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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是161-170 订阅

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Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations

Reduction of empiricism in the solder joint reliability asse...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： M. van Soestbergen R. Roucou M. Rebosolan J.J. M Zaal NXP Semiconductors Package Innovation Gerstweg 2 Nijmegen Netherlands NXP Semiconductors Corporate Quality Gerstweg 2 Nijmegen Netherlands dep. of Aerospace Engineering Delft University of Technology Kluyverweg 1 Netherlands

To ensure sufficient field life of solder joints, standardized stress tests are performed during the development phase of products, where calibrated thermo-mechanical simulations are frequently used to ensure a potentially sufficient robustness margin. In this work we show how simulations are calibrated for the QFN (Quad Flat No leads) package family. Using thorough failure analysis, we found that for QFN packages two types of solder joint failure modes can occur. The first failure mode is a brittle fracture through the intermetallic region near the solder interface, the other mode is a crack through the bulk of the solder. In the simulations we handle both failure modes using two different failure metrics. For the brittle fractures we analyzed the volumetric strain energy density in a thin region near the interface. For bulk fails we computed the volume-averaged inelastic strain energy density across the whole solder joint. Using both metrics we found a correlation between simulation and experimental results, where Miner’s rule was used to correlate the results of any non-functional anchor joint to the experimental results of the functional joints. The correlation can be used to predict the solder performance upfront in the design phase, and thus reduce the experimental effort during product development.

关键词： Measurement Correlation Computational modeling Thermomechanical processes Failure analysis Fatigue Intermetallic

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Sallen-Key High-Pass Filter with Unrelated Tune of Generic Parameter 23

Sallen-Key High-Pass Filter with Unrelated Tune of Generic P...

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23rd IEEE International conference of Young Professionals in Electron Devices and Materials, EDM 2022

作者： Denisenko, Darya Yu. Prokopenko, Nikolay N. Ivanov, Yuri I. Butyrlagin, Nikolay N. Don State Technical University Department of Scientific Research Rostov-on-Don Russia Southern Federal University Department of Automatic Control Systems Rostov-on-Don Russia Department of Information Systems and Radio Engineering Don State Technical University Zelenograd Rostov-on-Don Russia Institute for Design Problems in Microelectronics of Russian Academy of Sciences Zelenograd Rostov-on-Don Russia

ISBN: (纸本)9781665498043

New second order high-pass filter of the Sallen-Key family circuit is considered, where there is unrelated tune of generic parameters by a digitally controlled resistor - the pole frequency, Q-factor pole and the scale transfer coefficient. The basic mathematical expressions of transfer function for proposed high-pass filter are obtained. A comparison of the parameters of the known and new schemes is given. A Sallen-Key high-pass filter circuit based on a high-frequency emitter follower has been developed. The results of high-pass filter modeling in the Micro-Cap 12 environment using the OP37 operational amplifier and an ideal buffer amplifier are presented. Computer simulation has shown that the pole frequency is adjusted by resistor R5. Adjusting the pole attenuation is possible by changing the resistor R3, while the pole attenuation frequency unchanged, an increase in R3 leads to an increase of the pole attenuation. © 2022 IEEE.

关键词： Operational amplifiers

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Channel modeling of Multilayer PCB with Nonhomogeneous Substrates using Neural Network 13

Channel Modeling of Multilayer PCB with Nonhomogeneous Subst...

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13th International conference on Microwave and Millimeter Wave Technology, ICMMT 2021

作者： Wang, Xin Chen, Xiong Wang, Ling Tianjin University School Of Microelectronics Tianjin China

ISBN: (纸本)9781665434379

This paper proposes a simplified channel modeling method for the multilayer PCB with nonhomogeneous substrate filling using neural network. The neural network model is used to obtain a simplified relationship between the geometry parameters at section view and the resistance, inductance, conductance and capacitance (RLGC) of the multilayer PCB. By using this method, the S-parameter comparable with finite element electromagnetic (EM) simulation can be obtained. By this proposed method, the channel property of multilayer PCB filling with nonhomogeneous substrates can be effectively solved rather than using the time- costing full wave simulation. © 2021 IEEE.

