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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1418 条记录，以下是31-40 订阅

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Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications 23

Model Order Reduction of a Thermo-Mechanical Packaged Chip M...

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23rd International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Umunnakwe, C. B. Zawra, I. Yuan, C. Rudnyi, E. B. Hohlfeld, D. Niessner, M. Bechtold, T. Jade Univ Appl Sci Wilhelmshaven Germany Univ Rostock Rostock Germany Cadfem GmbH Munich Germany Infineon Technol AG Neubiberg Germany

ISBN: (纸本)9781665458368

Experimental investigations for performing design optimization and life cycle assessment during the development of high-tech components are costly and time consuming. Hence, they are preceded by finite element simulations. Mathematical methods of model order reduction can speed-up the simulation time significantly and thus, enable system level simulation. In this paper we demonstrate how model order reduction can be applied to a linearized, coupled domain thermomechanical packaged chip finite element model. The resulting reduced order model is built using Krylov subspace based model reduction technique and exhibits an outstanding accuracy. Furthermore, at the system level it can be connected to the lumped element electrothermal MOSFET model in order to provide it with realistic time-variable boundary conditions.

关键词： Semiconductor device modeling Micromechanical devices MOSFET Thermomechanical processes Boundary conditions Mathematical models Reduced order systems

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Advanced process library irradiation parameter modeling and analysis techniques 2

Advanced process library irradiation parameter modeling and ...

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2nd International conference on Electronic Information Technology, EIT 2023

作者： Shi, Fayin Wang, Liang Sang, Qianqian Shen, Mengdong Li, Yong Liu, Chang National University of Defense Technology Hunan Changsha410073 China Beijing Microelectronics Technology Institute Beijing100076 China

ISBN: (数字)9781510666627

ISBN: (纸本)9781510666610

The irradiation experimental analysis of chips can obtain irradiation data of advanced processes, which is beneficial to guide the research of new generation of anti-irradiation chips. In this paper, based on the GDS layout of the advanced process library, we firstly design the GDS layout hierarchy information extraction technology and implement the standard cell TCAD model automatic generation technology, then design the algorithm to generate irradiation parameters for heavy ion bombardment simulation experiments, and finally analyze the experimental data to establish the irradiation database. The experimental results show that it is feasible to establish an automatic irradiation data acquisition scheme based on the GDS layout of the advanced process library. © 2023 SPIE.

关键词： Ion bombardment

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An Infrared AFE Chip and System with Non-Invasive Blood Glucose Detection Output 17

An Infrared AFE Chip and System with Non-Invasive Blood Gluc...

引用

17th IEEE International conference on Solid-State and Integrated Circuit Technology, ICSICT 2024

作者： Li, Bin Guo, Jiyuan Xie, Chengzhen Mei, Jian Deng, Lei Yin, Rui National Integrated Circuit Innovation Center Shanghai China School of Microelectronics Fudan University Shanghai China Jiashan Fudan Institute Jiaxing China

ISBN: (纸本)9798350361834

China, with the highest diabetic patient count globally as of 2021 stats, presents substantial market potential and broad prospects for non-invasive blood glucose detection (NIBGD) in healthcare. Infrared absorption spectroscopy (IAS) stands out among NIBGD methods for its advantages. Leveraging CMOS for its high integration, reliability, low power, and compactness, this study targets sensor exploration. The paper presents a long-wave IAS-based glucose detection scheme using multispectral imaging, with an AFE chip and system achieved via circuit design and Verilog-A modeling. simulation results show the superior performance of PGA in gain deviation, and accurately discerning 50 mg/dL and 138 mg/dL glucose levels. © 2024 IEEE.

关键词： Glucose sensors

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Deep Learning Modelling for Composite Properties of PCB Conductive Layers 23

Deep Learning Modelling for Composite Properties of PCB Cond...

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23rd International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Stoyanov, Stoyan Bailey, Chris Univ Greenwich Computat Mech & Reliabil Grp Sch Comp & Math Sci London SE10 9LS England

ISBN: (纸本)9781665458368

This paper presents the development of a novel modelling approach, based on the use of deep learning (DL), to predict the orthotropic composite properties of copper-patterned conductive layers of printed circuit boards (PCBs). This data is needed to assess the bulk PCB properties with existing methods for laminar composites. Image datasets of copper patterned artwork, required with this approach, are gathered and the composite (homogenised) orthotropic elastic modulus of the respective conductive layouts is evaluated through an automated, macro-script executed, finite element analyses. The modulus values are assigned as labels to each image of a copper layout in the dataset. A regression convolutional neural network is developed and optimised using a training dataset and validated using the test dataset. The results show that the DL model can predict the orthotopic values of the elastic modulus of highly non-structured copper patterns accurately, with the absolute errors of the predicted vs. true (FEA evaluated) property value being less than 3% of the composite propriety range for 99% of the patterns in the validation dataset. The advantages of the proposed machine learning solution over existing techniques are that it can be digitalised and made available to the end-user as an easy-to-use and computationally fast toolset. The modelling approach can enable design engineers effectively explore PCB design alternatives, with awareness of their thermo-mechanical properties and the effect they have on the assembly performance and components' reliability.

