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18th International conference on microelectronics (ICM 2006)

作者： Lapalme, J. Aboulhamid, E. M. Nicolescu, G. Rousseau, F. Univ Montreal Montreal PQ Canada Ecole Polytech Montreal PQ Canada TIMA Grenoble France

ISBN: (纸本)9781424407644

Many are working on the productivity gap problem affecting the Electronic design Automation. None of the current paths seems to be a silver bullet but object-oriented framework-based solutions such as SystemC are gaining a great deal of momentum and acceptance. Despite all the efforts which have been spent one the development of these types of solutions, as well as the numerous satellite tools which add a lot of value to the approach;very few efforts have been spent on the cornerstone task of investigating which software design techniques and technologies should be used to develop effective framework-based solutions. The main objective of the article is to present how new software engineering technologies may be used to create better framework-based modeling solutions by promoting separation of concerns between modeling and simulation aspects.

关键词： framework modeling simulation system-level design

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ToPoliNano & MagCAD: a Complete Framework for design and simulation of Digital Circuits based on Emerging Technologies 15

ToPoliNano & MagCAD: a Complete Framework for Design and Sim...

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15th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 14th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Garlando, Umberto Riente, Fabrizio Vergallo, Deborah Graziano, Mariagrazia Zamboni, Maurizio Politecn Torino Dept Elect & Telecommun I-10129 Turin Italy

ISBN: (纸本)9781538651537

Evaluating the performance of beyond CMOS devices poses many challenges to the research community. Several works analyze emerging technologies at device level;nonetheless an architectural design space exploration is fundamental to understand their potential. We present a design framework for emerging technologies, consisting of two tools ToPoliNano and MagCAD. It provides a top-down design flow and a methodology enabling the architectural exploration of emerging devices.

关键词： Tools Integrated circuit modeling Layout Windows CMOS technology Libraries Semiconductor device modeling"

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modeling and simulation of Monolithic Integration of Rectifiers for Solid State Lighting Applications

Modeling and Simulation of Monolithic Integration of Rectifi...

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15th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, (EuroSimE)

作者： Venkatesh, M. R. Liu, P. van Zeijl, H. W. Zhang, G. Q. Delft Univ Technol DIMES Res Ctr NL-2628 CT Delft Netherlands

ISBN: (纸本)9781479947904

In this paper, a design methodology for modelling and simulation of monolithic integration of low power rectifier for solid state lighting application is presented. The power conversion is built based on schottky diode fabricated in a standard BiCMOS process. The process simulation is done by using TSUPREME4 to study the doping profiles and junction depth of the standard BiCMOS fabrication steps. The modelling and design of the schottky diode for rectifier design is then made with inputs from the process simulation tool. COMSOL Multiphysics environment is used to couple both semiconductor module and circuit analysis steps. The simulated IV characteristics of the schottky diode are used to build the spice model parameters of the fabricated device. A model for monolithically integrated rectifier application and analysis is presented and analysed.

关键词： Rectifiers Schottky diodes Monolithic integration Solid state lighting process simulation modeling and simulation junction depth doping profiles modeling BiCMOS Power conversion simulating

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A fully static scheduling approach for fast cycle accurate SystemC simulation of MPSoCs

A fully static scheduling approach for fast cycle accurate S...

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International conference on microelectronics

作者： Buchmann, Richard Greiner, Alain Univ Paris 06 LIP6 4 Pl Jussieu F-75005 Paris France

ISBN: (纸本)9781424418466

This paper presents principles and tools to facilitate Mufti-Processor System on Chips (MPSoCs) design and modeling, and to speed up cycle accurate SystemC simulation. We describe an effective way to build an hardware architecture virtual prototype, using a library of SystemC simulation models based on communicating synchronous finite state machines. This modeling approach supports a fully static scheduling strategy, based on the analysis of the combinational dependency graph. Our static scheduling algorithm has been implemented in the SystemCASS simulator, and provides speed-up of one order of magnitude versus the standard event-driven SystemC simulation engine. The modeling approach proposed in this paper has been adopted by the SoCLIB french national project, that is an open modeling and simulation platform for multi-processors system on chips.

关键词： Scheduling algorithms

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Multi-dimensional Parameter Fitting Method for Device Aging modeling

Multi-dimensional Parameter Fitting Method for Device Aging ...

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IEEE Asia Pacific conference on Postgraduate Research in microelectronics and Electronics (PrimeAsia)

作者： Sang, Qianqian Yang, Xinhuan Wang, Chuanzheng Wang, Shuo Wang, Liang Zhao, Yuanfu Hangzhou Dianzi Univ Sch Elect Informat Hangzhou Peoples R China Beijing Microelect Technol Inst Beijing Peoples R China

ISBN: (纸本)9781665450690

As semiconductor devices become smaller and smaller, device aging simulation plays an increasingly important role in the overall circuit design. In recent years, the research of device aging modeling has gradually become the focus of researchers. Most of the current aging modeling methods only consider the degradation of one parameter, resulting in inaccurate simulation of the model in actual testing. In response to this problem, this paper establishes an HCI(Hot Carrier Injection) aging model on NMOS devices, focusing on the simultaneous degradation of multiple parameters (drain current in saturation region (I-dsat) and threshold voltage (v(th)) in the process of extracting model parameters. simulation results show that this method can improve the fitting accuracy of aging model.

关键词： device aging modeling multi-dimensional device model parameter fitting

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simulation Methodology for Active Semiconductor Devices in MEMS 20

Simulation Methodology for Active Semiconductor Devices in M...

