检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

1,367 篇 会议
46 篇 期刊文献
6 册 图书

馆藏范围

1,419 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

615 篇 工学
- 387 篇 电气工程
- 246 篇 电子科学与技术（可...
- 221 篇 计算机科学与技术...
- 128 篇 材料科学与工程（可...
- 119 篇 软件工程
- 89 篇 机械工程
- 66 篇 动力工程及工程热...
- 59 篇 控制科学与工程
- 42 篇 化学工程与技术
- 35 篇 信息与通信工程
- 31 篇 仪器科学与技术
- 23 篇 力学（可授工学、理...
- 15 篇 冶金工程
- 15 篇 生物医学工程（可授...
- 10 篇 建筑学
- 9 篇 光学工程
- 9 篇 土木工程
- 8 篇 交通运输工程
- 8 篇 安全科学与工程
- 7 篇 生物工程
255 篇 理学
- 146 篇 物理学
- 116 篇 数学
- 45 篇 化学
- 22 篇 系统科学
- 10 篇 生物学
- 10 篇 统计学（可授理学、...
38 篇 管理学
- 37 篇 管理科学与工程(可...
8 篇 医学
- 7 篇 临床医学
- 6 篇 基础医学(可授医学...
- 5 篇 药学(可授医学、理...
4 篇 法学
4 篇 艺术学
2 篇 农学
1 篇 经济学
1 篇 教育学

主题

272 篇 computational mo...
230 篇 integrated circu...
190 篇 circuit simulati...
179 篇 microelectronics
126 篇 semiconductor de...
115 篇 analytical model...
107 篇 solid modeling
96 篇 mathematical mod...
65 篇 simulation
61 篇 silicon
58 篇 predictive model...
53 篇 hardware design ...
53 篇 micromechanical ...
50 篇 load modeling
50 篇 hardware
49 篇 cmos technology
47 篇 spice
45 篇 design automatio...
43 篇 logic gates
42 篇 finite element a...

机构

13 篇 institute of mic...
13 篇 institute of mic...
12 篇 institute of mic...
7 篇 institute of mic...
6 篇 department of mi...
6 篇 institute of mic...
6 篇 department of mi...
6 篇 school of softwa...
5 篇 school of microe...
5 篇 nxp semiconducto...
5 篇 national microel...
5 篇 school of microe...
5 篇 institute of mic...
5 篇 philips applied ...
5 篇 imec leuven
5 篇 institute of mic...
5 篇 amic angewandte ...
5 篇 agilent technol ...
5 篇 delft university...
4 篇 shanghai researc...

作者

10 篇 xiaowu zhang
10 篇 roca e.
9 篇 castro-lopez r.
9 篇 a. napieralski
8 篇 rodriguez r.
8 篇 nafria m.
7 篇 l.j. ernst
7 篇 g.q. zhang
7 篇 martin-martinez ...
7 篇 sven rzepka
7 篇 fernandez f. v.
7 篇 s. selberherr
7 篇 zhang gq
6 篇 andrzej napieral...
6 篇 m.k. iyer
6 篇 ru huang
6 篇 n. ranganathan
6 篇 k.m.b. jansen
5 篇 khaoula mbarek
5 篇 sami ghedira

语言

1,398 篇 英文
10 篇 中文
8 篇 其他
3 篇 德文

检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是1091-1100 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Predictive simulation of microdevices and microsystems: The basis of virtual prototyping

Predictive simulation of microdevices and microsystems: The ...

引用

International conference on microelectronics, MIEL

作者： G. Wachutka G. Schrag R. Sattler Institute for Physics of Electrotechnology Munich University of Technology Munich Germany

The rapid progress in microsystems technology is increasingly supported by MEMS-specific modeling methodologies and dedicated simulation tools. These do not only enable the visualization of fabrication processes and operational principles, but they also assist the designer in making decisions with a view to finding optimized microstructures under technological and economical constraints. Currently strong efforts are being made towards simulation platforms for the predictive simulation of microsystems, i.e. the "virtual fabrication" and "virtual experimentation and characterization" on the computer. We discuss the most important aspects to be focussed on and practicable methodologies for microdevice and system modeling, in particular the consistent treatment of coupled fields and coupled domains required for setting up physically-based models for full system mixed-level simulation, and for the reliable validation and accurate calibration of the models.

