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24th IASTED International conference on modeling, Identification, and Control, MIC 2005

作者： Semerci, Elzem A. Ateşoǧlu, Özgür Navigation and Guidance System Design Department Microelectronics Guidance and Electro-Optics Division ASELSAN Inc. P.O. Box: 30 Etlik 06011 Ankara Turkey

The objective of this study is to improve a readily existing, on-off controlled pneumatic actuation system. The study primarily focused on modeling of that system. A nonlinear model and a linear model are built. The nonlinear modeling is formed by applying parameter identification based optimization. And, linear modeling is based on linear time invariant system fitting by using system identification techniques and linearization. Afterwards, different PWM schemes are studied to cascade with the identified models. And a hybrid PWM scheme is introduced to the open loop model. A discrete position controller is designed on that hybrid PWM scheme and identified plant model showing the best performance. Success of the controller is also tested for an artificial torque disturbance which is possible to act on the load shaft during its operation.

关键词： Pulse width modulation

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Measurements and modeling of thickness distribution to improve the uniformity of evaporated thin films 15

Measurements and modeling of thickness distribution to impro...

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15th European microelectronics and Packaging conference and Exhibition, EMPC 2005

作者： Balogh, Bálint Farkas, Csongor Harsányi, Gábor Illyefalvi-Vitéz, Zsolt Lovics, Riku Department of Electronics Technology Budapest University of Technology and Economics Goldmann ter 3 Budapest1111 Hungary

Both optical and electrical parameters of thin film layers depend highly on their thickness. In most cases measurement of thickness distribution is complicated and takes a long time, consequently there is a need for an effective simulation tool to calculate the thickness distribution of deposited layers. Such simulation software also reduces the design time and cost of new evaporator equipment. This paper describes the results of a research project that aimed to determine and improve the thickness distribution of the deposited aluminum thin film layer over a large target area. Initially the emission characteristic of the evaporator source was determined by laboratory experiments. Then simulations were carried out with various source arrangements based on the measured emission characteristic. © EMPC 2005 - conference Programme and *** right reserved.

关键词： Evaporators

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Thermal, mechanical, and structural phenomena in laser material interaction by large-scale atomistic modeling

Thermal, mechanical, and structural phenomena in laser mater...

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conference on Photon Processing in microelectronics and Photonics IV

作者： Wang, XW Univ Nebraska Dept Mech Engn Walter Scott Engn Ctr N104 Lincoln NE 68588 USA

ISBN: (纸本)081945687X

Laser material interaction involved in laser-assisted microscale packaging is endowed with rapid and coupled optical, mechanical, and thermal processes. In-depth understanding of the underlying physics in these processes is instrumental for process optimization and functionality and dependability design of systems. This work is focused on the atomistic modeling of laser material interaction, particularly about the phase change, nanoparticle formation, stress generation and propagation, and formation and revolution of sub-surface structural damages. Large-scale parallel molecular dynamics simulation is conducted to model over 200 millions of atoms. The result reveals no clear interface when phase change occurs, but a transition region where the solid and liquid structures co-exist. The solid-liquid interface is found to move with a velocity up to the local sound speed. A vapor and droplet mixture is ejected from the surface with a high speed. The simulation reveals that nanoparticles originate from an intense vapor phase explosion after laser heating. The emerging time of larger particles is much later than that associated with smaller clusters. The resulting nanoparticles are characterized with a gas-like structure while characteristics of liquid are also preserved to a certain degree. In laser-assisted surface nanoscale structuring, visible sub-surface nanoscale structural damages are observed in the direction of 45 degrees with respect to the laser incident direction. Detailed study of the lattice structure reveals atomic dislocation in the damaged regions. Both temporary and permanent structural damages are observed in the material.

