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European conference on Wireless Technology

作者： Chih-de Hung Wen-shen Wuen Mei-fen Chou Kuei-ann Wen Department of Electronics Engineering National Chiao Tung University Hsinchu Taiwan Microelectronics & Information Systems Research Center National Chiao Tung University Hsinchu Taiwan

This paper presents a unified RF behavior model that simultaneously predicts the effects of noise, nonlinearity, impedance matching and frequency response and that enables efficient and accurate system simulation. The proposed modeling approach allows characterizing the RF effects incrementally to reduce iteration. A Verilog-A behavior model for an ultra-wideband CMOS low noise amplifier is developed for fast and accurate system simulation. The system simulation results show that the behavior model agrees well with the transistor-level circuit with RMS error less than 0.79%. Ultimately, 87% reduction of simulation time is achieved

关键词： Low-noise amplifiers Semiconductor device modeling Circuit simulation Radiofrequency amplifiers Radio frequency Predictive models Impedance matching Frequency response Hardware design languages Ultra wideband technology

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Wireless Hearing Aid System simulations using Advanced design System ™ : A Behavioral modeling Approach

Wireless Hearing Aid System Simulations using Advanced Desig...

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Annual International conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

作者： R.S. Rana Tang Bin Zhang Liang G.H. Krishna Wang De Yun Institute of Microelectronics Singapore National University of Singapore Singapore Department of Electrical & Computer Engineering National University of Singapore Singapore Department of Otolaryngology Faculty of Medicine National University of Singapore Singapore

The stringent requirements on size and power consumption constrain the conventional hearing aid devices from providing the patients an economic and user friendly solution, specifically for better noise cancellation. With the advancements in technologies such as integrated circuits design, wireless communications and digital signal processing techniques, the wireless hearing aids having multi-microphones, analog, digital and mixed signals and radio frequency signals processing circuits, DSP and programmable units seem to be promising to provide enhanced performance. The focus of this paper is about the system simulation of a typical wireless hearing aid using Agilent Advanced design Systemtrade. The behavioral modeling features are exploited to enable the whole system simulations including electro-acoustic transducers. A few system level simulation results are included

关键词： Auditory system Circuit simulation Digital signal processing Power system modeling Energy consumption Power system economics Power generation economics Noise cancellation Integrated circuit technology Integrated circuit synthesis

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A New Electrothermal Simulator in Analogue Integrated Circuit design

A New Electrothermal Simulator in Analogue Integrated Circui...

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International conference on Modern Problems of Radio Engineering, Telecommunications and Computer Science

作者： Marek Kaminski Mariusz Jankowski Michal Szermer Department of Microelectronics and Computer Science Technical University of Lodz Lodz Poland

In this paper the usage of electrothermal simulator for analogue circuit design is presented. In the first part the operating and usage rules are presented. In the second part the operational amplifier is presented wi... 详细信息

ISBN: (纸本)9789665535072

关键词： Electrothermal effects Integrated circuit modeling Analog integrated circuits Circuit simulation Temperature Costs Fabrication Shape MOSFETs Circuit synthesis

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Towards a C++-based design methodology facilitating sequential equivalence checking

Towards a C++-based design methodology facilitating sequenti...

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design Automation conference

作者： P. Georgelin V. Krishnaswamy ST Microelectronics S.r.L. Crolles France Calypto Design Systems Inc. Santa Clara USA

It has long been the practice to create models in C or C++ for architectural studies, software prototyping and RTL verification in the design of systems-on-chip (SoC). These models are written in C++ primarily because it is possible to achieve very high simulation speeds, but also because it is productive to code at high levels of abstraction. In this paper we present a modeling methodology that continues to exploit the inherent advantages of writing models in C++ while ensuring that they are usable for formal verification of RTL through the use of sequential equivalence checking technology. An industrial case study is presented to show the validity of the approach

关键词： design methodology Hardware Software prototyping Formal verification Writing Signal processing algorithms Electronic design automation and methodology High level synthesis Image coding Computational modeling