关键词： Predictive models Virtual prototyping Computational modeling Fabrication Computer simulation Visualization Constraint optimization design optimization Microstructure Economic forecasting

来源：评论

学校读者我要写书评

暂无评论

The Ninth Intersociety conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

The Ninth Intersociety Conference on Thermal and Thermomecha...

引用

Intersociety conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)

The following topics are dealt with: thermal management; thermal interface materials; experimental methods and procedures; natural convection and passive thermal management of electronics; thermal and packaging optimization in telecommunications; forced convection cooling; refrigerated systems; thermal design and sustainability; airborne and space system; heat sinks; micro and meso scale thermal management; fundamentals and applications of conduction; thermal simulation and modeling; system level thermal design of electronic equipment; data center thermal management; package characterization and modeling; novel cooling methods for microelectronics; software tools and techniques; thermal management of microelectronic systems; heat pipes and thermosyphons; high flux liquid cooling techniques; mechanics of materials; lead free solder materials and reliability; constitutive modeling and viscoplasticity; failure mechanics and damage modeling; package level reliability; modeling and simulation; nanoscale phenomena in microelectronics; green packaging; optoelectronics; MEMS modeling and packaging; nanoscale thermal effects in electronics; MEMS thermal management.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Model for electrical simulation of photogate active pixel sensor

Model for electrical simulation of photogate active pixel se...

引用

International conference on microelectronics, ICM

作者： B. Casadei Y. Hu C. Dufaza L. Martin L2MP-Podytech Marseille France ST Microelectronics Rousset France

A new electrical simulation model for photogate active pixel sensor in CMOS imagers is proposed. Review of three conventional models is done and shows lack of accuracy. Therefore photoelectric mechanisms and charges transfer of photogate pixel are analysed and lead to the definition of a Verilog-A description model. This model is then simulated into the Cadence design tool environment and simulation results show great improvements in simulation accuracy of the proposed model versus others ones.

关键词： CMOS image sensors Intelligent sensors Pixel Semiconductor device modeling Photodiodes Switches CMOS technology Sensor phenomena and characterization Image converters Gain

来源：评论

学校读者我要写书评

暂无评论

Trends & challenges in microsystems packaging

Trends & challenges in microsystems packaging

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： M.K. Iyer Microsystems Modules and Components Laboratory Institute of Microelectronics Singapore

Summary form only given. Current and future microsystems require a set of fundamental technologies that include microelectronics, photonics, MEMS, biological and wireless functions. For these functions to be integrated into systems they have to be designed, fabricated, assembled, tested and reliability assured which means they have to be packaged at the system level. This talk addresses some of the trends and key challenges for tomorrow's microsystems and how the microsystems technologies form the drivers of this information age. Research challenges pertinent to design, modeling and simulation, materials and assembly are also covered.

关键词： Packaging microelectronics Photonics Micromechanical devices Radio frequency Stacking Biology Assembly systems Aerospace testing System testing

来源：评论

学校读者我要写书评

暂无评论

Determination of non-linear harmonic distortion in SPICE using the Integral Function Method

Determination of non-linear harmonic distortion in SPICE usi...

引用

International conference on microelectronics, MIEL

作者： M.A. Aleman A. Cerdeira Dcpanamento de Ingenieria Eléctrica Sección de Electrónica del Estado Sólido (SEES) Mexico

The nonlinear harmonic distortion is an important feature in the design and analysis of devices and analog integrated circuits. The design process is usually performed using the SPICE type simulation programs. The SPICE programs use different methods, as Fourier analysis and non linearity coefficients, for analysis distortion but in most of the cases the results are not quite good, In this work we present results of applying the recently developed Integral Function Method (IFM) to the analysis of non-linear harmonic distortion of simulated devices in SPICE.

关键词： Harmonic distortion SPICE Harmonic analysis Circuit simulation MOSFET circuits Total harmonic distortion Signal analysis Process design Computational modeling Analytical models

来源：评论

学校读者我要写书评

暂无评论

Power consumption awareness in cache memory design with SystemC

Power consumption awareness in cache memory design with Syst...

引用

International conference on microelectronics, ICM

作者： S. Niar S. Meftali J.-L. Dekeyser INRIA-FUTURS DART Project University of Lille (USTL) France

This study presents the development of a cache memory module in a component library, designed for fast and synthetic embedded system simulation. This paper also demonstrates the possibility of integrating an existing ... 详细信息

关键词： Energy consumption Cache memory Libraries Embedded system Hardware Mobile computing Electronic packaging thermal management Thermal management Power system modeling design methodology

来源：评论

学校读者我要写书评

暂无评论

VLSI architecture of Rayleigh fading simulator based on IIR filter and polyphase interpolator

VLSI architecture of Rayleigh fading simulator based on IIR ...

