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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1413 条记录，以下是131-140 订阅

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Live Thermal simulation Using Digital Twin for Efficient Semiconductor Layout design

Live Thermal Simulation Using Digital Twin for Efficient Sem...

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Electronics Packaging Technology conference (EPTC)

作者： Bin He Gongyue Tang Institute of Microelectronics (IME) Agency for Science Technology & Research (A*STAR) Singapore Republic of Singapore

ISBN: (数字)9798331522001

ISBN: (纸本)9798331522018

This paper presents a novel approach for rapid thermal assessment of electronic devices using a Reduced-Order Model (ROM) based digital twin, with specific application to Electric Vehicle (EV) drivetrain inverters. The method utilizes Singular Value Decomposition (SVD) to construct a computationally efficient model that enables real-time manipulation of chip layouts and instant visualization of thermal impacts. Tested on both homogeneous and heterogeneous chip configurations, the approach demonstrates high accuracy with maximum temperature differences of ~3 K compared to Computational Fluid Dynamics (CFD) simulations and significant computational efficiency (results generated in ~1 second). This technology offers a powerful tool for balancing increased power density demands with effective thermal management, potentially accelerating the development of high-performance EV drivetrain inverters.

关键词： Power system measurements Accuracy Density measurement Computational modeling Computational fluid dynamics Electric vehicles Inverters Digital twins Computational efficiency Read only memory

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design and simulation of Optical XNOR Logic Gate Based on MEMS Technology

Design and Simulation of Optical XNOR Logic Gate Based on ME...

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Iranian International conference on microelectronics (IICM)

作者： Eslami, Mohamadreza Marvi, Fahimeh Dinani, Kian Jafari Shahid Beheshti Univ Fac Elect Engn Tehran Iran

ISBN: (纸本)9781665480604

Prototypes of computers, or processors, were based almost exclusively on mechanical devices. Although electronic processors have become increasingly dominant over the past few decades, Recent advances in the technology of manufacturing 3D electromechanical components in micro and nano sizes have created new techniques for building complex microstructures that are of interest to researchers in new research In the field of mechanical computing. In this paper, we present a new XNOR logic gate design approach that can be built based on micro-electromechanical logic gates. One of the main advantages of this method is the ability to combine multi-physical as well as compatibility with the CMOS manufacturing process, as well as lower power consumption compared to logic gates consisting of several CMOS transistors. In this design, we have designed and simulated an XNOR logic gate using the multi-physics capability of Comsolsoftware and as well as using optical, electronic, mechanical and electro-static physics, whose inputs will be both electrical and optical signals. In this paper, according to the above selected design, by modeling and simulating different input modes of this logic gate, we examine the effect of each mode on the output of the gate as well as other features such as structure life, power consumption and resonant frequency. The proposed gate structure has a resonant frequency of 46 kHz and is highly reliable because it can operate without mechanical connection of the MEMS operator to logic inputs.

关键词： Logic gates Optical MEMS structure Mechanical computers

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Investigation on the Radiation Emission Characteristics of Printed Circuit Boards with Integrated Isolation Chip

Investigation on the Radiation Emission Characteristics of P...

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Electronic Information Engineering and Computer Technology (EIECT), International conference on

作者： Fang Liu Tianmeng Zhang Tianting Zhao Yiming Chen Yue Zhuo Jianyu Feng Mengjiao Li Jinchun Gao Beijing Smart-chip Microelectronics Technology Co. Ltd. Beijing China Beijing Key Laboratory of Work Safety Intelligent Monitoring Beijing University of Posts and Telecommunications Beijing China

ISBN: (数字)9798331528850

ISBN: (纸本)9798331528867

Isolation technology is widely used in high-low voltage transformation and long-distance transmission to effectively improve the reliability of the system. However, the imperfect design of the transformer inside the isolation chip may lead to an interference path between the primary and secondary coils of the transformer, which causes radiation emission. Accordingly, in this current work, the radiation emission characteristic of the printed circuit board (PCB) was investigated by simulation analysis and experimental tests. The main radiation sources in isolation chip were extracted, and the electromagnetic interference (EMI) radiation model was developed in electromagnetic simulation software to analyze the maximum radiation intensity of the PCB. A series of experimental tests are conducted to validate the electromagnetic field model. The results of this study provide a better understanding of the radiation emission characteristic of isolation chips and theorical support for improving the electromagnetic compatibility in the electronic system.

关键词： Coils Analytical models Printed circuits Electromagnetic interference Voltage Transformers Three-dimensional printing Numerical models Electromagnetic fields Integrated circuit modeling

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Multi-Scale modeling of Transistors Based on the 2D Semiconductor Bi2O2Se

Multi-Scale Modeling of Transistors Based on the 2D Semicond...

