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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1413 条记录，以下是231-240 订阅

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design and Implementation of High Performance Elliptic Curve Coprocessor Based on Dual Finite Field 6th

Design and Implementation of High Performance Elliptic Curve...

引用

6th International conference on Life System modeling and simulation, LSMS 2020, and 6th International conference on Intelligent Computing for Sustainable Energy and Environment, ICSEE 2020

作者： Han, Guang Chen, Guanghua Wu, Yupeng Zeng, Weimin Liu, Jingjing School of Mechatronic Engineering and Automation Shanghai University Shanghai200072 China Shandong Hua Yi Micro-Electronics Technology Co. Ltd. Jinan250101 China School of Microelectronics Shandong University Jinan250101 China State Key Laboratory of ASIC and System School of Microelectronics Fudan University Shanghai201203 China Key Laboratory of Air-Driven Equipment Technology of Zhejiang Province Quzhou University Quzhou324000 China

ISBN: (纸本)9789813363779

In order to realize the scalar multiplication algorithm in GF (p) and GF (2m), and reducing the module implementation area, a high performance elliptic curve cryptographic coprocessor supporting dual finite field is designed and implemented. By multiplexing the shift register, the operation efficiency of the modular multiplication algorithm is greatly improved. On the other hand, combining multiplication and inverse operations, which reduces the extra modular multiplication operation after inverse operation and reduces the complexity of implementation. After verification by comparing SYSTEMC model with RTL coding, the function of the improved algorithm is correct. The result of hardware simulation shows that the equivalent unit gate is 27092 by 0.13 um SMIC standard cell process library. The modified modular multiplication requires 37.2 us, and the modular inverse requires only 96.1 us under 50 MHz clock constraint, average of 233 bit operation in GF (2m) and 256bit operation in GF (p). Compared with previous works, it has a large advantage in terms of area, and the speed has reached the expected goal. © 2020, Springer Nature Singapore Pte Ltd.

关键词： Coprocessor

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Automatic modeling of Transistor Level Circuits by Hybrid Systems with Parameter Variable Matrices 16

Automatic Modeling of Transistor Level Circuits by Hybrid Sy...

引用

16th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 15th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Tarraf, Ahmad Hedrich, Lars Goethe Univ Frankfurt Inst Comp Sci Frankfurt Germany

ISBN: (纸本)9781728112015

Model abstraction of transistor-level circuits, while preserving an accurate behavior, is still an open problem. In this paper an approach is presented that automatically generates a hybrid automaton (HA) with linear states. The resulting HA is used for reachability analysis. Each of the locations of the HA is modeled with a system matrix described as a matrix zonotope or interval matrix. This leads to an acceptable over approximation, but guarantees that the system behavior is covered. The approach starts with a netlist at transistor level with full SPICE accuracy and ends at the system level description of the circuit. To illustrate our methodology, an example of a circuit containing complex poles and strong nonlinear limiting behavior is analyzed.

关键词： abstraction verification hybrid automaton reachability behavioral modeling parameter variable matrices

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Verilog-A based Behavioral modeling of an FBMC Transmitter 16

Verilog-A based Behavioral Modeling of an FBMC Transmitter

引用

作者： Doell, Patrick Hanay, Oner Bayram, Erkan Negra, Renato Rhein Westfal TH Aachen Chair High Frequency Elect Aachen Germany

ISBN: (纸本)9781728112015

In this paper a Verilog-A based behavioral modelling of a filter-bank multicarrier (FBMC) transmitter with the focus on the RF-DAC cores is presented. Multiple switching signals within the transmitter yield to a tremendous degradation in simulation performance. Because of that, the simulation of the entire system at transistor-level is time consuming. The abstracted model leads to a reduction in simulation time of up to 70% with only half of the memory usage compared to the original model by still getting sufficient results. Furthermore, a performance friendly and simple technique is presented to generate signals with equidistantly spaced frequencies with additional abstraction level to generate jitter and deterministic phase noise. Verilog-A has been used to design the models in combination with Spectre simulator to verify the results.

