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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1419 条 记 录,以下是381-390 订阅
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Infocommunication Networks design with Self-Similar Traffic
Infocommunication Networks Design with Self-Similar Traffic
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International conference on CAD Systems in microelectronics (CADSM)
作者: Dmytro Ageyev Aram Mohsin Tamara Radivilova Lyudmyla Kirichenko Infocommunication Engineering Department Kharkiv National University of Radio Electronics Kharkiv Ukraine Applied Mathematics Department Kharkiv National University of Radio Electronics Kharkiv Ukraine
The parametric synthesis is one of the planning stages of infocommunication networks. Recent studies of network traffic properties have shown that models of self-similar processes (self-similar traffic) describe traff... 详细信息
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Current Threshold Elements of Cyclic Shift for Constructing Specialized IP-Memory Modules in Automation and Systems for Tolerance Control of Analog Signals
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Journal of Physics: conference Series 2020年 第1期1443卷
作者: N V Butyrlagin N I Chernov N N Prokopenko V Ya Yugai Department of Information System and Radio engineering Don State Technical University Gagarin Sq. 1 Rostov-on-Don 344000 Russia Institute for Design Problems in Microelectronics of Russian Academy of Sciences Institute for Design Problems in Microelectronics RAS Sovetskaya St. 3 Zelenograd 124681 Russia
The current threshold elements of direct and reverse cyclic shift are developed. This logical elements are recommended as memory elements for the construction of relevant controllers and devices for tolerance control ...
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Redundant Double Conversion based Digital Background Calibration of SAR ADC with Convergence Acceleration and Assistance  25
Redundant Double Conversion based Digital Background Calibra...
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25th International conference on Mixed design of Integrated Circuits and System (MIXDES)
作者: Ding, Xiang Hofmann, Klaus Zhang, Liang Yi, Dongbai Ma, Yingjiang Tech Univ Darmstadt Integrated Elect Syst Lab Merckstr 25 D-64283 Darmstadt Germany Gree Elect Appliances Inc Commun Technol Res Inst West Jinji Rd Qianshan 519070 Zhuhai Peoples R China
A redundant double conversion (RDC) based digital background technique for successive approximation analogueto-digital converters (SAR ADCs) with convergence acceleration and assistance is presented. The convergence t... 详细信息
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MEMS Gyroscope FEM modeling and simulation  25
MEMS Gyroscope FEM Modeling and Simulation
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25th International conference on Mixed design of Integrated Circuits and System (MIXDES)
作者: Nazdrowicz, Jacek Szermer, Michal Stawinski, Adam Napieralski, Andrzej Lodz Univ Technol Dept Microelect & Comp Sci Lodz Poland
This paper the analysis of a 3D model of MEMS Gyroscope is presented. The FEM analysis of the 3D structure has been performed in very popular COMSOL Multiphysit software. Authors took particular attention on mechanica... 详细信息
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L-MPC: A LUT based MuIti-LeveI Prediction-Correction Architecture for Accelerating Binary-Weight Hourglass Network
L-MPC: A LUT based MuIti-LeveI Prediction-Correction Archite...
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design Automation conference
作者: Hong Liu Leibo Liu Wenping Zhu Qiang Li Huiyu Mo Shaojun Wei Institute of Microelectronics Tsinghua University Beijing China Chinese Academy of Science Institute of Semiconductors Beijing China Intel Corporation Beijing China
A binary-weight hourglass network (B-HG) accelerator for landmark detection, built on the proposed look-up-table (LUT) based multi-level prediction-correction approach, is enabled for highspeed and energy-efficient pr... 详细信息
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An Overview of the modeling and simulation of the Single Event Transients at the Circuit Level  30
An Overview of the Modeling and Simulation of the Single Eve...
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30th IEEE International conference on microelectronics (MIEL)
作者: Andjelkovic, M. Ilic, A. Stamenkovic, Z. Krstic, M. Kraemer, R. IHP Technol Pk 25 D-15236 Frankfurt Oder Germany
The single event transients (SETs) are a common source of malfunction in nano-scale CMOS integrated circuits. For this reason, evaluation of the SET effects and application of appropriate measures for their mitigation... 详细信息
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Optimization of Through Crackstop Via using Finite Element modeling  18
Optimization of Through Crackstop Via using Finite Element M...
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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)
作者: Rabie, Mohamed A. Polomoff, Nick GLOBALFOUNORIES Inc 400 Stone Break Rd Extens Malta NY 12020 USA
The ability of Through Crackstop Via (TCV) to prevent cracks from propagation is compared to conventional crackstop using a novel systematlc simulation methodology. The design of TCV is, then, optimized by varying the... 详细信息
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A TCAD modeling Approach for Diamond Particle Detectors: simulation and Test  13
A TCAD Modeling Approach for Diamond Particle Detectors: Sim...
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13th conference on Ph.D. Research in microelectronics and Electronics (PRIME) / 14th International conference on Synthesis, modeling, Analysis and simulation Methods and Application to Circuit design (SMACD)
作者: Morozzi, Arianna Passeri, Daniele Univ Perugia Engn Dept Perugia Italy INFN Perugia Perugia Italy
In order to fully exploit the properties of diamond in electronic semiconductor applications, standard design and verification tools should be adopted, following the conventional TCAD design flow. However, diamond is ... 详细信息
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High-Frequency Electronic modeling Using Neural Networks
High-Frequency Electronic Modeling Using Neural Networks
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2018 International conference on Advanced Control, Automation and Artificial Intelligence (ACAAI2018)
作者: Qijun Zhang School of Microelectronics Tianjin University
We present an overview of neural network approaches for efficient modeling, simulation and optimization of high-frequency electronic and microwave circuits. Neural networks trained from electronic/microwave data are s... 详细信息
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On the modelling and placement of bonding-pillar holes in multi-wafer, vacuum-packaged MEMS  20
On the modelling and placement of bonding-pillar holes in mu...
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20th Symposium on design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
作者: Bojesomo, Alabi Syed, Wajih Elfadel, Ibrahim Abe M. Department of Electrical and Computer Engineering Masdar Institute Khalifa University of Science and Technology Abu Dhabi United Arab Emirates
Reliability considerations in multi-wafer, vacuum- packaged MEMS often require the usage of bonding pillars connecting the top and bottom capping wafers. Such bonding pillars in turn require the etching of holes into ... 详细信息
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