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15th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 14th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Paun, Maria-Alexandra Dehollain, Catherine Ecole Polytech Fed Lausanne RFIC Grp Lausanne Switzerland

ISBN: (纸本)9781538651537

This work is devoted to the three-dimensional modeling and evaluation of multi-electrode capacitive sensing, in an insulin pen used by diabetic persons, for insulin dose precise detection. To this purpose a fully parameterized model has been developed in ANSYS for the insulin pen containing a smart cap which hosts the electrodes, used for the capacitive measurement and therefore dose detection. Different electrode configurations have been evaluated, including 3, 4, 6 and 8 electrodes. The numerical values of the electrode capacitances have been extracted using Maxwell 3D for all the configurations proposed.

关键词： 3D model ANSYS Maxwell 3D insulin pen electrode configuration capacitive measurement

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2-D Axisymmetric modeling of Circular PCB Coils and Solenoids in COMSOL Multiphysics 5

2-D Axisymmetric Modeling of Circular PCB Coils and Solenoid...

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5th Iranian International conference on microelectronics (IICM)

作者： Gozalpour, Farshad Yavari, Mohammad Amirkabir Univ Technol Dept Elect Engn Integrated Circuits Design Lab Tehran Polytech PO 15875-4413 Tehran 15914 Iran

ISBN: (纸本)9798350360196

In this paper, a 2-dimentional (2-D) axisymmetric modeling is presented for biomedical circular printed circuit board (PCB) coils and solenoids in COMSOL Multiphysics. With this model, the number of required meshes in finite element method (FEM) based simulations is reduced, which speeds up the iterative design procedure of inductive links in biomedical implants. While having a good accuracy, the presented 2-D axisymmetric modeling reduces the extraction time of electromagnetic parameters of PCB coils and solenoids by about 90%, compared to 3-D modeling. In order to investigate the accuracy of presented 2-D modeling, we have fabricated a PCB coil and a solenoid with suitable geometries for implantation in body. The measurement results of electromagnetic parameters have a good agreement with the 2D modeling based simulation results, and they verify each other. Finally, using the presented 2-D modeling, a comprehensive parametric simulation has been performed to study the behavior of coupling coefficient (k) and the maximum achievable k of PCB coils as a function of geometric parameters.

关键词： 2-dimentional (2-D) axisymmetric modeling circular PCB coil solenoid biomedical inductive link electromagnetic parameters COMSOL Multiphysics

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Novel methodology for 3D FEM modeling of wire bonding process by ball deformation reproduction 23

Novel methodology for 3D FEM modeling of wire bonding proces...

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23rd International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Guarino, L. Caglio, C. Villa, R. Zullino, L. Cecchetto, L. STMicroelectronics Via C Olivetti 2 I-20864 Agrate Brianza MB Italy

ISBN: (纸本)9781665458368

Computer Aided Engineering (CAE) is fundamental to guide design options in semiconductors industry. The increasing demand of early anticipation of manufacturing risks is leading to an improvement of CAE modeling on processes, focusing on Chip-Package Interaction (CPI). The integration of new materials, especially low-k dielectric, requires an increasingly deep understanding of thermo-mechanical stress affecting packaging processes and reliability. Moreover, stresses imposed by wire bonding process increase the risk of bond pad damage leading to cracks in the silicon structure. The aim of the presented work is the study of copper ball shape and its evolution during ball bonding phase to establish a new approach for the modeling of wire bonding. Finite Element Method (FEM) is developed and validated with experimental results obtained at different time intervals, on which the deformations occurred in the bonded copper ball has been measured.

关键词： Deformable models Solid modeling Three-dimensional displays Wires Thermomechanical processes Data models Finite element analysis

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Novel method for modelling the local electro-thermal behaviour of discrete power diode using Verilog-A in a standard CAD environment 23

Novel method for modelling the local electro-thermal behavio...

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23rd International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Kaid, Achraf Kammerer, Jean-Baptiste Roqueta, Fabrice Hebrard, Luc STMicroelectronics 10 Rue Thales Millet F-37100 Tours France CNRS ICube 23 Rue Loess F-67200 Strasbourg France

ISBN: (纸本)9781665458368

An original method of modelling power devices is presented in this article. This method consists in generating a 3D electrothermal netlist from the knowledge of the device layout. Each element of the produced netlist is described thanks to the Verilog-A language which allows to describe both electrical and thermal effects. Thanks to that method, the DC characteristics of Schottky power diodes can be obtained, and full 3D transient electrothermal simulations can be done. Both DC characteristic and transient electro-thermal behaviours are obtained using a SPICE-like simulator. The simulations realised with our method are compared to conventional Technology Computer-Aided design (TCAD) simulations. It is shown that our approach allows simulating the behaviour of power diodes six times faster than with TCAD tools.

关键词： Micromechanical devices Solid modeling Schottky diodes Three-dimensional displays Computational modeling Layout microelectronics

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Vibration Investigation in Power Module Busbar design 18

Vibration Investigation in Power Module Busbar Design

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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Packwood, Matt Li, Daohui Dai, Xiapoing Jones, Steve Dynex Semicond Lincoln LN6 3LF England

ISBN: (纸本)9781509043446

The structural response of power module bus bars under harmonic loads is considered using finite element method simulation. simulation parameters and boundary conditions are considered in terms of their effect on the accuracy of simulation results with relation to real life application. Vibrational analysis was found to be highly sensitive to geometry preparation and constraint in terms of both mechanical stress magnitude and location. Overall the simulation process was determined to be a valuable tool in terms of reducing time/cost involved in iteratively designing power module busbars to withstand mechanical vibration with relation to life time application as well as ultrasonic weld process.

