咨询与建议

限定检索结果

文献类型

  • 1,366 篇 会议
  • 46 篇 期刊文献
  • 1 册 图书

馆藏范围

  • 1,413 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 615 篇 工学
    • 387 篇 电气工程
    • 246 篇 电子科学与技术(可...
    • 221 篇 计算机科学与技术...
    • 128 篇 材料科学与工程(可...
    • 119 篇 软件工程
    • 89 篇 机械工程
    • 66 篇 动力工程及工程热...
    • 59 篇 控制科学与工程
    • 42 篇 化学工程与技术
    • 35 篇 信息与通信工程
    • 31 篇 仪器科学与技术
    • 23 篇 力学(可授工学、理...
    • 15 篇 冶金工程
    • 15 篇 生物医学工程(可授...
    • 10 篇 建筑学
    • 9 篇 光学工程
    • 9 篇 土木工程
    • 8 篇 交通运输工程
    • 8 篇 安全科学与工程
    • 7 篇 生物工程
  • 255 篇 理学
    • 146 篇 物理学
    • 116 篇 数学
    • 45 篇 化学
    • 22 篇 系统科学
    • 10 篇 生物学
    • 10 篇 统计学(可授理学、...
  • 38 篇 管理学
    • 37 篇 管理科学与工程(可...
  • 8 篇 医学
    • 7 篇 临床医学
    • 6 篇 基础医学(可授医学...
    • 5 篇 药学(可授医学、理...
  • 4 篇 法学
  • 4 篇 艺术学
  • 2 篇 农学
  • 1 篇 经济学
  • 1 篇 教育学

主题

  • 272 篇 computational mo...
  • 230 篇 integrated circu...
  • 190 篇 circuit simulati...
  • 178 篇 microelectronics
  • 125 篇 semiconductor de...
  • 115 篇 analytical model...
  • 107 篇 solid modeling
  • 96 篇 mathematical mod...
  • 65 篇 simulation
  • 61 篇 silicon
  • 57 篇 predictive model...
  • 53 篇 hardware design ...
  • 53 篇 micromechanical ...
  • 50 篇 load modeling
  • 50 篇 hardware
  • 49 篇 cmos technology
  • 47 篇 spice
  • 45 篇 design automatio...
  • 43 篇 logic gates
  • 42 篇 finite element a...

机构

  • 13 篇 institute of mic...
  • 13 篇 institute of mic...
  • 12 篇 institute of mic...
  • 7 篇 institute of mic...
  • 6 篇 department of mi...
  • 6 篇 institute of mic...
  • 6 篇 department of mi...
  • 6 篇 school of softwa...
  • 5 篇 school of microe...
  • 5 篇 nxp semiconducto...
  • 5 篇 national microel...
  • 5 篇 school of microe...
  • 5 篇 institute of mic...
  • 5 篇 philips applied ...
  • 5 篇 imec leuven
  • 5 篇 institute of mic...
  • 5 篇 amic angewandte ...
  • 5 篇 agilent technol ...
  • 5 篇 delft university...
  • 4 篇 shanghai researc...

作者

  • 10 篇 xiaowu zhang
  • 10 篇 roca e.
  • 9 篇 castro-lopez r.
  • 9 篇 a. napieralski
  • 8 篇 rodriguez r.
  • 8 篇 nafria m.
  • 7 篇 l.j. ernst
  • 7 篇 g.q. zhang
  • 7 篇 martin-martinez ...
  • 7 篇 sven rzepka
  • 7 篇 fernandez f. v.
  • 7 篇 s. selberherr
  • 7 篇 zhang gq
  • 6 篇 andrzej napieral...
  • 6 篇 m.k. iyer
  • 6 篇 ru huang
  • 6 篇 n. ranganathan
  • 6 篇 k.m.b. jansen
  • 5 篇 khaoula mbarek
  • 5 篇 sami ghedira

