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MICROCHANNEL design STUDY FOR 3D microelectronics COOLING USING A HYBRID ANALYTICAL AND FINITE ELEMENT METHOD 13

13TH ASME International conference on Nanochannels, Microchannels, and Minichannels

作者： Collin, L. -M. Fiori, V. Coudrain, P. Lhostis, S. L. Cheramy, S. Colonna, J-P Mathieu, B. Souifi, A. Frechette, L. G. STMicroelectronics Crolles Isere France CEA Grenoble LETI F-38054 Grenoble Isere France INSA Lyon Villeurbanne Rhone France Univ Sherbrooke Sherbrooke PQ J1K 2R1 Canada

ISBN: (纸本)9780791856871

For microelectronics cooling, microchannels are a potential solution to ensure reliability without sacrificing compactness, as they require relatively small space to remove high heat fluxes compared to air cooling. However, designing microchannels is a complex task where simulation models become a forefront tool to investigate and propose new solutions to increase the chip thermal performances with minimal impact on other aspects. This work evaluates numerically the impact of microchannel cooling in a standalone chip and a 3D assembly of two stacked chips with localized heat sources. To do so, a modeling approach was developed to combine finite element modeling of conduction in the chip using commercial software with analytical relations to capture the heat transfer and fluid flow in the microchannels. This approach leverages the multiphysics and post-processing capabilities of commercial software, but avoids the extensive discretization that would normally be required in microchannels with full finite element modeling. The study shows that increasing the flow rate is not as beneficial as increasing the number of channels (with constant total cross-section area). The effect of heat spreading was also found to be critical, favoring thicker dies. When switching to 3D chip configuration, the interdie underfill layer significantly increases the total thermal resistance and must be considered for thermal design. This effect can be significantly alleviated by increasing the interdie thermal conductivity through adding copper micropillars.

关键词： Cooling Finite element methods design Microelectronic devices Microchannels

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Predictive physical simulation of III/V quantum-well MISFETs for logic applications 45

Predictive physical simulation of III/V quantum-well MISFETs...

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45th European Solid-State Device Research conference, ESSDERC 2015

作者： Stanojevic, Z. Karner, M. Aichhorn, M. Mitterbauer, F. Eyert, V. Kernstock, C.C. Kosina, H. Global TCAD Solutions GmbH. Landhausgasse 4/la Vienna1010 Austria Institute for Microelectronics TU Wien GuBhausstraBe 27-29/E360 Vienna1040 Austria Materials Design S.a.r.L 18 rue de Saisset Montrouge92120 France

ISBN: (纸本)9781467371339

We present a simulation modeling chain for nano-scaled III/V quantum-well MISFETs. Our methods are based on physical rather than empirical modeling, which allows to obtain predictive simulation results with very few fitting parameters. We use a recent InGaAs-based technology from Intel [1] to validate our simulation results which show excellent agreement with measured capacitance and conductance curves. We further evaluate the properties of a 60 nm long InGaAs quantum-well transistor, finding a sub-threshold slope of 73.5 mV/dec and a DIBL of 103.8 mV/V. A fast numerical computational framework ensures high modeling flexibility;at the same time execution times are kept short making our approach an ideal replacement for empirical device modeling which is still pervasive in TCAD. © 2015 IEEE.

关键词： Semiconducting indium gallium arsenide

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Efficient modeling of printed circuit boards structures for dynamic simulations 16

Efficient modeling of printed circuit boards structures for ...

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16th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE)

作者： Zukowski, Elena Kimpel, Thomas Kraetschmer, Daniel Roessle, Andreas Engn Design ECUs Transmiss Sensors & Battery Product Optimizat AE EDT D-72703 Reutlingen Germany

ISBN: (纸本)9781479999507

Printed circuit boards (PCB) are complex geometrical and functional systems that may be exposed to a combination of external and internal loads. In order to evaluate the dynamic behaviour of PCBs in early stages of the development process, modal finite element (FE) simulations are used. Realistic results for a wide frequency range can only be achieved if all the geometrical features, such as PCB assembly, copper layer thicknesses, prepreg structures, etc. with the appropriate material properties are taken into account. To model a printed circuit board including all details such as glass fiber-epoxy compounds and copper traces is possible, but is found to be very time-consuming. A method to model PCBs was developed taking into account the corresponding functional board layout and assembly. In order to ensure an appropriate representation of the layout-dependent local material properties for FE applications without considering the geometry in full detail, a simplified approach based on general composite theory, domain-specific mixture rules and generalized laminate theory was developed. The analytically calculated material property distributions of the PCB such as local stiffness values and densities can be transferred to the meshed geometry. To verify the developed method by comparison with experimentally achieved results, operational modal analysis (OMA) for a frequency up to 25 kHz was carried out by piezo patch transducer. It can be shown that both simulated mode shapes and natural frequencies of the non-assembled board show a very good agreement with the experimental results.

