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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是191-200 订阅

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EI-MOR: A Hybrid Exponential Integrator and Model Order Reduction Approach for Transient Power/Ground Network Analysis

EI-MOR: A Hybrid Exponential Integrator and Model Order Redu...

引用

IEEE International conference on Computer-Aided design

作者： Cong Wang Dongen Yang Quan Chen School of Microelectronics Southern University of Science and Technology Shenzhen China

Exponential integrator (EI) method has been proved to be an effective technique to accelerate large-scale transient power/ground network analysis. However, EI requires the inputs to be piece-wise linear (PWL) in one step, which greatly limits the step size when the inputs are poorly aligned. To address this issue, in this work we first elucidate with mathematical proof that EI, when used together with the rational Krylov subspace, is equivalent to performing a moment-matching model order reduction (MOR) with single input in each time step, then advancing the reduced system using EI in the same step. Based on this equivalence, we next devise a hybrid method, EI-MOR, to combine the usage of EI and MOR in the same transient simulation. A majority group of well-aligned inputs are still treated by EI as usual, while a few misaligned inputs are selected to be handled by a MOR process producing a reduced model that works for arbitrary inputs. Therefore the step size limitation imposed by the misaligned inputs can be largely alleviated. Numerical experiments are conducted to demonstrate the efficacy of the proposed method.

关键词： Analytical models design automation Computational modeling Circuit simulation Network analyzers Linear circuits Mathematical models

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design of an Online Detection System for High-Power Submerged Arc Furnace with Magnetic Field Difference 7th

Design of an Online Detection System for High-Power Submerge...

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7th International conference on Life System modeling and simulation, LSMS 2021, and 7th International conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2021

作者： Liu, Wei-Ling Yang, Zi-Kai Yang, Ling-Zhen Chang, Xiao-Ming School of Data Science Taiyuan University of Technology Taiyuan Shanxi030024 China School of Microelectronics Tianjin University Tianjin300072 China School of Physics and Optoelectronics Taiyuan University of Technology Taiyuan Shanxi030024 China School of Information and Computer Science Taiyuan University of Technology Taiyuan Shanxi030024 China

ISBN: (纸本)9789811672095

An online measurement system to effectively detect electrode tip position of high-power submerged arc furnace (SAF) based on magnetic field difference were proposed and demonstrated. According to the current distribution characteristics near the electrode tip position and the theory of electromagnetism, a magnetic field radiation model was established, and the differential array sensing system was explored and developed based on sensing mechanism of differential magnetic field. The electrode tip position is obtained through collecting magnetic field information outside the furnace and analyzing the current difference characteristics. The experiment and simulation results showed that the peak point of the magnetic field distribution curve on the electrode line is near the electrode tip position of the furnace. The differential on-line measuring system can accurately detect the electrode tip position of the high-power SAF, which has important significance in optimizing the smelting process, improving the quality of products and reducing energy consumption. © 2021, Springer Nature Singapore Pte Ltd.

关键词： Magnetic fields

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design of Fast Start-up CMOS RC Oscillator Based on Low Temperature Coefficient Current Mode Bandgap Reference

Design of Fast Start-up CMOS RC Oscillator Based on Low Temp...

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International conference on Integrated Circuits and Microsystems (ICICM)

作者： Mincong Wang Xin Liu Chongbin Hou Cheng Liu School of Microelectronics Shanghai University Shanghai China School of Software & Microelectronics Peking University Beijing China

ISBN: (纸本)9781665460583

This paper presents a fully integrated 2MHz RC oscillator which is less affected by the fluctuations of power supply voltage and ambient temperature. This design consists of a current mode bandgap reference circuit and an RC oscillation circuit. Furthermore, a digital trimming circuit is used to adjust the frequency back to the ideal one, in order to obtain better accuracy. The proposed current mode bandgap reference has a very low temperature coefficient, which is only 1.66ppm/°C. This RC oscillator can work in the power supply range of l.9V to 4.6V and the ambient temperature of −40°C~+125°C, and has a very fast start-up speed. After digital trimming, the frequency can be adjusted back to the target frequency under the other four process corners, and the circuit supports complete shutdown. Spectre simulation was made based on CSMC’s $0.18\mu \mathrm{m}$ CMOS technology. The final die size is $194\mu \mathrm{m}\times 87\mu \mathrm{m}$.

关键词： Semiconductor device modeling Temperature distribution Time-frequency analysis Photonic band gap Power supplies Voltage Stability analysis

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Advances in modeling Emerging Magnetoresistive Random Access Memories: From Finite Element Methods to Machine Learning Approaches 14

Advances in Modeling Emerging Magnetoresistive Random Access...

