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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是211-220 订阅

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An Investigation on the Analysis of Graphene-based Counter Electrode with MATLAB simulation for Dye-Sensitized Solar Cells

An Investigation on the Analysis of Graphene-based Counter E...

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microelectronics, Signals & Systems (ICMSS), International conference on

作者： Feba Job Samuel Mathew Stephanie Narbey Toby Meyer Mar Thoma College Thiruvalla Kerala India Solaronix SA Rue de I’ Ouriette 129 AubonneSwitzerland

ISBN: (纸本)9781665448864

The ever-escalating demands for the clean energy and its environment concerns are widely exploring research area in the development of energy conversion devices. There are copious sustainable energy resources available in nature, among them solar energy is considered to be promising and potential energy source due to its inexhaustible and eco-friendly features. Among the photovoltaic devices; Dye Sensitized Solar Cells (DSSCs) gained an extensive development and remarkable attention due to its simple design and fabrication, eco-friendly properties, etc. In the design of DSSC devices, the counter electrode (CE) plays an important role in catalytic activity so, a worthwhile effort is necessary to seek for an active and inexpensive CE material. However, most of the CE materials have been discovered by using ‘trial and error’ method. In this research work, we selected graphene as CE material for analyzing the proposed DSSC performance and alternatively, the experimental data is computed with the help of user friendly simulation tool. Here, the overall proposed DSSC performance demonstrates that the graphene based CE is proficient of being considered for DSSCs during ambient light conditions and that enables to provide progress in the field of indoor light harvesting applications. Meanwhile, for the simulation process we opted MATLAB software package which facilitates to provide a significant path for the prospects and development of photovoltaic technology.

关键词： Electrodes Performance evaluation Analytical models Software packages Photovoltaic cells Computational modeling Graphene

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TEVoT: Timing Error modeling of Functional Units under Dynamic Voltage and Temperature Variations 57

TEVoT: Timing Error Modeling of Functional Units under Dynam...

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57th ACM/IEEE design Automation conference (DAC)

作者： Jiao, Xun Ma, Dongning Chang, Wanli Jiang, Yu Villanova Univ Villanova PA 19085 USA Univ York York N Yorkshire England Tsinghua Univ Beijing Peoples R China

ISBN: (纸本)9781728110851

With the continuous scaling of CMOS technology, microelectronic circuits are increasingly susceptible to microelectronic variations such as variations in operating conditions. Such variations can cause delay uncertainty in microelectronic circuits, leading to timing errors. Circuit designers typically combat these errors using conservative guardbands in the circuit and architectural design, which can, however, cause significant loss of operational efficiency. In this paper, we propose TEVoT, a supervised learning model that can predict the timing errors of functional units (FUs) under different operating conditions, clock speeds, and input workload. We perform dynamic timing analysis to characterize the delay variations of FUs under different conditions, based on which we collect training data. We then extract useful features from training data and apply supervised learning methods to establish TEVoT. Across 100 different operating conditions, 4 widely-used FUs, 3 clocking speeds, and 3 datasets, TEVoT achieves an average prediction accuracy at 98.25% and is 100X faster than gate-level simulation. We further use TEVoT to estimate application output quality under different operating conditions by exposing circuit-level timing errors to application level. TEVoT achieves an average estimation accuracy at 97% for two image processing applications across 100 operating conditions.

关键词： microelectronics

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design of a PMUT array for Multifrequency Imaging

Design of a PMUT array for Multifrequency Imaging

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： B. Weekers M. Billen R. Haouari V. Rochus Imec kapeldreef 75 Leuven

In this paper, a piezoelectric micromachined ultrasound transducer (PMUT) array for multi-frequency imaging is investigated. The PMUTs are thoroughly characterized and a finite element model is created in COMSOL Multiphysics^® software. First, an axisymmetric model of a single PMUT is constructed that couples the solid mechanics, electrostatics and pressure acoustics interfaces. The model accurately predicts static deformation, resonance frequencies and displacement at resonance. Finally, a full 3D model is created to investigate the origin of an observed resonance mode in the array that does not correspond to any flexural mode of the PMUTs. Acoustic crosstalk through the fluid is identified as the likely cause for this “array mode”. Acoustic coupling should therefore be considered carefully in future designs and utilized where possible to achieve improved performance or added functionality such as multi-frequency imaging.

关键词： Solid modeling Three-dimensional displays Fluids Imaging Resonant frequency Predictive models Solids

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Rectangular Partially Adaptive Antenna Array in Real-Valued Arithmetic

Rectangular Partially Adaptive Antenna Array in Real-Valued ...

