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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1419 条 记 录,以下是191-200 订阅
排序:
EI-MOR: A Hybrid Exponential Integrator and Model Order Reduction Approach for Transient Power/Ground Network Analysis
EI-MOR: A Hybrid Exponential Integrator and Model Order Redu...
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IEEE International conference on Computer-Aided design
作者: Cong Wang Dongen Yang Quan Chen School of Microelectronics Southern University of Science and Technology Shenzhen China
Exponential integrator (EI) method has been proved to be an effective technique to accelerate large-scale transient power/ground network analysis. However, EI requires the inputs to be piece-wise linear (PWL) in one s... 详细信息
来源: 评论
design of an Online Detection System for High-Power Submerged Arc Furnace with Magnetic Field Difference  7th
Design of an Online Detection System for High-Power Submerge...
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7th International conference on Life System modeling and simulation, LSMS 2021, and 7th International conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2021
作者: Liu, Wei-Ling Yang, Zi-Kai Yang, Ling-Zhen Chang, Xiao-Ming School of Data Science Taiyuan University of Technology Taiyuan Shanxi030024 China School of Microelectronics Tianjin University Tianjin300072 China School of Physics and Optoelectronics Taiyuan University of Technology Taiyuan Shanxi030024 China School of Information and Computer Science Taiyuan University of Technology Taiyuan Shanxi030024 China
An online measurement system to effectively detect electrode tip position of high-power submerged arc furnace (SAF) based on magnetic field difference were proposed and demonstrated. According to the current distribut... 详细信息
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design of Fast Start-up CMOS RC Oscillator Based on Low Temperature Coefficient Current Mode Bandgap Reference
Design of Fast Start-up CMOS RC Oscillator Based on Low Temp...
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International conference on Integrated Circuits and Microsystems (ICICM)
作者: Mincong Wang Xin Liu Chongbin Hou Cheng Liu School of Microelectronics Shanghai University Shanghai China School of Software & Microelectronics Peking University Beijing China
This paper presents a fully integrated 2MHz RC oscillator which is less affected by the fluctuations of power supply voltage and ambient temperature. This design consists of a current mode bandgap reference circuit an... 详细信息
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Advances in modeling Emerging Magnetoresistive Random Access Memories: From Finite Element Methods to Machine Learning Approaches  14
Advances in Modeling Emerging Magnetoresistive Random Access...
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14th International conference on Micro- and Nano-Electronics 2021, ICMNE 2021
作者: Ender, Johannes Fiorentini, Simone de Orio, Roberto L. Hadámek, Tomáš Bendra, Mario Goes, Wolfgang Selberherr, Siegfried Sverdlov, Viktor Christian Doppler Laboratory for Nonvolatile Magnetoresistive Memory and Logic The TU Wien Gußhausstr. 27-29 Vienna1040 Austria Institute for Microelectronics TU Wien Gußhausstr. 27-29 Vienna1040 Austria Silvaco Europe Cambridge United Kingdom
Emerging spin transfer torque magnetoresistive random access memories (STT MRAM) are nonvolatile and offer high speed and endurance. They are promising for stand-alone and embedded applications in the automotive indus... 详细信息
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The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies
The Performance Effects of Bondwire Characteristics Up to mm...
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European microelectronics and Packaging conference, EMPC
作者: Serhat Y. Çekiç Arif Ergen Alperen Tunç Aselsan Inc. Ankara Turkey
In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are use... 详细信息
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Power Module Ceramic Substrates: mechanical characterization and modeling  21
Power Module Ceramic Substrates: mechanical characterization...
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21st International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Sitta, Alessandro Renna, Marco Messina, Angelo Alberto Mirone, Giuseppe D'Arrigo, Giuseppe Calabretta, Michele STMicroelectronics ADG R&D Catania Italy Univ Catania Dipartimento Ingn Informat Elettr & Elettron Catania Italy STMicroelectronics Italy Publ Affairs Catania Italy CNR IMM Catania Italy Univ Catania Dipartimento Ingn Civile & Architettura Catania Italy
In this work the warpage of a power modules ceramic substrates due to temperature variation has been numerically calculated. It has been used a not linear finite element model, which account the experimentally charact... 详细信息
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VLSI design of Low Power $8\times 4$ Barrel Shifter using 90 nm TG technology
VLSI Design of Low Power $8\times 4$ Barrel Shifter using 90...
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microelectronics, Signals & Systems (ICMSS), International conference on
作者: Jaya Sai Deepak Vudatha Naveena Kota Preethi Gutha Baby Sreeja Sreenidhi Prabha Rajeev Department of Electronics and Communication Engineering Amrita Vishwa Vidyapeetham AmritapuriIndia
The barrel shifter is known for the manipulation of various bits in a single clock cycle. In this paper, an $8\times 4$ barrel shifter is designed using transmission gate technology. The design and simulations are c... 详细信息
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design of a Broadband Measurement Systerm of Die-lectric Constant Based on Parallel Plate Waveguide
Design of a Broadband Measurement Systerm of Die-lectric Con...
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International conference on Microwave and Millimeter Wave Technology Proceedings
作者: Zhiqiang Song Liqin Xu College of Electronic and Optical Engineering & College of Microelectronics Nanjing University of Posts and Telecommunications Nanjing China
This paper presents a new method of measuring the complex permittivity of solid materials based on a parallel plate waveguide. Based on the analysis and improvement of the parallel plate system model, the testing syst... 详细信息
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Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life  23
Mechanical modeling study for fan-out wafer level package pa...
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23rd IEEE Electronics Packaging Technology conference, EPTC 2021
作者: Mandal, Rathin Chong, Chai Tai Institute of Microelectronics 2 08-02 Innovis Fusionopolis Way Singapore138634 Singapore
Fan-Out Wafer Level Package (FOWLP) is experiencing a significant growth due to its thinner thickness, higher I/Os in smaller chip area, better thermal and electrical performance. Due to the shorter, finer and simpler... 详细信息
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Numerical simulation for Flow Boiling in Microchannels with Different Pin Fin Arrays
Numerical Simulation for Flow Boiling in Microchannels with ...
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Electronics Packaging Technology conference (EPTC)
作者: Li Hongying Pan Lunsheng Lou Jing Zhang Xiaowu Le Ducvinh Cheng Ming Li Jun Kang Chang Wei Chui King Jien Feng Huicheng A*STAR Institute of High Performance Computing Connexis Singapore A*STAR Institute of Microelectronics Connexis Singapore
The rapid development of technology in the past years brings unprecedent challenges in the cooling of electronic devices. Densely packed electronic systems require more efficient ways to dissipate the heat generated b... 详细信息
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