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14th International conference on Micro- and Nano-Electronics 2021, ICMNE 2021

作者： Ender, Johannes Fiorentini, Simone de Orio, Roberto L. Hadámek, Tomáš Bendra, Mario Goes, Wolfgang Selberherr, Siegfried Sverdlov, Viktor Christian Doppler Laboratory for Nonvolatile Magnetoresistive Memory and Logic The TU Wien Gußhausstr. 27-29 Vienna1040 Austria Institute for Microelectronics TU Wien Gußhausstr. 27-29 Vienna1040 Austria Silvaco Europe Cambridge United Kingdom

ISBN: (数字)9781510651913

ISBN: (纸本)9781510651906

Emerging spin transfer torque magnetoresistive random access memories (STT MRAM) are nonvolatile and offer high speed and endurance. They are promising for stand-alone and embedded applications in the automotive industry, microcontrollers, Internet of Things, frame buffer memory, and slow SRAM. The MRAM cell usually includes a CoFeB fixed reference layer and a free magnetic layer (FL), separated by a tunnel barrier. To design ultra-scaled MRAM cells it is necessary to accurately model the torques acting on the magnetization in composite magnetic layers with one or several nonmagnetic inclusions between the ferromagnetic parts. The magnetization dynamics is governed by the Landau-Lifshitz-Gilbert (LLG) equation supplemented with the corresponding torques. The torques depend on nonequilibrium spin accumulation generated by an electric current. The electric current and the spin accumulation also depend on the magnetization. Therefore, the LLG and the spin-charge transport equations are coupled and must be solved simultaneously. We apply the finite element method (FEM) to numerically solve this coupled system of partial differential equations. To develop an open source solver, we use well-developed C++ FEM libraries. The computationally most expensive part is the demagnetizing field calculation. It is performed by a hybrid finite element-boundary element method. This confines the simulation domain for the field evaluation to the ferromagnets only. Advanced compression algorithms for large, dense matrices are used to optimize the performance of the demagnetizing field calculation in complex structures. To evaluate the torques acting on the magnetization, a coupled spin and charge transport approach is implemented. For the computation of the torques acting in a magnetic tunnel junction (MTJ), a magnetization-dependent resistivity of the tunnel barrier is introduced. A fully three-dimensional solution of the equations is performed to accurately model the torques acting on

关键词： MRAM devices

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The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies

The Performance Effects of Bondwire Characteristics Up to mm...

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European microelectronics and Packaging conference, EMPC

作者： Serhat Y. Çekiç Arif Ergen Alperen Tunç Aselsan Inc. Ankara Turkey

In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are used in high-frequency circuits, was calculated by considering height, angle, and length. After these calculations, 3D models and electromagnetic simulations of these interconnections were realized with a computer-aided design tool. Then, bondwires which have different characteristics, are implemented on alumina transmission lines. Furthermore, S-parameters were measured with a 2-port network analyzer using a probe station. Measured insertion loss and reflection values were compared with 3D electromagnetic simulation results, in order to obtain conceivable interconnection.

关键词： Solid modeling Three-dimensional displays design automation Computational modeling simulation Integrated circuit interconnections Tools

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Power Module Ceramic Substrates: mechanical characterization and modeling 21

Power Module Ceramic Substrates: mechanical characterization...

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21st International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Sitta, Alessandro Renna, Marco Messina, Angelo Alberto Mirone, Giuseppe D'Arrigo, Giuseppe Calabretta, Michele STMicroelectronics ADG R&D Catania Italy Univ Catania Dipartimento Ingn Informat Elettr & Elettron Catania Italy STMicroelectronics Italy Publ Affairs Catania Italy CNR IMM Catania Italy Univ Catania Dipartimento Ingn Civile & Architettura Catania Italy

ISBN: (纸本)9781728160498

In this work the warpage of a power modules ceramic substrates due to temperature variation has been numerically calculated. It has been used a not linear finite element model, which account the experimentally characterized material properties, including the copper elastoplasticity. Model results have been compared with dedicated interferometric measurements to validate the model. As application example, it has been calculated the benefit in terms of temperature warpage realized with a different substrate design option.

关键词： Substrates

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VLSI design of Low Power $8\times 4$ Barrel Shifter using 90 nm TG technology

VLSI Design of Low Power $8\times 4$ Barrel Shifter using 90...

