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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是191-200 订阅
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Bias temperature instability characterization and modeling for 0.18um CMOS under extreme thermal stress conditions  16
Bias temperature instability characterization and modeling f...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Tran, Yen Nomura, Toshihiro Cherchali, Mohamed Salim Tassin, Claire Deval, Yann Maneux, Cristell Etudes et Production Schlumberger Clamart France Univ. Bordeaux Bordeaux INP UMR CNRS 5218 IMS Laboratory Talence France
We investigated the significance of 0.18um CMOS (Complementary Metal-Oxide-Semiconductor) degradation due to bias temperature instability (BTI) under extreme temperature operations (150°C and 210°C). The tra... 详细信息
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A symmetry enhancement method for process modeling and its applications in IC design and OPC
A symmetry enhancement method for process modeling and its a...
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conference on design, Process Integration, and Characterization for microelectronics
作者: Lei, JJ Sanie, M Lay, DKH Numer Technol Inc San Jose CA 95134 USA
When applying OPC techniques in manufacturing of complex and delicate integrated circuits, any improvement in accuracy of computing aerial images is crucial. simulation accuracy is demanded more and more today as the ... 详细信息
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Optical micro-machined ultrasound sensors with a silicon photonic resonator in a buckled acoustical membrane  20
Optical micro-machined ultrasound sensors with a silicon pho...
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20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Westerveld, W. J. Leinders, S. M. van Neer, P. L. M. J. Urbach, H. P. de Jong, N. Verweij, M. D. Rottenberg, X. Rochus, V. IMEC Kapeldreef 75 B-3001 Leuven Belgium Delft Univ Technol Dept ImPhys Lorentzweg 1 NL-2628 CJ Delft Netherlands TNO Oude Waalsdorperweg 63 NL-2597 AK The Hague Netherlands
Future applications of ultrasonography in (bio-)medical imaging require ultrasound sensor matrices with small sensitive elements. Promising are opto-mechanical ultrasound sensors (OMUS) based on a silicon photonic rin... 详细信息
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Organic transistor parameter estimation and accurate modeling for process optimization  16
Organic transistor parameter estimation and accurate modelin...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Liguori, Rosalba Licciardo, Gian Domenico Di Benedetto, Luigi Italy
The development of accurate tools and models able to analyze and predict the electronic device properties is compulsory to promote the technological advancement and particularly to improve fabrication process in the c... 详细信息
来源: 评论
Kriging Metamodeling-Assisted Multi-Objective Optimization of CMOS Current Conveyors  15
Kriging Metamodeling-Assisted Multi-Objective Optimization o...
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15th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 14th conference on PhD Research in microelectronics and Electronics (PRIME)
作者: Kotti, Mouna Fakhfakh, Mourad Tlelo-Cuautle, Esteban Univ Sousse Sousse Tunisia Univ Sfax Sfax Tunisia INAOE Cholula Mexico
In this brief, we deal with the generation of the Pareto front for multi-objective analog circuit sizing optimization. The main idea of the proposed work consists of using metamodels of the considered performances to ... 详细信息
来源: 评论
Long-Term Reliability Management For Multitasking GPGPUs  16
Long-Term Reliability Management For Multitasking GPGPUs
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16th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 15th conference on PhD Research in microelectronics and Electronics (PRIME)
作者: Sun, Zeyu Kim, Taeyoung Chow, Marcus Peng, Shaoyi Zhou, Han Kim, Hyoseung Wong, Daniel Tan, Sheldon X-D Univ Calif Riverside Dept Elect & Comp Engn Riverside CA 92521 USA Univ Calif Riverside Dept Comp Sci & Engn Riverside CA 92521 USA
This paper proposes long-term reliability management for spatial multitasking GPU architectures. Specifically, we focus on electro-migration (EM)-induced long-term failure of the GPU's power delivery network. A di... 详细信息
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Warpage simulation and DOE analysis with application in Package-on-Package development
Warpage simulation and DOE analysis with application in Pack...
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EuroSimE 2008 - International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro-Systems
作者: Sun, Wei Zhu, W.H. Wang, C.K. Sun, Anthony Y.S. Tan, H.B. Packaging Analysis and Design Center 5 Serangoon North Ave 5 Singapore 554916 Singapore
The current paper talks about warpage modeling and validation, DOE analysis and approximation model derivation, and solving of actual warpage problem. Warpage of actual PoP (Package-on-Package), both the top and botto...
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Mechanistic Model for the Stress-Strain Response of Double-Layered PSA  19
Mechanistic Model for the Stress-Strain Response of Double-L...
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19th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Huang, H. Dasgupta, A. Univ Maryland Ctr Adv Life Cycle Engn College Pk MD 20742 USA
Experiments and modeling are used to understand the mechanics of the deformation mechanisms in double-layers pressure sensitive adhesives (PSAs). The mechanical role of the carrier layer and the resulting stress state... 详细信息
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Adaptive test bench generation, simulation and parameter extraction for AMS circuitry  16
Adaptive test bench generation, simulation and parameter ext...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Meyer, Alexander Weihs, Léon Wunderlich, Ralf Heinen, Stefan Integrated Analog Circuits and RF Systems Laboratory RWTH Aachen University Kopernikusstr. 16 AachenD-52074 Germany
This paper presents a novel semi-automatic test bench generation and parameter extraction workflow for analog-mixed signal circuitry. Specific test benches for a given circuit are automatically generated, simulated, a... 详细信息
来源: 评论
Advanced Risk Analysis of Interface Delamination in Semiconductor Packages: A Novel Experimental Approach to Calibrating Cohesive Zone Elements for Finite Element Modelling  19
Advanced Risk Analysis of Interface Delamination in Semicond...
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19th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Pfluegler, Nadine Reuther, Georg M. Goroll, Michael Udiljak, Dominik Pufall, Reinhard Wunderle, Bernhard Infineon Technol AG Campeon 1-15 D-85579 Neubiberg Germany Tech Univ Chemnitz Reichenhainer Str 70 D-09126 Chemnitz Germany
Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a "design for Reliability" approach, the whole product needs to be studied virtually usi... 详细信息
来源: 评论