咨询与建议

限定检索结果

文献类型

  • 1,366 篇 会议
  • 46 篇 期刊文献
  • 1 册 图书

馆藏范围

  • 1,413 篇 电子文献
  • 0 种 纸本馆藏

日期分布

学科分类号

  • 615 篇 工学
    • 387 篇 电气工程
    • 246 篇 电子科学与技术(可...
    • 221 篇 计算机科学与技术...
    • 128 篇 材料科学与工程(可...
    • 119 篇 软件工程
    • 89 篇 机械工程
    • 66 篇 动力工程及工程热...
    • 59 篇 控制科学与工程
    • 42 篇 化学工程与技术
    • 35 篇 信息与通信工程
    • 31 篇 仪器科学与技术
    • 23 篇 力学(可授工学、理...
    • 15 篇 冶金工程
    • 15 篇 生物医学工程(可授...
    • 10 篇 建筑学
    • 9 篇 光学工程
    • 9 篇 土木工程
    • 8 篇 交通运输工程
    • 8 篇 安全科学与工程
    • 7 篇 生物工程
  • 255 篇 理学
    • 146 篇 物理学
    • 116 篇 数学
    • 45 篇 化学
    • 22 篇 系统科学
    • 10 篇 生物学
    • 10 篇 统计学(可授理学、...
  • 38 篇 管理学
    • 37 篇 管理科学与工程(可...
  • 8 篇 医学
    • 7 篇 临床医学
    • 6 篇 基础医学(可授医学...
    • 5 篇 药学(可授医学、理...
  • 4 篇 法学
  • 4 篇 艺术学
  • 2 篇 农学
  • 1 篇 经济学
  • 1 篇 教育学

主题

  • 272 篇 computational mo...
  • 230 篇 integrated circu...
  • 190 篇 circuit simulati...
  • 178 篇 microelectronics
  • 125 篇 semiconductor de...
  • 115 篇 analytical model...
  • 107 篇 solid modeling
  • 96 篇 mathematical mod...
  • 65 篇 simulation
  • 61 篇 silicon
  • 57 篇 predictive model...
  • 53 篇 hardware design ...
  • 53 篇 micromechanical ...
  • 50 篇 load modeling
  • 50 篇 hardware
  • 49 篇 cmos technology
  • 47 篇 spice
  • 45 篇 design automatio...
  • 43 篇 logic gates
  • 42 篇 finite element a...

机构

  • 13 篇 institute of mic...
  • 13 篇 institute of mic...
  • 12 篇 institute of mic...
  • 7 篇 institute of mic...
  • 6 篇 department of mi...
  • 6 篇 institute of mic...
  • 6 篇 department of mi...
  • 6 篇 school of softwa...
  • 5 篇 school of microe...
  • 5 篇 nxp semiconducto...
  • 5 篇 national microel...
  • 5 篇 school of microe...
  • 5 篇 institute of mic...
  • 5 篇 philips applied ...
  • 5 篇 imec leuven
  • 5 篇 institute of mic...
  • 5 篇 amic angewandte ...
  • 5 篇 agilent technol ...
  • 5 篇 delft university...
  • 4 篇 shanghai researc...

作者

  • 10 篇 xiaowu zhang
  • 10 篇 roca e.
  • 9 篇 castro-lopez r.
  • 9 篇 a. napieralski
  • 8 篇 rodriguez r.
  • 8 篇 nafria m.
  • 7 篇 l.j. ernst
  • 7 篇 g.q. zhang
  • 7 篇 martin-martinez ...
  • 7 篇 sven rzepka
  • 7 篇 fernandez f. v.
  • 7 篇 s. selberherr
  • 7 篇 zhang gq
  • 6 篇 andrzej napieral...
  • 6 篇 m.k. iyer
  • 6 篇 ru huang
  • 6 篇 n. ranganathan
  • 6 篇 k.m.b. jansen
  • 5 篇 khaoula mbarek
  • 5 篇 sami ghedira

