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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是431-440 订阅

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Layout-Aware Challenges and a Solution for the Automatic Synthesis of Radio-Frequency IC Blocks 14

Layout-Aware Challenges and a Solution for the Automatic Syn...

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13th conference on Ph.D. Research in microelectronics and Electronics (PRIME) / 14th International conference on Synthesis, modeling, Analysis and simulation Methods and Application to Circuit design (SMACD)

作者： Martins, R. Lourenco, N. Povoa, R. Canelas, A. Horta, N. Passos, F. Castro-Lopez, R. Roca, E. Fernandez, F. Univ Lisbon Inst Super Tecn Inst Telecomunicacoes Lisbon Portugal Univ Seville CSIC IMSE CNM Inst Microelect Sevilla Seville Spain

ISBN: (纸本)9781509050529

In this paper, the major methodologies proposed in the last years to speed-up the synthesis of radio-frequency integrated circuits blocks are overviewed. The challenges to automate this task are discussed, and, to avoid non-systematic iterations between circuit and layout design steps, the architecture of an innovative solution is proposed. The proposed tool exploits the full capabilities of most established computer-aided design tools available nowadays, i.e., off-the-shelf circuit simulator, electromagnetic simulator and layout extractor. The approach intends to bypass the two major bottlenecks of RF-design: the design of reliable integrated inductors and accurate layout parasitic estimates since the early stages of design process.

关键词： Inductors Layout Integrated circuit modeling Radio frequency Solid modeling Optimization Generators

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modeling and optimization of Blumlein nanosecond pulse generator for experiments on planar lipid bilayers 14

Modeling and optimization of Blumlein nanosecond pulse gener...

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作者： Rebersek, Matej Pirc, Eva Miklavcic, Damijan Kramar, Peter Univ Ljubljana Fac Elect Engn Ljubljana Slovenia

ISBN: (纸本)9781509050529

Although electroporation protocols are common in biomedicine and biotechnology, the fundamental molecular-scale mechanisms involved in electroporation are still not completely understood. Therefore, molecular dynamics (MD) simulations of small patches of planar lipid bilayers (PLB) and experimentally formed PLB are used to model the cell membrane and to explain the electroporation process. However, in addition to the size difference, there is also a significant time gap between this two modeling methods. MD simulates processes up to nanoseconds while experimentally formed PLB are used to detect microsecond processes. In the presented work we model and optimize Blumlein nanosecond generator with pulse forming networks (PFN) for application of nanosecond pulses on PLB, where PLB chamber electrically represents low conductance and high capacitance. Blumlein nanosecond generator with PFN is suitable for adjusting the impedance of the generator to the impedance of the load. The challenge of generating nanosecond pulses on PLB can be addressed with careful designing of the pulse generator architecture and selecting appropriate electrical components. Numerical approaches, such as SPICE, can be a great help during development of pulse generators by either verification of its configuration or defining values of electrical components in order to obtain desired pulse characteristics.

关键词： Blumlein generator electroporation lipid bilayer nanosecond pulse generator pulse-forming network SPICE

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LNA-ESD-PCB Codesign for Robust Operation of IR-UWB Non-coherent Receiver 14

LNA-ESD-PCB Codesign for Robust Operation of IR-UWB Non-cohe...

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作者： Batur, Okan Zafer Dundar, Gunhan Koca, Mutlu Istanbul Bilgi Univ Dept Elect & Elect Engn TR-34060 Istanbul Turkey Bogazici Univ Dept Elect & Elect Engn TR-34342 Istanbul Turkey

ISBN: (纸本)9781509050529

In this paper, we present a radio frequency (RF) front-end design for increasing robustness of non-coherent energy detection based impulse radio (IR) ultra-wideband (UWB) receivers in impulsive noise environment. Robustness against impulsive noise is achieved by on chip LNA-bandpass filter (BPF) circuit, which also works as a clipper for high energy impulsive noise bursts. The electrostatic discharge (ESD), wirebond, pad capacitance, and the chip package model are co-designed with wideband cascode LNA structure. These unwanted capacitive and inductive elements are designed as a part of input BPF. The LNA output stage includes an inductor that is coupling with the input capacitance of the VGA block results in additional filtering. In the post-layout simulations, 45 dB impulsive noise compression has been achieved. It has been shown that the RF front-end and LNA output stage reduces the impulsive noise and increases the noise performance of the IR-UWB receiver, hence becoming robust against the impulsive noise.