关键词： Verilog-A Verification FBMC Behavior modeling HDL Digital-Analog Conversion Oscillators

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Electrical modeling and Analysis of Through-Silicon-Via Crosstalk Based on Scalable Physical Lumped Circuit Model for 3D Packaging 22

Electrical Modeling and Analysis of Through-Silicon-Via Cros...

引用

22nd European microelectronics and Packaging conference and Exhibition (EMPC)

作者： Shi, Xiangyang Zeng, Rong Lv, Liming China Acad Engn Phys Inst Elect Engn Mianyang Sichuan Peoples R China

ISBN: (纸本)9780956808660

In this paper, we investigate the transportation mode of TSV structure for subsequent modeling G-S TSVs. Next, a scalable physical lumped circuit model of ground-signal TSVs is established The scalable G-S TSVs model is developed with closed-form analytic RLGC equations derived from physical structure, and can be changed with structure parameters in design process accordingly. The validity of this model is verified with full-wave FEM-based simulator up to 20 GHz. Based on this accurate physical lumped circuit model, we investigate crosstalk of TSV array in both frequency domain and time domain. The method of modeling and analysis of TSV array crosstalk proposed in this paper can effectively reduce simulation time and computing resource over finite-element-based 3-D full-wave simulation.

关键词： Through-Silicon-Via physical lumped circuit model crosstalk 3D packaging

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Model-Based Engineering of Magnetic Sensors 16

Model-Based Engineering of Magnetic Sensors

引用

作者： Lazar, Zsombor Bidaux, Yves Roos, Markus Close, Gael F. Melexis CH-2022 Bevaix Switzerland NM Numer Modelling GmbH CH-6300 Zug Switzerland

ISBN: (纸本)9781728112015

A modern car contains about 30 magnetic sensors on average. Their performances depend on the readout circuit imperfections, the magnetic environment, and mechanical assembly tolerances. For angle sensors, this yields a complex physics with magnet tilt and off-axis rotation. Traditionally these effects are studied separately in finite-element-method (FEM) simulators, separated from traditional system and circuit design simulation tools. This creates a simulation gap. A new modeling method for physical modeling of magnetic position sensors is presented. The method is based on spherical harmonic decomposition, and is implemented in Matlab. In this representation, any rigid-body 3-D motion of the magnet and sensor is modeled by matrix operations. Critical physical effects for the sensor accuracy can then be explored directly in system simulation tools such as Matlab, Simulink, Python or even in an integrated circuit simulator. The method maintains FEM accuracy. It represents a paradigm shift in magnetic position sensor design, and brings FEM accuracy to a much wider range of users.

关键词： multiphysics system modeling magnetic position sensors automotive electronics

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Automated Method Using Finite Element simulation to Identify Microvia Stacks at Risk of Separation in Complex PCB designs 20

Automated Method Using Finite Element Simulation to Identify...

引用

20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Kalayeh, Kourosh Hernandez, Natalie Hillman, Craig Blattau, Nathan DfR Solut 9000 Virginia Manor RdSte 290 Beltsville MD 20705 USA

ISBN: (纸本)9781538680407

The electronic industry recently experienced a sudden increase in microvia failures in printed circuit boards during the reflow process. The failures occurred specifically on triple-stack microvias placed over a buried via. The failure mechanisms included separation of the microvia from the capture pad and ductile tearing of the copper flanges. The sudden onset of these failures was due to the electronics industry's over-reliance on design rules to avoid PCB issues. The flaw in design rules is their reliance on lessons learned from previous designs and the assumption that new designs are sufficiently similar to older designs. This pervasive failure mode across multiple industries and designs is evidence that a new, more robust technique based on reliability physics is required for future, high density electronic hardware designs. We propose a technique that takes advantage of finite element modeling and industry research to predict the reliability and manufacturability of microvias.

