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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1418 条记录，以下是11-20 订阅

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modeling and simulation of Cmut and Pmut Ultrasound Transducers and Package Using a Multiphysics Approach

Modeling and Simulation of Cmut and Pmut Ultrasound Transduc...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Nilavazhagan Subbiah Jash Banker Soundara Pandian Mohanraj Braig Dominik Erhard Landgraf Sebastian Pregl Bassou Khouya Alexandre Halbach Andrew Tweedie Infineon Technologies AG Infineon Technologies Dresden GmbH Quanscient Oy Finland

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Ultrasound transducers have diverse applications in medical imaging, consumer electronics, and automotive industries, offering advantages such as non-invasive medical imaging, reliable and non-mechanical transduction of input signals. Micro-Electro-Mechanical Systems (MEMS) based ultrasound transducer solutions, including Piezoelectric Micromachined Ultrasound Transducer (PMUT) and Capacitive Micromachined Ultrasound Transducer (CMUT) devices, exhibit superior performance compared to traditional piezo-ceramic based solutions due to their low cost, compact design, high efficiency and wideband operation capability, furthermore monolithic integration with electronics is possible. However, the development of these cutting-edge technologies requires sophisticated simulation tools to understand and manipulate the underlying ultrasound physics, which is essential for engineering applications. The newly developed simulation methodology will be utilized to model three-dimensional arrays of CMUT and PMUT cells. simulations are performed on cutting-edge designs of Infineon-developed chips using the Quanscient Allsolve software. The results obtained through resonance frequency measurements on PMUT devices and CMUT devices will be evaluated and compared with the simulation results obtained using the presented methodology. Additional capabilities on building ultrasound simulation models with multiphysics is elaborated in this work and demonstrated. Projections for further development in the simulation environment are also presented.

关键词： Performance evaluation Micromechanical devices Solid modeling Ultrasonic imaging Transducers simulation Software Resonance Wideband Biomedical imaging

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Electromigration simulation of Copper-Pillar Bump in 3D Integration

Electromigration Simulation of Copper-Pillar Bump in 3D Inte...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Zhoubang Du Leiming Du GuoQi Zhang EEMCS Faculty Delft University of Technology Delft the Netherlands

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

The continuous trend toward miniaturization and increased integration density in semiconductor devices has exacerbated electromigration (EM) issue, making it a significant reliability concern in advanced packaging technologies, especially in copper (Cu)-pillar bumps used in 3D integration. This study investigates the EM phenomenon in a Cu-pillar bump structure using the birth/death element method in ANSYS. The model incorporates electro-thermal-structural-diffusion coupling transient simulations to analyze the time-dependent evolution of atomic concentration and resistance under varying experimental durations, model sizes, temperatures and current. The simulation results indicate that increased current and temperature significantly accelerate the formation of voids, leading to earlier EM failure. A comparative study between forward and inverse current reveals differences in the evolution of EM-induced damage, where inverse currents exhibiting lower resistance growth over time. These findings provide valuable insights into the design of Cu-pillar bump structures to enhance EM resistance in advanced packaging technologies.

关键词： Resistance Electromigration Solid modeling Analytical models simulation Packaging Predictive models Finite element analysis Current density Three-dimensional integrated circuits

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Analytical Calculation of Core Loss and Magnetic Flux Density in E-Cores

Analytical Calculation of Core Loss and Magnetic Flux Densit...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Talits Kevin Tebruegge Claas Pfost Martin Chair of Energy Conversion Technical University of Dortmund Dortmund Germany E-LAB HELLA GmbH & Co. KGaA Lippstadt Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

This paper improves the analytic calculation of magnetic flux density and core loss inside an E-core made up of ferrite. Based on Finite Element Analysis (FEA) simulations, the error of analytical techniques is evaluated, and new corrections applied. Target values are the total core loss, mean magnetic flux density and standard deviation. The calculation of the magnetic flux density and core loss using analytical formulas and finite element simulations are compared. simulation model construction and their calculation is conducted in ANSYS Maxwell software. The proposed changes in the analytic calculation enables developers to generate fast design studies with over 100 000 analytic calculations in the same time one simulation runs. Calculations of the analytical computations match with the simulation results with a minimum error of 1.424% for constant permeability. Non-Linear permeability exhibits the maximum error of calculation with 11.625%, in contrast to an error of 52.888% with a not optimized method.

