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Asian simulation conference/The 6th International conference on system simulation and Scientific Computing

作者： LOU Wei, YAN Limin, HE Guosen (Department of Automation Eng., Shanghai University, Shanghai 200072, P.R.China microelectronics R&D Center, Shanghai University, Shanghai 200072)

This paper presents the design of a noval Bjork-Shiley Heart valve with optimal minimum energy loss. A kind of noval model of human heart value has been researched based on the hydrokinetics and Newtonian mechanics. AH unknown parameters of the model have been found by our realistic scientific experiments in the Shanghai Chang-Hai Hospital's Cardiovascular Laboratory. We found the optimal orifice angle and optimal fulcrum seat under the index of least energy loss by means of modeling, simulation and the principle of optimization. Because the moving states of the heart value and passing blood are extremely complicated. It was assumed that all flowing states are steady as a condition of solution according to the Principle of Newtonian mechanics and the kinetic equations of the heart value which is very complex and nonlinear and is solved by direct method of Hooke-Jeeres simplying and reliably. So all experimental results show the orientation future R&D.

关键词： Bjork-Shiley Heart valve Mathematical model Bond Graph Technology Least Energy Loss simulation

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Three-dimensional simulation of nanoscale copper interconnects

Three-dimensional simulation of nanoscale copper interconnec...

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IEEE conference on Nanotechnology

作者： Hung-Mu Chou Yiming Li Department of Electrophysics National Chiao Tung University Hsinchu Taiwan Microelectronics and Information Systems Research Center National Chiao Tung University Hsinchu Taiwan Department of Computational Nanoelectronics National Nano Device Laboratories Hsinchu Taiwan

ISBN: (纸本)0780391993

Copper (Cu) interconnects are one of promising approaches for design and fabrication of gigascale ultra-large scale integrated (ULSI) circuit. In this paper, three configurations of interconnect, the parallel lines, the parallel lines on a plane, and the parallel lines between two planes are investigated. Three-dimensional simulation is performed by solving an electrostatic model using adaptive computing technique. For the studied three configurations, delay of resistance and capacitance (RC) is calculated with respect to different line spacing, line distance to plane, line width, and line height. Equivalent circuit is implemented for circuit simulation, and calculation of timing delay and crosstalk. It is found that RC time constant not only depends on the configurations but also dominates by the ratio of line height to line width. For sub-100 nm fabrication technology, there is an optimal design with respect to the three configurations. If the ratio of line height to line width is larger than 1, the RC time constant reaches to a minimum.

关键词： Copper Circuit simulation Integrated circuit interconnections Fabrication Delay Ultra large scale integration Computational modeling Electrostatics Capacitance Equivalent circuits

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Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Compliance, deformation and thermal fatigue behavior of mult...

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Electronics Packaging Technology conference (EPTC)

作者： E.B. Liao A.A.O. Tay S.S.T. Ang H.H. Feng R. Nagarajan V. Kripesh R. Kumar I. Mahadevan Institute of Microelectronics Singapore Nano/Microsystem Integration Laboratory National University of Singapore Singapore University of Arkansas Fayetteville AR USA

In this paper, macro- and micro-modeling technique is implemented to correlate the compliance, deformation and thermal fatigue damage of composite interconnect structures that consist of copper columns and solder joint. Systematic simulation results reveal the dependence of solder joint fatigue life upon four geometric parameters such as column height, column radius, solder volume and substrate pad radius. A simple model has been developed to explain the dependence of plastic strain on the interconnect compliance. This work provides guidance for design of composite interconnect structure that is meant to enhance the solder joint reliability by incorporation of flexible structures

关键词： Fatigue Deformable models Copper Soldering Plastics Capacitive sensors Thermal force Solid modeling Thermomechanical processes Structural beams

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Viscoelastic characterization of fast curing moulding compounds

Viscoelastic characterization of fast curing moulding compou...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： B.V. Milosheva K.M.B. Jansen J.H.J. Janssen H.J.L. Bressers L.J. Ernst Central Laboratory of Physico-Chemical Mechanics - BAS Sofia Bulgaria Delft University of Technology Delft CD The Netherlands Philips Semiconductors Nijmegen AE The Netherlands