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International conference on simulation of Semiconductor Processes and Devices (SISPAD)

作者： Mohammad Rasool Davoudi Pedram Khakbaz Theresia Knobloch Dominic Waldhoer Changze Liu Aftab Nazir Yichi Zhang Hailin Peng Tibor Grasser Institute for Microelectronics Technische Universitat Wien Vienna Austria Huawei Technologies R&D Belgium NV Leuven Belgium Peking University Beijing China

The growing interest in 2D materials for novel electronic devices has sparked extensive research into their properties. These atomically thin materials, such as graphene and transition metal dichalcogenides, possess unique properties that make them highly appealing for various applications. In this context, our study focuses on investigating the material and non-ideal properties of the 2D layered semiconductor bismuth oxyselenide (Bi 2 O 2 Se) and its native oxide Bi 2 SeO 5 . Through a multi-scale simulation approach combining density functional theory (DFT) with technology computer-aided design (TCAD), we extract critical parameters and simulate transfer characteristics, demonstrating the potential of these materials in nano-electronics.

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Determining System Level Margin through SIPI Co-simulation and Jitter Transfer Function

Determining System Level Margin through SIPI Co-simulation a...

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Electronics Packaging Technology conference (EPTC)

作者： Fern Nee Tan Li Wern Chew Ling Li Ong Sze Lin Mak Chee Hoong Mah Client System Architecture & Engineering Intel Microelectronics (M) Sdn. Bhd. Penang Malaysia Assembly and Test Division Intel Microelectronics (M) Sdn. Bhd. Penang Malaysia

ISBN: (纸本)9798350398861

This paper investigates Signal Integrity - Power Integrity relationship using a dual reference package design and understanding high-speed interconnect circuit's behavior through Jitter Transfer Function. A dual referencing design and modeling approach is introduced to enable maximum noise coupling to differential signal traces. simulation platform that allows a quick jitter assessment with power noise injection is then built to evaluate the risk of having dual referencing design. Using Peripheral Component Interconnect Express Gen5 interconnects as a case study, the findings shown that mid-frequency power noise matters most to differential interconnects, which turned out to be correlated to its Jitter Transfer Function.

关键词： Couplings simulation Transfer functions Integrated circuit interconnections Jitter Data models Integrated circuit modeling

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Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment

Thermo-Mechanical Super-Element of a Packaged-Chip Model for...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： C. B. Umunnakwe I. Zawra E. B. Rudnyi M. Niessner T. Bechtold Jade University of Applied Sciences Wilhelmshaven Germany Cadfem GmbH Munich Germany Infineon Technologies AG Neubiberg Germany

The integration of reduced state-space models into finite element analysis tools is a key factor in enhancing the practicality of reduced order models. It helps safeguarding the intellectual property and approximating the behaviour of complex systems. This paper introduces a novel thermo-mechanical super-element, which contains the reduced order model and can be easiliy integrated into finite element environment. Application of the thermo-mechanical super-element leads to significant speed up in computational time of the entire finite element model. Furthermore, compared to the full-order finite element model, the super-element shows excellent approximation of the thermo-mechanical behaviour of the original model and has significant implications for the design and optimization of such systems.

关键词： Micromechanical devices Computational modeling Thermomechanical processes Intellectual property Reduced order systems Finite element analysis State-space methods

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simulation of remote-controlled power supplies for laboratory and research work 16

Simulation of remote-controlled power supplies for laborator...

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IEEE 16th International conference on the Experience of designing and Application of CAD Systems (CADSM)

作者： Sus, Bogdan B. Zagorodnyuk, Sergiy P. Bauzha, Oleksandr S. Diachuk, Nazar O. Kozinetz, Aleksey, V Taras Shevchenko Natl Univ Kyiv Inst High Technol Kiev Ukraine Taras Shevchenko Natl Univ Kyiv Fac Radio Phys Elect & Comp Syst Kiev Ukraine

ISBN: (纸本)9781665438940

The development of hardware and software for remote control systems can effectively resolve these problems. The article discusses the main steps of modeling analog and digital parts of power supplies and technical solutions for laboratory work in Multisim and Proteus. The important task of developing remotely controlled power supplies based on microcontrollers for research purposes is discussed in detail. Development is carried out by modeling the developed schemes based on digital and analog elements. The algorithm of work and the basic stages of designing the electronic circuit and methods of stabilization with the application of the microcontroller are described in detail. Software application for remote control of the power supply in real-time has been developed. The possibility of conducting remote real experiments in the courses of semiconductor electronics and peripherals was demonstrated.