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Siberian conference on Control and Communications (SIBCON)

作者： Victor Djigan Russian Metrological Institute of Technical Physics and Radio Engineering Institute for Design Problems in Microelectronics of RAS Moscow Russia

ISBN: (纸本)9781665476294

Arithmetic complexity of the Adaptive Antenna Array (AAA) consists of two parts: the complexity of the beamforming (the AAA input signal weighting and combination) and the AAA weights computation (the adaptive algorithm). The beamforming complexity cannot be reduced because it depends on the number of the antennas/channels which are selected to ensure the required properties of the array. At the same time, if the number of the adaptively controlled weights is less than the total number of the array weights, the arithmetic complexity of the adaptive algorithm can be reduced. Such an AAA is called a partially adaptive one. In the case of the rectangular AAA the partial adaptation can be achieved by the combination of the signals received by the antennas of the rows and the columns of the array prior to the adaptive weighting. This reduces the adaptive algorithm complexity because the reduced number of the adaptively computed/controlled weights is required in this case. However if the receiving signals number (the informational one and the interfering ones) is less than the array rows and columns number the partially adaptive array provides the steady-state performance which is almost the same as that of the array with all adaptively controlled weights. If the AAA is a symmetrical one (the pairs of its weights, which correspond the antennas placed in the locations symmetrical relatively the array phase center, are complex conjugated to each other) then a further reduction of the arithmetic complexity might be achieved by means of the usage of the real-valued computations. The main steps of the development of the real-valued partially adaptive antenna array with the combination of the row and column signals are considered in this paper. The AAA architecture, its computational procedure and the results of the AAA simulation are also considered. This simulation demonstrates about 3 dB better cancellation of the interferences and about two times shorter transient response

关键词： Adaptation models Transient response Array signal processing Computational modeling Adaptive arrays Complexity theory Time factors

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simulation and Analysis of Microparticles Acoustophoretic Separation in Multi-Channel Lab-Chip Device

Simulation and Analysis of Microparticles Acoustophoretic Se...

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International conference on CAD Systems in microelectronics (CADSM)

作者： Tamara Klymkovych Nataliia Bokla Oleh Matviykiv Volodymyr Stakhiv Lviv Polytechnic National University Lviv Ukraine

ISBN: (数字)9781665438940

ISBN: (纸本)9781665446051

The separation of Suspended Microparticles based on physical and chemical properties is an essential step in numerous microfluidic applications. Recent research of acoustofluidic effects proves that acoustophoresis is an effective and flexible method for continuous sorting and separation of multiple beads, living cells, and suspended microparticles. The following research dedicated to the novel design of a microparticle sorter consisted of two pairs of IDT electrodes and provided precise sorting capabilities for multi-channel microfluidic structures. modeling and FEM simulation of the soot and fly ash microparticles separation in CAD/CAE tools allow visualizing the multiphysical interactions between fluid flow, standing acoustic waves, and suspended microparticles in microfluidic Lab-chip devices.

关键词： Solid modeling Fly ash Visualization Surface acoustic waves Tools Microfluidics Sorting

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designing EDA-Compatible Cryogenic CMOS Platform for Quantum Computing Applications

Designing EDA-Compatible Cryogenic CMOS Platform for Quantum...

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IEEE Electron Devices Technology and Manufacturing conference (EDTM)

作者： Zewei Wang Chengwei Cao Puqing Yang Yumeng Yuan Zhidong Tang Renhe Chen Weican Wu Xin Luo Ao Guo Liujiang Yu Ganbing Shang Zhaofeng Zhang Shaojian Hu Xufeng Kou Information of Science and Technology ShanghaiTech University Shanghai China Shanghai IC Research and Development Center Shanghai China Shanghai Advanced Research Institute Chinese Academy of Sciences Shanghai China Huali Microelectronics Corporation (HLMC) Shanghai China

This paper presents the temperature-dependent characterizations and compact modeling on both the front-end-of-line (FEOL) and back-end-of-line (BEOL) devices based on the HLMC 40-nm low-power CMOS technology. Moreover, an EDA-compatible cryo-CMOS platform which covers the 10 region is developed to guide the design of specific cryogenic integrated circuits for quantum computing applications.

关键词： Semiconductor device modeling MOSFET Solid modeling Quantum computing Superconducting integrated circuits Computational modeling simulation

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simulation of fast room-temperature bonding by mechanical interlock structure applied for 3D integration

Simulation of fast room-temperature bonding by mechanical in...

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IEEE Electron Devices Technology and Manufacturing conference (EDTM)

作者： Ziyu Liu Yaomin Gong Lin Chen Qingqing Sun Wei Zhang School of Microelectronics Fudan University Shanghai China

A mechanical interlock Cu-Sn bonding for multi-chip 3D integration is proposed to save total bonding time and lower bonding temperature. Protrusion Cu width, recess width were optimized based on strain and stress simulation. Bonding pressure, annealing temperature, and shear stress after mechanical interconnection were studied for the process condition. Then optimal design was proposed finally.

关键词： Solid modeling Three-dimensional displays Annealing Force Manufacturing Bonding Stress

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design and simulation of Optical XNOR Logic Gate Based on MEMS Technology

Design and Simulation of Optical XNOR Logic Gate Based on ME...