关键词： Magnetic flux density Analytical models Solid modeling Uncertainty Magnetic cores Core loss Windings Permeability Finite element analysis Standards

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Microvia Homogenised Behaviour for the Mechanical Modelling of PCB with Embedded Components

Microvia Homogenised Behaviour for the Mechanical Modelling ...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Flora Dailland Gautier Girard Mounira Bouarroudj Marion Martiny Sébastien Mercier LEM3 CNRS Arts et Métiers Université de Lorraine Metz France SATIE Université Paris Est Créteil Université Paris-Saclay CNRS Gif-sur-Yvette France

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Driven by the development of e-mobility, printed circuit boards with active embedded components are seen as potential design to increase interconnect density. One way to increase the lifetime of printed circuits boards is to investigate the response of the interconnect layers of embedded components, areas that can be subject to various types of failure. Chip interconnection by numerous microvias is a highly developed industrial technique. Nowadays numerical studies are realised on the reliability of microvias on embedded components. The numerical modelling problem arises from the very large number of microvias connecting the chip surface to the rest of the printed circuit board. To overcome this problem, a homogenisation method is proposed. Once defined, the equivalent homogeneous material may replace the real microvia in a larger design. It is seen in this work that models with homogenised and real microvias provide consistent predictions for averages. Nevertheless, local stresses and strains are not accessible in homogeneous models. Thus it is necessary to combine fully discretised patterns and homogenised ones. This will enable the detection of crack initiation zones in microvia interconnect layers in the context of embedded component printed circuit board technology.

关键词： Accuracy Printed circuits Integrated circuit interconnections Predictive models Numerical models Finite element analysis Integrated circuit modeling Stress Load modeling Strain

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Fatigue Delamination Study of Parylene as Electronic Packaging Material

Fatigue Delamination Study of Parylene as Electronic Packagi...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Carlos Rincon-Ruiz Uwe Zschenderlein Martin Kühn Franz Selbmann Bernhard Wunderle Materials and Reliability of Microsystems University of Technology Chemnitz Chemnitz Germany Department System Packaging Fraunhofer ENAS Chemnitz Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Parylene has emerged as a promising substrate material in the development of electronic packaging due to its important dielectric properties, optical transparency, biocompatibility, and mechanical flexibility. However, limited information exists regarding its performance and properties bonded to other packaging materials under cyclic loading, which is critical for long-term reliability. This study presents the development of a numerical-experimental method for characterizing the delamination behavior of parylene under fatigue conditions, essential for the design and simulation of electronic packaging. A fatigue cohesive zone model (FCZM) was formulated to describe the strength degradation of a Si-Parylene C interface and integrated to a finite element model of the sample structure. The parameters of the FCZM were calculated trough its fitting to experimental data from a custom setup.

关键词： Degradation Packaging Fatigue Silicon Optical materials Numerical models Delamination Substrates Electronics packaging Load modeling

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Efficient modeling and simulation of Large PMUT Arrays for Biomedical Applications

Efficient Modeling and Simulation of Large PMUT Arrays for B...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Omer Mohamed Osman Abdalla Michelangelo Gabriele Garroni Edoardo Moretti Gianluca Massimino Alberto Corigliano Attilio Frangi Nicola Parolini Ilario Mazzieri Paola Antonietti Domenico Giusti Alessandro Stuart Savoia Department of Civil and Environmental Engineering Politecnico di Milano Milan Italy MOX Department of Mathematics Politecnico di Milano Milan Italy STMicroelectronics Agrate Italy Department of Industrial Electronic and Mechanical Engineering Roma Tre University Rome Italy

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

This paper presents three innovative numerical modeling techniques tailored to meet the substantial computational demands of high-density Piezoelectric Micromachined Ultrasonic Transducer (PMUT) arrays, increasingly utilized in medical ultrasound imaging. The first strategy adopts first-order shear deformation theory (FSDT) to model the thin multilayered structure of PMUTs as equivalent 2D-shell elements, addressing the ultra-thin nature of these devices while maintaining the inherent 3D properties of the piezoelectric materials. The second, being an FE-based modeling technique, leverages Model Order Reduction (MOR) to condense the dynamic behavior of PMUTs into a limited set of piezo-mechanical eigenmodes, drastically reducing computational load during coupled acoustic analysis by minimizing the degrees of freedom (DOF) to those of the precomputed eigenmodes. The third approach likewise employs these modes while introducing the Discontinuous Galerkin Spectral Element Method to enhance accuracy and handle nonconforming grids effectively across extensive PMUT arrays. Validation of these models was conducted via simulation of a 1-D PMUT array, fabricated using sol-gel PZT thin-film-based MEMS technology, exhibiting a high correlation between the experimental hydrophone measurements and simulated acoustic pressures and spectra, thus confirming the efficacy of the proposed methods. These models substantially decrease computing demands while preserving excellent accuracy, offering a rapid and reliable framework that is particularly advantageous during the PMUT design process.