关键词： Printed Circuit Board Device Component Polychlorinated Biphenyls Material properties PROCESS DEVELOPMENT Dynamic simulation Circuit Board Device Component wide frequency range modal response Natural frequencies GTF2E1 gene Iron

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modeling of wet-chemical porosification processes on LTCC for high frequency electromagnetic field simulation

Modeling of wet-chemical porosification processes on LTCC fo...

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MikroSystemTechnik Kongress 2015: MEMS, Mikroelektronik, Systeme - MikroSystemTechnik conference 2015: MEMS, microelectronics, Systems

作者： Talai, Armin Steinhäußer, Frank Bittner, Achim Schmid, Ulrich Weigel, Robert Koelpin, Alexander Friedrich-Alexander-Universität Lehrstuhl für Technische Elektronik Erlangen91058 Germany Technische Universität Wien Institut für Sensor und Aktuatorsysteme Wien1040 Austria

ISBN: (纸本)9783800741007

A novel porosification process on Low Temperature Cofired Ceramics (LTCC) offers the possibility of a local reduction of the relative permittivity Εr. This local reduction of Εr is required for a direct integration of patch antennas on LTCC, such as for 77 GHz radar frontends, in order to meet the demands on the focusing capability and radiation efficiency of today's millimeter-wave modules. The LTCCs DuPont DP951 and Heraeus CT702 represent suitable materials, which satisfy both the technical requirements in terms of high-frequency dielectric losses and the chemical requirements in terms of suitability for porosification. In order to allow the simulation and design of RF circuits on porous LTCC, suitable 3D models are presented in this paper. Starting from a realistic 3D model of the porous LTCC, the simulation data concerning the permittivity gradient within the porous substrate can be exported into a simplified 3D layer-model. The presented layer model is suitable to allow circuit design on porous LTCC with today's computing hardware within CST Microwave Studio. © Technische Universität *** right reserved.

关键词： Dielectric losses

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Smart Systems Integration 2015 - 9th International conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015

Smart Systems Integration 2015 - 9th International Conferenc...

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Smart Systems Integration 2015 - 9th International conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015

ISBN: (纸本)9783863592967

The proceedings contain 76 papers. The topics discussed include: rapid prototyping of 3D electrically conducting structures;high performance silicon membrane etching in volume production;trends in the manufacturing of miniaturized microelectronics circuits for active implantable medical devices;diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding;mechanical stress induced in si sensors during bonding and packaging processes;model-based design of MEMS far infrared thermal imagers;high level modeling and simulation of a sensor system for trace detection of different molecules in the air;self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects;and development of solder paste jetting processes for advanced packaging.

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Modelling and simulation of parallel triangular triple quantum dots (TTQD) by using SIMON 2.0

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AIP conference Proceedings 2016年第1期1725卷

作者： Maulana Yusuf Fathany Syifaul Fuada Braham Lawas Lawu Muhammad Amin Sulthoni Microelectronics Research Group –School of Electrical Engineering and Informatics Institut Teknologi Bandung Jalan Ganesha No.10 Bandung 40132 Indonesia

This research presents analysis of modeling on Parallel Triple Quantum Dots (TQD) by using SIMON (simulation Of Nano-structures). Single Electron Transistor (SET) is used as the basic concept of modeling. We design the structure of Parallel TQD by metal material with triangular geometry model, it is called by Triangular Triple Quantum Dots (TTQD). We simulate it with several scenarios using different parameters; such as different value of capacitance, various gate voltage, and different thermal condition.

