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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是21-30 订阅

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2023 24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2023

2023 24th International Conference on Thermal, Mechanical an...

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24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2023

ISBN: (纸本)9798350345971

The proceedings contain 105 papers. The topics discussed include: thermomechanical and electrical material characterization for a DLP printing process simulation of electrically conductive parts;studying asymmetric warpage behavior of panel-level packages using process modeling techniques and viscoelasticity theory;using grid search methods and parallel computing to reduce AI training time for reliability lifetime prediction of wafer-level packaging;improved nanoindentation methods for polymer based multilayer film cross-sections;power semiconductor die passivation layer stress mechanism investigation and optimization by numerical analysis;the effect of geometric and material uncertainty on debonding warpage in fan-out panel level packaging;fem simulation of influence of different polymeric module materials and layouts on thermomechanical deformations in strings of shingled solar cells;finite element model for prediction of back-end-of-line process induced wafer bow for patterned wafer;impact of viscoelastic properties on package warpage prediction;influence of the quality of material models on warpage and lifetime prediction by finite element simulation;and design of power modules using containers filled with phase change materials as device top interconnection for power peak management.

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modeling of Wireless Sensor Network Based on Functioning Parameters of Unevenly Distributed Nodes 17

Modeling of Wireless Sensor Network Based on Functioning Par...

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IEEE 17th International conference on the Experience of designing and Application of CAD Systems (CADSM)

作者： Belej, Olexander Nestor, Natalia Artyshchuk, Iryna Spas, Nataliia Lviv Polytechn Natl Univ Dept Comp Aided Design Lvov Ukraine

ISBN: (纸本)9798350310856

Connection and routing parameters of wireless sensor networks are considered for static topologies and uniform distribution of nodes. Most of the studied models do not take into account the parameters of message connectivity and their delivery time between unevenly distributed nodes. in the proposed study, models of connectivity analysis and message delivery between unevenly distributed nodes are developed. Models of wireless sensor networks with uniform and normal distribution of nodes and research on the network connectivity parameter for these models are proposed. Network models with different types of distributions are built based on the Erdosh-Rani random graph model, which allows describing of the connectivity of wireless sensor networks as the connectivity of a random graph, that is, to determine the connectivity of wireless sensor networks with the probability of finding the distance between two vertices of the graph. simulation models with a uniform and normal distribution of nodes are implemented to investigate the probability of network connection. The choice of these types of distribution is explained by possible real distributions of nodes in the studied area.

关键词： information system wireless sensor network network model multimodal distribution of nodes simulation model graph vertices

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Analysis and modeling of Non-ideal Effects in SAR ADC 15

Analysis and Modeling of Non-ideal Effects in SAR ADC

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15th IEEE International conference on ASIC, ASICON 2023

作者： Zeng, Yaxin Xu, Hao Feng, Xi Yan, Na Fudan University State Key Laboratory of Integrated Chip and Systems Shanghai China Beijing Smartchip Microelectronics Technology Co. Ltd Beijing Smartchip Semiconductor Technology Co. Ltd Beijing China

ISBN: (纸本)9798350312980

For high resolution SAR ADC, the noise and distortion will significantly degrade the performance, thus should be considered carefully during design. This paper presents a behavioral modeling of SAR ADC in Simulink. The model includes the performance limitations such as clock jitter, capacitor mismatch, sampled KT/C noise for switches, noise and offset of comparator and S/H on-resistance distortion. The simulation results of the proposed model provide guidance in choosing the circuit structure and determine spec breakdown of each block in the SAR ADC, which increases the design efficiency with fast design iterations. © 2023 IEEE.

关键词： ADC Behavioral-modeling SAR Simulink

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LEDs Lifetime Prediction modeling: Thermomechanical simulation for SAC305 and SAC105 25

LEDs Lifetime Prediction Modeling: Thermomechanical Simulati...

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25th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024

作者： Akhtar, Mohd Zubair Schmid, Maximilian Zippelius, Andreas Elger, Gordon Technische Hochschule Ingolstadt Esplanade 10 Ingolstadt85049 Germany

