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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是111-120 订阅
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Analytical Calculation of Core Loss and Magnetic Flux Density in E-Cores
Analytical Calculation of Core Loss and Magnetic Flux Densit...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Talits Kevin Tebruegge Claas Pfost Martin Chair of Energy Conversion Technical University of Dortmund Dortmund Germany E-LAB HELLA GmbH & Co. KGaA Lippstadt Germany
This paper improves the analytic calculation of magnetic flux density and core loss inside an E-core made up of ferrite. Based on Finite Element Analysis (FEA) simulations, the error of analytical techniques is evalua... 详细信息
来源: 评论
Reduced Shell Model for the simulation of Crosstalk in Piezoelectric Micromachined Ultrasound Transducer Arrays
Reduced Shell Model for the Simulation of Crosstalk in Piezo...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Philipp Möhrle Aleskander Bajt Gabriele Schrag Technical University Munich Munich Germany Fraunhofer Institute for Electronic Microsystems and Solid State Technologies Munich
Piezoelectric micromachined ultrasonic transducers (PMUTs) offer a promising approach for generating ultrasonic waves across various applications. Typically utilized in large arrays, this poses significant challenges ... 详细信息
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Fatigue Delamination Study of Parylene as Electronic Packaging Material
Fatigue Delamination Study of Parylene as Electronic Packagi...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Carlos Rincon-Ruiz Uwe Zschenderlein Martin Kühn Franz Selbmann Bernhard Wunderle Materials and Reliability of Microsystems University of Technology Chemnitz Chemnitz Germany Department System Packaging Fraunhofer ENAS Chemnitz Germany
Parylene has emerged as a promising substrate material in the development of electronic packaging due to its important dielectric properties, optical transparency, biocompatibility, and mechanical flexibility. However... 详细信息
来源: 评论
Applying Hodgkin-Huxley Neuron Model for Perovskite Memristor in Circuit simulation
Applying Hodgkin-Huxley Neuron Model for Perovskite Memristo...
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Metrology for Extended Reality, Artificial Intelligence and Neural Engineering (MetroXRAINE), IEEE International conference on
作者: Mostafa Shooshtari Manuel Jiménez Través Saeideh Pahlavan Teresa Serrano-Gotarredona Bernabé Linares-Barranco The Neuromorphic Group Institute of Microelectronics of Seville (IMSE-CNM) CSIC University of Seville. Sevilla Spain
The convergence of memristor technology and neuromorphic computing represents a paradigm shift in the field of electronics and artificial intelligence (AI). Memristors, with their ability to remember past electrical s... 详细信息
来源: 评论
Multi-dimensional Parameter Fitting Method for Device Aging modeling
Multi-dimensional Parameter Fitting Method for Device Aging ...
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Asia Pacific conference on Postgraduate Research in microelectronics & Electronics (PrimeAsia)
作者: Qianqian Sang Xinhuan Yang Chuanzheng Wang Shuo Wang Liang Wang Yuanfu Zhao School of Electronic Information Hangzhou Dianzi University Hangzhou China Beijing Microelectronics Technology Institute Beijing China
As semiconductor devices become smaller and smaller, device aging simulation plays an increasingly important role in the overall circuit design. In recent years, the research of device aging modeling has gradually bec...
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Model order reduction for nonlinear modal analysis of MEMS devices: theory and recent advancements
Model order reduction for nonlinear modal analysis of MEMS d...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Andrea Opreni Peter Degenfeld-Schonburg Engineering MEMS Design Robert Bosch GmbH Tübinger Straße 123 Reutlingen Germany Corporate Research Robert Bosch GmbH Robert Bosch Campus 1 Renningen Germany
designing resonating components as MEMS gyroscopes, micromirrors, and resonators requires accurate prediction of their nonlinear dynamic response. This ensures avoiding undesired effects as hardening/softening behavio... 详细信息
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Automatic Digital modeling for Analog Blocks in Mixed-Signal Verification
Automatic Digital Modeling for Analog Blocks in Mixed-Signal...
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2021 China Semiconductor Technology International conference, CSTIC 2021
作者: Leng, Yangyang Ye, Zuochang Xin, Jian Wang, Zhikai Wang, Yan The Institute of Microelectronics Tsinghua University Beijing China
Analog circuits are indispensable in practical circuit design, even in digital circuit systems. Mixed-signal circuits often cost a lot of simulation time. In this paper, we propose an automatic digital modeling algori... 详细信息
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Simulating the Co-Evolution of Porous Microstructures and Grain Growth in Sintered Ag Die Attach Layers
Simulating the Co-Evolution of Porous Microstructures and Gr...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Xiao Hu Jianlin Huang René Poelma Hans van Rijckevorsel Willem Dirk van Driel Guoqi Zhang Department of Microelectronics Delft University of Technology Delft The Netherlands Ampleon B.V. Nijmegen The Netherlands Nexperia Nijmegen The Netherlands
In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, w... 详细信息
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A Stacking-Based Method for Path Loss Prediction in Evaporation Ducts
A Stacking-Based Method for Path Loss Prediction in Evaporat...
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Future Communications and Networks (FCN), International conference on
作者: Huazheng Miao Hanzhong Zhang Tianheng Xu Ting Zhou Honglin Hu School of Microelectronics Shanghai University China Shanghai Advanced Research Institute Chinese Academy of Sciences China
Evaporation duct is a common atmospheric phenomenon in marine environments, which significantly affects signal transmission. Accurately predicting path loss (PL) in evaporation ducts is crucial for the design of marit... 详细信息
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Warpage Prediction of mmWave Antenna-Inpackage Modules During Solder Reflow
Warpage Prediction of mmWave Antenna-Inpackage Modules Durin...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: M. van Soestbergen A. Ghannam B. Gustafson J.W. Bergman NXP Semiconductors Nijmegen the Netherlands 3DiS Technologies S.A.S Labège France Ericsson AB Stockholm Sweden
Millimeter-wave (mmWave) technology promises to revolutionize communication by delivering faster data rates, higher capacity, and lower latency, while also enabling innovative applications such as combined communicati... 详细信息
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