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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是1321-1330 订阅
排序:
Laser attacks on integrated circuits: From CMOS to FD-SOI
Laser attacks on integrated circuits: From CMOS to FD-SOI
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International conference on design and Technology of Integrated Systems in Nanoscale Era (DTIS)
作者: Jean-Max Dutertre Stephan De Castro Alexandre Sarafianos Noémie Boher Bruno Rouzeyre Mathieu Lisart Joel Damiens Philippe Candelier Marie-Lise Flottes Giorgio Di Natale ENSM.SE Centre Microlectronique de Provence-Georges Charpak France ST Microelectronics Avenue Clestin Coq France STMicroelectronics LIRMM (CNRS UMR N5506) France
The use of a laser as a means to inject errors during the computations of a secure integrated circuit (IC) for the purpose of retrieving secret data was first reported in 2002. Since then, a lot of research work, main... 详细信息
来源: 评论
Lead-free solder material characterization for thermo-mechanical modeling
Lead-free solder material characterization for thermo-mechan...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Edith S. W. Poh W. H. Zhu X. R. Zhang C. K. Wang Anthony Y. S. Sun H. B. Tan Packaging Analysis & Design Center United Technologies Research Center Inc. Singapore Singapore
Systematic mechanical characterization has been done on lead-free solder alloys, i.e., SAC105, SAC205, SAC305, SAC105Ni0.02, and SAC105Ni0.05 as promising alternatives of SnPb solder. Solder joints in service stay in ... 详细信息
来源: 评论
Characterization and modeling of Thin Film Interface Strength Considering Mode Mixity
Characterization and Modeling of Thin Film Interface Strengt...
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Electronic Components and Technology conference (ECTC)
作者: A. Xiao L. G. Wang W. D. van Driel L. J. Ernst O. van der Sluis D. G. Yang G. Q. Zhang Delft University of Technnology Delft Netherlands NXP Semiconductors Research Nijmegen Netherlands
Interfacial delamination is a common cause of failure in microelectronic packages. Characterization and prediction of interface behavior in manufacturing, testing and application conditions is demanded in order to red... 详细信息
来源: 评论
A Method of Estimating FD Capacitance with Large Size Photodiode in High Speed Imaging (Invited Paper)
A Method of Estimating FD Capacitance with Large Size Photod...
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IEEE International conference on Integrated Circuits, Technologies and Applications (ICTA)
作者: Chao Gu Zhenhua Guo Shuangming Yu Liyuan Liu Jian Liu Peng Feng Nanjian Wu State Key Laboratory of Superlattices and Microstructures Institute of Semiconductors Chinese Academy of Sciences Beijing China School of Microelectronics University of Chinese Academy of Sciences Beijing China Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing China
This work proposes a simple method of calculating FD capacitance in 2-dimensional (2D) TCAD simulation that combines with pixel layout, simplifying the estimation of CIS FD design. Approximate per unit FD junction cap... 详细信息
来源: 评论
Live Thermal simulation Using Digital Twin for Efficient Semiconductor Layout design
Live Thermal Simulation Using Digital Twin for Efficient Sem...
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Electronics Packaging Technology conference (EPTC)
作者: Bin He Gongyue Tang Institute of Microelectronics (IME) Agency for Science Technology & Research (A*STAR) Singapore Republic of Singapore
This paper presents a novel approach for rapid thermal assessment of electronic devices using a Reduced-Order Model (ROM) based digital twin, with specific application to Electric Vehicle (EV) drivetrain inverters. Th... 详细信息
来源: 评论
A Modified Inter-Stage Binary Comparator Based on Parallel Prefix for Low Power and High-Density Applications
A Modified Inter-Stage Binary Comparator Based on Parallel P...
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IEEE UP Section conference on Electrical Computer and Electronics (UPCON)
作者: Rahul Kumar Shaleen Sangeeta Singh Microelectronics and VLSI Lab NIT Patna Bihar India
A recently reported parallel prefix tree approach is used to realize the N-bit comparator. The sub-circuit is modified to achieve the same functionality for a comparator with a lesser number of transistors, power and ... 详细信息
来源: 评论
simulation and experimental research on the multi-band slot-loaded printed antenna
Simulation and experimental research on the multi-band slot-...
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International conference on Communication Technology (ICCT)
作者: Run-nan Cai Shu Lin Guan-long Huang Jin-xiang Wang School of Electronics and Information Engineering Harbin Institute of Technology Harbin China Electronic Science and Technology post-doctoral research center Harbin Institute of Technology Harbin China Department of Microelectronics Science and Technology Harbin Institute of Technology Harbin China
Slots which are parallel with the bottom side are loaded at the two equilateral sides of the monopole isosceles triangle printed antenna to achieve multi-band in the operating frequency. The antenna is simulated by CS... 详细信息
来源: 评论
Investigation on the Radiation Emission Characteristics of Printed Circuit Boards with Integrated Isolation Chip
Investigation on the Radiation Emission Characteristics of P...
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Electronic Information Engineering and Computer Technology (EIECT), International conference on
作者: Fang Liu Tianmeng Zhang Tianting Zhao Yiming Chen Yue Zhuo Jianyu Feng Mengjiao Li Jinchun Gao Beijing Smart-chip Microelectronics Technology Co. Ltd. Beijing China Beijing Key Laboratory of Work Safety Intelligent Monitoring Beijing University of Posts and Telecommunications Beijing China
Isolation technology is widely used in high-low voltage transformation and long-distance transmission to effectively improve the reliability of the system. However, the imperfect design of the transformer inside the i... 详细信息
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Fabrication and characterization of a 83 MHz high temperature /spl beta/-SiC MESFET operational amplifier with an AlN isolation layer on
Fabrication and characterization of a 83 MHz high temperatur...
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Device Research conference
作者: K.K. Diogu G.L. Harris A. Mahajan I. Adesida D.F. Moeller R.A. Bertram Materials Science Research Center of Excellence School of Engineering Howard University College of Medicine Washington D.C. DC USA Center for Compound Semiconductor Microelectronics University of Illinois Urbana IL USA MOS Digita-Analog Integrated Circuits Division Motorola Inc. Austin TX USA
Summary form only given. The fabrication of a high temperature analog integrated operational amplifier implemented in /spl beta/-SiC technology using depletion-only MESFETs is presented. The operational amplifier is i... 详细信息
来源: 评论
A phase-shift compensation technique for radiation detection readout circuit to improve stability
A phase-shift compensation technique for radiation detection...
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2010 10th IEEE International conference on Solid-State and Integrated Circuit Technology(第十届固态和集成电路技术国际会议 ICSICT-2010)
作者: Jing Li Ya-Cong Zhang Zhong-Jian Chen Department of Microelectronics Peking University Beijing 100871 China
Stability is a critical design issue for radiation detection readout circuit when high counting rate together with low power property is simultaneously required. In this letter a novel method which increases the phase... 详细信息
来源: 评论