检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

1,367 篇 会议
46 篇 期刊文献
6 册 图书

馆藏范围

1,419 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

615 篇 工学
- 387 篇 电气工程
- 246 篇 电子科学与技术（可...
- 221 篇 计算机科学与技术...
- 128 篇 材料科学与工程（可...
- 119 篇 软件工程
- 89 篇 机械工程
- 66 篇 动力工程及工程热...
- 59 篇 控制科学与工程
- 42 篇 化学工程与技术
- 35 篇 信息与通信工程
- 31 篇 仪器科学与技术
- 23 篇 力学（可授工学、理...
- 15 篇 冶金工程
- 15 篇 生物医学工程（可授...
- 10 篇 建筑学
- 9 篇 光学工程
- 9 篇 土木工程
- 8 篇 交通运输工程
- 8 篇 安全科学与工程
- 7 篇 生物工程
255 篇 理学
- 146 篇 物理学
- 116 篇 数学
- 45 篇 化学
- 22 篇 系统科学
- 10 篇 生物学
- 10 篇 统计学（可授理学、...
38 篇 管理学
- 37 篇 管理科学与工程(可...
8 篇 医学
- 7 篇 临床医学
- 6 篇 基础医学(可授医学...
- 5 篇 药学(可授医学、理...
4 篇 法学
4 篇 艺术学
2 篇 农学
1 篇 经济学
1 篇 教育学

主题

272 篇 computational mo...
230 篇 integrated circu...
190 篇 circuit simulati...
179 篇 microelectronics
126 篇 semiconductor de...
115 篇 analytical model...
107 篇 solid modeling
96 篇 mathematical mod...
65 篇 simulation
61 篇 silicon
58 篇 predictive model...
53 篇 hardware design ...
53 篇 micromechanical ...
50 篇 load modeling
50 篇 hardware
49 篇 cmos technology
47 篇 spice
45 篇 design automatio...
43 篇 logic gates
42 篇 finite element a...

机构

13 篇 institute of mic...
13 篇 institute of mic...
12 篇 institute of mic...
7 篇 institute of mic...
6 篇 department of mi...
6 篇 institute of mic...
6 篇 department of mi...
6 篇 school of softwa...
5 篇 school of microe...
5 篇 nxp semiconducto...
5 篇 national microel...
5 篇 school of microe...
5 篇 institute of mic...
5 篇 philips applied ...
5 篇 imec leuven
5 篇 institute of mic...
5 篇 amic angewandte ...
5 篇 agilent technol ...
5 篇 delft university...
4 篇 shanghai researc...

作者

10 篇 xiaowu zhang
10 篇 roca e.
9 篇 castro-lopez r.
9 篇 a. napieralski
8 篇 rodriguez r.
8 篇 nafria m.
7 篇 l.j. ernst
7 篇 g.q. zhang
7 篇 martin-martinez ...
7 篇 sven rzepka
7 篇 fernandez f. v.
7 篇 s. selberherr
7 篇 zhang gq
6 篇 andrzej napieral...
6 篇 m.k. iyer
6 篇 ru huang
6 篇 n. ranganathan
6 篇 k.m.b. jansen
5 篇 khaoula mbarek
5 篇 sami ghedira

语言

1,403 篇 英文
10 篇 中文
3 篇 德文
3 篇 其他

检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是491-500 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

A full chip scale numerical simulation method for thermal management of 3D IC

A full chip scale numerical simulation method for thermal ma...

引用

International conference on (ICEPT) Electronic Packaging Technology

作者： Ningyu Wang Yufeng Jin Yudan Pi Wei Wang School of Electronic and Computer Engineering Peking University Shenzhen China Institute of Microelectronics Peking University Beijing China

ISBN: (纸本)9781509013975

Thermal issue is becoming more and more serious when integrated circuits (IC) further explores along the road of More Moore with dramatic increments of integration degree and power density. Thermal management, including thermal design, modeling, and optimization, has been an important concern in the system-level design of 3D IC. Current thermal modeling for a system level 3D IC design usually relies on a simplified thermal resistance network, which requires trade-offs between the model complexity and the simulation accuracy. Comparing to traditional thermal resistance based model, finite element simulation can provide a more accurate simulation for the thermal management of 3D IC. However, a full chip scale numerical simulation is still lack as an unacceptable huge grid number is unavoidable to deal with the geometric size mismatch existed in a 3D IC. Moreover, current finite element method based numerical simulation tools have no direct supports for the thermal management of 3D IC, since the placement design usually consists a complex data structure from a 3D IC. A method to bridge the finite element method and the 3D IC placement is introduced in this work. The whole bridge process includes placement data structure extraction, 3D IC system model generation, structure, mesh, solver configuration, calculation, and post data analysis. A full chip scale numerical simulation was demonstrated based the present bridge method along with the recently reported equivalent thermal conductivity simplified model.