关键词： Deep learning Training Computational modeling Layout Thermomechanical processes Predictive models Finite element analysis

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Investigation of Parasitic Background IR Radiation Levels on a Photodetector Surface in a Vacuum Cryostat

Investigation of Parasitic Background IR Radiation Levels on...

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2022 IEEE International Multi-conference on Engineering, Computer and Information Sciences, SIBIRCON 2022

作者： Novoselov, Andrew R. Dobrovolsky, Peters P. Khryashchev, Sergey V. Shatunov, Konstantin P. Aldokhin, Pavel A. Dept. of Thermal Imaging and Television Technology and Design Institute of Applied Microelectronics Novosibirsk Branch of Rzhanov Institute of Semiconductor Physics Siberian Branch of the Russian Academy of Sciences Novosibirsk Russia Dept. of Modeling of Electrooptical Devices Novosibirsk Branch of Rzhanov Institute of Semiconductor Physics Siberian Branch of the Russian Academy of Sciences Technology and Design Institute of Applied Microelectronics Novosibirsk Russia

ISBN: (纸本)9781665464802

The results of experimental and numerical simulations studying the stray background levels on an IR photodetector surface in a vacuum cryostat with a cylindrical diaphragm are presented in the article. The stray background value was investigated by the direct measurement with a second thermal camera pointed at the surface of the first camera's hybrid assembly. The limitations of the experimental method are the accuracy of measuring the background level on the surface of the photodetector. It is necessary to use a cooled second thermal camera as a measuring instrument since if the temperature of the photodetector in it is higher than the temperature of studied surface, and its radiation reflected from the IR photodetector does not allow reliable results to be obtained. This method of the research makes it possible to identify technological imperfections in the design of the studied cryostats. Numerical simulation makes it possible to optimize the shape and the design of cold diaphragms, but it does not allow to analyze the contributions of various sources of parasitic radiation in the cryostat. This requires additional modeling and simulation. © 2022 IEEE.

关键词： Infrared radiation

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2023 International conference on Electrical Drives and Power Electronics, EDPE 2023 - Proceedings

2023 International Conference on Electrical Drives and Power...

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36th International conference on Electrical Drives and Power Electronics, EDPE 2023

ISBN: (纸本)9798350322750

The proceedings contain 61 papers. The topics discussed include: torque ripple reduction utilizing pole-shoe extensions for a traction wound field synchronous machine;investigation of the influence of geometry of wireless power transfer (WPT) coupling coils on transmitting performance;nonlinear PMSM model implementation in MATLAB-Simulink for sensorless polarity detection;analysis of the characteristics of a dual-channel three-phase induction motor;design of piece-wised linearized simulation model of the traction inverter suited for efficiency performance evaluation;data science-based techniques for modelling and diagnostics of battery cells based on end-of-life criteria;neural network speed controller for DC motor;and the analysis, modeling, and control of the forward DC/DC converter.

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Analysis and simulation of Reset Leakage Currents and Quantization Error in a PFM Digital Pixel

Analysis and Simulation of Reset Leakage Currents and Quanti...

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International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD)

作者： Sergio Palomeque-Mangut Pablo Fernández-Peramo Juan A. Leñero-Bardallo Ángle Rodríguez-Vázquez Institute of Microelectronics of Seville (IMSE-CNM) CSIC-Universidad de Sevilla Spain

ISBN: (数字)9798350351927

ISBN: (纸本)9798350351934

This paper analyzes the design and performance optimization of the intensity-to-frequency converter in a Pulse-Frequency Modulated (PFM) Digital Pixel Sensor (DPS). We modeled the leakage currents induced by the self-reset feedback switch, which have a significant impact on its behavior. The work presents simulation results conducted in an advanced CMOS technology, illustrating the benefits of utilizing an NMOS reset to mitigate leakage, as opposed to a PMOS device. Additionally, the paper explores the consequences of quantization errors on sensor performance.