关键词： Stress Bars Welding Vibrations Acoustics Analytical models Load modeling

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ISMILE - A NOVEL CIRCUIT simulation PROGRAM WITH EMPHASIS ON NEW DEVICE MODEL DEVELOPMENT 89

ISMILE - A NOVEL CIRCUIT SIMULATION PROGRAM WITH EMPHASIS ON...

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26TH design AUTOMATION CONF

作者： YANG, AT KANG, SM Center for Compound Semiconductor Microelectronics and Coordinated Science Laboratory and Department of Electrical and Computer Engineering University of Illinois 1101 W. Springfield Ave. Urbana IL Center for Compound Semiconductor Microelectronics

ISBN: (纸本)0897913108

The laborious task of implementing a new device model in a circuit simulator has long been recognized as a painful bottleneck to device modeling. In contrast to the conventional circuit simulators which employ a built-in model library approach, iSMILE generates and links all the necessary codes automatically from a minimal set of model descriptions contained in a user's model input *** are completely shielded from the internal complexity of the program when implementing new models. This flexibility of extraction and by comparing circuit simulation results in terms of performance and *** has been used successfully as a CAD tool for the development of new models for high-speed optoelectronic integrated circuits.

关键词： Integrated circuits

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Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling 20

Application of Artificial and recurrent neural network on th...

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20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Yuan, Cadmus Hong, Yu-Jun Lee, Chang-Chi Chian, Kou-Ning Huang, Jin-Huang Feng Chia Univ Dept Mech & Comp Aided Engn Taichung Taiwan Natl Tsing Hua Univ Dept Power Mech Engn Hsinchu Taiwan

ISBN: (纸本)9781538680407

Artificial intelligence techniques have been widely applied in many domains, such as image/sound/text recognition, manufacturing monitoring, etc. One of the requirements for an artificial intelligence modeling is massive datasets. However, it is often limited known in the beginning of the design phase. This paper studied the methods and the influence of building an artificial intelligence model from a limited number of inputs. The application of the artificial neural network (ANN) and the recurrent neural network (RNN) has been applied to the nonlinear mechanical FE, steady-state thermal FE and transient FE model, and a rather simple neural network model and accuracy/application of these models has been reported.

关键词： Artificial neural networks Iron Recurrent neural networks Artificial intelligence Training Electronic packaging thermal management Semiconductor device modeling

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Sensitivity Analysis of Inductive Power Transfer Systems for Electric Vehicles Battery Charging 16

Sensitivity Analysis of Inductive Power Transfer Systems for...

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16th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 15th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Di Capua, Giulia Femia, Nicola Stoyka, Kateryna Univ Salerno DIEM Fisciano SA Italy

ISBN: (纸本)9781728112015

This paper investigates the sensitivity of inductive power transfer systems for electric vehicles battery charging. The goal of the analysis is to assess the impact of harmonics on the transferred power and on the efficiency, in order to define the main specifications for design and calibration of relevant measurement systems. The first harmonic approximation models of a Series/Series system and a Series-Parallel/Series system is developed to perform the analysis with respect to the variations of main operating parameters and coils mutual coupling. The resulting model predictions are validated by comparison with PSIM simulations.

关键词： inductive coupling compensation architecture wireless power transfer modeling simulations

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Improvement of simulation-based analog circuit sizing using design-space transformation 16

Improvement of simulation-based analog circuit sizing using ...

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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021

作者： Schweikardt, Matthias Scheible, Jürgen Electronics and Drives Reutlingen University Reutlingen Germany

ISBN: (纸本)9783800755899

This paper presents an improvement in usability and integrity of simulation-based analog circuit sizing. Instead of using geometrical sizing parameters (width, length), a transformed design-space, consisting exclusively of electrical parameters (branch currents, efficiencies and speed) is utilized. This design-space is explored more efficiently by optimizers. Moreover, this design-space can be reduced without affecting the quality of the result. The method is illustrated on two application examples, a symmetrical and a miller operational amplifier. Sizing the circuits using the transformed design-space showed significant reduction in required circuit simulations (up to 11x faster), better convergence, without loss in quality. © VDE VERLAG GMBH.

关键词： Circuit simulation

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Characterization and modeling of avalanche multiplication in HBTs

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microelectronics JOURNAL 2002年第1-2期33卷 39-43页

作者： Lin, FJ Chen, B Zhou, TS Ooi, BL Kooi, PS Natl Univ Singapore Dept Elect Engn Singapore 119260 Singapore Agilent Technol SMMC Singapore 119958 Singapore

The accurate modeling of weak avalanche breakdown of HBTs in compact bipolar transistor models for circuit simulation is presented. Based on various device electrical characteristics that are grouped into three classes, a modified VBIC avalanche multiplication model is proposed. By simply replacing one constant avalanche model parameter with current linear dependence, the new model predicts well broad behaviors of breakdown from weak avalanche up into high level injections. (C) 2002 Elsevier Science Ltd. All rights reserved.

关键词： avalanche multiplication bipolar transistor modeling compact model SiGeHBT VBIC parameter extraction

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