关键词： Receivers Robustness Band-pass filters Radio frequency Integrated circuit modeling Noise measurement Electrostatic discharges

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Multi-physics based system simulations for magnetic sensors 18

Multi-physics based system simulations for magnetic sensors

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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Koeck, Helmut Binder, Gemt Heinrichs, Frank Wautischer, Gregr Bruckner, Flrian Suess, Dieter Infineon Technol Austria AG Siemensstr 2 A-9500 Villach Austria Univ Vienna Inst Solid State Phys Christian Doppler Lab Adv Magnet Sensing & Mat Vienna Austria

ISBN: (纸本)9781509043446

Today's magnetic sensor applications demand a detailed understanding of all relevant system components. This work presents a holistic simulation methodology to account for the close interaction between ferromagnetic target objects, magnetic circuit designs and specific sensor characteristics of relevant Hall and xMR technologies. The core element of this simulation approach is a proprietary developed finite element/boundary element based magnetic simulation environment capable to accurately calculate isotropic as well as anisotropic permanent magnets in a ferromagnetic target wheel setup. Available simulation features are superior in terms of field accuracy and computational cost compared to commercially available tools. Incorporating the magnetic simulation core in a holistic simulation design flow offers the integration of application driven key parameters like target wheel rotation or air gap variation and ultimately translates the results to electrical signals. Target wheels, package details including magnet design, chip layout and sensor specific properties are parametrized and investigated in detail. The numerical results of a target wheel optimization based on the multi-physics simulation approach presented in this work are eventually compared to actual measurements. The presented results clearly highlight the potential to support future product developments in the field of magnetic sensors.

关键词： Magnetic domains Wheels Finite element analysis Perpendicular magnetic anisotropy Magnetostatics Atmospheric modeling

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Minimizing electro-mechanical shifts in IC applications

Minimizing electro-mechanical shifts in IC applications

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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： J. J. M. Zaal A. Mavinkurve Y. K. Liang S. F. Chopin E. Huynh Y. Gao A. Damian NXP Semiconductors Nijmegen AE Netherlands

With the ever increasing functionality of modern electronics many applications have emerged using high-performance-mixed-signal ICs. Many of these ICs require control of device parameters in the sub-one-percent range. To reach such precision, trimming on wafer level is commonly employed. Trimming is needed due to slight dimensional differences caused by the front-end process variation and small differences in mechanical stress between the products. The piezo-electric effect, responsible for causing changes in electrical parameters due to mechanical stress has been studied extensively. [1-4] In this paper we study the effects of the time-temperature behavior exhibited by organic materials at the die-package level on the electrical performance of typical devices used in IC design such as pMOS, nMOS and vertical PNP bipolar junction transistors (vPNP). With some applications, minimizing the coupling between the materials that exhibit time-temperature dependent behavior and the sensitive circuitry will ensure that a properly-trimmed circuit will behave predictably during its lifetime. We explore potential solutions based on integrated die-package stress buffers. Buffers used to decouple the IC circuitry from the surrounding packaging materials are investigated by simulation and experimentation. A response surface model is used to find a limited set of geometrical configurations for sample builds via virtual prototyping. Using thermo-mechanical simulations, we were able to limit the number of relevant design parameters and predict the sensitivity of the circuit for each of them.

关键词： Stress Integrated circuit modeling Silicon Response surface methodology Microassembly

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Sim2Cool: A Two-Phase Cooling System Simulator and design Tool

Sim2Cool: A Two-Phase Cooling System Simulator and Design To...

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Intersociety conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM)

作者： Pritish R. Parida Mark. D. Schultz Timothy Chainer IBM T. J. Watson Research Center Yorktown Heights NY USA

The development of two-phase cooling for both two-dimensional (2D) and three-dimensional (3D) integrated circuits using pumped dielectric coolant has gained recent attention due to the ability to manage high heat densities, compatibility with electronics and low cooling energy usage. Development of this approach requires high fidelity and computationally manageable conjugate thermal models both at the device level as well as the system level. Recent studies have shown micro-scale modeling of in-situ thermal and hydrodynamic phenomena (e.g. boiling and bubble dynamics) of two-phase flow boiling with good accuracy. This paper describes a simulation tool named Sim2Cool which addresses the need for macro-scale system level design simulation for two-phase cooling. The Sim2Cool simulation tool uses an enthalpy-based / energy balance model for the system components and a reduced order model for device-level model. The system simulator tool allows system component parameters to be quickly analyzed including; condenser, reservoir and tubing diameter as well as heat dissipation and flow rate to quantify the impact on the system coefficient of performance (COP). Such tools are critical to accelerating the integration of two phase cooling with microelectronics to realize performance gains by way of high density electronic packaging as Moore's law on silicon technology advancement reaches physics limits.

关键词： Mathematical model Heat transfer Electronic countermeasures Coolants Computational modeling Tools

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Thermo-mechanical properties of ABS parts fabricated by fused deposition modeling and vapor smoothing 18

Thermo-mechanical properties of ABS parts fabricated by fuse...

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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Zhang, Sung-Uk Han, Jonghyeuk Kang, Hyun-Wook Shin, Byoung-Chul Dong Eui Univ Electro Ceram Ctr 1 176 Eomgwangro Busan 47340 South Korea Ulsan Natl Inst Sci & Technol Sch Life Sci 2 50 UNIST Gil Ulsan 440919 South Korea

ISBN: (纸本)9781509043446

FDM is one of the popular 3D printing technologies due to an inexpensive extrusion machine and multi-material printing. However, FDM could only use thermoplastics such as ABS and PLA and has a problem related to the post-processing. In this study, we measured the mechanical property of ABS parts fabricated by FDM and the vapor smoothing technique which is one of the post-processing methods. Using dynamic mechanical analysis (DMA) and dilatometer, we observed temperature-dependent storage modulus and CTE for specimens varying with amount of acetone in the vapor smoothing process. In result, we could not observe the effect of the amount of acetone in the given range but differentiate one without the vapor smoothing process and the others with the vapor smoothing process in terms of the storage modulus and CTE. Moreover, we could perform finite element analysis using the measured mechanical properties and make a design guideline for an ABS product. We could conclude that the vapor smoothing process weakens thermal stability of ABS 3D printed parts.