ISBN: (纸本)9798350393637

The challenge of predicting the reliability of solder joints in high-power LED packages by Finite Element Analysis (FEA) is crucial for the automotive industry. Focusing on the thermo-mechanical stresses between LED package and the PCB, *** aluminum insulated metal substrate (Al-IMS), this paper analyzes the crack formation in the solder joints for seven different ceramic-based LED packages. The model is validated by data from a large experimental study, covering typical two pad and three pad footprint design for LED package and five solder materials. The data set contains experimental data of nearly 1,800 LED packages, including over 40,000 Transient Thermal analyses (TTA) and 9,000 Scanning Acoustic Microscopy (SAM) measurements. The paper investigates different post-processing approaches related to FEA simulations for surfacemounted devices (SMD) LED assemblies, recognizing the limitations of approaches used for Ball Grid Array (BGA) packages due to the large difference in geometry and pad layout. The primary goal of the FEA model is to correctly predict the reliability of different pad designs, *** or three pad footprints for different solders and develop the universal lifetime model. The methodology includes detailed thermomechanical simulations via Ansys. The paper compares the behavior of SAC305 and SAC105. Each LED package undergoes five thermal cycles, ranging from-40 °C to 125 °C, to assess accumulated creep strain. The Coffin Manson model is utilized for the lifetime prediction of the solder joint. To the best of the author s knowledge, the paper presents for the first time a model which is validated for different pad designs and answers the question: Is a threepad or a two-pad preferable for solder joint reliability? The results show a good agreement, i.e. R 2=96% for critical path averaging, of simulation outcomes for ceramic LED packages with thick film metallization. However, some variability is noted for ceramic LED packages with thin film ce

关键词： Computer Aided design (CAD) Finite Element Analysis (FEA) LED Lifetime Post Processing Prediction SMD Solders

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Development, Optimization, and Application of ML based modeling of Printed VO2RF Switch

Development, Optimization, and Application of ML based Model...

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2023 International conference on microelectronics, ICM 2023

作者： Khusro, Ahmad Hashmi, Mohammad Chaudhary, Muhammed Akmal Iit Kanpur Department of Electrical Engineering Kanpur India Nazarbayev University School of Engineering and Digital Sciences Astana Kazakhstan Ajman University College of Engineering and Information Technology Ajman United Arab Emirates

ISBN: (纸本)9798350380828

This paper proposes a globally optimized behavioral modeling algorithm using cascaded feed-forward neural network in conjugation with Particle Swarm optimization (PSO) for fully printed VO2 based RF switches. The proposed model makes use of varied set of operating conditions (geometric dimensions and operating temperature) over a frequency range of 0.01 to 33 GHz. The modeling algorithm enables flexibility in selecting the optimized hyperparameters such as number of neurons in each hidden layer, and activation function at each layer. The developed model is tested for both interpolation and frequency extrapolation cases up to 40 GHz to establish the validity and robustness of the modeling algorithm. An excellent agreement between the measured and the modeled performance over a broad frequency range demonstrates a good generalization capability and successful model development strategy. The proposed model is then evaluated within a commercial circuit simulator (Keysight's ADS) to demonstrate usefulness in RF circuit design. © 2023 IEEE.

关键词： Circuit simulation

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Characterization and modeling of Cure-Induced Thermo Mechanical Properties and Chemical Shrinkage of Epoxy Resins 25

Characterization and Modeling of Cure-Induced Thermo Mechani...

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25th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024

作者： Kasinikota, Venu Prakash Muehleisen, Wolfgang Grinschgl, Markus Steiner, Alexander Hasil, Siegfried Lang, Margit Christa Leoben8700 Austria Institute of Mechanics Montanuniversität Leoben Leoben8700 Austria Villach9524 Austria GIPRO GmbH Peggau8120 Austria

ISBN: (纸本)9798350393637

Epoxy resins are widely used in molding electrical insulators and electronic components due to their superior dielectric properties and mechanical strength. However, due to poor process control along with the complex geometry of their components, parts can entail air pockets, cracks, or deformations driven by residual stresses. To address these challenges, this research uses the Computational Fluid Dynamics (CFD) software Autodesk Moldflow Synergy 2023 to visualize epoxy resin flow behavior and predict the curing behavior as it flows through the mold using respective models. When simulating the mold-filling behavior, comprehensive thermo-mechanical data are required for both uncured and cured states of cycloaliphatic epoxy resins. Therefore, it was crucial to thoroughly characterize the material to obtain precise material parameters for using them in simulations, as these parameters play a vital role in the accuracy of the simulations. Python-based formulations of the Prout-Tompkins cure kinetic and Cross-Castro-Macosko viscosity models are used to comprehensively analyze the flow front and curing behavior during an Automatic Pressure Gelation (APG) process. This research provides valuable insights into the behavior of epoxy resin when molded in complex scenarios. It enables the design of optimized molds while allowing for fast and efficient evaluation and optimization of process parameters, ultimately reducing high rejection rates as safety critical parts, like insulators, need to be flawless. © 2024 IEEE.

关键词： cure kinetics process simulation reactive-viscosity modeling Thermoset material characterization

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modeling the Thermal Characteristics of Stacked 2T0C Memory Array Based on InGaZnO4 Thin-film Transistors

Modeling the Thermal Characteristics of Stacked 2T0C Memory ...