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A VLSI design Framework with Freeware CAD Tools

A VLSI Design Framework with Freeware CAD Tools

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IEEE International conference on Semiconductor Electronics (ICSE)

作者： Y. K. Teh F. Mohd-Yasin M. B. I. Reaz A. Kordesch Multimedia University Cyberjaya Selangor Darul Ehsan Malaysia ECE Department IIUM University Kuala Lumpur Malaysia Device Modeling Group Silterra슠(M)슠Sdn Bhd. Kulim Kedah Malaysia

This work presents a PC-based freeware CAD environment to design and tape out VLSI microelectronic circuits, starting from schematic capture all the way to a foundry compatible GDS II database. These free tools will help more Malaysian universities to set up low cost VLSI CAD laboratories and tape out circuits using Silterra's University Program. This will help grow local IC design culture and skills. FreeVLSI uses common freeware CAD tools: 5SPICE, LASI, and WinSPICE, and some custom scripts to interface between these tools. Currently FreeVLSI is able to cater to full custom design flow from schematic capture to circuit layout.

关键词： Very large scale integration design automation Foundries Circuit simulation Layout Costs SPICE Semiconductor device modeling Integrated circuit modeling microelectronics

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Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirror

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SENSOR LETTERS 2006年第1期4卷 23-28页

作者： Parrain, F Megherbi, S Raynaud, G Mathias, H Gilles, JP Bosseboeuf, A Schröpfer, G Faure, N Cusin, P Univ Paris 11 UMR 8622 Inst Elect Fondamentale F-91405 Orsay France Coventor Sarl 3 F-91140 Villebon Sur Yvette France Colibrys SA Maladiere CH-2007 Neuchatel Switzerland

Recent developments in Micro-Electro-Mechanical Systems (MEMS) and micromachining technologies have made possible the development and the integration of micromirrors that can be employed for a number of consumer applications such as free space optical switching,(1,2) 2D scanning or image projection.(3) This high level of integration provides many advantages such as reproductivity and improved performance. Obviously these increased levels of miniaturization raise new characterization and modeling concerns. We present in this paper the design, the fabrication process, the characterization and the behavioral modeling approach of a novel electrostatically actuated biaxial micromirror. This MOEMS is a result of a joint development between our partners Colibrys and Coventor companies.(4,5) In the field of this work two HDL multi-physics models using Verilog-A language and Matlab have been developed and validated by different experimental measurements.

关键词： MOEMS micromirror HDL modeling matlab verilog-A interferometric profilometer PSoC

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A new compressed voxel-based method for swept volume modeling of drum cutter and its application

A new compressed voxel-based method for swept volume modelin...

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International conference on Computer-Aided Industrial design and Conceptual design, CAIDCD

作者： Z. X. Hou F.-l. Krause F. X. Yan J. S. Wu The China Education Ministry Key Laboratory of Contemporary Design and Integrated Manufacturing Technology Northwestern Polytechnical University Xi'an China Institute of Machine Tool and Factory Management Technical University of Berlin China College of Software and Microelectronics Northwestern Polytechnical University Xi'an China

Swept surface model of a drum cutter is established and discretized into uniformly distributed voxel model by ray casting approach. Solid model of the cutter is stored in the form of three mutually perpendicular rays array along X, Y, Z axis, with each ray being originated from the cutter swept surface and offset from its neighboring one at a distance of voxel size, resulting in a compressed dexel model. Boolean operation of the cutter swept surface with workpiece is fulfilled among one-dimensional dexel arrays and workpiece at high speed. Marching cube algorithm is applied to build the triangle mesh model of machined workpiece which can be observed in real time from any direction. This method was applied in five-axis NC simulation system base on compressed voxel model, which has gained excellent effect. The disadvantages of current five-axis NC simulation method and commercial software systems are overcome. The method is the key technology for the virtual numerical control machining