语言

  • 1,396 篇 英文
  • 10 篇 中文
  • 4 篇 其他
  • 3 篇 德文
检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1413 条 记 录,以下是21-30 订阅
排序:
2023 24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2023
2023 24th International Conference on Thermal, Mechanical an...
收藏 引用
24th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2023
The proceedings contain 105 papers. The topics discussed include: thermomechanical and electrical material characterization for a DLP printing process simulation of electrically conductive parts;studying asymmetric wa...
来源: 评论
modeling of Wireless Sensor Network Based on Functioning Parameters of Unevenly Distributed Nodes  17
Modeling of Wireless Sensor Network Based on Functioning Par...
收藏 引用
IEEE 17th International conference on the Experience of designing and Application of CAD Systems (CADSM)
作者: Belej, Olexander Nestor, Natalia Artyshchuk, Iryna Spas, Nataliia Lviv Polytechn Natl Univ Dept Comp Aided Design Lvov Ukraine
Connection and routing parameters of wireless sensor networks are considered for static topologies and uniform distribution of nodes. Most of the studied models do not take into account the parameters of message conne... 详细信息
来源: 评论
Analysis and modeling of Non-ideal Effects in SAR ADC  15
Analysis and Modeling of Non-ideal Effects in SAR ADC
收藏 引用
15th IEEE International conference on ASIC, ASICON 2023
作者: Zeng, Yaxin Xu, Hao Feng, Xi Yan, Na Fudan University State Key Laboratory of Integrated Chip and Systems Shanghai China Beijing Smartchip Microelectronics Technology Co. Ltd Beijing Smartchip Semiconductor Technology Co. Ltd Beijing China
For high resolution SAR ADC, the noise and distortion will significantly degrade the performance, thus should be considered carefully during design. This paper presents a behavioral modeling of SAR ADC in Simulink. Th... 详细信息
来源: 评论
LEDs Lifetime Prediction modeling: Thermomechanical simulation for SAC305 and SAC105  25
LEDs Lifetime Prediction Modeling: Thermomechanical Simulati...
收藏 引用
25th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024
作者: Akhtar, Mohd Zubair Schmid, Maximilian Zippelius, Andreas Elger, Gordon Technische Hochschule Ingolstadt Esplanade 10 Ingolstadt85049 Germany
The challenge of predicting the reliability of solder joints in high-power LED packages by Finite Element Analysis (FEA) is crucial for the automotive industry. Focusing on the thermo-mechanical stresses between LED p... 详细信息
来源: 评论
Development, Optimization, and Application of ML based modeling of Printed VO2RF Switch
Development, Optimization, and Application of ML based Model...
收藏 引用
2023 International conference on microelectronics, ICM 2023
作者: Khusro, Ahmad Hashmi, Mohammad Chaudhary, Muhammed Akmal Iit Kanpur Department of Electrical Engineering Kanpur India Nazarbayev University School of Engineering and Digital Sciences Astana Kazakhstan Ajman University College of Engineering and Information Technology Ajman United Arab Emirates
This paper proposes a globally optimized behavioral modeling algorithm using cascaded feed-forward neural network in conjugation with Particle Swarm optimization (PSO) for fully printed VO2 based RF switches. The prop... 详细信息
来源: 评论
Characterization and modeling of Cure-Induced Thermo Mechanical Properties and Chemical Shrinkage of Epoxy Resins  25
Characterization and Modeling of Cure-Induced Thermo Mechani...
收藏 引用
25th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, EuroSimE 2024
作者: Kasinikota, Venu Prakash Muehleisen, Wolfgang Grinschgl, Markus Steiner, Alexander Hasil, Siegfried Lang, Margit Christa Leoben8700 Austria Institute of Mechanics Montanuniversität Leoben Leoben8700 Austria Villach9524 Austria GIPRO GmbH Peggau8120 Austria
Epoxy resins are widely used in molding electrical insulators and electronic components due to their superior dielectric properties and mechanical strength. However, due to poor process control along with the complex ... 详细信息
来源: 评论
modeling the Thermal Characteristics of Stacked 2T0C Memory Array Based on InGaZnO4 Thin-film Transistors
Modeling the Thermal Characteristics of Stacked 2T0C Memory ...
收藏 引用
International conference on simulation of Semiconductor Processes and Devices (SISPAD)
作者: He, Song Li, Haoxin Xu, Guangwei Tang, Xinyi Li, Yuanbiao Kim, Jaewoo Gu, Tingting Xue, Xingkun Li, Zelun Xu, Handong Dong, Haiyang Zhou, Kai Hu, Xianqin Long, Shibing Univ Sci & Technol China Sch Microelect Hefei 230026 Peoples R China Changxin Memory Technol Inc Hefei 230601 Peoples R China
For the first time, the electrothermal characteristics of the stacked 2T0C memory array were modeled based on the material properties, electron transport mechanism of InGaZnO4 (IGZO) and basic Fourier heat flow equati... 详细信息
来源: 评论
A High Isolation Dual-band WiFi MIMO Antenna design  4
A High Isolation Dual-band WiFi MIMO Antenna Design
收藏 引用
2022 4th International conference on modeling, simulation, Optimization and Algorithm, ICMSOA 2022
作者: Yuan, Kang Nie, Qilei Zhang, Songtao Peng, Lihu Wang, Qinghai Liu, Geng Smart Shine Microelectronics Technology CO. Ltd Beijing China
In this paper, a dual-band WiFi MIMO antenna with high isolation is designed. The antenna is F-Type structure, and the resonant points of high frequency and low frequency are mainly controlled by two branches of '... 详细信息
来源: 评论
simulation Analysis Thermal Damage Effect of Strong Electromagnetic Pulse on PIN Limiter
Simulation Analysis Thermal Damage Effect of Strong Electrom...
收藏 引用
2023 Cross Strait Radio Science and Wireless Technology conference, CSRSWTC 2023
作者: Bing, Ruan Dongdong, Wang Wenzhuo, Wang Shengquan, Zheng Xujing, Huang Science and Technology on Electromagnetic Compatibility Laboratory Wuhan430064 China China Ship Development and Design Center Wuhan430064 China
The effects of pulse power and rise time on the performance of PIN limiter and internal temperature of PIN diode have been analyzed through multi-physics modeling simulation. The results show that the leakage power of... 详细信息
来源: 评论
Analysis and modeling of System Performance Based on Random Matching Errors, Gradient Errors, and Finite Output Impedance of Current-source DAC  3
Analysis and Modeling of System Performance Based on Random ...
收藏 引用
2023 3rd International conference on Electronics, Circuits and Information Engineering, ECIE 2023
作者: Ma, Zhihua Song, Zheng Yao, Yao Hu, Jianguo School of Microelectronics Science and Technology Sun Yat-sen University Guangdong Province Zhuhai519000 China Shenzhen Research Institute Sun Yat-Sen University Guangdong Province Shenzhen518000 China Development Research Institute of Guangzhou Smart City Guangdong Province Guangzhou510000 China
With the development of communication technology, the performance of digital-to-analog converters as the last link in signal processing is particularly important. This paper analyzes the errors of current rudder DAC a... 详细信息
来源: 评论