关键词： Timing circuits

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W-band Broadband Frequency Multiplier

W-band Broadband Frequency Multiplier

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IEEE Asia-Pacific conference on Antennas and Propagation (APCAP)

作者： Xi Fang Bo Zhang Zhongqian Niu Yuanbo Wen Lei Wang School of Optoelectronic Engineering Chongqing University of Posts and Telecommunications Chongqing China Chongqing Institute of Microelectronics Industry Technology UESTC Chongqing China School of Electronic Science and Engineering University of Electronic Science and Technology of China Chengdu China

The W-band frequency range has garnered considerable attention among researchers, necessitating the development of efficient frequency doubling techniques. This paper introduces a novel W-band broadband frequency doubler employing a Schottky diode-based approach. A varactor diode, specifically the M4AE1310 model, serves as the crucial nonlinear element in the frequency doubler design. To streamline the model structure, the biased DC ground structure is eliminated. The frequency doubler comprises a waveguide-microstrip probe, a ground-matched direct, a CMRC (compact microstrip resonant cell) low-pass filter, and an input-output matching section. The modeling simulation is conducted using a combined ADS and HFSS. The simulation results demonstrate exceptional frequency doubling efficiency, yielding an output power of approximately 10 dBm when driven with a power of 20 dBm within the W-band frequency range.

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Board level FEA reliability and stress modeling for chip-to-wafer bonded chiplet package

Board level FEA reliability and stress modeling for chip-to-...

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Electronic Components and Technology conference (ECTC)

作者： Rathin Mandal Chai Tai Chong Institute of Microelectronics Agency for Science Technology and Research (A*STAR) Innovis Singapore

Chip-to-wafer interconnect approach is to produce denser and smaller dies, while improving inter-chip bandwidth and power dissipation. In this work a vertical system integration is done by copper pillar and solder interconnects. Three-dimensional (3D) integration technology uses chip-to-wafer bonding to achieve effective chip integration. By structural simulation and modeling a reliable package selection is made from different package designs, epoxy mold compounds (EMC), polymer dielectric (PD) materials and different other package parameters. In this simulation and modeling an approach has been taken to model two levels of solder interconnects namely copper pillar solder micro-bump and BGA (ball grid array) solder in the same FEA (finite element analysis) model. FEA mesh densities in 1 st and 2 nd interconnects are joined by contact pair definition. Parametric studies are done for three different EMC and three different PD materials. 1 st level solder interconnect or micro-bump temperature cycling (TC) reliability life is significantly higher than 2 nd level solder interconnect due to presence of EMC around the 1 st level interconnect. High CTE (coefficient of thermal expansion) of EMC shows very poor solder life for 1 st level solder interconnect. PD material CTE shows significant impact on component side solder life for 2 nd level interconnect. Also, higher PD material CTE shows worsening 1 st level interconnect life. Stress analysis shows pad diameter smaller than UBM (under bump metallization) opening is a better design.

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modeling and simulation of Terahertz Indoor Wireless Channel Based on Radial Basis Function Neural Network 13

Modeling and Simulation of Terahertz Indoor Wireless Channel...

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13th International conference on Microwave and Millimeter Wave Technology, ICMMT 2021

作者： Guo, Yating Liu, Yuanjian Li, Shuangde Nanjing University Of Posts And Telecommunication College Of Electronic And Optical Engineering College Of Microelectronics Jiangsu Nanjing210003 China

ISBN: (纸本)9781665434379

This paper studies the radial basis function (RBF) neural network algorithm, applying big data analysis to the latest developments in wireless communication and channel modeling. A channel model based on RBF neural network is proposed to predict the path loss and delay spread of the wireless channel in indoor environment at 350/ 650 GHz. It is found that the mean square error (MSE) is within 10-4 at different frequencies. © 2021 IEEE.

关键词： Mean square error

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An Impedance Characterisation Circuit for Implantable Research Platforms

An Impedance Characterisation Circuit for Implantable Resear...

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Ph.D. Research in microelectronics and Electronics (PRIME)

作者： Vichaya Manatchinapisit Peilong Feng Lijie Xie Timothy G. Constandinou Department of Electrical and Electronic Engineering Imperial College London UK Care Research & Technology Centre Imperial College London UK Dementia Research Institute Mint Neurotechnologies Ltd London UK

ISBN: (数字)9798350386301

ISBN: (纸本)9798350386318

Neuromodulation devices use stimulation to inject current through electrodes to modulate the activity of tissue for therapeutic benefit. Complex electrochemical processes happening at the electrode-tissue interface pose a challenge in ensuring long-term safety to avoid corrosion and tissue damage. Convention devices such as deep brain stimulators (DBS) providing constant, tonic stimulation patterns can be designed to operate within a safe window by controlling parameters. Recent de-vices providing closed-loop stimulation, for example, dynamically adjusting stimulation based on neural activity. Furthermore, research platforms configure devices for new neural targets, and new therapies and can use different electrodes. To ensure safe operation and to mitigate potentially hazardous states, it is now essential to monitor electrode properties. Electrochemical impedance spectroscopy (EIS) is a valuable technique for characterizing electrode properties, such as charge transfer and surface integrity. This paper describes a circuit for achieving in situ characterisation of electrode impedance using EIS. The circuit generates and injects a microamp-level sinusoidal test current, measures the voltage waveform, and sweeps frequency to obtain an impedance spectrum. This has been implemented in an integrated circuit technology for future integration within an implantable research platform. The design has been verified through circuit simulation, using a realistic model for a DBS electrode that has been experimentally characterised.