关键词： Solid modeling Machining Cutting tools Computer numerical control Computational modeling Software systems Space technology Application software Laboratories Virtual manufacturing

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Combined Fracture, Delamination Risk and Fatigue Evaluation of Advanced microelectronics Applications towards RSM/DOE Concepts

Combined Fracture, Delamination Risk and Fatigue Evaluation ...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： J. Auersperg R. Dudek B. Michel Department Mechanical Reliability and Micro Materials Fraunhofer Institute of Reliability and Microintegration (IZM) Berlin Germany AMIC Angewandte Micro-Messtechnik GmbH Berlin Germany

Microelectronic assemblies are basically compounds of several high precision materials with quite different Young's moduli and thermal expansion coefficients (CTE). Additionally, various kinds of inhomogeneity, residual stresses generated by several steps of the manufacturing process and extreme thermal environmental conditions contribute to interface delamination, chip cracking and fatigue of solder interconnects. For that reason, numerical investigations by means of nonlinear FEA together with conventional strength hypotheses are frequently used for design optimizations and sensitivity analyses. So, design studies on the basis of parameterized FE-models and DOE/RSM-approaches help to optimize electronic components at early phases of the product development process. But, this methodology typically bases on classical stress/strain strength evaluations or/and life time estimations of solder interconnects using modified Coffin-Manson approaches, whereas delamination or bulk fracture mechanisms usually remain unconsidered. By means of a representative microelectronics assembly this contribution is going to figure out and discuss ways and challenges of using numerical fatigue evaluation and fracture mechanics approaches in connection with parameterized finite element modeling based DOE/RSM-concepts. That is, the evaluation of mixed mode interface delamination phenomena utilizing the VCCT-methodology, classical strength hypotheses along with fracture mechanics approaches and modified Coffin-Manson thermal fatigue estimation of solder joints will be simultaneously applied within a multi-objective optimization towards a thermo-mechanical reliable design

关键词： Delamination Fatigue microelectronics US Department of Energy design optimization Assembly Life estimation Thermal expansion Residual stresses Manufacturing processes

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A Study on RF Transistor Implementations on a 0.25 μm Digital CMOS Process

A Study on RF Transistor Implementations on a 0.25 μm Digit...

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IEEE Region 10 International conference TENCON

作者： Jose Enrico R. Mangaser Maria Cecilia N. Gutierrez John Richard E. Hizon Louis P. Alarcon Microelectronics and Microprocessors Laboratory Department of Electrical and Electronics Engineering University of Philippines Quezon Philippines

modeling MOSFET parasitics is vital as the operating frequency increases and enters the GHz range. To improve RF design capability, several common source NMOS transistors were implemented on a 0.25 μm digital CMOS process using various layout techniques described in literature. Relevant parasitics were then extracted and compared to identify the techniques that would maximize transistor performance for RF applications

关键词： Radio frequency CMOS process MOSFET circuits CMOS technology Integrated circuit technology Space technology Equivalent circuits Semiconductor device modeling Predictive models Circuit simulation

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A parallelized way to provide data encryption and integrity checking on a processor-memory bus

A parallelized way to provide data encryption and integrity ...

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design Automation conference

作者： R. Elbaz L. Torres G. Sassatelli P. Guillemin M. Bardouillet A. Martinez LIRMM CNRS UMR University of Montpellier II Montpellier France Advanced System Technology ST Microelectronics S.r.L. Rousset France

This paper describes a novel engine, called PE-ICE (parallelized encryption and integrity checking engine), enabling to guarantee confidentiality and integrity of data exchanged between a SoC (system on chip) and its external memory. The PE-ICE approach is based on an existing block-encryption algorithm to which the integrity checking capability is added. simulation results show that the performance overhead of PE-ICE remains low (below 4%) compared to block-encryption-only systems (which provide data confidentiality only)

关键词： Cryptography Engines Data security System-on-a-chip Splicing Information security Portable computers Microcomputers Algorithm design and analysis Computational modeling

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