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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是1301-1310 订阅
排序:
VHDL-AleC++ co-simulation
VHDL-AleC++ co-simulation
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International conference on microelectronics, MIEL
作者: Z. Dimic M. Damnjanovic V. Litovski Faculty of Electronic Engineering University of Niš Yugoslavia Univerzitet u Nisu Nis RS
A powerful HDL (Hardware description language) can be considered as sufficient input tool only until the full problem is recognized. HDL-co-simulation is, in such cases, used as a better solution. In this report, logi... 详细信息
来源: 评论
Electrical modeling and simulation for mixed-signal interconnect and packaging
Electrical modeling and simulation for mixed-signal intercon...
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IEEE International conference on Innovative Systems in Silicon
作者: A.C. Cangellaris Department of Electrical and Computer Engineering University of Illinois Urbana-Champaign Urbana IL USA
The explosive growth of wireless communications, combined with the rapid advances in high-performance portable computing, are driving the microelectronics industry toward the development of a variety of multi-function... 详细信息
来源: 评论
Limes: a multiprocessor simulation environment for PC platforms
Limes: a multiprocessor simulation environment for PC platfo...
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International conference on microelectronics, MIEL
作者: D. Magdic School of Electrical Engineering Department of Computer Engineering University of Belgrade Belgrade Serbia
This paper presents a multiprocessor simulation environment, developed with the aim to facilitate the researches of multiprocessor systems at the University of Belgrade. It comprises a simulation tool applicable for a... 详细信息
来源: 评论
modeling and optimization of multilayer thick film inductors
Modeling and optimization of multilayer thick film inductors
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International conference on microelectronics, MIEL
作者: S.M. Jenei O.S. Aleksic L.D. Zivanov Faculty of Technical Sciences University of Novi Sad Novi Sad Yugoslavia Faculty of Electrical Engineering University of Belgrade Belgrade Serbia
Different planar inductive structures were designed, simulated, fabricated in multilayer thick film technology and measured. Analytical analysis and computer simulations of design inductor parameters were performed fo... 详细信息
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Two-dimensional modeling of on state voltage drop in IGBT
Two-dimensional modeling of on state voltage drop in IGBT
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International conference on microelectronics, MIEL
作者: E. Napoli A.G.M. Strollo P. Spirito Department of Electronic Engineering University of Napoli Federico II Napoli Italy
In this paper a two-dimensional analysis of the on-state voltage drop for an IGBT, investigating the influence of the geometrical parameters of the device on current handling capabilities, is presented. Numerical simu... 详细信息
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A new opportunity by low power CMOS decision circuit for optical communications and its comparison with new GaAs and HBT implementation
A new opportunity by low power CMOS decision circuit for opt...
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International conference on microelectronics, MIEL
作者: M. Lee KJIST Kwangju South Korea
The design specifications considering low-power and high-speed are presented. Several decision circuits used for an optical communication receiver system, are designed and simulated using the circuit simulation tool A... 详细信息
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Hierarchical modelling of microsystems in an object-oriented hardware description language
Hierarchical modelling of microsystems in an object-oriented...
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International conference on microelectronics, MIEL
作者: Z. Mrcarica V.B. Litovski M. Jakovljevic H. Detter Faculty of Electronic Engineering University of Niš Yugoslavia Institute for Precision Engineering Technical University of of Vienna Vienna Austria
Hardware description languages can be used for the description of models of micromechanical transducers. This enables simulation of microsystems, i.e. micromechanics with processing electronics. If such a language is ... 详细信息
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Learning by virtual doing: protocol simulators for surface analysis in microelectronics
Learning by virtual doing: protocol simulators for surface a...
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IEEE International conference on Microelectronic Systems Education
作者: F. Pecheux Y. Herve H. Marchall N. Hertel J.P. Stoquert R. Stuck Cnrs Phase Strasbourg France ISA University of Aarhus Aarhus Denmark
The paper details how state-of-the-art technologies like multimedia, computer modeling and simulation may be applied with profit for education in microelectronics. It presents a set of multimedia courses on material c... 详细信息
来源: 评论
simulation tools for the design and analysis of plasma processing equipment
Simulation tools for the design and analysis of plasma proce...
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IEEE International conference on Plasma Science (ICOPS)
作者: S. Rauf M. Grapperhaus R.J. Hoekstra M.J. Kushner University of Illinois at Urbana-Champaign Urbana IL US
Summary form only given. Plasma processing equipment has become one of the most important tools used for microelectronics fabrication. The increasing complexity of microelectronics devices is making it imperative to d... 详细信息
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Significant microelectronics systems design experience for a heterogeneous class of CS, CE, and EE students
Significant microelectronics systems design experience for a...
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IEEE International conference on Microelectronic Systems Education
作者: C.N. Purdy ECECS Department Electronic Design Automation Research Center University of Cincinnati Cincinnati OH USA
Using structured design techniques borrowed from software programming, beginning circuit designers at the University of Cincinnati consistently create correct, working chips containing several thousand gates. Careful ... 详细信息
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