关键词： Three-dimensional displays Integrated circuit modeling Solid modeling Numerical models Computational modeling Optimization

来源：评论

学校读者我要写书评

暂无评论

Amplifier design approximations in submicron CMOS

Amplifier design approximations in submicron CMOS

引用

International conference on microelectronics, Computing and Communications (MicroCom)

作者： Ashis Kumar Mal Agnish Mal Department of ECE National Institute of Technology Durgapur INDIA Department of ECE Birla Institute of Technology Mesra INDIA

ISBN: (纸本)9781467366229

This paper demonstrates the design of analog circuits using simulated I/V data of a sample device (PMOS/NMOS), and estimation of transconductance (g m ) from this plot using approximation. Proposed design technique is based on the fact that the ratio of transconductance (g m ) is inversely proportional to the MOS gate-source voltage (V GS ). From the amplifier specifications, bias current and the load (or DC drop across the load) are generally estimated which in-turn is used to predict the device size. Proposed method is not only technology independent, it is also free from complex mathematical expressions associated with the device as it employs plots generated from simulators, Instead of analytical methods usually based on square law, which is unfit to capture sub-micron characteristics. When simulator is incorporated in the design process, analysis of the designed circuit, using the same simulator, is expected to match the desired performance closely. Using this simple approach, design time becomes shorter and a workable design can be made very quickly. An example amplifier circuit is designed using the proposed method, and simulation results are presented.

关键词： Mathematical model Transconductance CMOS integrated circuits Performance evaluation Semiconductor device modeling Impedance Logic gates

来源：评论

学校读者我要写书评

暂无评论

simulation and synthesis of networks-on-chip by using NoCSimp HDL library

Simulation and synthesis of networks-on-chip by using NoCSim...

引用

IEEE International conference on Electronics and Nanotechnology (ELNANO)

作者： A. Yu. Romanov A. D. Ivannikov I. I. Romanova National Research University Higher School of Economics Moscow Russian Federation The Institute for Design Problems in Microelectronics of Russian Academy of Sciences Moscow Zelenograd Russian Federation Computer Systems and Networks dept. of State Higher Educational Institution Kyiv Electromechanical College Kyiv Ukraine

ISBN: (纸本)9781509014323

This paper proposes an approach to the synthesis and modeling of networks-on-chip (NoCs) by using the NoCSimp library based on a simplified wormhole router with central buffer and without virtual channels. The analysis of the results of simulation and synthesis of NoCs with regular and quasi-optimal topologies with number of nodes 8 and 9 is given. It is shown that in the case where the number of NoC nodes is not a power of 2 the use of quasi-optimal topologies offers a significant advantage.

关键词： Topology Network topology Libraries Computational modeling Hardware design languages Bandwidth Ports (Computers)

来源：评论

学校读者我要写书评

暂无评论

Fatigue crack growth modeling in the metallization of power semiconductors under cyclic thermo-mechanical loading

Fatigue crack growth modeling in the metallization of power ...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Martin Springer Michael Nelhiebel Heinz E. Pettermann Vienna University of Technology Institute of Lightweight Design and Structural Biomechanics Austria KAI - Kompetenzzentrum Automobil- u. Industrieelektronik GmbH Villach Austria Infineon Technologies Austria AG Villach Austria

Power semiconductors may be subjected to short electric overload pulses during operation, which induce very high temperatures and temperature gradients in the multilayer chip structure. This can lead to material degradation in the ductile metallization and repetitive overload conditions can result in overheating and destruction of the device. A unified approach is presented predicting material degradation in terms of fatigue crack nucleation and fatigue crack propagation, to identify a tolerable number of electric overload pules during operation. Fatigue Indicators based on mechanical quantities are utilized to identify locations of material failure in the power metallization and material degradation is modeled. Repetitive loading leads to an evolving damage zone. The proposed approach is implemented within the framework of the Finite Element Method and exemplified at a simplified, generic metallization stack.

关键词： Fatigue Finite element analysis Load modeling Strain Degradation Metallization Loading

来源：评论

学校读者我要写书评

暂无评论

Voltage mode first order all pass filter design using differential difference current conveyor

Voltage mode first order all pass filter design using differ...

