, asymmetric warpage, and even packaging failure. This paper aims to discuss the factors that may cause warpage in the panel-level packaging (PLP) process, including material non-uniformity, thermal stress, and mechanical stress. To address these issues, design and optimization of the packaging, selection of appropriate materials and process parameters, and stress analysis and simulation of the packaging are required. Through simulation, the warpage variation and stress distribution during the manufacturing process can be analyzed more efficiently. Our research will investigate the effects of different process parameters, such as the temperature of the molding process and the heating/cooling rate, as well as the thickness, size, and distribution of the encapsulant chips and other layers on warpage.

关键词： Substrates

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modeling and Parameter Extraction of Semiconductor Devices for simulation and design Optimization of ESD Protection Circuits on BCD Technologies for Automobile and Industry Applications 17

Modeling and Parameter Extraction of Semiconductor Devices f...

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17th IEEE International conference on Solid-State and Integrated Circuit Technology, ICSICT 2024

作者： Cheng, Yuhua Yu, Wei-Wei Worley, Eugene Shanghai Research Institute of Microelectronics Peking University Shanghai China Silicon Crossing LLC IrvineCA92620 United States

ISBN: (纸本)9798350361834

In this paper, modeling and parameter extraction of semiconductor devices for simulation and design optimization of ESD protection circuits on BCD technologies were discussed. Concepts on developing optimal and advanced devices for cost effective and robust ESD protection capability were introduced, which can be executed with the support of the test chip design experience and on-wafer device characterization equipment environment. Turnkey solutions of ESD protection device development and debugging of ESD surge failure could be offered to circuit designers for designing efficient and robust ESD protection circuit blocks, which need to be simulated and optimized with the model library for the ESD protection devices. © 2024 IEEE.

关键词： Electrostatic devices

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