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20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Schwarz, Mike Senz, Volkmar Dannenberg, Arne Feiler, Wolfgang Heuck, Friedjof Friedrich, Thomas Sorger, Christian Franz, Jochen Robert Bosch GmbH Gerlingen Germany

ISBN: (纸本)9781538680407

Nowadays, the demand for a MEMS Development/design Kit (MDK) is even more in the focus than ever. In order to achieve a high quality and cost effectiveness in automotive and consumer applications, an advanced design flow for the MEMS (Micro Electro Mechanical Systems) element is required to fulfill these criteria. In this paper, a methodology and design flow is presented to ensure an integration of active semiconductor devices and components into micromechanical sensors. The methodology considers cross coupling effects and limitations of the electrical active device and mechanical MEMS. An example with mechanical constraints is presented and discussed and finally the results of the simulation methodology are compared with fabricated devices in terms of accuracy and capability of the design flow.

关键词： Micromechanical devices Semiconductor diodes Semiconductor process modeling Sensors Analytical models Temperature measurement

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Mismatch-aware Placement of Device Arrays using Genetic Optimization 15

Mismatch-aware Placement of Device Arrays using Genetic Opti...

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作者： Nashaat, Islam Mohammed, Inas Dessouky, Mohamed Said, Hazem Ain Shams Univ Cairo Egypt

ISBN: (纸本)9781538651537

This paper presents an automatic matched devices layout generation tool. An adapted form of genetic optimization is used to minimize the overall systematic mismatch due to oxide gradients and Shallow Trench Isolation (STI) effect. A new STI evaluation methodology is introduced based on simulation and foundry models. The tool is capable of generating a current mirror or capacitor array layout pattern with optimal systematic mismatch and STI mismatch.

关键词： Layout Automation Systematic Mismatch STI LDE Genetic Optimization Matching Current mirror Placement modeling

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simulation Platform for Analyzing Battery Parallelization 14

Simulation Platform for Analyzing Battery Parallelization

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13th conference on Ph.D. Research in microelectronics and Electronics (PRIME) / 14th International conference on Synthesis, modeling, Analysis and simulation Methods and Application to Circuit design (SMACD)

作者： Di Rienzo, R. Baronti, F. Roncella, R. Morello, R. Saletti, R. Univ Pisa Dip Ingn Informaz Pisa Italy

ISBN: (纸本)9781509050529

This paper discusses a simulation platform for predicting the behavior of a battery system comprising two batteries, which can be parallelized in a controllable way. The model of the battery, the load and the parallelization algorithm is developed and simulated in MATLAB (R) Simulink environment. The simulation platform and the proposed parallelization algorithm are validated in a real gardening application. The simulation results prove to be useful for further investigation into the benefits of battery parallelization in terms of reduced battery aging and improved energy efficiency.

关键词： Batteries State of charge Load modeling Mathematical model Integrated circuit modeling Switches Predictive models

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Verilog-A based Behavioral modeling of an FBMC Transmitter 16

Verilog-A based Behavioral Modeling of an FBMC Transmitter

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16th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 15th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Doell, Patrick Hanay, Oner Bayram, Erkan Negra, Renato Rhein Westfal TH Aachen Chair High Frequency Elect Aachen Germany

ISBN: (纸本)9781728112015

In this paper a Verilog-A based behavioral modelling of a filter-bank multicarrier (FBMC) transmitter with the focus on the RF-DAC cores is presented. Multiple switching signals within the transmitter yield to a tremendous degradation in simulation performance. Because of that, the simulation of the entire system at transistor-level is time consuming. The abstracted model leads to a reduction in simulation time of up to 70% with only half of the memory usage compared to the original model by still getting sufficient results. Furthermore, a performance friendly and simple technique is presented to generate signals with equidistantly spaced frequencies with additional abstraction level to generate jitter and deterministic phase noise. Verilog-A has been used to design the models in combination with Spectre simulator to verify the results.

关键词： Verilog-A Verification FBMC Behavior modeling HDL Digital-Analog Conversion Oscillators

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Response surface modeling for nonlinear packaging stresses

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JOURNAL OF ELECTRONIC PACKAGING 2003年第4期125卷 490-497页

作者： van Driel, WD Zhang, GQ Janssen, JHJ Ernst, LJ Philips Semicond ATO Innovat NL-6534 AE Nijmegen Netherlands Philips CFT NL-5600 MD Eindhoven Netherlands Delft Univ Technol NL-2600 GA Delft Netherlands

The present study focuses on the development of reliable response surface models (RSM's) for the major packaging processes of a typical electronic package. The major objective is to optimize the product/process designs against the possible failure mode of vertical die cracks. First, the finite element mode (FEM)-based physics of failure models are developed and the reliability of the predicted stress levels was verified by experiments. In the development of reliable thermo-mechanical simulation models, both the process (time and temperature) dependent material nonlinearity and geometric nonlinearity are taken into account. Afterwards, RSM's covering the whole specified geometric design spaces are constructed. Finally, these RSM's are used to predict, evaluate, optimize, and eventually qualify the. thermo-mechanical behavior of this electronic package against the actual design requirements prior to major physical prototyping and manufacturing investments.

关键词： Solders integrated circuit packaging Optimization response surface methodology cracks Packaging finite element analysis design Stress modeling Testing Response surface methodology Finite element model Temperature failure analysis integrated circuit reliability

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