关键词： Smoothing methods Temperature measurement Three-dimensional displays Frequency division multiplexing Temperature dependence Three-dimensional printing Mechanical factors

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Multi-physics Models and Condition-based Monitoring for 3D-Printing of Electronic Packages 18

Multi-physics Models and Condition-based Monitoring for 3D-P...

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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Bailey, Chris Stoyanov, Stoyan Tilford, Tim Tourloukis, Georgios Univ Greenwich Computat Mech & Reliabil Grp London SE10 9LS England

ISBN: (纸本)9781509043446

3D-Printing technology, or additive manufacturing, is seeing increased interest in the electronic packaging community as it has the potential to enable cost-effective, potentially high-throughput and high degree of design customisation. At the same time there are a number of challenges related to quality, performance and reliability of the fabricated products. Technological advances and other capabilities to address successfully these challenges are required and need to be developed. This include the development of process models that can be used to predict characteristics of products manufactured with 3D printing techniques. This paper gives an overview of the current state of 3D printing in the context of technology use for electronics packaging. lt details in particular the developments made in the modelling for 3D ink-jet printing of packaged electronic components which is taking place in the EU funded project NextFactory (http://***). This project is developing an all-in-one manufacturing platform that integrates 3D-printing (multi-material ink-jet), material cure and sintering and micro-assembly technologies for electronic packaging applications. Particular areas of novelty in the presented work relate to: (1) development of Smooth Particle Hydrodynamics solver for ink-jet drop let deposition and coalescence, (2) development of finite element models for predicting deformation and residual stress due to cure shrinkage as each layer is deposited, and (3) development of machine-learning and surrogate modelling based framework for condition-based monitoring of the fabrication process.

关键词： Solid modeling Three-dimensional printing Electronics packaging Three-dimensional displays Consumer electronics Computational modeling

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Lifetime modeling Based on Anodic Oxidation Failure for Packages with Internal Galvanic Isolation 18

Lifetime Modeling Based on Anodic Oxidation Failure for Pack...

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18th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Schaller, R. Strutz, V. Theuss, H. Dudek, R. Rzepka, S. Infineon Technol AG Regensburg Germany Fraunhofer ENAS Chemnitz Germany

ISBN: (纸本)9781509043446

In More-than-Moore technologies, the number and complexity of micro and nano devices, that are directly integrated into control units of power electronics and mechatronics systems, increase. These systems typically operate at working voltages in the range of 220-1000 V-RMS [1]. The galvanic isolation between the high voltage and the low voltage domains is usually ensured by the geometries of the electronic package. Consequently, detailed knowledge about the field behavior under operating and environmental conditions is essential for product development in order to ensure proper isolation quality throughout the product lifetime. The paper describes the development of a lifetime model for devices subjected to strong electrical fields. Anodic oxidation of silicon has been found to be the most important failure mode that occurs under the specific conditions of these devices. After studying the chemical and physical effects of the phenomenon, a reliability model is derived. It allows estimating the lifetime under field conditions based on tests which use the extrinsic accelerators voltage, humidity, and temperature. Furthermore, the impacts of operational and environmental conditions are taken into account. Finally, the accumulation of the degradation is considered by applying Miner's rule for calculating the cumulative lifetime. The paper ends with an advice for the design of future qualification tests.

关键词： Silicon Stress Acceleration Oxidation Humidity Leakage currents Electrodes

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Analysis and Test of Time Difference Measurement IP Based on FIB

Analysis and Test of Time Difference Measurement IP Based on...

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2018 2nd International conference on modeling, simulation and Optimization Technologies and Applications(MSOTA 2018)

作者： Jun DENG Ke-liu HU Tao ZHANG Hao LUO Kun HUANG Sichuan Institute of Solid-state Circuits School of Microelectronics and Communication Engineering Chongqing University

With the development of semiconductor technology, how to locate and verify the problems found in chip testing becomes the key of the chip design. In the test of time difference measurement IP chip, test results find that the phase shift output does not correspond with the design requirements. After analyzing the circuit, the leakage current of refresh circuit is found. The FIB(Focused Ion Beam) technology is adopted to modify the physical circuit. The circuit is tested after FIB. The result shows that the judgement and analysis of the crux of the problem is correct. Through FIB, not only the problem is found, but also the function and performance of the chip are tested rapidly. The purpose of rapid verification is achieved, and the modification time is saved. Using FIB can help to reduce the cost of chip design sometimes.

关键词： IC Test leakage current FIB(Focused Ion Beam) Verification

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