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microelectronics, Signals & Systems (ICMSS), International conference on

作者： Jaya Sai Deepak Vudatha Naveena Kota Preethi Gutha Baby Sreeja Sreenidhi Prabha Rajeev Department of Electronics and Communication Engineering Amrita Vishwa Vidyapeetham AmritapuriIndia

ISBN: (纸本)9781665448864

The barrel shifter is known for the manipulation of various bits in a single clock cycle. In this paper, an $8\times 4$ barrel shifter is designed using transmission gate technology. The design and simulations are carried out using the cadence virtuoso tool at 90 nm technology. The simulation results show that the power consumed by the proposed design is 51.5% more efficient than the barrel shifter designed from CMOS NAND-based multiplexer design. Hence this design can be used in the application of low-power digital communication.

关键词： Semiconductor device modeling Multiplexing Power demand Temperature simulation Voltage Switches

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design of a Broadband Measurement Systerm of Die-lectric Constant Based on Parallel Plate Waveguide

Design of a Broadband Measurement Systerm of Die-lectric Con...

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International conference on Microwave and Millimeter Wave Technology Proceedings

作者： Zhiqiang Song Liqin Xu College of Electronic and Optical Engineering & College of Microelectronics Nanjing University of Posts and Telecommunications Nanjing China

ISBN: (纸本)9781665482271

This paper presents a new method of measuring the complex permittivity of solid materials based on a parallel plate waveguide. Based on the analysis and improvement of the parallel plate system model, the testing system is fabricated and verified. The system is used to test the transmission and reflection coeffi-cients of a solid dielectric substrate in the 4–8 GHz frequency band. The normalized scattering parameters are obtained by time do-main gate calibration, and then the complex permittivity is de-duced by the traditional NRW (Nicolson-Ross- Weir) algorithm. Finally, the comparison between theoretical and simulation S pa-rameters of a solid dielectric material at 4–8 GHz is given. Com-pared with the traditional waveguide testing system, the system has the advantages of simple structure, low profile, fast and low cost.

关键词： Solid modeling Permittivity measurement Millimeter wave technology Millimeter wave measurements Solids Reflection Scattering parameters

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Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life 23

Mechanical modeling study for fan-out wafer level package pa...

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23rd IEEE Electronics Packaging Technology conference, EPTC 2021

作者： Mandal, Rathin Chong, Chai Tai Institute of Microelectronics 2 08-02 Innovis Fusionopolis Way Singapore138634 Singapore

ISBN: (纸本)9781665416191

Fan-Out Wafer Level Package (FOWLP) is experiencing a significant growth due to its thinner thickness, higher I/Os in smaller chip area, better thermal and electrical performance. Due to the shorter, finer and simpler interconnection as compare to flip chip, FOWLP shows superior performance. On the other hand this package is vulnerable due to its higher warpage and package stress concentration. This paper will explore different options to enhance board level reliability performance during temperature cycling for FOWLP. The mechanical simulation has been performed for board level temperature cycling reliability test on a uniform ball pitch, with/without UBM (under bump metallization), BGA with underfill, SACQ (bismuth bearing SnAgCu alloy) solder material and different package design factors (pad diameter, solder resist opening, silicon chip thickness, BGA height, etc). Our aim from this mechanical simulation is to find ways to enhance TCoB (temperature cycling on board) solder joint life performance for FOWLP to be used for antenna-in-package (AiP) automotive radar application. Among the different package parameters, UBM, SACQ solder, solder resist opening and larger BGA height are the few packaging parameters which significantly enhancing the BGA solder joint life. The most noticeable factor bismuth bearing SACQ shows more than 2x performance improvement whereas underfilling the BGA layer in the FOWLP package reduces solder join life significantly. © 2021 IEEE.

关键词： Tin alloys

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Numerical simulation for Flow Boiling in Microchannels with Different Pin Fin Arrays

Numerical Simulation for Flow Boiling in Microchannels with ...

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Electronics Packaging Technology conference (EPTC)

作者： Li Hongying Pan Lunsheng Lou Jing Zhang Xiaowu Le Ducvinh Cheng Ming Li Jun Kang Chang Wei Chui King Jien Feng Huicheng A*STAR Institute of High Performance Computing Connexis Singapore A*STAR Institute of Microelectronics Connexis Singapore

ISBN: (纸本)9798350398861

The rapid development of technology in the past years brings unprecedent challenges in the cooling of electronic devices. Densely packed electronic systems require more efficient ways to dissipate the heat generated by the electronic components. The present study develops a numerical model to investigate flow boiling in micro-channels. Volume of Fluid method is adopted to capture the interface between the liquid and vaporized gas. The results from the developed model are validated against the existing published data. Upon this achieved, we then applied the model to simulate flow boiling in micro-channels with different pin-fin structures. The effects of pitch for the pin-fins are investigated and the optimized design of pin-fin structure is proposed. (“***”)

关键词： Heating systems Solid modeling Three-dimensional displays Predictive models Thermal management Electronic packaging thermal management Numerical simulation

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