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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是1271-1280 订阅
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design of a Low-Dropout Linear Regulator
Design of a Low-Dropout Linear Regulator
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Artificial Intelligence and Information Systems (ICAIIS), 2020 IEEE International conference on
作者: Enyu Xu Xuehong He School of Microelectronics Shanghai Jiao Tong University Shanghai China Shanghai Integrated Circuit Research and Development Center Ltd. Shanghai China
This paper introduces a low-dropout linear regulator with an operating voltage of 2.5V. An anti-overshoot circuit is added to the error amplifier, and the regulator module is optimized based on circuit stability perfo... 详细信息
来源: 评论
Fracture mechanics based crack and delamination risk evaluation and RSM/DOE concepts for advanced microelectronics applications
Fracture mechanics based crack and delamination risk evaluat...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: J. Auersperg B. Seiler E. Cadalen R. Dudek B. Michel Department Mechanical Reliability and Micro Materials Fraunhofer Institute of Reliability and Microintegration (IZM) Berlin Germany AMIC Angewandte Micro-Messtechnik GmbH Berlin Germany CWM Chemnitzer Werkstoffmechanik GmbH Chemnitz Germany THALES Microelectronics S. A. Chateaubourg France
Fatigue and failure of advanced electronic packages and related systems is often caused by their increasing use under harsh environmental conditions - extreme temperatures, in particular. As a result, its thermomechan... 详细信息
来源: 评论
Predictive fatigue life equation for CBGA electronic packages based on design parameters
Predictive fatigue life equation for CBGA electronic package...
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Intersociety conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)
作者: A. Perkins S.K. Sitaraman Computer Aided Simulation for Package Reliability (CASPaR) Laboratory The George W. W&ff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA USA
Finite-element simulations in combination with experimental data have been used extensively by researchers to predict the solder joint fatigue life in microelectronic packages. Such simulations often require good unde... 详细信息
来源: 评论
Analyse of Protection Devices' Speed Performance against ESD under CDM Using TCAD
Analyse of Protection Devices' Speed Performance against ESD...
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IEEE conference on Electron Devices and Solid-State Circuits
作者: Qiang Cui Yan Han Juin J. Liou Shurong Dong Institute of Microelectronics and Photoelectronics University of Zhejiang Hangzhou China Department of Electrical and Computer Engineering University of Central Florida Orlando FL USA
Speed performance plays a critical role in protection devices against ESD (Electro-Static Discharge) overstress under CDM (Charged Device Model). It is too demanding to obtain speed performance of protection devices u... 详细信息
来源: 评论
Modernization of Low-Temperature JFET Models Built into LTspice CAD Systems, Taking into Account the Results of their Experimental Study
Modernization of Low-Temperature JFET Models Built into LTsp...
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Latin American Electron Devices conference (LAEDC)
作者: Oleg V. Dvornikov Valentine L. Dziatlau Vladimir A. Tchekhovski Nikolay N. Prokopenko Alexey A. Zhuk Anna V. Bugakova Plc. “Minsk Research Instrument-Making Institute” (MNIPI) Kolas's str. 73 Minsk Belarus Institute for Nuclear Problems of Belarussian State University Bobruiskaya str. 11 Minsk Belarus Institute for Design Problems in Microelectronics of Russian Academy of Sciences (IPPM RAS) Sovetskaya st. 3 Zelenograd Russia Don State Technical University Gagarin's sq. 1 Rostov-on-Don Don State Technical University Rostov-on-Don (RR) Russia
The results of experimental studies of the current-voltage characteristics (CVC) of silicon n-JFET and p-JFET manufactured at JSC INTEGRAL (Minsk, Belarus) at temperatures from minus 195°C up to 30°C are con... 详细信息
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IR drop analysis in mobile IC package with consideration of self-heating and leakage power
IR drop analysis in mobile IC package with consideration of ...
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Electronic Components and Technology conference (ECTC)
作者: Zheng Qin Zhi Wang He Ma Shuqiang Zhang Daquan Yu Institute of Microelectronics Chinese Academy of Sciences Beijing China University of Chinese Academy of Science Beijing China Apache Design Solutions Inc. Shanghai China
Due to the high integration and high speed, Power-Ground (P/G) network design becomes a critical challenge in mobile IC package. As accurate IR-drop analysis provides important reference for P/G network design, an ele... 详细信息
来源: 评论
Parity Generator & Parity Checker Using Sub-threshold Adiabatic Logic
Parity Generator & Parity Checker Using Sub-threshold Adiaba...
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IEEE UP Section conference on Electrical Computer and Electronics (UPCON)
作者: Prashant Gaurav Prashant Sangeeta Singh Saurabh Kumar Pandey Microelectronics and VLSI design NIT Patna Bihar India Sensors and Optoelectronics Research Group (SORG) Indian Institute of Technology Patna Bihta Bihar India
Power dissipation becomes an essential criterion in VLSI system in the current ultra-low power applications scenario. Sub-threshold adiabatic logic designing has shown its potential as more efficient logic for ultra l... 详细信息
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Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications
Characterization and simulation of LTCC/adhesive and alloy 4...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: B. Öztürk P. Lou P. Gromala C. Silber K.M.B. Jansen L.J. Ernst Robert Bosch GmbH Automotive Electronics Reutlingen Germany Delft University of Technology Delft The Netherlands Ernst Consultant Schoonhoven Schoonhoven The Netherlands Emeritus Professor of Delft University of Technology The Netherlands
Thermoset-based adhesives are used as thermal and electrical interfaces. In automotive applications, they are required to have excellent adhesion since delamination may precipitate other electrical, thermal or mechani... 详细信息
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A Compact Model of Resistive Switching Devices
A Compact Model of Resistive Switching Devices
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2010 10th IEEE International conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)
作者: B. Chen J.F. Kang R.Q. Han Y.S. Chen K.L. Wei Q.Y.Jun X.Y. Liu B. Gao F.F. Zhang L.F. Liu Peking University Shenzhen Graduate School Shenzhen 518055 China Institute of Microelectronics Pe Institute of Microelectronics Peking University Beijing 100871 China
In this paper a compact model both for bipolar and unipolar resistive switching device is proposed. Basic I-V characteristics of RRAM are easily and correctly represented by this model. The model is verified by the bi... 详细信息
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A CAD framework for co-design and analysis of CMOS-SET hybrid integrated circuits  03
A CAD framework for co-design and analysis of CMOS-SET hybri...
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IEEE International conference on Computer-Aided design
作者: S. Mahapatra K. Banerjee F. Pegeon A.M. Ionescu Electronics Laboratory (LEG) Institute of Microelectronics and Microsystems (IMM) Swiss Federal Institute of Technology Lausanne Switzerland Electronics Laboratory (LEG) Swiss Federal Institute of Technology Lausanne (EPFL) Lausanne Switzerland Department of Electrical & Computer Engineering University of California Santa Barbara CA USA Silvaco Data Systems Inc. Grenoble France Silvaco Data Systems Grenoble France
This paper introduces a CAD framework for co-simulation of hybrid circuits containing CMOS and SET (Single Electron Transistor) devices. An improved analytical model for SET is also formulated and shown to be applicab... 详细信息
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