Thermoset resins are well known as materials for high performance applications such as in the microelectronics. Examples are moulding compounds, underfill materials, coatings, adhesives, etc. A problem is however that the curing process induces thermal and reaction shrinkage, which leads to residual stresses and warpage. The polymer behavior is highly time, temperature and cure dependent and spans the entire range from liquid to solid state during processing. In order to be able to reduce and to prevent these stresses and warpage, the compound selection and the curing procedure should be optimized within the design process. For this, the polymer material behavior should be understood in advance, which in turn requires adequate modeling and characterization during cure. This paper deals with characterization and analysis of the viscoelastic properties of underfill and molding compounds. The focus is on the determination of the most useful method to find the viscoelastic properties of fast curing materials during the cure process.

关键词： Viscosity Elasticity Curing Thermal stresses Residual stresses Polymers Resins microelectronics Coatings Temperature dependence

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Fracture mechanics based crack and delamination risk evaluation and RSM/DOE concepts for advanced microelectronics applications

Fracture mechanics based crack and delamination risk evaluat...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： J. Auersperg B. Seiler E. Cadalen R. Dudek B. Michel Department Mechanical Reliability and Micro Materials Fraunhofer Institute of Reliability and Microintegration (IZM) Berlin Germany AMIC Angewandte Micro-Messtechnik GmbH Berlin Germany CWM Chemnitzer Werkstoffmechanik GmbH Chemnitz Germany THALES Microelectronics S. A. Chateaubourg France

Fatigue and failure of advanced electronic packages and related systems is often caused by their increasing use under harsh environmental conditions - extreme temperatures, in particular. As a result, its thermomechanical reliability becomes more and more one of the most important preconditions for adopting it in industrial applications. Residual stresses from several steps of the manufacturing process, thermal and static and dynamic mechanical loading conditions along with the fact that microelectronic packages are basically compounds of materials with quite different Young's modules and thermal expansion coefficients contribute to interface delamination, chip cracking and fatigue of interconnects. Consequently, numerical investigations by means of nonlinear parameterized FEA, fracture mechanics concepts are frequently used for design optimizations using sensitivity analyses (Auersperg et al., 2001). So, numerical design studies can help to optimize designs of electronics applications at the earlier phase of the product development processes. Unfortunately, this methodology typically accounts for classical stress/strain evaluation or life-time estimations of solder interconnects using modified Coffin-Manson approaches. Delamination or bulk fracture mechanisms usually remain unconsidered. This contribution intends to figure out and discuss ways of using fracture mechanics numerical approaches in connection with parameterized FEA based DOE/RSM. For improving such methods, the evaluation of mixed mode interface delamination phenomena of several ceramics/encapsulant-specimens under bending has been combined with experimental deformation measurements. Measured force vs. deflection curves, deformation fields as results of optical inspection and deformation analysis as well as crack tip vs. deflection curves determined using constitute the input for the delamination modeling by means of FEM. Major goal of the study is to make such a way determined interface toughness para

关键词： Delamination US Department of Energy microelectronics Electronic packaging thermal management Fatigue Thermal expansion Thermal loading Thermal stresses design optimization Force measurement

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Quantum correction simulation of random dopant-induced threshold voltage fluctuations in nanoscale metal-oxide-semiconductor structures

Quantum correction simulation of random dopant-induced thres...

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IEEE conference on Nanotechnology

作者： Yiming Li Shao-Ming Yu Microelectronics and Information Systems Research Center National Chiao Tung University Hsinchu Taiwan Department of Computational Nanoelectronics National Nano Device Laboratories Hsinchu Taiwan Department of Computer and Information Science National Chiao Tung University Hsinchu Taiwan

ISBN: (纸本)0780391993

In this paper, we explore random dopant-induced threshold voltage fluctuations by directly solving quantum correction model for nanoscale metal-oxide-semiconductor field effect transistors (MOSFETs). To calculate the variance of the threshold voltage of nanoscale MOSFETs, quantum correction model at equilibrium conditions is expanded and numerically solved with perturbation and monotone iterative methods. Fluctuations of threshold voltage resulting from the random dopant, variations of gate oxide thickness and epitaxial layer, and the device width are calculated. Classical and quantum mechanical results are provided to support the conclusions drawn from the theoretical findings. In contrast to traditional quantum Monte Carlo approach and small signal analysis of the Schrodinger-Poisson equations, this approach shows good accuracy and computational efficiency, and is ready for industrial technology computer-aided design application.

