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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1413 条 记 录,以下是1261-1270 订阅
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Physics based modeling of simultaneous switching noise in high speed systems
Physics based modeling of simultaneous switching noise in hi...
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Electronic Components and Technology conference (ECTC)
作者: Sungjun Chun M. Swaminathan L.D. Smith J. Srinivasan Zhang Jin M.K. Iyer School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta GA USA Sun Microsystems Palo Alto CA USA Advanced Packaging Development Support Department Institute of Microelectronics Singapore
Simultaneous Switching Noise (SSN) has become a major bottleneck in high speed digital design. For future systems, modeling SSN can be complex due to the thousands of interconnects that need to be analyzed. This is be... 详细信息
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Characterization and modeling of a GaAs HFET toward design of linear 2.4 GHz high power amplifier
Characterization and modeling of a GaAs HFET toward design o...
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Asia-Pacific conference on Microwave
作者: A. Khusaidi M.A. Riyadi B.R. Alam RF Device & IC Research Group Department of Electrical Engineering Institute of Technology Bandung InterUniversity Research Center on Microelectronics Bandung Indonesia
A large signal HFET model based on the Curtice-Cubic model is constructed. Power GaAs HFET transistor SHF0186K is adopted for extraction. The DC and S-parameters characteristics of the transistor are used to derive th... 详细信息
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Mapping matrix multiplication algorithm onto optimal fault-tolerant systolic array
Mapping matrix multiplication algorithm onto optimal fault-t...
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International conference on microelectronics, MIEL
作者: I.Z. Milovanovic T.I. Tokic M.K. Stojcev E.I. Milovanovic N.M. Novakovic Fac. of Electron. Eng. Nis Univ. Serbia Faculty of Electronic Engineering University of Niš Nis Yugoslavia Univerzitet u Nisu Nis RS
An approach to the design of fault-tolerant hexagonal systolic array (SA) for matrix multiplication is described. The approach comprises of three steps. First, redundancies are introduced at the computational level by... 详细信息
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Efficient prediction of interconnect crosstalk using neural networks
Efficient prediction of interconnect crosstalk using neural ...
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International conference on Tools for Artificial Intelligence (ICTAI)
作者: A.A. Ilumoka Pettit Microelectronics Research Center Georgia Institute of Technology Atlanta USA
Interconnect crosstalk prediction has become increasingly important with deep submicron downscaling of ICs and wafer scale integration. Existing tools for management of the emi problem are computationally expensive an... 详细信息
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Development and application of a macro model for flash EEPROM design
Development and application of a macro model for flash EEPRO...
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Annual IEEE International ASIC/SOC conference
作者: M. O'Shea A. Concannon K. McCarthy B. Lane A. Mathewson M. Slotboom National Microelectronics Research Centre Cork Ireland Philips Research Laboratories Eindhoven Netherlands
The inclusion of embedded flash memory in systems-on-chip designs enables the addition of many new features. However to enable designers to embed flash memory in an efficient and competent manner, they must have the c... 详细信息
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An integrated plasma equipment-feature scale model for ionized metal physical vapor deposition
An integrated plasma equipment-feature scale model for ioniz...
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IEEE International conference on Plasma Science (ICOPS)
作者: Junqing Lu M.J. Kushner Dept. of Mech. & Ind. Eng. Illinois Univ. Urbana IL USA Department of Electrical and Computer Engineering University of Illinois Urbana IL USA
Summary form only given. Ionized metal physical vapor deposition (IMPVD) is used to deposit diffusion barriers and metal seed layers into high aspect ratio trenches for interconnect wiring in the fabrication of microe... 详细信息
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design and simulation of a micromirror array for a projection TV
Design and simulation of a micromirror array for a projectio...
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conference on design, Characterization, and Packaging for MEMS and microelectronics
作者: Choi, B Lee, J Jung, K Shin, H Sogang Univ Dept Engn Mech Mapo Gu Seoul 121742 South Korea
The design of a micromirror for a projection TV is investigated. A static structural analysis is performed to give an optimal shape of the micromirror using the FEM(finite-element method) commercial package, ANSYS. A ... 详细信息
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Efficient ANN-based interconnect delay and crosstalk modeling
Efficient ANN-based interconnect delay and crosstalk modelin...
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22nd International conference on microelectronics (MIEL 2000)
作者: Ilumoka, A. Univ of Hartford Hartford CT United States
The dominance of system performance by interconnect delay in deep-submicron design presents many challenges to physical design tool developers. This paper presents an efficient ANN-based technique for modeling interco... 详细信息
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Reactor and process modeling in optoelectronics device fabrication
Reactor and process modeling in optoelectronics device fabri...
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conference on Physics and simulation of Optoelectronic Devices VII
作者: Meyyappan, M Bose, D NASA Ames Res Ctr Moffett Field CA 94035 USA
Computational modeling of reactors and processes has gained wide acceptance in the microelectronics industry. Commercial software are readily available and routinely used at the design stage to reduce design cycle and... 详细信息
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Optimizing the simulation of bipolar transistor packages using sliding mode techniques
Optimizing the simulation of bipolar transistor packages usi...
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conference on design, Characterization, and Packaging for MEMS and microelectronics
作者: Mkrttchian, V Simonyan, A Mkrtchyan, K Stat Engn Univ Armenia Yerevan 375009 Armenia
modeling packaged electronic elements is encumbered by parasitic effects and discontinuities causing enlarged parameters and is done using numerical field simulation in reference to results of on-wafer measurements an... 详细信息
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