A new formulation for gate-leakage currents due to quantum tunneling is presented. The resulting model has been inserted into software modules. The relative importance of various gate stack design parameters is invest...
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A new formulation for gate-leakage currents due to quantum tunneling is presented. The resulting model has been inserted into software modules. The relative importance of various gate stack design parameters is investigated using DOE/RSM methods.
The dominance of system performance by interconnect delay in deep-submicron design presents many challenges to physical design tool developers. This paper presents an efficient ANN-based technique for modeling interco...
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The dominance of system performance by interconnect delay in deep-submicron design presents many challenges to physical design tool developers. This paper presents an efficient ANN-based technique for modeling interconnect crosstalk in integrated circuits. ANN models for user-defined interconnect primitives called wirecells are trained and tested using a database created using a suitable simulation package. For fixed wirecell length and geometry, inputs to the ANN include signal frequency, input voltage amplitude, near and far end termination impedances. Outputs derived from the ANN include crosstalk voltage peak and RMS values and spectral composition. Experimental results demonstrate the ability of this approach to successfully predict coupled noise in modest cpu times compared with existing approaches.
In this paper, a cycle-based RT level simulation engine is being discussed. Issues treated include component extraction, component ordering and feedback detection from behavioral VHDL descriptions. Proposing new metho...
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ISBN:
(纸本)9643600572
In this paper, a cycle-based RT level simulation engine is being discussed. Issues treated include component extraction, component ordering and feedback detection from behavioral VHDL descriptions. Proposing new methods in these topics, we try to give solutions for the problems that VHDL register transfer level simulators have to deal with. We also introduce a levelization method that due to its compatibility with the nature of RTL VHDL increases the simulation speed.
This paper presents a mixed-signal/multi-language simulation environment for the languages VHDL-AMS, Java, and C++. The environment is implemented in Java and based upon a previously developed VHDL-AMS design environm...
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ISBN:
(纸本)0780365984
This paper presents a mixed-signal/multi-language simulation environment for the languages VHDL-AMS, Java, and C++. The environment is implemented in Java and based upon a previously developed VHDL-AMS design environment consisting of a compiler, an elaborator and a simulator. The latter was extended by open object-oriented Java and C++ interfaces towards system-level simulation capabilities. Obviously, this approach lends itself to a VHDL-centric modeling style. However it also results in a well-defined overall simulation semantics based on the proven semantic principles of VHDL-AMS. Moreover the object-oriented Java and C++ interfaces enforce a much better language modeling style than traditional callback-based procedural language interfaces. The presented open architecture provides good capabilities for research in the field of system-level simulation.
This paper reviews the evolution of partially depleted (PD) CMOS SOI technology at IBM. Several aspects of this development leading to successful fabrication of high-performance microprocessors are discussed. They inc...
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ISBN:
(纸本)9643600572
This paper reviews the evolution of partially depleted (PD) CMOS SOI technology at IBM. Several aspects of this development leading to successful fabrication of high-performance microprocessors are discussed. They include SOI-specific device design and process modifications; creation of compact device models for circuit simulation (SPICE-like models); and development of circuit styles and strategies employed in the design of CMOS VLSI on PD SOI. Since these strategies address issues and problems that arise on PD SOI circuits such as delay hysteresis and noise margin reduction, they are discussed in detail. Although many aspects of CMOS design pertaining to SOI are covered, emphasis is placed on dynamic and static circuits and high-performance SRAMs.
This paper has presented an analytical three-dimensional (3D) model for threshold voltage of small dimensions MOSFETs with an experimental dependence of acceptor concentration in the channel. The corresponding algorit...
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This paper has presented an analytical three-dimensional (3D) model for threshold voltage of small dimensions MOSFETs with an experimental dependence of acceptor concentration in the channel. The corresponding algorithms have been developed and the simulation of surface potential and threshold voltage has been performed.
Due to the ever increasing packaging density of integrated circuits, self-heating and thermal coupling effects become more and more important. For state-of-the-art mixed-mode device simulation the solution of the basi...
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Due to the ever increasing packaging density of integrated circuits, self-heating and thermal coupling effects become more and more important. For state-of-the-art mixed-mode device simulation the solution of the basic transport equations for the semiconductor devices is directly embedded into the solution procedure for the circuit equations. Compact modeling is thus avoided and much high accuracy is obtained which is especially true for the temperature dependence of the device terminal characteristics. We review the state of the art in mixed-mode device simulation with particular emphases placed on self-heating of individual and thermal coupling effects between different devices.
This paper reviews the evolution of partially depleted (PD) CMOS SOI technology at IBM. Several aspects of this development leading to successful fabrication of high-performance microprocessors are discussed. They inc...
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This paper reviews the evolution of partially depleted (PD) CMOS SOI technology at IBM. Several aspects of this development leading to successful fabrication of high-performance microprocessors are discussed. They include SOI-specific device design and process modifications; creation of compact device models for circuit simulation (SPICE-like models); and development of circuit styles and strategies employed in the design of CMOS VLSI on PD SOI. Since these strategies address issues and problems that arise on PD SOI circuits such as delay hysteresis, and noise margin reduction, they are discussed in detail. The discussion is focused on the 0.18 /spl mu/m and 0.13 /spl mu/m generations, with some deliberations on the 0.10 /spl mu/m node.
Thermal vias and balls are key elements in plastic ball grid array (PBGA) package thermal design as they enhance the package performance. simulation is a versatile design optimization tool for characterizing the therm...
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ISBN:
(纸本)0780366441
Thermal vias and balls are key elements in plastic ball grid array (PBGA) package thermal design as they enhance the package performance. simulation is a versatile design optimization tool for characterizing the thermal vias and balls. However, the finer geometric details of the vias require excessive memory and modeling and simulation time. Different modeling concepts are being tried in the industry to include finer geometries in the package. This paper shows a methodology of developing compact thermal via models and validating the same with detailed models. The accuracy of compact thermal via models with respect to the detailed models has been determined using PBGA 352 as the test vehicle. It is found that the accuracy is within 3%. The simulation models of PBGA 352 have been validated by measurements and found that the accuracy of model is within 10%. Two and four layer PBGA 352s with different via configurations have been characterized with compact thermal via models, and design guidelines for PBGA 352 packages have been obtained.
This paper presents a novel study of the dynamic performance analysis of an advanced static VAr compensator (ASVC) using a three-level voltage source inverter. The analysis is based on the modelling of the system in t...
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ISBN:
(纸本)9643600572
This paper presents a novel study of the dynamic performance analysis of an advanced static VAr compensator (ASVC) using a three-level voltage source inverter. The analysis is based on the modelling of the system in the d-q axis. The dynamic behaviour of the system is further analysed using MATLAB through a set of simulation tests. The results obtained may lead to correct design of a robust controller for reactive power applications.
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