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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是1251-1260 订阅
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design and Optimization of Bump Structures of Large Die Fine Pitch Copper/Low-k FCBGA and Copper Post Interconnections
Design and Optimization of Bump Structures of Large Die Fine...
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Electronics Packaging Technology conference (EPTC)
作者: Kalyan Biswas Shiguo Liu Xiaowu Zhang TC Chai IBIDEN Singapore Private Limited Singapore Singapore Institute of Microelectronics Singapore
This paper presents the study on the effect of bump structure, chip pad structures and die thickness of a large die Cu/low-k chip for improving assembly performance on organic buildup substrate. After assembly with th... 详细信息
来源: 评论
design, modeling and simulation of an Anchorless Nano-Electro- Mechanical Nonvolatile Memory
Design, Modeling and Simulation of an Anchorless Nano-Electr...
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2012 International conference on Solid-State and Integrated Circuit(ICSIC 2012)
作者: Ramesh Vaddi Vincent Pott Julius Tsai Ming Lin Tony T. Kim VIRTUS School of Electrical and Electronic Engineering Nanyang Technological University50 Nanyang Avenue Singapore 639798 Institute of Microelectronics A*STAR (Agency for Science Technology and Research) 11 Science Park Road Singapore Science Park ⅡSingapore 117685
Non Volatile Memories (NVMs) based on a storage layer, like FLASH, suffer from poor retention at high temperature, high voltage writing, and wear out while cycling. This paper presents the structure, operation and mod... 详细信息
来源: 评论
Molecular simulation of cu-sam adhesion force
Molecular simulation of cu-sam adhesion force
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Haibo Fan C.K.Y. Wong M.M.F. Yuen Department of Mechanical Engineering Hong Kong University of Science and Technology Kowloon Hong Kong China
The interface of Copper-EMC (Epoxy Molding Compound) is known to be the weakest joint in the electronic package design, which causes delamination during reliability test. A prime reason is the poor adhesion between Cu... 详细信息
来源: 评论
Quick generation of temporal power waveforms for RT-level hard macros
Quick generation of temporal power waveforms for RT-level ha...
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IEEE International conference on Innovative Systems in Silicon
作者: L. Benini G. De Micheli E. Macii M. Poncino R. Scarsi Computer Systems Laboratory University of Stanford Stanford CA USA Dip. di Automatica e Informatica Politecnico di Torino Torino Italy
Power characterization of complex macros is essential to enable accurate RT-level power estimation. Existing characterization procedures focus on the average value of power. In this paper, we take a fresh look at this... 详细信息
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Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments
Molecular dynamic simulations of maximum pull-out forces of ...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Steffen Hartmann Ole Hölck Thomas Blaudeck Sascha Hermann Stefan E. Schulz Thomas Gessner Bernhard Wunderle Technische Universität Chemnitz Chemnitz Germany
We present investigations of pull-out tests on CNTs embedded in palladium by means of molecular dynamics (MD) and compare our results of maximum pull-out forces with values of nano scale in situ pull-out tests inside ... 详细信息
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External field enhancement in coupled polymer microcavities - New options for integrated photonic components
External field enhancement in coupled polymer microcavities ...
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conference on Lasers and Electro-Optics Europe (CLEO EUROPE)
作者: Nicolas Innocenti Sergei Popov Sergey Sergeyev Ari T. Friberg Department of Microelectronics and Applied Physics Royal Institute of Technology Kista Sweden Optics Research Group Waterford Institute of Technology Waterford Ireland Department of Applied Physics Helsinki University of Technology Finland Department of Physics and Mathematics University of Joensuu Joensuu Finland
Microcavities are key components for integrated optical devices and systems. In this paper, enhancement of the resonance electric field outside a pair of coupled polymeric microcavities of hexagonal shape is investiga... 详细信息
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An Efficient 90nm Technology-Node GHz Transceiver of On-Chip Global Interconnect
An Efficient 90nm Technology-Node GHz Transceiver of On-Chip...
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2011 IEEE 9th International conference on ASIC(2011年第九届IEEE国际专用集成电路大会)
作者: Zaixiao Zheng Zhigang Mao Jianfei Jiang Department of Microelectronics Shanghai JiaoTong University Shanghai 200240. China
Today high speed signal transmission system for on chip global interconnect requires elaborate design of the transceiver. The design goal of transceiver is to ensure the transmission obtains 'an improvement in ... 详细信息
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Verification of transaction-level SystemC models using RTL testbenches  03
Verification of transaction-level SystemC models using RTL t...
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ACM and IEEE International conference on Formal Methods and Models for Co-design (MEMOCODE)
作者: R. Jindal K. Jain CRnD STMicroelectronics India
System architects working on SoC design have traditionally been hampered by the lack of a coherent methodology for architecture evaluation and co-verification of hardware and software. SystemC 2.0 facilitates the deve... 详细信息
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modeling of SiC power modules with double sided cooling
Modeling of SiC power modules with double sided cooling
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Klas Brinkfeldt Klaus Neumaier Alexander Mann Olaf Zschieschang Alexander Otto Eberhard Kaulfersch Michael Edwards Dag Andersson Swerea IVF Mölndal Sweden Fairchild Semiconductor GmbH Aschheim Germany Fraunhofer ENAS Chemnitz Germany Berliner Nanotest und Design GmbH Berlin Germany
Silicon Carbide (SiC) based transistor devices have demonstrated higher efficiency switching operation compared to silicon-based, state-of-the-art solutions due to the superior electrical and thermal properties of the... 详细信息
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Multi-scale energy-based failure modeling of bond pad structures
Multi-scale energy-based failure modeling of bond pad struct...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: O. van der Sluis R.B.R. van Silfhout R.A.B. Engelen W.D. van Driel G.Q. Zhang Department of Precision and Microsystem Engineering Delft University of Technology the Netherlands Philips Applied Technologies Eindhoven The Netherlands Department of Precision and Microsystem Engineering Delft University of Technnology Netherlands NXP Semiconductors Nijmegen The Netherlands NXP Semiconductors Nijmegen AE The Netherlands
Thermo-mechanical reliability issues have been identified as major bottlenecks in the development of future microelectronic components. This is caused by the following technology and business trends: (1) increasing mi... 详细信息
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