关键词： Semiconductor device modeling Performance evaluation Quantization (signal) simulation Switches Leakage currents Photoconductivity Integrated circuit modeling Optimization MOS devices

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Research on Channel modeling in Enclosed Metal Scenario with Aperture

Research on Channel Modeling in Enclosed Metal Scenario with...

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2023 Cross Strait Radio Science and Wireless Technology conference, CSRSWTC 2023

作者： Xu, Haotian Wang, Yanwei Kou, Aonan Sun, Lanhao Wu, Mengchun Ding, Tonyu Shenyang Aircraft Design and Research Institute Shenyang China School of Ocean Information Engineering Jimei University Xiamen China

ISBN: (纸本)9798350358971

This paper proposes a method for extracting channel features in specialized 5G application scenarios, aiming to address the simulation discrepancies in metal aperture-coupled models using the ray tracing algorithm. simulations performed on a 100 × 100 × 15 cm3 metal cavity with aperture using both full wave and ray tracing methods revealed distinct differences in field strength distributions. Based on the derived convolution formula, this study presents a more accurate electric field distribution in metal cavity with aperture. Compared to the straightforward ray tracing method, the proposed channel modeling and field strength extraction techniques offer a novel theoretical foundation for electromagnetic wave propagation in enclosed metal scenarios. Within this metal model, the proposed method combines the precision of full wave methods with the efficiency of ray tracing techniques. © 2023 IEEE.

关键词： aperture coupling aperture transmission characteristics channel feature extraction ray tracing algorithm

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modeling of Electromagnetic Phenomena in Small Hydroelectric Plants 36

Modeling of Electromagnetic Phenomena in Small Hydroelectric...

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36th International conference on Electrical Drives and Power Electronics, EDPE 2023

作者： Fedor, Pavol Perdukova, Daniela Bernat, Petr Stepanec, Libor Fedak, Viliam Technical University Dept. of Ee &mechatronics Kosice Slovakia Vsb Technical University Dept. of El. Power Engg. Ostrava Czech Republic

ISBN: (纸本)9798350322750

Due to the increasing consumption of electricity,small hydropower plants (SHPP) are becoming one of the most important sources of renewable energy in the world with a negative impact on the environment. Their research and practical implementation are among the current tasks of contemporary power engineering. The expected production of the electricity depends on certain design parameters of an SHPP, which can be determined by analyzing dynamic phenomena using its specific simulation model. The paper focuses on the development of a functional simulation model of an SHPP using an induction machine as an electrical generator, which is used to model their mutual couplings and to analyze arising hydro-mechanical and electro-mechanical phenomena. The overall model has been used for the investigation of the dynamics of fast electro-mechanical phenomena during individual start-up phases of the SHPP, and also for solving the problems of short-term voltage interruptions in the electrical network. The paper brings a solution to the problem of limiting peak currents that arise during the connection of the electric generator to the power grid. The elimination of this negative phenomenon is important in terms of optimal sizing of the power grid (cables, circuit breakers), as well as for the design, and operation of the SHPP itself. © 2023 IEEE.

关键词： Asynchronous generators

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Arithmetic Calculus modeling for Approximate Circuits

Arithmetic Calculus Modeling for Approximate Circuits

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International conference on microelectronics, ICM

作者： Alain Aoun Mahmoud Masadeh Osman Hasan Sofiene Tahar Department of Electrical and Computer Engineering Concordia University Montreal Quebec Canada Computer Engineering Department Yarmouk University Irbid Jordan Department of Electrical Engineering National University of Sciences & Technology Islamabad Pakistan

ISBN: (数字)9798350379396

ISBN: (纸本)9798350379402

Approximate computing (AC) is a paradigm that introduces errors for reduced design metrics. AC has been recommended for implementation in error-resilient applications. Previously proposed AC implementations can be modified to generate new configurations and thus result in a large design space of AC. In this paper, we propose a mathematical modeling technique that allows a fast analysis of hardware designs with the aim of studying the quality of large design spaces. Mathematically modeling the AC circuits facilitates the quality to be assessed using various error metrics while reducing the assessment time. The proposed approach has been applied to various arithmetic units, including an array multiplier, a multiply accumulate unit and a divider. The experimental results showed a quality assessment equivalent to the one obtained by the Monte-Carlo simulation, while offering a remarkable reduction in CPU time.

关键词： Measurement Computational modeling Circuits Approximate computing Mathematical models Hardware Calculus Quality assessment Integrated circuit modeling Arithmetic

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