引用

International conference on microelectronics, Computing and Communications (MicroCom)

作者： Rupam Das Sajal. K. Paul Electronics &Communication Engineering Asansol Engineering College Asansol India Electronics Engineering Indian School of Mines Dhanbad Jharkhand India

ISBN: (纸本)9781467366229

This paper presents a voltage mode first order all pass filter using one differential difference current conveyor (DDCC) as active element and resistor and capacitor one each as passive elements. The proposed circuit realizes first-order all-pass functions without any component matching constraints. Hence phase shifted signal over whole range of 180° to -180° may be obtained simultaneously. A new sinusoidal oscillator circuit is designed with the DDCC based all pass filter. The proposed circuit performance is tested using PSPICE software simulation with the 0.5 μm MIETEC CMOS model parameters. Non-ideal analysis is also performed.

关键词： Oscillators Matched filters Filtering theory Semiconductor device modeling Transfer functions Transistors Resistors

来源：评论

学校读者我要写书评

暂无评论

Coupled thermo-fluidic simulation for design space exploration of microchannels in liquid-cooled 3D ICs

Coupled thermo-fluidic simulation for design space explorati...

引用

International conference on Mixed design of Integrated Circuits and Systems (MIXDES)

作者： Piotr Zając Cezary Maj Melvin Galicia Andrzej Napieralski Department of Microelectronics and Computer Science Lodz University of Technology Lodz Poland

Integrated liquid cooling is a promising idea for future 3D integrated circuits and potentially a scalable solution for ever-increasing power dissipation. In this paper, we analyze the efficiency of heat removal from a 3D stacked chip with microchannels. We build a detailed chip model and perform a coupled thermo-fluidic finite element method simulation for various microchannel designs. We explore the design space and point out the correlations between various chip and cooling parameters. In particular, we show that with ten microchannels of size 500 μm × 70 μm it is possible to remove 100 W of heat from a two-tier 3D chip while maintaining the temperature below 90°C and the pressure drop below 50 kPa.

关键词： Microchannels Three-dimensional displays Thermal conductivity Cooling Conductivity Metals Integrated circuit modeling

来源：评论

学校读者我要写书评

暂无评论

Reliability model of LED package regarding the fatigue behavior of gold wires

Reliability model of LED package regarding the fatigue behav...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： P. Altieri-Weimar W. Yuan E. S. Annibale S. Schoemaker D. Amberger M. Göken H.W. Höppel Osram Opto Semiconductors GmbH Regensburg Germany Materials Science & Engineering Institute I Erlangen Germany

In this study the mechanical properties and fatigue behavior of ultra-fine gold wires are investigated by experimental tension fatigue tests and finite element (FE) simulation. Hardening behavior, yield criterion and yield surface of gold wire are determined by tensile tests and force controlled tension fatigue tests. The relationship between plastic strain and loading stress amplitude is determined and the cyclic strain hardening coefficient is calculated. The fatigue data are used to develop a predictive crack model for gold wires bonded in LED packages, based on finite element (FE) stress simulation at temperature cycles (TC). The computer model of the gold wire in the LED package used in the simulation is reconstructed from computer tomography (CT) analysis. The predictive crack model is calibrated using on-line monitoring of LED wire cracks during TC tests. Finally, using the reliability model, the impact of LED package design and material on the wire lifetime is investigated.

关键词： Wires Stress Gold Strain Light emitting diodes Computational modeling Fatigue

来源：评论

学校读者我要写书评

暂无评论

Aerospace-electronics reliability-assurance (AERA): Three-step prognostics-and-health-monitoring (PHM) modeling approach

Aerospace-electronics reliability-assurance (AERA): Three-st...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： E. Suhir Ariel University Ariel Israel ERS Co. Los Altos CA USA Technical University Vienna Austria Portland State University Portland OR USA

