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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是1351-1360 订阅
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EMIB Packages simulation for Heterogeneous Integration of GaN and Si High-Power Devices
EMIB Packages Simulation for Heterogeneous Integration of Ga...
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International conference on (ICEPT) Electronic Packaging Technology
作者: Nana Pan Ziyu Liu Yudi Ju Han Jiang Yun Yin Qingqing Sun Lin Chen School of Microelectronics Fudan University Shanghai China
Serving as a high-bandwidth, low-latency, and low-power solution for die-to-die communication, Embedded Multi-die Interconnect Bridge (EMIB) enables selective high-density electrical connections between heterogeneous ... 详细信息
来源: 评论
design and experiment of a high gain axial-mode helical antenna
Design and experiment of a high gain axial-mode helical ante...
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International conference on Communication Technology (ICCT)
作者: Run-nan Cai Shu Lin Li-na Wang Jin-yue Wang Yue-long Lü Guan-long Huang Jing-hui Qiu Jin-xiang Wang School of Electronics and Information Engineering Harbin Institute of Technology Harbin China Electronic Science and Technology post-doctoral research center Harbin Institute of Technology Harbin China Department of Microelectronics Science and Technology Harbin Institute of Technology Harbin China
A high gain axial-mode helical antenna with parasitic element is proposed. A metal wafer is used as parasitic element, loaded in the front of general axial-mode helical antenna to achieve the aim of improving antenna ... 详细信息
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Frequency Domain Methodology for Evaluating Signal Integrity Performance of Logic to Logic and HBM Interconnect Models for Chiplet Packaging
Frequency Domain Methodology for Evaluating Signal Integrity...
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Electronics Packaging Technology conference (EPTC)
作者: Li Kangrong Mihai Dragos Rotaru Institute of Microelectronics ASTAR Singapore
A novel methodology to evaluate the signal integrity (SI) performance of logic to logic and high bandwidth memory (HBM) interconnect model for chiplet packaging is proposed. Compared with the traditional S parameters ... 详细信息
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A Study of the States Kinetics in NBTI and HCI Degradation based on TCAD
A Study of the States Kinetics in NBTI and HCI Degradation b...
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Electronics and Electrical Engineering Technology (EEET), International conference on
作者: Xinhuan Yang Mingyan Yu Xingyu Fang Liang Wang Chuanzheng Wang Yuanfu Zhao School of Electronic Information Hangzhou Dianzi University Hangzhou China Beijing Microelectronics Technology Institute Beijing Chinia
The evaluation of MOSFET reliability requires aging model, which based on time-consuming and costly aging test. In order to reduce the costs of aging test, the parameters of trap (TP) and two-stage (TS) degradation mo... 详细信息
来源: 评论
A Fully Static Scheduling Approach for Fast Cycle Accurate SystemC simulation of MPSoCs
A Fully Static Scheduling Approach for Fast Cycle Accurate S...
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2007 International conference on microelectronics (ICM'07)
作者: Richard Buchmann Alain Greiner LIP6/UPMC Université Pierre et Marie Curie Paris France
This paper presents principles and tools to facilitate Multi-Processor System on Chips (MPSoCs) design and modeling, and to speed up cycle accurate SystemC simulation. We describe an effective way to build an hardware... 详细信息
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Enabling Power Side-Channel Attack simulation on Mixed-Signal Neural Network Accelerators
Enabling Power Side-Channel Attack Simulation on Mixed-Signa...
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Omni-layer Intelligent Systems (COINS), International conference on
作者: Simon Wilhelmstätter Joschua Conrad Devanshi Upadhyaya Ilia Polian Maurits Ortmanns Institute of Microelectronics University of Ulm Ulm Germany Institute for Computer Architecture and Computer Engingeering University of Stuttgart Stuttgart Germany
Due to the tremendous success of Deep Learning with neural networks (NNs) in recent years and the simultaneous leap of embedded, low-power devices (e.g. wearables, smart-phones, IoT, and smart sensors), enabling the i... 详细信息
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A Novel Method for Air-Gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ)
A Novel Method for Air-Gap Formation around Via-Middle (VM) ...
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Electronic Components and Technology conference (ECTC)
作者: King-Jien Chui Woon Leng Loh Xiangyu Wang Zhaohui Chen Mingbin Yu Institute of Microelectronics A*STAR (Agency for Science Technology and Research) Singapore
Significant stress is induced in the crystalline Si area around a Cu-filled Through Silicon Via (TSV) due to the large mismatch in the co-efficient of thermal expansion (CTE) between Si and Cu. As a result, CMOS devic... 详细信息
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A novel low-voltage low-power bulk-driven cascade current mirror
A novel low-voltage low-power bulk-driven cascade current mi...
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International conference on Advanced Computer Theory and Engineering, ICACTE
作者: Li Yani Yang Yintang Zhu Zhangming Institute of Microelectronics Xidian University Xi'an China
A novel low-voltage low-power PMOS cascade current mirror employing the bulk-driven technique is described in this paper. Based on SMIC 0.18μm CMOS process, the characteristics of the low-voltage bulk-driven cascade ... 详细信息
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Silicon implementation of micro pressure sensor
Silicon implementation of micro pressure sensor
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International conference on Electronic Devices, Systems and Applications (ICEDSA)
作者: Yufridin Wahab Aladin Zayegh Rezaul Begg Centre for Industrial Collaboration School of Microelectronic Engineering Universiti Malaysia Pedis Kangar Malaysia Centre for Microelectronics and Telecommunication Centre for Ageing Rehab. Exercise & Sport Science Victoria University Melbourne Australia
Pressure sensing is one of the mostly performed measurement encompassing varieties of applications. The latest technology such as silicon based Micro-electromechanical Systems (MEMS) technology is favoured due to its ... 详细信息
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Analysis of the three-dimensional delamination behavior of stretchable electronics applications
Analysis of the three-dimensional delamination behavior of s...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: O. van der Sluis P.H.M. Timmermans E.J.L. van der Zanden J.P.M. Hoefnagels Philips Applied Technologies Eindhoven Netherlands Department of Precision and Microsystem Engineering Delft University of Technnology Delft Netherlands Department of Mechanical Engineering Eindhovan University of Technology Eindhoven Netherlands
Stretchable electronics offer potential application areas in biological implants interacting with human tissue. Furthermore, they facilitate increased design freedom of electronic products. Typical applications can be... 详细信息
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