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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1418 条 记 录,以下是21-30 订阅
排序:
Thermomechanical Reliability of Bond Wires in Power Modules Subjected to Power Cycling
Thermomechanical Reliability of Bond Wires in Power Modules ...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Mohamed Boutaleb Fabrice Roqueta Fabrice Moreau Yann Brenet Laurent Barreau Analog Power & Discrete MEMS and Sensors Group Discrete & Filter Division (DFD) Quality Manufacturing & Technology BEM&T R&D STMicroelectronics Tours France
In the context of the expanding automotive market, power modules have emerged as key components, driving the need for compact devices, enhanced thermal management, and higher power density. These modules, which offer ... 详细信息
来源: 评论
Physics-Informed Machine Learning-Based Methodology for Plated Through Holes Lifetime Estimation in Printed Circuit Boards
Physics-Informed Machine Learning-Based Methodology for Plat...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Marco Sperti Chinmay Nawghane Bart Vandevelde Nicolas Lammens Mathias Verbeke imec Leuven Belgium Siemens Industry Software nv Strategy & Innovation Leuven Belgium Department of Computer Science KU Leuven Belgium Flanders Make@KU Leuven Belgium
The increasing demand for reliable electronics underscores the need for predictive tools to estimate component lifetimes and mitigate key failure risks and associated costs. This study focuses on Plated Through Holes ... 详细信息
来源: 评论
A New Holistic Approach for Prosthesis Polymeric Aortic Valve design
A New Holistic Approach for Prosthesis Polymeric Aortic Valv...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Müge Yaren Yaşartürk Emirhan Yığıt Reza Daryanı Emre Cenk Ersan Mustafa Serdar Çelebı Dept. of Computational Science and Engineering Istanbul Technical University Istanbul Turkey Dept. of Computer Engineering Istanbul Beykent University Istanbul Turkey Dept. of Mechanical Engineering Istanbul Technical University Istanbul Turkiye Dept. of Computational Science and Engineering Istanbul Technical University Istanbul Turkiye
Aortic valve insufficiency is a life-threatening condition. The primary treatment approach is the replacement of the native valve with prosthetic valves in severe cases. However, current prostheses often lead to compl... 详细信息
来源: 评论
Rheological Analysis and Numerical modeling of Viscoelastic Buffer Receiving Layer for Micro-LED Laser Mass Transfer
Rheological Analysis and Numerical Modeling of Viscoelastic ...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Zehou Li Liangzheng Ji Xin Wang Jun Wang Jing Zhang Fenglian Sun Yang Liu School of Material Science and Chemical Engineering Harbin University of Science and Technology Harbin China Heraeus Electronics Technology Heraeus Materials Technology Shanghai Shanghai China
This study introduces an innovative numerical model to simulate the dynamic impact of Micro-LED chips on viscoelastic buffer receiving materials during the Laser-Induced Forward Transfer (LIFT) process. We developed a... 详细信息
来源: 评论
FUNCTIONAL modeling OF LSI FOR simulation.
Proceedings of the Technical Program - International Microel...
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Proceedings of the Technical Program - International microelectronics conference 1980年 221-227页
作者: Wiles, Douglas
During the last decade, LSI technology has changed from theory to application in almost every facet of electronic equipment. This trend will certainly continue in the future. While LSI simplifies board design by perfo... 详细信息
来源: 评论
modeling and design of 3-D MPPT for ultra low power RF energy harvesters
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INTEGRATION-THE VLSI JOURNAL 2020年 72卷 21-28页
作者: Caselli, Michele Boni, Andrea Univ Parma Dept Engn & Architecture I-43124 Parma Italy
Radio-Frequency (RF) energy harvesting must cope with the limited availability and high variability of the energy source. In this paper, the modeling of an RF harvester for ultra low power environments is presented. A... 详细信息
来源: 评论
An Overview of the modeling and simulation of the Single Event Transients at the Circuit Level  30
An Overview of the Modeling and Simulation of the Single Eve...
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30th IEEE International conference on microelectronics (MIEL)
作者: Andjelkovic, M. Ilic, A. Stamenkovic, Z. Krstic, M. Kraemer, R. IHP Technol Pk 25 D-15236 Frankfurt Oder Germany
The single event transients (SETs) are a common source of malfunction in nano-scale CMOS integrated circuits. For this reason, evaluation of the SET effects and application of appropriate measures for their mitigation... 详细信息
来源: 评论
Transfer Molding simulation to Predict Filling Flaws and Optimize Package design  22
Transfer Molding Simulation to Predict Filling Flaws and Opt...
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22nd European microelectronics and Packaging conference and Exhibition (EMPC)
作者: Rovitto, M. Cannavacciuolo, A. STMicroelectronics Via C Olivetti 2 I-20864 Agrate Brianza MB Italy
The process of microchip encapsulation by epoxy resin injection is simulated by employing moldflow modeling. In this work, the use of modeling allows to reproduce the unbalanced flow behavior of the resin within the m... 详细信息
来源: 评论
Optimization of Through Crackstop Via using Finite Element modeling  18
Optimization of Through Crackstop Via using Finite Element M...
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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Rabie, Mohamed A. Polomoff, Nick GLOBALFOUNORIES Inc 400 Stone Break Rd Extens Malta NY 12020 USA
The ability of Through Crackstop Via (TCV) to prevent cracks from propagation is compared to conventional crackstop using a novel systematlc simulation methodology. The design of TCV is, then, optimized by varying the... 详细信息
来源: 评论
Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling
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microelectronics RELIABILITY 2004年 第12期44卷 1967-1976页
作者: Fan, XJ Zhou, J Zhang, GQ Philips Res USA Briarcliff Manor NY 10510 USA Lamar Univ Dept Engn Mech Beaumont TX 77710 USA Eindhoven Univ Technol Eindhoven Netherlands
The realization of virtual prototyping of electronic packages depends on the capability and reliability of multiphysics modeling. This paper focuses on the methods and solutions of combined thermal and thermo-mechanic... 详细信息
来源: 评论