关键词： Proteus remote control simulation peripheral devices high impedance samples signal encoder

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Applying Ensemble Learning with Multiple Machine Learning Algorithms to Predict the Reliability of Wafer-Level Packaging

Applying Ensemble Learning with Multiple Machine Learning Al...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Qinghua Su K. N. Chiang Dept. of Power Mechanical Engineering Advanced Microsystem Packaging and Nano-Mechanics Research Lab National Tsing Hua University Hsinchu Taiwan R.O.C

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Before being introduced to the marketplace, electronic packaging products typically undergo an Accelerated Thermal Cycling (ATC) test. During the design phase, extensive repetitive experiments can lead to significant waste of both time and resources. Therefore, applying machine learning with finite element analysis to predict the reliability of advanced packaging can greatly enhance the efficiency of electronic packaging product development. To reduce costs, the validated finite element models will replace real experiments to generate a small dataset for training the machine learning models. The smaller the required dataset, the lower the time cost for simulation; however, this also increases the difficulty of training the high-performance machine learning models. To address challenges associated with training on small datasets, this study uses Wafer-Level Packaging (WLP) as an example and applies ensemble learning with multiple machine learning algorithms to predict the reliability for packaging.

关键词： Semiconductor device modeling Training Machine learning algorithms Semiconductor device reliability Predictive models Packaging Prediction algorithms Wafer scale integration Finite element analysis Ensemble learning

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Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Evaluation of thermomechanical behavior of electronic device...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： M. Weninger J. Zündel T. Krivec M. Frewein S. Waschnig P. Fuchs C. Obst AT&S Austria Technologie & Systemtechnik Aktiengesellschaft Austria Polymer Competence Center Leoben GmbH Austria Prime Aerostructures GmbH Austria

Warpage is an issue in the manufacturing of electronic packages. The main driver for this effect is the mismatch of material properties especially during temperature cycling. To predict warpage before building samples, the FEM (Finite Element Method) is used in this study. PCBs (Printed Circuit Boards) are assembled in array format. Thus the simulation should be done in this format. Studies investigated PCBs thru a detailed representation [1]. However, no studies were found which simulate an array of PCBAs (Assembled PCBs). This is mainly due limitation of the hardware memory. The array of m2x modules in this work is not feasible to be calculation thru a usual modelling approach, even not through cloud computing. Thus this study investigates the use of substructures to overcome the hardware limitations. The array was manufactured and the simulation results were validated by using DIC (Digital Image Correlation). The predicted warpage of the novel modelling approach is well aligned with the measurement *** establishment of the method for array format warpage assessment significantly decreases the development times for electronic packages, due to the mitigation of reliability risks and thus design cycles.

关键词： Micromechanical devices Temperature Computational modeling simulation Thermomechanical processes Printed circuits Predictive models

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LEDs Lifetime Prediction modeling: Thermomechanical simulation for SAC305 and SAC105

LEDs Lifetime Prediction Modeling: Thermomechanical Simulati...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Mohd Zubair Akhtar Maximilian Schmid Andreas Zippelius Gordon Elger Technische Hochschule Ingolstadt Esplanade 10 Ingolstadt

The challenge of predicting the reliability of solder joints in high-power LED packages by Finite Element Analysis (FEA) is crucial for the automotive industry. Focusing on the thermo-mechanical stresses between LED package and the PCB, i.e. the aluminum insulated metal substrate (Al-IMS), this paper analyzes the crack formation in the solder joints for seven different ceramic-based LED packages. The model is validated by data from a large experimental study, covering typical two pad and three pad footprint design for LED package and five solder materials. The data set contains experimental data of nearly 1,800 LED packages, including over 40,000 Transient Thermal analyses (TTA) and 9,000 Scanning Acoustic Microscopy (SAM) measurements. The paper investigates different post-processing approaches related to FEA simulations for surface-mounted devices (SMD) LED assemblies, recognizing the limitations of approaches used for Ball Grid Array (BGA) packages due to the large difference in geometry and pad layout. The primary goal of the FEA model is to correctly predict the reliability of different pad designs, i.e. two or three pad footprints for different solders and develop the universal lifetime model. The methodology includes detailed thermomechanical simulations via Ansys. The paper compares the behavior of SAC305 and SAC105. Each LED package undergoes five thermal cycles, ranging from $- 40^{\circ}\mathrm{C}$ to $125^{\circ}\mathrm{C}$, to assess accumulated creep strain. The Coffin Manson model is utilized for the lifetime prediction of the solder joint. To the best of the author’s knowledge, the paper presents for the first time a model which is validated for different pad designs and answers the question: Is a three-pad or a two-pad preferable for solder joint reliability? The results show a good agreement, i.e. $\mathrm{R}^simulation=96$% for critical path averaging, of simulation outcomes for ceramic LED packages with thick film metallization. However, some variabilit

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