语言

  • 1,396 篇 英文
  • 10 篇 中文
  • 4 篇 其他
  • 3 篇 德文
检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1413 条 记 录,以下是131-140 订阅
排序:
Live Thermal simulation Using Digital Twin for Efficient Semiconductor Layout design
Live Thermal Simulation Using Digital Twin for Efficient Sem...
收藏 引用
Electronics Packaging Technology conference (EPTC)
作者: Bin He Gongyue Tang Institute of Microelectronics (IME) Agency for Science Technology & Research (A*STAR) Singapore Republic of Singapore
This paper presents a novel approach for rapid thermal assessment of electronic devices using a Reduced-Order Model (ROM) based digital twin, with specific application to Electric Vehicle (EV) drivetrain inverters. Th... 详细信息
来源: 评论
design and simulation of Optical XNOR Logic Gate Based on MEMS Technology
Design and Simulation of Optical XNOR Logic Gate Based on ME...
收藏 引用
Iranian International conference on microelectronics (IICM)
作者: Eslami, Mohamadreza Marvi, Fahimeh Dinani, Kian Jafari Shahid Beheshti Univ Fac Elect Engn Tehran Iran
Prototypes of computers, or processors, were based almost exclusively on mechanical devices. Although electronic processors have become increasingly dominant over the past few decades, Recent advances in the technolog... 详细信息
来源: 评论
Investigation on the Radiation Emission Characteristics of Printed Circuit Boards with Integrated Isolation Chip
Investigation on the Radiation Emission Characteristics of P...
收藏 引用
Electronic Information Engineering and Computer Technology (EIECT), International conference on
作者: Fang Liu Tianmeng Zhang Tianting Zhao Yiming Chen Yue Zhuo Jianyu Feng Mengjiao Li Jinchun Gao Beijing Smart-chip Microelectronics Technology Co. Ltd. Beijing China Beijing Key Laboratory of Work Safety Intelligent Monitoring Beijing University of Posts and Telecommunications Beijing China
Isolation technology is widely used in high-low voltage transformation and long-distance transmission to effectively improve the reliability of the system. However, the imperfect design of the transformer inside the i... 详细信息
来源: 评论
Multi-Scale modeling of Transistors Based on the 2D Semiconductor Bi2O2Se
Multi-Scale Modeling of Transistors Based on the 2D Semicond...
收藏 引用
International conference on simulation of Semiconductor Processes and Devices (SISPAD)
作者: Mohammad Rasool Davoudi Pedram Khakbaz Theresia Knobloch Dominic Waldhoer Changze Liu Aftab Nazir Yichi Zhang Hailin Peng Tibor Grasser Institute for Microelectronics Technische Universitat Wien Vienna Austria Huawei Technologies R&D Belgium NV Leuven Belgium Peking University Beijing China
The growing interest in 2D materials for novel electronic devices has sparked extensive research into their properties. These atomically thin materials, such as graphene and transition metal dichalcogenides, possess u...
来源: 评论
Determining System Level Margin through SIPI Co-simulation and Jitter Transfer Function
Determining System Level Margin through SIPI Co-simulation a...
收藏 引用
Electronics Packaging Technology conference (EPTC)
作者: Fern Nee Tan Li Wern Chew Ling Li Ong Sze Lin Mak Chee Hoong Mah Client System Architecture & Engineering Intel Microelectronics (M) Sdn. Bhd. Penang Malaysia Assembly and Test Division Intel Microelectronics (M) Sdn. Bhd. Penang Malaysia
This paper investigates Signal Integrity - Power Integrity relationship using a dual reference package design and understanding high-speed interconnect circuit's behavior through Jitter Transfer Function. A dual r... 详细信息
来源: 评论
Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment
Thermo-Mechanical Super-Element of a Packaged-Chip Model for...
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: C. B. Umunnakwe I. Zawra E. B. Rudnyi M. Niessner T. Bechtold Jade University of Applied Sciences Wilhelmshaven Germany Cadfem GmbH Munich Germany Infineon Technologies AG Neubiberg Germany
The integration of reduced state-space models into finite element analysis tools is a key factor in enhancing the practicality of reduced order models. It helps safeguarding the intellectual property and approximating... 详细信息
来源: 评论
simulation of remote-controlled power supplies for laboratory and research work  16
Simulation of remote-controlled power supplies for laborator...
收藏 引用
IEEE 16th International conference on the Experience of designing and Application of CAD Systems (CADSM)
作者: Sus, Bogdan B. Zagorodnyuk, Sergiy P. Bauzha, Oleksandr S. Diachuk, Nazar O. Kozinetz, Aleksey, V Taras Shevchenko Natl Univ Kyiv Inst High Technol Kiev Ukraine Taras Shevchenko Natl Univ Kyiv Fac Radio Phys Elect & Comp Syst Kiev Ukraine
The development of hardware and software for remote control systems can effectively resolve these problems. The article discusses the main steps of modeling analog and digital parts of power supplies and technical sol... 详细信息
来源: 评论
Applying Ensemble Learning with Multiple Machine Learning Algorithms to Predict the Reliability of Wafer-Level Packaging
Applying Ensemble Learning with Multiple Machine Learning Al...
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Qinghua Su K. N. Chiang Dept. of Power Mechanical Engineering Advanced Microsystem Packaging and Nano-Mechanics Research Lab National Tsing Hua University Hsinchu Taiwan R.O.C
Before being introduced to the marketplace, electronic packaging products typically undergo an Accelerated Thermal Cycling (ATC) test. During the design phase, extensive repetitive experiments can lead to significant ... 详细信息
来源: 评论
Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach
Evaluation of thermomechanical behavior of electronic device...
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: M. Weninger J. Zündel T. Krivec M. Frewein S. Waschnig P. Fuchs C. Obst AT&S Austria Technologie & Systemtechnik Aktiengesellschaft Austria Polymer Competence Center Leoben GmbH Austria Prime Aerostructures GmbH Austria
Warpage is an issue in the manufacturing of electronic packages. The main driver for this effect is the mismatch of material properties especially during temperature cycling. To predict warpage before building samples... 详细信息
来源: 评论
LEDs Lifetime Prediction modeling: Thermomechanical simulation for SAC305 and SAC105
LEDs Lifetime Prediction Modeling: Thermomechanical Simulati...
收藏 引用
Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Mohd Zubair Akhtar Maximilian Schmid Andreas Zippelius Gordon Elger Technische Hochschule Ingolstadt Esplanade 10 Ingolstadt
The challenge of predicting the reliability of solder joints in high-power LED packages by Finite Element Analysis (FEA) is crucial for the automotive industry. Focusing on the thermo-mechanical stresses between LED p...
来源: 评论