关键词： Electrodes Semiconductor device modeling Voltage measurement Impedance measurement Satellite broadcasting Silicon Frequency measurement

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Inductive Loop Operation Versus Loop Antenna for Partial Discharge Detection

Inductive Loop Operation Versus Loop Antenna for Partial Dis...

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IEEE International conference on Dielectrics (ICD)

作者： Sana Chouaibi Mohamed Hadj Said Antonino Imburgia Pietro Romano Sinda Kaziz Guido Ala Mossaad Ben Ayed Denis Flandre Fares Tounsi National Engineering School of Sousse (ENISo) Sousse University Tunisia Center for Research in Microelectronics & Nanotechnology (CRMN) Sousse Tunisia Department of Engineering L.E.PR.E.H.V. Laboratory University of Palermo Italy SMALL Group ICTEAM Institute Université catholique de Louvain Belgium

ISBN: (数字)9798350308976

ISBN: (纸本)9798350308983

This article delves into the application and efficacy of planar loop sensors for detecting partial discharge (PD) phenomena. The preference for loop sensors in PD detection stems from their simple design, non-destructive testing feature, and contactless characteristics. The paper explores both experimental and finite element modeling (FEM) approaches to evaluate the performance of distinct planar square spiral sensors in PD detection. The primary objective of the study is to compare inductive loops with loop antennas by varying the geometric parameters to achieve each approach. Two single-turn square loop antennas were designed, with a circumference of 30 cm and 75 cm, and compared with four multi-turn square inductive loops with an exterior side of 31.2 mm and varying geometric parameters. The figures of merit of all sensors, such as inductance, quality factor, and resonant frequency, are extracted through measurement and simulation to identify the most influential parameter that maximizes the sensing capability toward PD.

关键词： Q-factor Partial discharges Antenna measurements Inductance Sensitivity Magnetic sensors Loop antennas

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Physics-Informed Machine Learning-Based Methodology for Plated Through Holes Lifetime Estimation in Printed Circuit Boards

Physics-Informed Machine Learning-Based Methodology for Plat...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Marco Sperti Chinmay Nawghane Bart Vandevelde Nicolas Lammens Mathias Verbeke imec Leuven Belgium Siemens Industry Software nv Strategy & Innovation Leuven Belgium Department of Computer Science KU Leuven Belgium Flanders Make@KU Leuven Belgium

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

The increasing demand for reliable electronics underscores the need for predictive tools to estimate component lifetimes and mitigate key failure risks and associated costs. This study focuses on Plated Through Holes (PTHs) in Printed Circuit Boards, which are critical to system reliability but prone to failures under standard thermal cycling due to strain from coefficient of thermal expansion mismatches. A physics-informed machine learning-based methodology is proposed, integrating data from Finite Element Method simulations and experimental data from degradation tests. Two machine learning models are combined to estimate the Remaining Useful Life of PTHs: a feedforward neural network (FFNN) able to predict the number of cycles to failure of a given structure and trained on a design of Experiment dataset with geometric and material parameters, and a Long Short-Term Memory (LSTM) network to predict the temporal degradation trend measured by real sensors on the board. The combination of these two models allows the implementation of a Physics-informed Neural Network where the physics learned based on the FFNN is used as a physical constraint in the cost function of the LSTM to guide the prediction of the degradation.

关键词： Degradation Thermal expansion Printed circuits Predictive models Sensors Finite element analysis Integrated circuit modeling Integrated circuit reliability Long short term memory Strain

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Feature Selection and Parameter Optimization of Optimized Extreme Learning Machine for Motor Fault Detection

Feature Selection and Parameter Optimization of Optimized Ex...

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International conference on CAD Systems in microelectronics (CADSM)

作者： Dade Wu Hubei Mechanical and Electrical Research and Design Institute Co. Ltd. Wuhan China

In view of the disadvantage of existing motor fault detection algorithms that they cannot adapt to complex and non-linear fault categories and the accuracy is relatively low., we proposed one method for feature selection and parameter optimization based on simulated annealing-based whale optimization algorithm (SAWOA) optimized extreme learning machine (ELM) are proposed. Based on the ELM classification model., SAWOA is used to optimize the selection of network input variables and parameters of hidden layer nodes of ELM. To verify the effectiveness of the proposed method., it is applied to the real motor fault detection example., and compared with the existing methods under the same conditions. The experiment results show that the method achieves good performance in aspect of the classification accuracy and reliability, and show its effectiveness and application potential.

关键词： Solid modeling Extreme learning machines Fault detection simulation Simulated annealing Feature extraction Whale optimization algorithms

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