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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

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VHDL-AleC++ co-simulation

VHDL-AleC++ co-simulation

引用

International conference on microelectronics, MIEL

作者： Z. Dimic M. Damnjanovic V. Litovski Faculty of Electronic Engineering University of Niš Yugoslavia Univerzitet u Nisu Nis RS

A powerful HDL (Hardware description language) can be considered as sufficient input tool only until the full problem is recognized. HDL-co-simulation is, in such cases, used as a better solution. In this report, logic simulation is considered in the presence of existing language/simulator environment and VHDL predeveloped libraries. Successful simulation results are presented.

关键词： Object oriented modeling Circuit simulation Engines Hardware design languages Computer languages Software libraries Power system modeling Logic Integrated circuit technology Production systems

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Electrical modeling and simulation for mixed-signal interconnect and packaging

Electrical modeling and simulation for mixed-signal intercon...

引用

IEEE International conference on Innovative Systems in Silicon

作者： A.C. Cangellaris Department of Electrical and Computer Engineering University of Illinois Urbana-Champaign Urbana IL USA

The explosive growth of wireless communications, combined with the rapid advances in high-performance portable computing, are driving the microelectronics industry toward the development of a variety of multi-functional, low-cost, compact, mixed-signal electronic products. These new products call for novel, often revolutionary, practices in functional block integration and packaging. Some of the challenges associated with the electrical design and rapid prototyping of these systems are discussed in this paper. Examples are given of existing electromagnetic modeling methodologies and associated CAD tools that can be used today to facilitate the design of these novel packages. The paper concludes with a brief discussion of on-going research activities toward the enhancement of these modeling/simulation methodologies and the eventual establishment of an electromagnetic CAD environment for mixed-signal system electrical design.

关键词： Packaging Electromagnetic modeling design automation Computational modeling Explosives Wireless communication Portable computers microelectronics Communication industry Computer industry

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Limes: a multiprocessor simulation environment for PC platforms

Limes: a multiprocessor simulation environment for PC platfo...

引用

International conference on microelectronics, MIEL

作者： D. Magdic School of Electrical Engineering Department of Computer Engineering University of Belgrade Belgrade Serbia

This paper presents a multiprocessor simulation environment, developed with the aim to facilitate the researches of multiprocessor systems at the University of Belgrade. It comprises a simulation tool applicable for architecture studies of shared-address space multiprocessors, and a detailed model of bus-based cache coherent multiprocessor system. The environment executes on PC platforms and, while showing comparable performance with other tools of similar purpose, benefits from potential reusability of its realistic simulated models. The tool provides a simple general interface that allows for the hardware lying underneath the simulated processors to be modeled in a manner similar to the VHDL approach, but with far greater efficiency. The included model is easily extendible to other bus-based systems, and the basics of the design methodology are presented.

关键词： Multiprocessing systems Application software Computer architecture Software tools Analytical models Computational modeling design methodology Hardware design languages Cost benefit analysis Software prototyping

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modeling and optimization of multilayer thick film inductors

Modeling and optimization of multilayer thick film inductors

引用

International conference on microelectronics, MIEL

作者： S.M. Jenei O.S. Aleksic L.D. Zivanov Faculty of Technical Sciences University of Novi Sad Novi Sad Yugoslavia Faculty of Electrical Engineering University of Belgrade Belgrade Serbia

Different planar inductive structures were designed, simulated, fabricated in multilayer thick film technology and measured. Analytical analysis and computer simulations of design inductor parameters were performed for optimization of thick film multilayer inductors in order to achieve desired electrical characteristics. An original CAD has been developed and can be useful generally in different design simulations. Two prototype series were realized on an Al/sub 2/O/sub 3/ substrate using Pd/Ag conductive paste and Ni-ferrite paste for magnetic layers: inductors on magnetic layers and "sandwich" inductors.

关键词： Nonhomogeneous media Thick film inductors Computational modeling Thick films Performance analysis Thickness measurement Computer simulation design optimization Electric variables design automation

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Two-dimensional modeling of on state voltage drop in IGBT

Two-dimensional modeling of on state voltage drop in IGBT

引用

International conference on microelectronics, MIEL

作者： E. Napoli A.G.M. Strollo P. Spirito Department of Electronic Engineering University of Napoli Federico II Napoli Italy

In this paper a two-dimensional analysis of the on-state voltage drop for an IGBT, investigating the influence of the geometrical parameters of the device on current handling capabilities, is presented. Numerical simulations show that an optimal ratio between the cell dimension and the width of the epilayer region under the gate electrode exists. Furthermore, an analytical algorithm for the calculation of the two-dimensional carrier distribution in the epilayer region is proposed.

关键词： Voltage Insulated gate bipolar transistors Numerical simulation Algorithm design and analysis Medical simulation Electrodes Switching frequency Tail Steady-state Analytical models

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A new opportunity by low power CMOS decision circuit for optical communications and its comparison with new GaAs and HBT implementation

A new opportunity by low power CMOS decision circuit for opt...