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International conference on simulation of Semiconductor Processes and Devices (SISPAD)

作者： He, Song Li, Haoxin Xu, Guangwei Tang, Xinyi Li, Yuanbiao Kim, Jaewoo Gu, Tingting Xue, Xingkun Li, Zelun Xu, Handong Dong, Haiyang Zhou, Kai Hu, Xianqin Long, Shibing Univ Sci & Technol China Sch Microelect Hefei 230026 Peoples R China Changxin Memory Technol Inc Hefei 230601 Peoples R China

ISBN: (纸本)9784863488038

For the first time, the electrothermal characteristics of the stacked 2T0C memory array were modeled based on the material properties, electron transport mechanism of InGaZnO4 (IGZO) and basic Fourier heat flow equation utilizing the technology computer-aided design (TCAD) tool. According to the proposed electrothermal model, the multi-layer stacked 2T0C memory array would bring severe self-heating issue from the thermal crosstalk among layers. The temperature rising of stacked 2T0C cells decrease the retention time severely due to the temperature instability of IGZO thin-film transistors TFTs. Furthermore, several advanced device-level strategies were proposed to ameliorate the heat accumulation problem.

关键词： IGZO 2T0C DRAM stacked memory array self-heating TCAD simulation

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A High Isolation Dual-band WiFi MIMO Antenna design 4

A High Isolation Dual-band WiFi MIMO Antenna Design

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2022 4th International conference on modeling, simulation, Optimization and Algorithm, ICMSOA 2022

作者： Yuan, Kang Nie, Qilei Zhang, Songtao Peng, Lihu Wang, Qinghai Liu, Geng Smart Shine Microelectronics Technology CO. Ltd Beijing China

In this paper, a dual-band WiFi MIMO antenna with high isolation is designed. The antenna is F-Type structure, and the resonant points of high frequency and low frequency are mainly controlled by two branches of 'F'. In order to improve the isolation between antennas, multiple symmetrically distributed slots are introduced on the ground, by adjusting the size and spacing of each group of slots, the effect of 2.4GHz & 5G dual-band decoupling is realized. Through HFSS simulation and optimization, antenna in frequency of 2.4-2.5GHz & 5.2-5.825GHz, S11 meet-10db bandwidth requirements, the isolation between the two ports is higher than 25dB, meet the design requirements. © 2023 Institute of Physics Publishing. All rights reserved.

关键词： Slot antennas

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simulation Analysis Thermal Damage Effect of Strong Electromagnetic Pulse on PIN Limiter

Simulation Analysis Thermal Damage Effect of Strong Electrom...

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2023 Cross Strait Radio Science and Wireless Technology conference, CSRSWTC 2023

作者： Bing, Ruan Dongdong, Wang Wenzhuo, Wang Shengquan, Zheng Xujing, Huang Science and Technology on Electromagnetic Compatibility Laboratory Wuhan430064 China China Ship Development and Design Center Wuhan430064 China

The effects of pulse power and rise time on the performance of PIN limiter and internal temperature of PIN diode have been analyzed through multi-physics modeling simulation. The results show that the leakage power of... 详细信息

ISBN: (纸本)9798350358971

关键词： PIN Limiter Strong Electromagnetic Pulse Thermal Damage Effect

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Analysis and modeling of System Performance Based on Random Matching Errors, Gradient Errors, and Finite Output Impedance of Current-source DAC 3

Analysis and Modeling of System Performance Based on Random ...

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2023 3rd International conference on Electronics, Circuits and Information Engineering, ECIE 2023

作者： Ma, Zhihua Song, Zheng Yao, Yao Hu, Jianguo School of Microelectronics Science and Technology Sun Yat-sen University Guangdong Province Zhuhai519000 China Shenzhen Research Institute Sun Yat-Sen University Guangdong Province Shenzhen518000 China Development Research Institute of Guangzhou Smart City Guangdong Province Guangzhou510000 China

With the development of communication technology, the performance of digital-to-analog converters as the last link in signal processing is particularly important. This paper analyzes the errors of current rudder DAC and their effect on DAC performance. Different compensation methods are proposed to compensate for or eliminate the errors. Through system modeling, it is concluded that under the conditions of static parameters DNL90dB and SNDR>70dB, the random matching error should be less than 0.001, the gradient error less than 1E-5 and the admittance rate less than 1E-7. The correctness of the theoretical analysis can be verified through system modeling and simulation, providing accurate guidance direction for circuit design and greatly shortening the design cycle. © Published under licence by IOP Publishing Ltd.

关键词： Digital to analog conversion

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