When encountering a particular reliability problem at the design, fabrication, testing, or an operation stage of an electronics product's life, and considering the use of predictive modeling to assess the seriousness and possible consequences of its detected malfunction and likely failure, one has to choose whether a statistical, or a physics-of-failure-based, or a suitable combination of these two major predictive modeling tools should be employed to address the problem and to decide on how to proceed. An effective aerospace-electronics reliability-assurance (AERA) approach is suggested as a possible way to go in such a situation. In this approach the classical statistical Bayes formula (BF) is used at the first step as a technical diagnostics (TD) tool, with an objective to identify, on the probabilistic basis, the faulty (malfunctioning) device(s) from the obtained prognostics-and-health-monitoring (PHM) signals ("symptoms of faults"). The physics-of-failure-based Boltzmann-Arrhenius-Zhurkov's (BAZ) equation, a powerful, flexible and physically meaningful modeling tool suggested about five years ago can be employed at the second step with an objective is to assess the remaining useful life (RUL) of the malfunctioning device(s). If the predicted RUL is still long enough, no action might be needed, but if not, a corrective (restoration) action becomes necessary. It is shown in this connection how short/long the repair time should/could be, so that the availability of the equipment (the probability that it is sound and available to the user when needed) does not fall below the allowable level. In any event, after the first two steps of the AERA modeling effort are carried out, and the assessed probability of the product's continuing operation is found to be satisfactory, the device is put back into operation (testing). If failure nonetheless occurs, the third AERA step should be undertaken to update reliability. A well-known four-parametric statistical beta-distribu

关键词： Mathematical model Stress Probabilistic logic Reliability engineering Predictive models Load modeling

来源：评论

学校读者我要写书评

暂无评论

Experimental design for tensile tests on PCB copper traces for board level packaging

Experimental design for tensile tests on PCB copper traces f...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： S. Wiese D. Bruch M. Elasmi F. Kraemer J. Ahmar Chair of Microintegration and Reliability Saarland University Saarbrucken Germany

ISBN: (纸本)9781509021079

This paper presents an approach to adequately design a test setup and specimen in order to perform tensile tests on PCB copper traces for board level packaging. The difficulty to conduct tensile tests on thin pcb copper traces is caused by the requirements of representative specimens. Most of the failure sites on copper interconnect structures in electronic assemblies are characterised by a high aspect ratio between the thickness and width. While the width is on the range of some hundred micrometres to a few millimetres, typical thicknesses are between 1 to 100 micrometres. Therefore specimens that adequately represent the properties of pcb copper are difficult to test in a standard mechanical test setup, which is usually made for compact specimens. The experimental design for determining the deformation behaviour of the PCB copper trace material encompasses two aspects: (1) experimental setup design and (2) specimen design. The two aspects contribute to the accuracy of the later material model for the use in FEM simulation. In order to conduct tests on thin copper film specimens, a test setup was designed, which is characterized by higher compliance of its frame. This way the test setup is able to compensate for misaligned angles of the sample to the load axis of the setup. An optical measurement is used in order provide accurate strain measurements on the sample. The role of specimen design of thin copper foil specimens is crucial for the accuracy of the test. FEM simulations of stress distributions have been carried out on classical dog bone specimens and on stripe specimens. The paper will discuss the inhomogeneous stress distributions of the gauge length of the stripe specimen compared to the dog bone specimen. Another aspect is the sample preparation. The paper will report the difficulties that exist, when the specimen is prepared by milling a copper sheet. The paper will discuss the connection between test setup design and specimen design with respect to the

关键词： Stress Copper Bones Strain Optical interferometry Load modeling Finite element analysis

来源：评论

学校读者我要写书评

暂无评论

Nonlinear modelling of automatic gain control loops considering loop dynamics and stability

Nonlinear modelling of automatic gain control loops consider...

引用

Ph.D. Research in microelectronics and Electronics (PRIME)

作者： Mohammed El-Shennawy Niko Joram Frank Ellinger Chair for Circuit Design and Network Theory Technische Universität Dresden Dresden Germany

ISBN: (纸本)9781509004942

This work presents modelling aspects of automatic gain control (AGC) loops based on linear-in-dB variable gain amplifiers (VGAs). In these loops, the VGA control voltage is also an excellent received signal strength indicator (RSSI). The VGA gain is however nonlinearly related to the control voltage. Moreover, VGAs and detectors undergo nonlinear compression under high input amplitudes during settling transients. In this work, these effects are captured by a nonlinear model based on simple and readily available components from the “analogLib” and “functional” libraries in CADENCE design environment making it very easy and fast to build and simulate. The model is capable of verifying the AGC loop stability and capturing the loop dynamics with high accuracy compared to time consuming circuit level simulations. This provides insights into system level parameters such as AGC loop bandwidth, phase margin, settling time as well as estimating the AGC range and RSSI voltage vs. input power. Measurement results from a fabricated AGC prototype are in good agreement with simulation and modelling results thus validating the proposed modelling approach.

关键词： Gain control Gain Automatic generation control Detectors Integrated circuit modeling Stability analysis Mathematical model

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共142页 << < 46 47 48 49 50 51 52 53 54 55 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：