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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

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Implementation of hyperbolic functions using CORDIC algorithm

Implementation of hyperbolic functions using CORDIC algorith...

引用

International conference on microelectronics, ICM

作者： A. Boudabous F. Ghozzi M.W. Kharrat N. Masmoudi National Engineering School of Sfax (ENIS) Tunisia

In this paper, we present a new design of hyperbolic functions in order to implement logarithm and exponential functions using CORDIC algorithm (coordinate rotation digital computer). FPGA enable effective implementation of CORDIC algorithm in hardware, which is usually associated with "shift & add" hardware primitives. A comparison with Taylor precision was done to choose the best equation precision order. To valid CORDIC implementation, correction was introduced to remain in logarithm and exponential convergence range. We present simulation and synthesis results and comparison using ModelSim and Synplify/spl ***/Pro Xilinx tools.

关键词： Convergence Hardware Field programmable gate arrays Equations Calculus Information technology design engineering Algorithm design and analysis Computational modeling Calculators

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From chemical building blocks of polymers to microelectronics reliability

From chemical building blocks of polymers to microelectronic...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： H.J.L. Bressers W.D. van Driel K.M.B. Jansen L.J. Ernst G.Q. Zhang ATO Innovation/Philips Semiconductors Nijmegen Netherlands Delft University of Technnology Delft Netherlands Philips CFT Eindhoven Netherlands

Among various materials, polymers are widely used in microelectronics as different product constituents, such as encapsulants, conductive or non-conductive adhesives, underfills, molding compounds, insulators, dielectrics, and coatings. The behavior of these polymer constituents determines the performance, such as functionality and reliability, of the final products. Therefore, the successful development of microelectronics depends on, to some extent, the optimal design and processing of polymer materials. Due to the development trends of microelectronics, characterized mainly by ongoing miniaturization down to the nano scale, technology and functionality integration, eco-designing, shorter-time-to-market, development and application of polymers become one of the bottlenecks for the microelectronic industry. Aiming at optimizing the product/process development, much effort is directed to understanding and designing polymer behavior in microelectronics, such as in material pre-selection, processing, characterization and modeling. Although these efforts are necessary, the ultimate benefits can only be realized if the relationship between chemistry and the behavior can be understood and predicted. This paper presents some results of our effort to establish the links between chemical details of the polymers and microelectronics reliability.

关键词： Chemicals microelectronics Conducting materials Dielectric materials Polymer films Nonconductive adhesives Dielectrics and electrical insulation Plastic insulation Coatings Process design

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Demonstration of a SiGe RF LNA design using IBM design kits in 0.18 /spl mu/m SiGe BiCMOS technology

Demonstration of a SiGe RF LNA design using IBM design kits ...

引用

design, Automation and Test in Europe conference and Exhibition

作者： Yiming Chen Xiaojuen Yuan D. Scagnelli J. Mecke J. Gross D. Harame Microelectronics Division IBM CA USA Microelectronics Division BTV IBM VT USA

ISBN: (纸本)0769520855

A 1.5 GHz-2.0 GHz low noise amplifier (LNA) is designed in IBM 0.18 um BiCMOS technology using IBM design kits in cadence design flow. The fabricated LNA chip is packaged and tested. The measured results (gain, noise figure, and IIP3) correlate with the simulation very well. The results demonstrate that IBM SiGe technology, modeling, design kits and the cadence design flow are solid and accurate for RFIC design.

关键词： Silicon germanium Germanium silicon alloys Radio frequency BiCMOS integrated circuits Low-noise amplifiers Radiofrequency amplifiers Packaging Testing Gain measurement Noise measurement

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Hardware description language modeling of an electrostatically actuated bi-axial micromirror

Hardware description language modeling of an electrostatical...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： F. Parrain S. Megherbi G. Raynaud H. Mathias J.-P. Gilles A. Bosseboeuf G. Schropfer N. Faure P. Cusin Institut d'Electronique Fondamentale UMR 8622 Université Paris-Sud Orsay France Coventor Inc. Villebon France Colibrys S.A. Neuchatel Switzerland

Recent developments in micro-electro-mechanical system (MEMS) and micromachining technologies have made possible the development and the integration of micromirrors that can be employed for a number of consumer applications, such as free space optical switching, 2D scanning, or image projection. This high level of integration provides many advantages such as reproductivity and improved performance. Obviously, these increased levels of miniaturization raise new characterization and modeling concerns. We present in this paper the design, the fabrication process, the characterization and the behavioral modeling approach of a novel electrostatically actuated bi-axial micromirror. This MOEMS is a result of a joint development between our partners Colibrys and Coventor companies. In the field of this work, two HDL multi-physics models using Verilog-A language and Matlab have been developed and validated by different experimental measurements.

关键词： Hardware design languages Micromirrors Mathematical model Space technology Microelectromechanical systems Micromechanical devices Micromachining Integrated optics Process design Optical device fabrication

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A computer-architecture approach to thermal management in computer systems: opportunities and challenges

A computer-architecture approach to thermal management in co...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： K. Skadron M.R. Stan Wei Huang K. Sankaranarayanan Zhijian Lu J. Lach Department of Computer Science University of Virginia Charlottesville VA USA Department of Electrical and Computer Engineering University of Virginia Charlottesville VA USA

Cooling costs for notebook, desktop, and server computer systems are rising exponentially as power densities for high-performance chips continue to double every three years. Research has led to a range of advances in modeling and design of thermal packaging and circuit boards. Yet a major front that has been absent is thermal design in the computer architecture domain, where processor utilization, the interleaving of different computation processes, and the flow of instructions through the CPU are controlled. The architecture domain presents a rich opportunity for thermal management that complements other advances by controlling temperature at runtime in response to the dynamic behavior of the computer's current workload. This paper describes a compact modeling algorithm that is appropriate for this domain, presents some architecture techniques for runtime thermal management, and describes some interesting problems that remain to be solved.