关键词： Threshold voltage Fluctuations Nanostructures Semiconductor process modeling MOSFETs FETs Iterative methods Epitaxial layers Quantum mechanics Quantum computing

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Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling

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microelectronics RELIABILITY 2004年第12期44卷 1967-1976页

作者： Fan, XJ Zhou, J Zhang, GQ Philips Res USA Briarcliff Manor NY 10510 USA Lamar Univ Dept Engn Mech Beaumont TX 77710 USA Eindhoven Univ Technol Eindhoven Netherlands

The realization of virtual prototyping of electronic packages depends on the capability and reliability of multiphysics modeling. This paper focuses on the methods and solutions of combined thermal and thermo-mechanical modeling. The package-level thermal behaviors for various kinds of packages are discussed first through the thermal simulation. The impact of internal package design on thermal performance is highlighted. Then the methods and solutions of combined thermal and thermo-mechanical modeling are addressed in detail. The strong interactions of thermal and mechanical simulations, as well as the trade-off between thermal and mechanical designs are discussed through two case studies. The benefit of moisture behavior modeling for the package design is also briefed in this paper. (C) 2004 Elsevier Ltd. All rights reserved.

关键词： VAPOR pressure MOISTURE microelectronics PERFORMANCE

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Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling

Multi-physics modeling in virtual prototyping of electronic ...

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International conference on Thermal and Mechanical simulation and Experiments in microelectronics and Microsystems

作者： Fan, XJ Zhou, J Zhang, GQ Philips Res USA Briarcliff Manor NY 10510 USA Lamar Univ Dept Engn Mech Beaumont TX 77710 USA Eindhoven Univ Technol Eindhoven Netherlands

关键词： microelectronics

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design and modeling of on-chip electrostatic discharge (ESD) protection structures

Design and modeling of on-chip electrostatic discharge (ESD)...

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Proceedings - 2004 24th International conference on microelectronics, MIEL 2004

作者： Liou, Juin J. Gao, Xiaofang Department of Electrical Engineering University of Central Florida Orlando FL 32816 United States Modeling and Simulation Group Intel Corp. 9750 Goethe Rd. Sacramento CA 95827 United States

Electrostatic discharge (ESD) is a critical reliability concern for microchips. This paper presents a computer-aided design tool for ESD protection design and applications. Specifically, we develop an improved and robust MOS model and implement such a model into the industry standard Cadence SPICE for ESD circuit simulation. Experimental data measured from the transmission line pulsing (TLP) technique and human body model (HBM) tester are included in support of the model.

关键词： Electrostatics

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design, modeling and fabrication of piezoelectric polymer actuators

Design, modeling and fabrication of piezoelectric polymer ac...

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conference on Device and Process Technologies for MEMS, microelectronics, and Photonics III

作者： Yao, F Harvey, EC Ghantasala, MK Spinks, G Swinburne Univ Technol Ind Res Inst Swinburne CRC MicroTechnol Melbourne Vic 3122 Australia

ISBN: (纸本)081945169X

Piezoelectric polymers are a class of materials with great potential and promise for many applications. Because of their ideally suitable characteristics, they make good candidates for actuators. However, the difficulty of forming structures and shapes has limited the range of mechanical design. In this work, the design and fabrication of a unimorph piezoelectric cantilever actuator using piezoelectric polymer PVDF with an electroplated layer of nickel alloy has been described. The modeling and simulation of the composite cantilever with planar and microstructured surfaces has been performed by CoventorWare to optimize the design parameters in order to achieve large tip deflections. These simulation results indicated that a microstructured cantilever could produce 25 percent higher deflection compared to a simple planar cantilever surface. The tip deflection of the composite cantilever with a length of 6 mm and a width of 1 mm can reach up to 100 mum. A PVDF polymer with a specifically designed shape was punched out along the elongation direction on the embossing machine at room temperature. The nickel alloy layer was electroplated on one side of the PVDF to form a composite cantilever. The tip deflection of the cantilever was observed and measured under an optical microscope. The experimental result is in agreement with the theoretical analysis.

关键词： PVDF composite cantilever actuator simulation laser micromachining punching electroplating

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