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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1418 条记录，以下是111-120 订阅

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Analytical Calculation of Core Loss and Magnetic Flux Density in E-Cores

Analytical Calculation of Core Loss and Magnetic Flux Densit...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Talits Kevin Tebruegge Claas Pfost Martin Chair of Energy Conversion Technical University of Dortmund Dortmund Germany E-LAB HELLA GmbH & Co. KGaA Lippstadt Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

This paper improves the analytic calculation of magnetic flux density and core loss inside an E-core made up of ferrite. Based on Finite Element Analysis (FEA) simulations, the error of analytical techniques is evaluated, and new corrections applied. Target values are the total core loss, mean magnetic flux density and standard deviation. The calculation of the magnetic flux density and core loss using analytical formulas and finite element simulations are compared. simulation model construction and their calculation is conducted in ANSYS Maxwell software. The proposed changes in the analytic calculation enables developers to generate fast design studies with over 100 000 analytic calculations in the same time one simulation runs. Calculations of the analytical computations match with the simulation results with a minimum error of 1.424% for constant permeability. Non-Linear permeability exhibits the maximum error of calculation with 11.625%, in contrast to an error of 52.888% with a not optimized method.

关键词： Magnetic flux density Analytical models Solid modeling Uncertainty Magnetic cores Core loss Windings Permeability Finite element analysis Standards

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Reduced Shell Model for the simulation of Crosstalk in Piezoelectric Micromachined Ultrasound Transducer Arrays

Reduced Shell Model for the Simulation of Crosstalk in Piezo...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Philipp Möhrle Aleskander Bajt Gabriele Schrag Technical University Munich Munich Germany Fraunhofer Institute for Electronic Microsystems and Solid State Technologies Munich

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Piezoelectric micromachined ultrasonic transducers (PMUTs) offer a promising approach for generating ultrasonic waves across various applications. Typically utilized in large arrays, this poses significant challenges on design and simulation, particularly if crosstalk induced by surface acoustic waves (SAWs) are to be modeled, leading to extensive computation times and a large amount of random-access memory needed. To overcome these challenges, we developed a Finite Element Method (FEM)-based shell model of a PMUT cell, which we benchmarked against an FEM solid model. This shell model significantly reduces simulation time while maintaining high accuracy in predicting sound radiation, eigenfrequency and inplane stress. When applied to large arrays, this model enables the exploration of acoustic radiation with phase-varied arrays and the mutual interactions of PMUT cells through surface acoustic waves.

关键词： Phased arrays Micromechanical devices Ultrasonic transducers Solid modeling Ultrasonic imaging Transducers Surface acoustic waves Crosstalk Acoustic arrays Finite element analysis

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Fatigue Delamination Study of Parylene as Electronic Packaging Material

Fatigue Delamination Study of Parylene as Electronic Packagi...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Carlos Rincon-Ruiz Uwe Zschenderlein Martin Kühn Franz Selbmann Bernhard Wunderle Materials and Reliability of Microsystems University of Technology Chemnitz Chemnitz Germany Department System Packaging Fraunhofer ENAS Chemnitz Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Parylene has emerged as a promising substrate material in the development of electronic packaging due to its important dielectric properties, optical transparency, biocompatibility, and mechanical flexibility. However, limited information exists regarding its performance and properties bonded to other packaging materials under cyclic loading, which is critical for long-term reliability. This study presents the development of a numerical-experimental method for characterizing the delamination behavior of parylene under fatigue conditions, essential for the design and simulation of electronic packaging. A fatigue cohesive zone model (FCZM) was formulated to describe the strength degradation of a Si-Parylene C interface and integrated to a finite element model of the sample structure. The parameters of the FCZM were calculated trough its fitting to experimental data from a custom setup.

关键词： Degradation Packaging Fatigue Silicon Optical materials Numerical models Delamination Substrates Electronics packaging Load modeling

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Applying Hodgkin-Huxley Neuron Model for Perovskite Memristor in Circuit simulation

Applying Hodgkin-Huxley Neuron Model for Perovskite Memristo...