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microelectronics (IICM), Iranian International conference on

作者： Mohamadreza Eslami Fahimeh Marvi Kian Jafari Dinani Faculty of Electrical Engineering Shahid Beheshti University Tehran Iran

ISBN: (纸本)9781665480611

Prototypes of computers, or processors, were based almost exclusively on mechanical devices. Although electronic processors have become increasingly dominant over the past few decades, Recent advances in the technology of manufacturing 3D electromechanical components in micro and nano sizes have created new techniques for building complex microstructures that are of interest to researchers in new research In the field of mechanical computing. In this paper, we present a new XNOR logic gate design approach that can be built based on micro-electro-mechanical logic gates. One of the main advantages of this method is the ability to combine multi-physical as well as compatibility with the CMOS manufacturing process, as well as lower power consumption compared to logic gates consisting of several CMOS transistors. In this design, we have designed and simulated an XNOR logic gate using the multi-physics capability of Comsol-software and as well as using optical, electronic, mechanical and electro-static physics, whose inputs will be both electrical and optical signals. In this paper, according to the above selected design, by modeling and simulating different input modes of this logic gate, we examine the effect of each mode on the output of the gate as well as other features such as structure life, power consumption and resonant frequency. The proposed gate structure has a resonant frequency of 46 kHz and is highly reliable because it can operate without mechanical connection of the MEMS operator to logic inputs.

关键词： Micromechanical devices Computers Program processors Power demand Optical design Resonant frequency Logic gates

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Packaging Solution for RF SiP with on-top Integrated Antenna

Packaging Solution for RF SiP with on-top Integrated Antenna

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European microelectronics and Packaging conference, EMPC

作者： Amedeo Maierna Alex Gritti Luca Maggi Marco Del Sarto Aurora Sanna Damian Halicki Giovanni Graziosi STMicroelectronics Via Tolomeo 1 Cornaredo Italy STMicroelectronics Via C. Olivetti 2 Agrate Brianza Italy

Silicon based semiconductors are becoming a source of innovation in the field of RF solutions, especially involved in devices used in our everyday life. Wi-Fi and Bluetooth® connections adopted in home-networking, consumer platforms and wearable devices, together with the large spread of the IoT solutions, are more and more requiring very high levels in system integration. In particular, the focus on single-package Blue Tooth Low Energy (BTLE) system is increasing in the last few years. In this scenario, an innovative SiP (System in Package) solution with antenna integration on the top is considered as a possible and reliable alternative to SMD (Surface Mounted Device) antenna assembled on the package substrate. This paper will present a complex SiP composed by multiple stacked organic substrates, integrating a meander antenna that works in the Bluetooth® bandwidth. After describing the structure, the design methodology and the assembly strategy, a particular focus will be put on the antenna integration and dimensioning, supported by full-wave 3D electromagnetic simulations. The influence of the surrounding system on the antenna performance, and consequently the importance of co-design and co-simulation, will be emphasized.

关键词： Radio frequency Antenna measurements Solid modeling Three-dimensional displays Bluetooth Wearable computers Electromagnetics

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Sallen-Key High-Pass Filter with Unrelated Tune of Generic Parameter

Sallen-Key High-Pass Filter with Unrelated Tune of Generic P...

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Annual Siberian Russian Workshop on Electron Devices and Materials (EDM)

作者： Darya Yu. Denisenko Nikolay N. Prokopenko Yuri I. Ivanov Nikolay N. Butyrlagin Department of Scientific Research Don State Technical University Rostov-on-Don Russia Department of Automatic Control Systems Don State Technical University Southern Federal University Rostov-on-Don Russia Department of Information Systems and Radio Engineering Academy of Sciences Don State Technical University Institute for Design Problems in Microelectronics of Russian Rostov-on-Don Zelenograd Russia Department of Information Systems and Radio Engineering Don State Technical University Rostov-on-Don Russia

ISBN: (数字)9781665498043

ISBN: (纸本)9781665498050

New second order high-pass filter of the Sallen-Key family circuit is considered, where there is unrelated tune of generic parameters by a digitally controlled resistor - the pole frequency, Q-factor pole and the scale transfer coefficient. The basic mathematical expressions of transfer function for proposed high-pass filter are obtained. A comparison of the parameters of the known and new schemes is given. A Sallen-Key high-pass filter circuit based on a high-frequency emitter follower has been developed. The results of high-pass filter modeling in the Micro-Cap 12 environment using the OP37 operational amplifier and an ideal buffer amplifier are presented. Computer simulation has shown that the pole frequency is adjusted by resistor R5. Adjusting the pole attenuation is possible by changing the resistor R3, while the pole attenuation frequency unchanged, an increase in R3 leads to an increase of the pole attenuation.

关键词： Resistors Q-factor Performance evaluation Temperature dependence Temperature Silicon carbide Computer simulation

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