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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是1251-1260 订阅
排序:
Nuclear modeling of quantum gate leakage currents with sensitivity analysis
International Conference on Simulation of Semiconductor Proc...
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International conference on simulation of Semiconductor Processes and Devices, SISPAD 2000年 204-205页
作者: Schoenmaker, Wim Magnus, Wim Interuniversity Microelectronics Cent Leuven Belgium
A new formulation for gate-leakage currents due to quantum tunneling is presented. The resulting model has been inserted into software modules. The relative importance of various gate stack design parameters is invest... 详细信息
来源: 评论
Efficient ANN-based interconnect delay and crosstalk modeling
Efficient ANN-based interconnect delay and crosstalk modelin...
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International conference on microelectronics, MIEL
作者: A. Ilumoka Dept. of Electr. Eng. Hartford Univ. West Hartford CT USA
The dominance of system performance by interconnect delay in deep-submicron design presents many challenges to physical design tool developers. This paper presents an efficient ANN-based technique for modeling interco... 详细信息
来源: 评论
A fast cycle-based approach for synthesizable RT level VHDL simulation
A fast cycle-based approach for synthesizable RT level VHDL ...
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International conference on microelectronics, ICM
作者: L. Ghasemzadeh Z. Navabi ECE Department University of Tehran Iran
In this paper, a cycle-based RT level simulation engine is being discussed. Issues treated include component extraction, component ordering and feedback detection from behavioral VHDL descriptions. Proposing new metho... 详细信息
来源: 评论
A system-level simulation environment for system-on-chip design
A system-level simulation environment for system-on-chip des...
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Annual IEEE International ASIC/SOC conference
作者: T. Schneider J. Mades A. Windisch M. Glesner D. Monjau W. Ecker Corporate Development Infineon Technologies Munich Germany Institute of Microelectronic Systems Darmstadt University of Technology Darmstadt Germany Department of Computer Science Technical University of Chemnitz-Zwickau Chemnitz Germany
This paper presents a mixed-signal/multi-language simulation environment for the languages VHDL-AMS, Java, and C++. The environment is implemented in Java and based upon a previously developed VHDL-AMS design environm... 详细信息
来源: 评论
Partially depleted silicon-on-insulator (SOI): a device design/modeling and circuit perspective
Partially depleted silicon-on-insulator (SOI): a device desi...
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International conference on microelectronics, ICM
作者: F. Assaderaghi G. Shahidi S. Fung M. Sherony L. Wagner J. Sleight S.H. Lo K. Wu T.-C. Chen Development Center IBM Semiconductor Research and Development Center Hopewell Junction NY USA
This paper reviews the evolution of partially depleted (PD) CMOS SOI technology at IBM. Several aspects of this development leading to successful fabrication of high-performance microprocessors are discussed. They inc... 详细信息
来源: 评论
An analytical 3-D model for small dimensions MOSFETs' threshold voltage
An analytical 3-D model for small dimensions MOSFETs' thresh...
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International conference on microelectronics, MIEL
作者: D.Z. Pilja R.M. Sasic R.M. Ramovic D.A. Tjapkin Faculty of Technology and Metallurgy University of Belgrade Belgrade Serbia Faculty of Electrical Engineering University of Belgrade Belgrade Serbia
This paper has presented an analytical three-dimensional (3D) model for threshold voltage of small dimensions MOSFETs with an experimental dependence of acceptor concentration in the channel. The corresponding algorit... 详细信息
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Electro-thermal effects in mixed-mode device simulation
Electro-thermal effects in mixed-mode device simulation
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International conference on Semiconductor
作者: T. Grasser S. Selberherr TU Vienna Institute for Microelectronics Vienna Austria
Due to the ever increasing packaging density of integrated circuits, self-heating and thermal coupling effects become more and more important. For state-of-the-art mixed-mode device simulation the solution of the basi... 详细信息
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SOI at IBM: current status of technology, modeling, design, and the outlook for the 0.1 /spl mu/m generation
SOI at IBM: current status of technology, modeling, design, ...
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IEEE SOI-3D-Subthreshold microelectronics Technology Unified conference (S3S)
作者: F. Assaderaghi G. Shahidi IBM Semiconductor Research and Development Center Hopewell Junction NY USA
This paper reviews the evolution of partially depleted (PD) CMOS SOI technology at IBM. Several aspects of this development leading to successful fabrication of high-performance microprocessors are discussed. They inc... 详细信息
来源: 评论
Thermal characterization of vias using compact models
Thermal characterization of vias using compact models
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Electronics Packaging Technology conference (EPTC)
作者: D. Pinjala M.K. Iyer Chow Seng Guan I.J. Rasiah Institute of Microelectronics Singapore ST Assembly Test Services Private Limited Singapore Honeywell (S) Private Limited Singapore
Thermal vias and balls are key elements in plastic ball grid array (PBGA) package thermal design as they enhance the package performance. simulation is a versatile design optimization tool for characterizing the therm... 详细信息
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Control and dynamic analysis of a static VAr compensator using a three level inverter topology
Control and dynamic analysis of a static VAr compensator usi...
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International conference on microelectronics, ICM
作者: A. Draou M. Benghanem A. Tahri Applied Power Electronics Laboratory Institute of Electrotechnics University of Sciences and Technology Houari Boumediene Oran Algeria
This paper presents a novel study of the dynamic performance analysis of an advanced static VAr compensator (ASVC) using a three-level voltage source inverter. The analysis is based on the modelling of the system in t... 详细信息
来源: 评论