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Metrology for Extended Reality, Artificial Intelligence and Neural Engineering (MetroXRAINE), IEEE International conference on

作者： Mostafa Shooshtari Manuel Jiménez Través Saeideh Pahlavan Teresa Serrano-Gotarredona Bernabé Linares-Barranco The Neuromorphic Group Institute of Microelectronics of Seville (IMSE-CNM) CSIC University of Seville. Sevilla Spain

ISBN: (数字)9798350378009

ISBN: (纸本)9798350378016

The convergence of memristor technology and neuromorphic computing represents a paradigm shift in the field of electronics and artificial intelligence (AI). Memristors, with their ability to remember past electrical states, offer a fundamental building block for the realization of energy-efficient and adaptive electronic systems. Meanwhile, neuromorphic computing, inspired by the brain's architecture and functionality, aims to emulate its efficiency and adaptability in electronic circuits. This paper introduces a mathematical model, the Hodgkin-Huxley model, to describe the behavior of metal halide perovskite (MHP) memristors within the framework of neuromorphic computing. By extending a set of nonlinear differential equations and implementing them in Verilog-A code, the model facilitates the simulation and analysis of perovskite memristors within electronic circuits. Through comprehensive simulations, the model successfully reproduces both volatile and nonvolatile switching behaviors observed in perovskite-based memristors, demonstrating its versatility and applicability in electronic circuit design. The simulation results demonstrate that with appropriate excitation, the output current in the memristor nonlinearly tracks the input voltage, resulting in the observation of the initial high-resistance (HRS) state and the low-resistance state (LRS) in the presented structures. Moreover, Altering the scan and range of the input voltage can subsequently modify the resistance of the memristors and the threshold voltage. The design is presented, along with its corresponding simulation results using the Cadence Virtuoso toolset. The proposed MHP memristors structure combines the density and scalability advantages of memristive crossbar arrays with the feasibility of implementing them at the top of the CMOS layer. These findings offer insights into the potential of perovskite memristors to revolutionize various fields, including artificial intelligence, energy-efficient com

关键词： Adaptation models Electric potential Neuromorphic engineering Computational modeling Memristors Perovskites Mathematical models Integrated circuit modeling Artificial intelligence Electronic circuits

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Multi-dimensional Parameter Fitting Method for Device Aging modeling

Multi-dimensional Parameter Fitting Method for Device Aging ...

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Asia Pacific conference on Postgraduate Research in microelectronics & Electronics (PrimeAsia)

作者： Qianqian Sang Xinhuan Yang Chuanzheng Wang Shuo Wang Liang Wang Yuanfu Zhao School of Electronic Information Hangzhou Dianzi University Hangzhou China Beijing Microelectronics Technology Institute Beijing China

As semiconductor devices become smaller and smaller, device aging simulation plays an increasingly important role in the overall circuit design. In recent years, the research of device aging modeling has gradually become the focus of researchers. Most of the current aging modeling methods only consider the degradation of one parameter, resulting in inaccurate simulation of the model in actual testing. In response to this problem, this paper establishes an HCI(Hot Carrier Injection) aging model on NMOS devices, focusing on the simultaneous degradation of multiple parameters (drain current in saturation region $(I_{dsat})$ and threshold voltage $(v_{th})$ in the process of extracting model parameters. simulation results show that this method can improve the fitting accuracy of aging model.

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Model order reduction for nonlinear modal analysis of MEMS devices: theory and recent advancements

Model order reduction for nonlinear modal analysis of MEMS d...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Andrea Opreni Peter Degenfeld-Schonburg Engineering MEMS Design Robert Bosch GmbH Tübinger Straße 123 Reutlingen Germany Corporate Research Robert Bosch GmbH Robert Bosch Campus 1 Renningen Germany

designing resonating components as MEMS gyroscopes, micromirrors, and resonators requires accurate prediction of their nonlinear dynamic response. This ensures avoiding undesired effects as hardening/softening behaviour and internal resonance. However, computing oscillatory stationary states in MEMS systems with high quality factors from finite element models is prohibitively costly from a computational viewpoint, hence model order reduction techniques are necesssary. In the present work we detail computational aspects of model order reduction techniques suitable for MEMS devices exhibiting geometrically nonlinear behaviour, together with numerical results provided by state of the art methods on MEMS components.

关键词： Micromechanical devices Vibrations Computational modeling Stationary state Mathematical models Data models Numerical models

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Automatic Digital modeling for Analog Blocks in Mixed-Signal Verification

Automatic Digital Modeling for Analog Blocks in Mixed-Signal...

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2021 China Semiconductor Technology International conference, CSTIC 2021

作者： Leng, Yangyang Ye, Zuochang Xin, Jian Wang, Zhikai Wang, Yan The Institute of Microelectronics Tsinghua University Beijing China

ISBN: (纸本)9781665449458

Analog circuits are indispensable in practical circuit design, even in digital circuit systems. Mixed-signal circuits often cost a lot of simulation time. In this paper, we propose an automatic digital modeling algorithm to speed up the mixed-signal simulation. The algorithm is based on dynamic mode decomposition (DMD), which converts the mixed-signal circuit into a pure digital circuit. Experiments shows >100X speed-up compared with mixed-signal simulation. © 2021 IEEE.

