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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1413 条 记 录,以下是121-130 订阅
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Characterization and modeling of Cure-Induced Thermo Mechanical Properties and Chemical Shrinkage of Epoxy Resins
Characterization and Modeling of Cure-Induced Thermo Mechani...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Venu Prakash Kasinikota Wolfgang Muehleisen Markus Grinschgl Alexander Steiner Siegfried Hasil Margit Christa Lang Polymer Competence Center Leoben GmbH (PCCL) Leoben Austria Institute of Mechanics Montanuniversität Leoben Leoben Austria Silicon Austria Labs GmbH (SAL) Villach Austria GIPRO GmbH Peggau Austria
Epoxy resins are widely used in molding electrical insulators and electronic components due to their superior dielectric properties and mechanical strength. However, due to poor process control along with the complex ...
来源: 评论
Electromigration simulation of Copper-Pillar Bump in 3D Integration
Electromigration Simulation of Copper-Pillar Bump in 3D Inte...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Zhoubang Du Leiming Du GuoQi Zhang EEMCS Faculty Delft University of Technology Delft the Netherlands
The continuous trend toward miniaturization and increased integration density in semiconductor devices has exacerbated electromigration (EM) issue, making it a significant reliability concern in advanced packaging tec... 详细信息
来源: 评论
LSTM-based ECG Signal Classification with Multi-level One-hot Encoding for Wearable Applications
LSTM-based ECG Signal Classification with Multi-level One-ho...
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IEEE Biomedical Circuits and Systems (BIOCAS)
作者: Jinhai Hu Wang Ling Goh Yuan Gao School of Electrical and Electronic Engineering Nanyang Technological University (NTU) Republic of Singapore Agency for Science Technology and Research (A*STAR) Institute of Microelectronics (IME) Republic of Singapore
This paper presents an electrocardiogram (ECG) signal classification method using one-hot coding scheme and Long Short-Term Memory (LSTM) neural network. Instead of the conventional analog to digital converter (ADC) w... 详细信息
来源: 评论
Microvia Homogenised Behaviour for the Mechanical Modelling of PCB with Embedded Components
Microvia Homogenised Behaviour for the Mechanical Modelling ...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Flora Dailland Gautier Girard Mounira Bouarroudj Marion Martiny Sébastien Mercier LEM3 CNRS Arts et Métiers Université de Lorraine Metz France SATIE Université Paris Est Créteil Université Paris-Saclay CNRS Gif-sur-Yvette France
Driven by the development of e-mobility, printed circuit boards with active embedded components are seen as potential design to increase interconnect density. One way to increase the lifetime of printed circuits board... 详细信息
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modeling and Assessment of Atomic Precision Advanced Manufacturing (APAM) Enabled Vertical Tunneling Field Effect Transistor  26
Modeling and Assessment of Atomic Precision Advanced Manufac...
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International conference on simulation of Semiconductor Processes and Devices (SISPAD)
作者: Gao, Xujiao Mendez, Juan P. Lu, Tzu-Ming Anderson, Evan M. Campbell, DeAnna M. Ivie, Jeffrey A. Schmucker, Scott W. Grine, Albert Lu, Ping Tracy, Lisa A. Arghavani, Reza Misra, Shashank Sandia Natl Labs 1515 Eubank SE Albuquerque NM 87123 USA
The atomic precision advanced manufacturing (APAM) enabled vertical tunneling field effect transistor (TFET) presents a new opportunity in microelectronics thanks to the use of ultra-high doping and atomically abrupt ... 详细信息
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D2D Variation Aware DTCO for Novel Vertical a-IGZO-FETs in Large-Scale M3D 2TOC DRAM Bit Cell Evaluation via Statistical modeling Methodology
D2D Variation Aware DTCO for Novel Vertical a-IGZO-FETs in L...
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International conference on simulation of Semiconductor Processes and Devices (SISPAD)
作者: Yue Zhao Yong Yu Jingrui Guo Lingfei Wang Nan Yang Jianpeng Jiang Yanan Lu Menglong Zhou Shijie Huang Lihua Xu Zhenhua Wu Guanhua Yang Di Geng Guilei Wang Bryan Kang Chao Zhao Ling Li Ming Liu Key Laboratory of Fabrication Technologies for Integrated Circuits Institute of Microelectronics of the Chinese Academy of Sciences Beijing China Beijing Superstring Academy of Memory Technology Beijing China
Device nonuniformity of ultra-scaled novel vertical a-IGZO-FETs is induced by multi-sources, such as dimension variation and material disorder, limiting large-scale DRAM design. Particularly, fluctuation of disorders ... 详细信息
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Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process modeling Techniques and Viscoelasticity Theory
Studying Asymmetric Warpage Behavior of Panel-Level Packages...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Z. Shu K. N. Chiang Advanced Microsystem Packaging and Nano-Mechanics Research Lab Dept. of Power Mechanical Engineering National Tsing Hua University Hsinchu Taiwan R.O.C
Panel Level Packaging (PLP) is an integrated circuit (IC) packaging technology that is mainly used in fields such as mobile communications, consumer electronics, and industrial automation. Compared to wafer-level pack... 详细信息
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simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition  71
Simulation of moisture-induced plasticization in transfer-mo...
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IEEE 71st Electronic Components and Technology conference (ECTC)
作者: Huber, Fabian Etschmaier, Harald Hadley, Peter Ams AG AOS Packaging Design Premstaetten Austria Graz Univ Technol Inst Solid State Phys Graz Austria
Moisture sorption of microelectronics packages may lead to plasticization of materials such as epoxide-based transfer-molding compounds. This does not only result in a reduction of the modulus but also to a change in ... 详细信息
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A RISC-V-based system on chip for high-speed control in safety-critical 650 V GaN-applications  16
A RISC-V-based system on chip for high-speed control in safe...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Richter, Mike Lüdecke, André Lee, Yoon-Cue Stanitzki, Alexander Utz, Alexander Grau, Günter Kappert, Holger Kokozinski, Rainer Finkenstr. 61 Duisburg47057 Germany advICo Microelectronics GmbH Münsterstr. 13-15 Recklinghausen45657 Germany Department of Electronic Components and Circuits University of Duisburg-Essen Bismarckstr. 81 Duisburg47057 Germany
In power electronics applications, Gallium Nitride (GaN)-based transistors generally offer benefits in efficiency and switching speed, but come at the cost of harder controllability and thus more complex control circu... 详细信息
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Physics-Informed Compact Model for SF6/O2 Plasma Etching
Physics-Informed Compact Model for SF6/O2 Plasma Etching
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International conference on simulation of Semiconductor Processes and Devices (SISPAD)
作者: Lado Filipovic Josip Bobinac Julius Piso Tobias Reiter CDL for Multi-Scale Process Modeling of Semiconductor Devices and Sensors Institute for Microelectronics TU Wien Vienna Austria
We propose a process simulation/emulation flow which incorporates the generation and application of compact models for fast geometry generation, suitable for design-technology co-optimization (DTCO). The methodology i...
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