关键词： parallel molecular dynamics simulation laser-material interaction phase change nanoparticle formation thermal stress structural damage

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modeling and design of shape memory alloy actuators

Modeling and design of shape memory alloy actuators

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6th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

作者： Langelaar, Matthijs Yoon, Gil Ho Gurav, Sham Kim, Yoon Young Van Keulen, Fred Department for Precision and Microsystems Engineering Delft University of Technology Delft Netherlands National Creative Research Initiatives Center for Multi Scale Design School of Mechanical and Aerospace Engineering Seoul National University Seoul Korea Republic of Mekelweg 2 2628 CD Delft Netherlands

ISBN: (纸本)0780390628

This paper presents the application of systematic model-based design techniques to the design of Shape Memory Alloy (SMA) actuators. Shape memory alloys are promising materials for (micro-)actuation, because of the relatively large deformations and forces that can be achieved. However, the complex constitutive behavior and the fact that several physical domains (electrical, thermal and mechanical) play a role makes it difficult to design effective SMA actuators with complex shapes and layouts. For this reason, design optimization techniques are expected to play an important role in the further development of SMA actuators. The present paper presents shape and topology optimization of SMA structures and shows the effectiveness of these design approaches by several representative examples. © 2005 IEEE.

关键词： microelectronics

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Wireless hearing aid system simulations using advanced design system™: A behavioral modeling approach

Wireless hearing aid system simulations using advanced desig...

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2005 27th Annual International conference of the Engineering in Medicine and Biology Society, IEEE-EMBS 2005

作者： Rana, Ram Singh Tang, Bin Zhang, Liang Krishna, Garg Hari Wang, Yun Institute of Microelectronics Singapore Science Park II 11 Science Park Road Singapore 117685 Singapore Graduate Program in Bioengineering National University of Singapore Singapore 117597 Singapore Department of Electrical and Computer Engineering National University of Singapore Singapore 119260 Singapore Department of Otolaryngology Faculty of Medicine National University of Singapore Singapore 119074 Singapore

ISBN: (纸本)0780387406

The stringent requirements on size and power consumption constrain the conventional hearing aid devices from providing the patients an economic and user friendly solution, specifically for better noise cancellation. With the advancements in technologies such as integrated circuits design, wireless communications and digital signal processing techniques, the wireless hearing aids having multi-microphones, analog, digital and mixed signals and radio frequency signals processing circuits, DSP and programmable units seem to be promising to provide enhanced performance. The focus of this paper is about the system simulation of a typical wireless hearing aid using Agilent Advanced design System™. The behavioral modeling features are exploited to enable the whole system simulations including electro-acoustic transducers. A few system level simulation results are included. © 2005 IEEE.

关键词： Hearing aids

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Active RC circuit model of the optimized second-order PWL dynamical system

Active RC circuit model of the optimized second-order PWL dy...

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24th IASTED International conference on modeling, Identification, and Control, MIC 2005

作者： Pospisil, Jiri Kolka, Zdenek Brzobohaty, Jaromir Hanus, Stanislav Petrzela, Jiri Dostal, Tomas Institute of Radio Electronics Institute of Microelectronics Brno University of Technology Purkyňova 118 612 00 Brno Czech Republic

Active RC circuit model with a piecewise-linear (PWL) voltage-controlled voltage source (VCVS) and linear current-controlled voltage source (CCVS) for the second-order autonomous dynamical system realization is proposed. The main advantage of this equivalent circuit is simple relation between the state model parameters and their corresponding circuit parameters, which leads also to simple design formulas.

关键词： Networks (circuits)

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Thermal, Mechanical and Multi-Physics simulation and Experiments in Micro-Electronics and Micro-Systems: Proceedings of EuroSIME 2005

Thermal, Mechanical and Multi-Physics Simulation and Experim...

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6th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

ISBN: (纸本)0780390628

The proceedings contains 110 papers. The topics discussed include: nanoreliability-combined simulation and testing;sense and nonsense of heat transfer correlations applied to electronics cooling;thermal cycling simulation in electronic packages using molecular dynamic method;parametric model order reduction for scanning electrochemical microscopy: fast simulation of cyclic voltammogram;compact modeling of RF passives by using model order reduction techniques;Investigations of strength properties of ultra-thin silicon;measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound;validation of FE model for transient hot wire thermal conductivity measurements;and solder joints layout design and reliability enhancement of wafer level packaging.