关键词： Thermal management Computer architecture Runtime Power system management Cooling Costs Power system modeling Packaging Printed circuits Interleaved codes

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Nonlinear distortion simulation algorithm with capability of distortion diagnosis for analog and RF integrated circuits

Nonlinear distortion simulation algorithm with capability of...

引用

International conference on Solid-State and Integrated Circuit Technology

作者： Lin Zhang Li Zhang Zhiping Yu Institute of Microelectronics Tsinghua University Beijing China

ISBN: (纸本)078038511X

A nonlinear distortion simulation algorithm for analog and RF circuits that can generate individual distortion contributions is presented. This algorithm utilizes middle parameters in harmonic balance iterations to generate nonlinear current sources that can be used in consecutive current method of Volterra series analysis. Its computation complexity is simpler than Volterra series analysis while the results are similar circuit examples are used to demonstrate the efficacy the algorithm.

关键词： Nonlinear distortion Circuit simulation Radio frequency Analog integrated circuits Radiofrequency integrated circuits Algorithm design and analysis Computational modeling Steady-state Linear systems microelectronics

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Application of carrier lifetime control by irradiation to 1.2kV NPT IGBTs

Application of carrier lifetime control by irradiation to 1....

引用

International conference on microelectronics, MIEL

作者： R. Siemieniec R. Herzer M. Netzel J. Lutz Department of Solid-State Electronics Technische Universitaet Ilmenau Germany Semikron Elektronik GmbH and Company Nurnberg Germany Facully of Electrical Engineering Information Technology Technische Universitaet Chemnitz Germany

Device simulation, based on an extended recombination model and previously determined recombination center parameters, serves as design tool for carrier-lifetime controlled, state-of-the-art 1.2kV NPT IGBTs. Homogenous and local recombination center profiles are considered. The sensitivity of important device characteristics to the type of the recombination center profile is investigated in simulation and experiment. A possible application, the improvement of reverse leakage properties of reverse blocking capable NPT IGBTs, is discussed.

关键词： Charge carrier lifetime Insulated gate bipolar transistors Radiative recombination Spontaneous emission Poisson equations Manufacturing Silicon Electron traps Leakage current Solid modeling

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Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches

Crack and delamination risk evaluation of thin silicon appli...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： J. Auersperg D. Vogel B. Michel Department Mechanical Reliability and Micro Materials Fraunhofer Institute of Reliability and Microintegration (IZM) Berlin Germany AMIC Angewandte Micro-Messtechnik GmbH Berlin Germany

Enhanced miniaturization and system integration of microelectronics components demands growth in novel solutions toward embedding active and passive components into substrates, clothes, protective sleeves of consumer goods - smart, thin applications in general. As a result, the embedding of very thin silicon dies and metallic structures into highly flexible polymeric, paper like or textile materials causes several mechanical problems preventing those applications from being utilized. This paper intends to demonstrate and discuss advantages and needs of using fully parameterized finite element modeling techniques for design optimizations of thin devices on the basis of damage evaluation and fracture mechanics approaches. For improving that method, the evaluation of mixed mode interface delamination phenomena and fracture of embedded thin silicon were combined with experimental investigations.

关键词： Delamination Silicon microelectronics Electronic packaging thermal management Thermal stresses Protection Polymers Textiles Inorganic materials Finite element methods

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Optimizing low-power high-speed full adders with simulated annealing

Optimizing low-power high-speed full adders with simulated a...

引用

International conference on microelectronics, ICM

作者： A. Amirabadi Y. Mortazavi A. Afzali-Kusha Department of Electrical and Computer Engineering University of Tehran Tehran Iran

In this paper, a random search algorithm known as simulated annealing (SA) has been employed to optimize the sizing of a number of digital adder circuits. The SA algorithm is implemented in MATLAB; the cost function, a function of power and delay, is accurately computed using HSPICE for a 0.35 /spl mu/m technology. Using a piecewise linear and logarithmic cost function, the delay and power is optimized in an intelligent fashion. The results show a 60% reduction in power and a 65% reduction in delay with respect to previous designs based on analytical calculations.

关键词： Simulated annealing Adders Circuit simulation Delay Computational modeling Cost function design engineering MATLAB Optical computing Piecewise linear techniques

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Wireless system validation using VHDL-AMS behavioral antenna models: radio-frequency identification case study

Wireless system validation using VHDL-AMS behavioral antenna...

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European conference on Wireless Technology

作者： R. Khouri V. Beroulle T.-P. Vuong S. Tedjini LCIS-ESISAR Valence France

In order to generate a first-time right design, system level modeling and simulation is a must. Thus, functional validation of integrated wireless systems requires the development of antenna models compatible with the microelectronic design tools. This paper presents the first VHDLAMS model of a wireless system that includes an RF link. Firstly, a behavioral model of a simple antenna is presented, then, a complete RFID system behavioral model is described at the system level. Finally, some examples of system simulation are presented in order to demonstrate the interest of our approach.

关键词： Radio frequency Radiofrequency identification Computer aided software engineering Signal design microelectronics design methodology Receiving antennas Transmitting antennas Equivalent circuits Antenna accessories

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