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Structural coupling of two-nonlinear structures 33rd

Structural coupling of two-nonlinear structures

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33rd IMAC conference and Exposition on Balancing simulation and Testing, 2015

作者： Tepe, Cagri Cigeroglu, Ender Middle East Technical University Ankara06800 Turkey Microelectronics Guidance and Electro-Optics Division ASELSAN Inc Ankara06750 Turkey

ISBN: (纸本)9783319152080

In mechanical design, modeling and analysis of a complex structure can be simplified with dividing the structure into substructures;therefore, any change in the structure can be addressed easily which is referred as "structural coupling". Utilization of proper coupling techniques, it is possible to understand the behavior of the whole structure by considering the behavior of its substructures. For linear structures, coupling is a common technique;however, in most of the engineering structures, nonlinearities are also encountered;therefore, it is required to extend linear coupling methods to nonlinear systems. Although, there exists studies on nonlinear coupling, existing methods are limited to coupling of structures where one substructure is linear and the other is nonlinear or two linear substructures coupled with a nonlinear element. In this paper, a structural coupling method is proposed to couple two-nonlinear substructures. Similar to linear coupling methods, the proposed method considers the compatibility of internal forces at the connection degrees of freedom in addition to displacements. Since, the substructures are nonlinear, the resulting system of nonlinear differential equations are converted into a set of nonlinear algebraic equations by using Describing Function Method, which are solved by using Newton’s method with arc-length continuation. © The Society for Experimental Mechanics, Inc. 2015.

关键词： Degrees of freedom (mechanics)

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modeling and design of 700W digital average current mode controlled multiphase bidirectional DC-DC converter

Modeling and design of 700W digital average current mode con...

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Asia Pacific conference on Postgraduate Research in microelectronics & Electronics (PrimeAsia)

作者： Suryanarayana K H N Nagaraja NMAM Institute of Technology Nitte Karnataka IN Noble Group of Institutions Junagadh India

Mathematical modeling and analysis of converters is an essential and critical phase in the design stage of the system. High current switching and inductor ripple causes electromagnetic interference in the system. Paralleling of the converters and smart switching control will reduce the stress on the converter switches. Substantial ripple reduction in the source and load current can be achieved by optimally choosing the transfer ratio. Multiphase technique increases the ripple frequency resulting in lesser filter requirements. A two phase bidirectional converter operating in continuous current conduction mode is modeled and digital average current mode control technique is proposed to regulate the output voltage. A 700 watt system is designed and the simulation and experimental results are presented.

关键词： Mathematical model Switches Batteries Analytical models Inductors Equivalent circuits Asia

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SIPredict: Efficient post-layout waveform prediction via System Identification

SIPredict: Efficient post-layout waveform prediction via Sys...

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Asia and South Pacific design Automation conference

作者： Qicheng Huang Xiao Li Fan Yang Xuan Zeng Xin Li Microelectronics Dept. Fudan University Shanghai P. R. China Electrical and Computer Engineering Carnegie Mellon University Pittsburgh PA U.S.A.

ISBN: (纸本)9781479977932

In this paper, we propose a post-layout waveform prediction method by System Identification (SI) based on the fact that the waveforms of pre-layout and post-layout are always correlated. Mathematical models are built to describe the relationships between the pre-layout and post-layout simulation results via SI techniques. The model parameters are calibrated by using the simulation results of the first few data points of pre-layout and post-layout stages. By taking the corresponding pre-layout simulation results as inputs of the calibrated models, the rest post-layout waveforms can thus be predicted as the output of the models. Several examples demonstrate the efficiency of the prediction, which helps the designers have a quick view of the post-layout waveforms in the design process.

关键词： Integrated circuit modeling Data models Predictive models Calibration Computational modeling RLC circuits simulation

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Numerical solution of 1-D DPL heat transfer equation

Numerical solution of 1-D DPL heat transfer equation

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International conference on Mixed design of Integrated Circuits and Systems (MIXDES)

作者： Tomasz Raszkowski Mariusz Zubert Marcin Janicki Andrzej Napieralski Department of Microelectronics and Computer Science Lodz University of Technology Lodz Poland

This paper presents the Finite Difference Method solution of Dual-Phase-Lag heat transfer model appropriate for a thin one-dimensional problems with a heat flux heating on the one side and a fixed reference temperatur... 详细信息

关键词： Mathematical model Heat transfer Heating Finite difference methods Computational modeling Integrated circuit modeling Convergence

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