引用

International conference on microelectronics, ICM

作者： F. Sattar M. Mufti Department of Computer Engineering University of Engineering and Technology Taxila Pakistan

This paper presents hardware design of a Rayleigh fading simulator that efficiently generates Gaussian variates with Jakes power spectral density. The architecture is based on Komninakis design consisting of a fixed IIR filter followed by a polyphase interpolator for different Doppler rates. The hardware simulator facilitates real time error performance evaluation of wireless channels in Rayleigh fading environments. It also offers the potential of improving the evaluation speed by orders of magnitude over a software based simulation.

关键词： Very large scale integration Rayleigh channels IIR filters Hardware Frequency Computer architecture Computational modeling design engineering Power engineering and energy Fading

来源：评论

学校读者我要写书评

暂无评论

modeling of thermal resistance dependence on design parameters in silicon-on-glass bipolar transistors

Modeling of thermal resistance dependence on design paramete...

引用

International conference on microelectronics, MIEL

作者： F. Tamigi N. Nenadovic V. d'Alessandro L.K. Nanver N. Rinaldi J.W. Slotboom Department of Electronics and Telecommunications Engineering University of Napoli Federico II Naples Italy Laboratory of ECTM DIMES Delft University of Technnology Delft Netherlands

This contribution investigates the scalability of thermal resistance in modem RF bipolar transistors. Several different geometries of silicon-on-glass devices are numerically simulated in 3-D and the dependencies on geometric features are evidenced. A convenient meshing procedure is specifically developed for very thin geometries. simulations are supported by a compact closed-form analytical model. The combination of both simulations and the model allows prediction of thermal resistance at device design stage.

关键词： Thermal resistance Bipolar transistors Geometry Analytical models Predictive models Scalability Modems Radio frequency Solid modeling Numerical simulation

来源：评论

学校读者我要写书评

暂无评论

modeling of integrated monolithic transformers for silicon RF IC

Modeling of integrated monolithic transformers for silicon R...

引用

IEEE International conference on Electronics, Circuits and Systems (ICECS)

作者： O. El-Gharniti E. Kerherve J.-B. Begueret P. Jarry Microelectronics IXL Laboratory-CNRS UMR 5818-ENSEIRB University of Bordeaux 1 France

We present a compact and scalable model for on-chip transformers fabricated in silicon IC technology. The model is driven from the layout and the process technology specifications. It is suitable for design optimization and circuit simulation. EM-simulation is used to validate the model. The proposed model shows excellent agreement with EM-simulation over a large frequency range (1-15 GHz).

关键词： Integrated circuit modeling Transformers Silicon Radio frequency Monolithic integrated circuits Radiofrequency integrated circuits Circuit simulation Integrated circuit technology design optimization Spirals

来源：评论

学校读者我要写书评

暂无评论

Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages

Challenges of thermomechanical design and modeling of ultra ...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： A.A.O. Tay Nano/Microsystems Integration Laboratory Department of Mechanical Engineering National University of Singapore Singapore

With the relentless trend towards ever increasing number of I/Os of IC chips, the pitch of chip-to-substrate interconnections are ever decreasing. As the pitch is decreased so also will be the stand-off. If the coefficient of the thermal expansion of the chip and substrate remains the same, and the temperature cycling range remains the same, the stresses and strains induced in the interconnections will increase dramatically. This will probably decrease the fatigue life of the interconnections to an unacceptably low level unless novel designs and materials can be produced to address the problem. This paper describes the challenges in the design and thermomechanical modeling of the reliability of next generation ultra fine-pitch wafer level packages. Three designs of interconnections at 100 /spl mu/m pitch for 20 mm/spl times/20 mm wafer level packages are proposed and modeled. Two thermomechanical modeling approaches, namely, the equivalent beam approach and the small sector approach, have been developed to perform the the effective modeling of 40,000 interconnections per package. It was found that the key parameter is the coefficient of thermal expansion of the board which has to be made to match closer to that of the silicon chip in order to meet current reliability standards.

关键词： Thermomechanical processes Semiconductor device modeling Wafer scale integration Packaging Thermal expansion Thermal stresses Temperature distribution Capacitive sensors Fatigue Silicon

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共142页 << < 106 107 108 109 110 111 112 113 114 115 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：