关键词： microelectronics

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Integrated design and simulation tools for microfluidic systems

Integrated design and simulation tools for microfluidic syst...

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1st International conference and Exhibition on Ceramic Microsystems Technologies, CICMT 2005 - Co-located with the 107th Annual Meeting of the American Ceramic Society, ACerS 2005

作者： Krishnamoorthy, S. Bedekar, A.S. Feng, J.J. Sundaram, S. CFD Research Corporation 215 Wynn Drive Huntsville AL 35805 United States

ISBN: (纸本)0930815769

Recent advances in microfabrication, sensing and miniaturization technologies hare made μTAS or Lab-On-A-Chip systems find applications in diverse fields such as pharmaceuticals, biotechnology, defense, medical, and agriculture. For a successful custom device development, one needs to analyze and characterize the performance of individual components, such as pumps, valves, mixers, separators, sensors, etc., as -well as the integrated system. In this regard, first-principle based simulations of coupled fluid-thermal- mechanical-chemical-biological-electrical phenomena can revolutionize the pace of development of these systems. The paper Mill provide an overview of modeling and simulation -based analysis as a tool for design and development of microfluidic systems. Delineation of key input parameters and performance assessment are presented for different components/applications. Tackling commonly encountered issues such as mass transport effects, liquid filling, sample dispersion and Joule heating with the help of simulation will be demonstrated. We conclude with the need for advanced modeling techniques for system level analysis and device optimization. Copyright © 2005 IMAPS.

关键词： Lab-on-a-chip

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simulation of capacitive type bimorph humidity sensors

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Journal of Physics: conference Series 2005年第1期10卷 305-308页

作者： Fragakis, J. Chatzandroulis, S. Papadimitriou, D. Tsamis, C. National Technical University of Athens Department of Physics GR-15780 Athens Greece Institute of Microelectronics NCSR Demokritos 15310 Aghia Paraskevi PO Box 60228 Greece

FEM modeling of recently developed silicon/polymer bimorph micro-cantilever structures, applied as capacitive type humidity sensors, is presented. In these structures, the expansion of the overlying polymer in the presence of water vapors forces the silicon cantilever to bend resulting in a change of device capacitance. Experimental behavior is approximated by taking into account the stress induced in the cantilever due to the polymer swelling. simulation results are in good agreement with experimental values. The FEM model developed facilitates the design and optimization of the cantilever beam sensors. © 2005 IOP Publishing Ltd.

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Contrasting CFD for electronic systems modeling with that for aerospace

Contrasting CFD for electronic systems modeling with that fo...

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6th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

作者： Tucker, Paul G. Liu, Yan Civil and Computational Engineering Centre School of Engineering University of Wales Swansea Singleton Park Swansea SA2 8PP

ISBN: (纸本)0780390628

With aerospace industries wishing to take maximum advantage of computational modeling CFD (Computational Fluid Dynamics) has found increasing use at off-design conditions. These are characterized by significant areas of separated flow and the need for the resolution of small scale complex geometrical features. This new aerospace CFD direction has increased the common links between electronics CFD needs. This link is explored. As part of this, it is demonstrated how for typical non-separated aerospace flows with traditional turbulence models (RANS) CFD yields high solution accuracy (integrated stresses to within 1%). More separated aerospace flows, and the modern eddy resolving approaches now used to solve these are then considered. Despite the relatively simple level of geometrical complexity (in relation to electronics) and aerodynamic nature of geometries a significant reduction in solution accuracy is shown. However, even so the predictive accuracy could be better than 10%. The same model types are then applied, by the same research group, with high accuracy well validated CFD codes (again with aerospace - Rolls Royce - origins) to a non-isothermal ribbed channel flow, cube flow and complex geometry CPU system flow. With increasing geometrical complexity solution accuracy is shown to rapidly deteriorate. For the most complex geometry, turbulence models are shown to give a vast range of heat transfer levels deviating from measurements by around ± 100%. The important question of solution uniqueness is considered (for both aerospace and electronic geometry flows) and the matter of how different solvers can give qualitatively different flow solutions even for very simple multiple boundary isothermal flows noted. © 2005 IEEE.

关键词： microelectronics

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