关键词： Integrated circuit manufacture

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Simulating the Co-Evolution of Porous Microstructures and Grain Growth in Sintered Ag Die Attach Layers

Simulating the Co-Evolution of Porous Microstructures and Gr...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Xiao Hu Jianlin Huang René Poelma Hans van Rijckevorsel Willem Dirk van Driel Guoqi Zhang Department of Microelectronics Delft University of Technology Delft The Netherlands Ampleon B.V. Nijmegen The Netherlands Nexperia Nijmegen The Netherlands

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, while the phase field model describes the evolution of the porous network. These models are coupled via a hybrid free energy function to achieve a realistic representation of the microstructure evolution. This study further extends the hybrid model by incorporating (a) a flexible exchange interaction matrix to model the crystal anisotropy in grain growth, (b) Glauber or Kawasaki dynamics to describe different diffusion mechanisms, and (c) the effect of pinning sites, representing impurity-driven grain boundary stabilization. The computational framework is implemented using Taichi Lang, which allows for efficient parallel simulations. Results show that the model effectively captures the long-term evolution of the sintered silver microstructure in good agreement with experimental observations. This hybrid model is a powerful tool to predict microstructural reliability of sintered silver die attach layers, supporting material design and process optimization for high-power electronic applications.

关键词： Grain boundaries Silver Computational modeling Data models Computational efficiency Microstructure Thermal stresses Optimization Stress Microassembly

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A Stacking-Based Method for Path Loss Prediction in Evaporation Ducts

A Stacking-Based Method for Path Loss Prediction in Evaporat...

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Future Communications and Networks (FCN), International conference on

作者： Huazheng Miao Hanzhong Zhang Tianheng Xu Ting Zhou Honglin Hu School of Microelectronics Shanghai University China Shanghai Advanced Research Institute Chinese Academy of Sciences China

ISBN: (数字)9798331512880

ISBN: (纸本)9798331512897

Evaporation duct is a common atmospheric phenomenon in marine environments, which significantly affects signal transmission. Accurately predicting path loss (PL) in evaporation ducts is crucial for the design of maritime communication systems. This paper presents an ensemble method based on stacked generalization (stacking) to predict PL in evaporation ducts. Specifically, the stacking model employs a deep neural network (DNN) as the base learner in the first layer and a random forest as the meta learner in the second layer, using meteorological and antenna parameters as inputs to predict PL values. Compared to the state-of-the-art DNN model, the mean absolute error and mean square error values of the stacking model decrease by 41.57% and 20.81%, respectively. Meanwhile, the proportion of stacking model predictions with relative errors below 1% reaches 92.02%. simulation results demonstrate that the stacking-based ensemble method outperforms single models and shows good potential for future investigations into evaporation ducts.

关键词： Radio frequency Atmospheric modeling simulation Stacking Ducts Predictive models Evaporation Numerical models Ensemble learning Maritime communications

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Warpage Prediction of mmWave Antenna-Inpackage Modules During Solder Reflow

Warpage Prediction of mmWave Antenna-Inpackage Modules Durin...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： M. van Soestbergen A. Ghannam B. Gustafson J.W. Bergman NXP Semiconductors Nijmegen the Netherlands 3DiS Technologies S.A.S Labège France Ericsson AB Stockholm Sweden

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Millimeter-wave (mmWave) technology promises to revolutionize communication by delivering faster data rates, higher capacity, and lower latency, while also enabling innovative applications such as combined communication and radar-like sensing. The mmWave technology allows for compact antenna designs that can be integrated directly into the package. In this work, we explore a prototype that combines beamforming capabilities, antenna structures, and frequency conversion into a single module. The complex interconnect routing, low-loss RF dielectrics, and the large lateral dimensions relative to its thickness lead to significant intrinsic warpage of the module. To address this, we developed a sophisticated simulation model to predict the warpage and optimize the module's design and material selection. Through both simulation and experimental validation, we found that using a low-temperature solder alloy (BiSnAg) and strategically placing solder bumps allows the modules to be successfully soldered onto a printed circuit board at $200 \mu ~\mathrm{m}$ component spacing.

关键词： Semiconductor device modeling Thermal expansion simulation Metals Sensors Virtual prototyping Millimeter wave communication Tuning Standards Reflow soldering

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