引用

International conference on microelectronics, MIEL

作者： M. Lee KJIST Kwangju South Korea

The design specifications considering low-power and high-speed are presented. Several decision circuits used for an optical communication receiver system, are designed and simulated using the circuit simulation tool AIM-SPICE, based on extracted process parameters using an in-house characterization and modeling tool named CMLEE. The several sampled circuits are implemented in 2/spl times/4 emitter-area HBT, 0.5 /spl mu/m MESFET and compatible 0.1 /spl mu/m CMOS technologies. All the designed circuits are carefully simulated for the waveform at the output node and power consumption in the circuit. All waveform simulations showed good performance at 10 Gbps level. It is observed that 0.1 /spl mu/m CMOS of current mainstream electronic systems shows more than 10 GHz level operation, opening an opportunity for high frequency use as long as deep sub-/spl mu/m technology compromises maturity and cost in reality. In terms of power consumption, the sub-0.5 /spl mu/m GaAs MESFET design was 4.2 mW and the best choice for the same 10 GHz speed performance, compared to 60 mW by the 0.1 /spl mu/m CMOS circuit design.

关键词： Circuit simulation CMOS technology Optical receivers MESFET circuits Energy consumption High speed optical techniques Optical fiber communication Optical design Semiconductor device modeling Power system modeling

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Hierarchical modelling of microsystems in an object-oriented hardware description language

Hierarchical modelling of microsystems in an object-oriented...

引用

International conference on microelectronics, MIEL

作者： Z. Mrcarica V.B. Litovski M. Jakovljevic H. Detter Faculty of Electronic Engineering University of Niš Yugoslavia Institute for Precision Engineering Technical University of of Vienna Vienna Austria

Hardware description languages can be used for the description of models of micromechanical transducers. This enables simulation of microsystems, i.e. micromechanics with processing electronics. If such a language is object-oriented, a space-continuous micromechanical model can be described as a composition of previously defined submodels of mechanical structures. Inheritance properties of an object-oriented language make this hierarchical description very straightforward. For spatial discretization of models, we have used both finite difference and finite element methods.

关键词： Object oriented modeling Hardware design languages Micromechanical devices Circuit simulation Electronic circuits SPICE Transducers Production design automation Sensor phenomena and characterization

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Learning by virtual doing: protocol simulators for surface analysis in microelectronics

Learning by virtual doing: protocol simulators for surface a...

引用

IEEE International conference on Microelectronic Systems Education

作者： F. Pecheux Y. Herve H. Marchall N. Hertel J.P. Stoquert R. Stuck Cnrs Phase Strasbourg France ISA University of Aarhus Aarhus Denmark

The paper details how state-of-the-art technologies like multimedia, computer modeling and simulation may be applied with profit for education in microelectronics. It presents a set of multimedia courses on material characterization of VLSI wafers with different techniques. The major interest of the courses is the protocol simulator available for each technique. Such a simulator aims at giving the user a good look and feel of the real and complex experimental setup by allowing him to perform actions on its simulated model, according to the real protocol of use. Thanks to an appropriate design methodology, it is pretty easy to adapt the protocol simulator engine to any industrial or academic specific setup and to couple it with other simulators (like spectrum simulator), thus providing virtual instrumentation on surface analysis.

关键词： Protocols Analytical models Computational modeling Semiconductor device modeling Educational technology Paper technology Computer simulation Computer science education microelectronics Very large scale integration

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simulation tools for the design and analysis of plasma processing equipment

Simulation tools for the design and analysis of plasma proce...

引用

IEEE International conference on Plasma Science (ICOPS)

作者： S. Rauf M. Grapperhaus R.J. Hoekstra M.J. Kushner University of Illinois at Urbana-Champaign Urbana IL US

Summary form only given. Plasma processing equipment has become one of the most important tools used for microelectronics fabrication. The increasing complexity of microelectronics devices is making it imperative to develop a thorough understanding of this equipment. In order to accomplish this goal, a hierarchy of simulation tools have been developed at the University of Illinois in the recent years. These tool are centered around the Hybrid Plasma Equipment Model (HPEM), detailed plasma model. This paper gives an overview of the HPEM, its extensions and the variety of problems these tools can address.

关键词： Plasma simulation Analytical models Plasma materials processing Plasma applications Plasma devices microelectronics Computational modeling Fabrication Electromagnetic fields Electrons

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Significant microelectronics systems design experience for a heterogeneous class of CS, CE, and EE students

Significant microelectronics systems design experience for a...

引用

IEEE International conference on Microelectronic Systems Education

作者： C.N. Purdy ECECS Department Electronic Design Automation Research Center University of Cincinnati Cincinnati OH USA

Using structured design techniques borrowed from software programming, beginning circuit designers at the University of Cincinnati consistently create correct, working chips containing several thousand gates. Careful choice of topics and easy-to-use tools allow consideration of physical behaviour and optimization techniques and also prepare students for more advanced study of circuit design. Chip testing is accomplished with user-friendly software and hardware created locally by a group of M.S. Students. Initially targeting CMOS tiny chip designs, course materials have recently been modified for programmable logic devices (PLDs). Immediate testability of PLDs provides better feedback, and the associated design tools support high-level hardware description languages (HDLs). This also makes multi-chip student projects feasible.

关键词： Circuit testing Very large scale integration Computational modeling Circuit simulation design optimization Circuit synthesis Software testing Hardware design languages microelectronics Computer science

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