关键词： Copper Integrated circuit reliability Integrated circuit interconnections Stress Strain Integrated circuit modeling

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Performance Evaluation of Negative Capacitance Reconfigurable Field Effect Transistor for Sub 10 nm Integration

Performance Evaluation of Negative Capacitance Reconfigurabl...

引用

IEEE Electron Devices Technology and Manufacturing conference (EDTM)

作者： Zihan Sun Xianglong Li Yabin Sun Ziyu Liu Yanling Shi Xiaojin Li East China Normal University Shanghai China School of Microelectronics Fudan University Shanghai China

ISBN: (纸本)9781728181769;9781728181776

A dual-gate negative capacitance reconfigurable field effect transistor (NC-RFET) is proposed in present work. Combining with 3D TCAD simulation with Landau-Khalatnikov equation, critical electrical parameters such as surface potential, gate capacitance, and sub-threshold swing are evaluated to characterize the negative capacitance through the post-processing method. The design criterion for NC-RFET is obtained by analyzing the impact of some critical physical parameters.

关键词： Performance evaluation Solid modeling Electric potential Three-dimensional displays Field effect transistors Logic gates Capacitance

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Realistic Cable modeling for Low-Voltage Installations 16

Realistic Cable Modeling for Low-Voltage Installations

引用

作者： Marano, Stefano Maret, Yannick Varga, Matija Ghezzi, Luca Butti, Agostino ABB Switzerland Ltd ABB Corp Res Baden Switzerland ABB Electrificat R&D Vittuone Italy

ISBN: (纸本)9781728112015

Numerical models of electrical cables are important to describe accurately signal propagation in electrical networks. We are interested in the modeling of cables used in low-voltage electrical networks. We observed that numerical cable models exhibit unrealistically sharp resonances and antiresonances. We propose an approach to generate cable models with realistic resonances and antiresonances by modifying the attenuation constant. The proposed approach is validated with Vector Network Analyzer (VNA) measurements performed on SPT-2 cable specimens of different lengths.

关键词： cable modeling resonance attenuation constant rational-function fitting

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Application of Artificial and recurrent neural network on the steady-state and transient finite element modeling 20

Application of Artificial and recurrent neural network on th...

引用

20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Yuan, Cadmus Hong, Yu-Jun Lee, Chang-Chi Chian, Kou-Ning Huang, Jin-Huang Feng Chia Univ Dept Mech & Comp Aided Engn Taichung Taiwan Natl Tsing Hua Univ Dept Power Mech Engn Hsinchu Taiwan

ISBN: (纸本)9781538680407

Artificial intelligence techniques have been widely applied in many domains, such as image/sound/text recognition, manufacturing monitoring, etc. One of the requirements for an artificial intelligence modeling is massive datasets. However, it is often limited known in the beginning of the design phase. This paper studied the methods and the influence of building an artificial intelligence model from a limited number of inputs. The application of the artificial neural network (ANN) and the recurrent neural network (RNN) has been applied to the nonlinear mechanical FE, steady-state thermal FE and transient FE model, and a rather simple neural network model and accuracy/application of these models has been reported.

关键词： Artificial neural networks Iron Recurrent neural networks Artificial intelligence Training Electronic packaging thermal management Semiconductor device modeling

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modeling and performance investigation of insulin injection pen for diabetic persons 16

Modeling and performance investigation of insulin injection ...

引用

作者： Paun, Maria-Alexandra Dehollain, Catherine Ecole Polytech Fed Lausanne RFIC Grp Lausanne Switzerland

ISBN: (纸本)9781728112015

This paper is focused on modeling and performance investigation of insulin injection pens used by diabetic persons. A smart pen cap with two electrodes is used as a capacitive sensor for insulin dose detection and is presented in details. To faithfully analyze this medical device, both an analytical model and a fully parametrized three-dimensional physical model in ANSYS have been developed. The electrode capacitance is evaluated (by both simulations and analytical model), for the smart pen cap alone as well as for different insulin fill states in the insulin injection pen + smart pen cap complete system.

关键词： ANSYS Maxwell 3D 3D model insulin injection pen electrode capacitive sensor

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