关键词： Micromechanical devices Phased arrays Ultrasonic imaging Computational modeling Biological system modeling Acoustic arrays Acoustics Numerical models Load modeling Biomedical imaging

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Simulating the Co-Evolution of Porous Microstructures and Grain Growth in Sintered Ag Die Attach Layers

Simulating the Co-Evolution of Porous Microstructures and Gr...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Xiao Hu Jianlin Huang René Poelma Hans van Rijckevorsel Willem Dirk van Driel Guoqi Zhang Department of Microelectronics Delft University of Technology Delft The Netherlands Ampleon B.V. Nijmegen The Netherlands Nexperia Nijmegen The Netherlands

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

In this study, we introduced a hybrid Potts-phase field model to simulate the co-evolution of grain growth and pores migration in sintered silver layers. The Potts model is good at capture the grain growth dynamics, while the phase field model describes the evolution of the porous network. These models are coupled via a hybrid free energy function to achieve a realistic representation of the microstructure evolution. This study further extends the hybrid model by incorporating (a) a flexible exchange interaction matrix to model the crystal anisotropy in grain growth, (b) Glauber or Kawasaki dynamics to describe different diffusion mechanisms, and (c) the effect of pinning sites, representing impurity-driven grain boundary stabilization. The computational framework is implemented using Taichi Lang, which allows for efficient parallel simulations. Results show that the model effectively captures the long-term evolution of the sintered silver microstructure in good agreement with experimental observations. This hybrid model is a powerful tool to predict microstructural reliability of sintered silver die attach layers, supporting material design and process optimization for high-power electronic applications.

关键词： Grain boundaries Silver Computational modeling Data models Computational efficiency Microstructure Thermal stresses Optimization Stress Microassembly

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Warpage Prediction of mmWave Antenna-Inpackage Modules During Solder Reflow

Warpage Prediction of mmWave Antenna-Inpackage Modules Durin...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： M. van Soestbergen A. Ghannam B. Gustafson J.W. Bergman NXP Semiconductors Nijmegen the Netherlands 3DiS Technologies S.A.S Labège France Ericsson AB Stockholm Sweden

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Millimeter-wave (mmWave) technology promises to revolutionize communication by delivering faster data rates, higher capacity, and lower latency, while also enabling innovative applications such as combined communication and radar-like sensing. The mmWave technology allows for compact antenna designs that can be integrated directly into the package. In this work, we explore a prototype that combines beamforming capabilities, antenna structures, and frequency conversion into a single module. The complex interconnect routing, low-loss RF dielectrics, and the large lateral dimensions relative to its thickness lead to significant intrinsic warpage of the module. To address this, we developed a sophisticated simulation model to predict the warpage and optimize the module's design and material selection. Through both simulation and experimental validation, we found that using a low-temperature solder alloy (BiSnAg) and strategically placing solder bumps allows the modules to be successfully soldered onto a printed circuit board at $200 \mu ~\mathrm{m}$ component spacing.

关键词： Semiconductor device modeling Thermal expansion simulation Metals Sensors Virtual prototyping Millimeter wave communication Tuning Standards Reflow soldering

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Applying Ensemble Learning with Multiple Machine Learning Algorithms to Predict the Reliability of Wafer-Level Packaging

Applying Ensemble Learning with Multiple Machine Learning Al...

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Qinghua Su K. N. Chiang Dept. of Power Mechanical Engineering Advanced Microsystem Packaging and Nano-Mechanics Research Lab National Tsing Hua University Hsinchu Taiwan R.O.C

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

Before being introduced to the marketplace, electronic packaging products typically undergo an Accelerated Thermal Cycling (ATC) test. During the design phase, extensive repetitive experiments can lead to significant waste of both time and resources. Therefore, applying machine learning with finite element analysis to predict the reliability of advanced packaging can greatly enhance the efficiency of electronic packaging product development. To reduce costs, the validated finite element models will replace real experiments to generate a small dataset for training the machine learning models. The smaller the required dataset, the lower the time cost for simulation; however, this also increases the difficulty of training the high-performance machine learning models. To address challenges associated with training on small datasets, this study uses Wafer-Level Packaging (WLP) as an example and applies ensemble learning with multiple machine learning algorithms to predict the reliability for packaging.

关键词： Semiconductor device modeling Training Machine learning algorithms Semiconductor device reliability Predictive models Packaging Prediction algorithms Wafer scale integration Finite element analysis Ensemble learning

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design modeling, and simulation in microelectronics

Design modeling, and simulation in microelectronics

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design, modeling, and simulation in microelectronics

This Volume 4228 of the conference proceedings contains 45 papers. Topics discussed include computer aided design for microelectronics and microelectromechanical devices, advanced design method, high level synthesis a... 详细信息

关键词： microelectronics

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