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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是611-620 订阅

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Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis

Cu pattern density impacts on 2.5D TSI warpage using experim...

引用

Electronic Components and Technology conference (ECTC)

作者： C. T. Yeh C. Y. Wu C. F. Lin K. M. Chen M. J. Lin Y. C. Lin C. L. Kuo United Microelectronics Corporation Inc. Taiwan R.O.C.

Through Silicon Interposer (TSI) needs to fulfill multi-die stacking in one packaging which can bring high integration density, short interconnection length and small size for next generation devices. Die stacking is a key process in the TSI manufacturing flow, and within that process, die warpage is of central concern. This is because the large warpage of the Si-mterposer induces poor joining of u-bump interconnection, lithograph missing and die breakage during the assembly process. According to our experience, the Cu metal density of redistribution layer (RDL) significantly effects on TSI warpage. [2] The work proposes to design four different Cu metal densities, namely code A (10~25%), B (25~40%), C (40~55%) and D (55~70%) and combine the different metal density to investigate the relationship between Cu metal pattern density and TSI warpage under four different TSI size. Each unit of Cu metal density area is 12 × 12 mm 2 . The TSI size is ranging from unit 1 × 1 (12 × 12 mm 2 ), 1 × 2 (12 × 24 mm 2 ), 2 × 2 (24 × 24 mm 2 ) and 2 × 3 (24 × 36 mm 2 ). In this work, the TSI warpage modeling methodology has been developed and carried out to find the correlation between pattern density and warpage behavior using the finite element method (FEM). A simplified pattern-inclusion model has been constructed to obtain its warpage response under a thermal loading. Furthermore, the equivalent model has been established to obtain the effective mechanical properties of the equivalent layer (i.e., the composite layer of Cu traces and IMD) through adapting the warpage results to correctly match the simplified pattern-inclusion model. Therefore, the TSI warpage can be calculated during the reflow process after acquiring the effective mechanical properties of different Cu pattern densities. The simulation warpage variation of 1 × 1 (12 × 12 mm 2 ) TSI die size for code A, B, C and D are 8 μm, 19 μm, 32 μm, and 47 μm, respectively. The simulation results indicate that large TSI with

关键词： Metals Semiconductor device modeling Adaptation models Load modeling Finite element analysis Density measurement Temperature measurement

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Wafer test probe burn modeling and characterization

Wafer test probe burn modeling and characterization

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14th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Zafer, Baha Vishkasougheh, Mehdi H. Tunaboylu, Bahadir Istanbul Univ Dept Mech Engn Istanbul Turkey

ISBN: (纸本)9781467361392;9781467361385

This study investigates the wafer probe temperature distribution along a probe body in order to model probe burn phenomenon by using computational mechanics techniques. The mite volume software is used to study the effects of different materials and different geometrical factors on the temperature along a special design vertical/spring and cantilever probe. The computation shows higher temperatures towards the probe tip region as a result of Joule heating. The probe burn is also observed at the tip region of spring and cantilever probes in wafer testing. This is believed to be due to very low heat dissipation rates resulting from very small sizes compared to the probe body.

关键词： Probes Wafer Dosage Form CANTILEVER Wafers Burns

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Modelling of reliability by highly accelerated characterization method for solid state lighting LED boards

Modelling of reliability by highly accelerated characterizat...

引用

2013 5th International conference on Computational Intelligence, Modelling and simulation, CIMSim 2013

作者： Jakovenko, Jiri Formanek, Jan Faculty of Electrical Eng. Dpt. of Microelectronics Czech Technical University in Prague Technicka 2 166 27 Praha 6 Czech Republic

ISBN: (纸本)9780769551555

Main goal of the work presented in this paper is modeling of reliability and development of an innovative fast accelerated LED board validation method based on mechanical cycling which may replace currently used thermal cycling test. The paper discusses the design of new LED board 3-D models for reliability simulation. Reliability calculation is based on thermal or mechanical cycling using constructive equation for creep modeling and FEM thermo-mechanical elastic-plastic simulation. The simulation results were verified on newly developed testing facilities. © 2013 IEEE.

关键词： Reliability

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modeling and simulation on Temperature Control System for Hot Pressure Welding

Modeling and Simulation on Temperature Control System for Ho...

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4th International conference on Manufacturing Science and Engineering (ICMSE 2013)

作者： Xie, Bing Hu, Fang Chen, Shimin Wuhan Univ Technol Sch Mat Sci & Engn Wuhan 430070 Peoples R China

ISBN: (纸本)9783037856925

Hot pressure welding (HPW) is one of the inner lead bonding process which is widely used in microelectronics manufacturing. This paper presents a practical digital temperature controller for HPW. Based on the step response, an identification method is developed to obtain a nonlinear time-delay model for heating-up control design. The input-output linearization problem is solved by means of second-order Pade approximation and static inverse transform, and an optimal controller is obtained for the welding machine. The experimental equipment on the temperature control is designed based on LabVIEW and data acquisition card. simulation and experimental results show that the dynamic performance, steady stage error and overshoot satisfy the designed requirements.

关键词： hot pressure welding temperature control model identification nonlinear transform LabVIEW

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Proceedings - 2013 IEEE Asia Pacific conference on Postgraduate Research in microelectronics and Electronics, PrimeAsia 2013

Proceedings - 2013 IEEE Asia Pacific Conference on Postgradu...

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2013 5th IEEE Asia Pacific conference on Postgraduate Research in microelectronics and Electronics, PrimeAsia 2013

ISBN: (纸本)9781479927500

The proceedings contain 55 papers. The topics discussed include: power efficient reconfigurable charge pump for micro scale energy harvesting;analysis of induction generators and advanced power electronic converters for wind energy conversion technology;modeling and simulation of 8/6 pole switched reluctance motor with closed loop speed control;an efficient shielding effectiveness analysis of rectangular box perforated with numerous apertures by transmission line model;robust, ultra fast data sensing technique for low power asymmetrical SRAM with self-shut-off feature;optimal positioning of superconducting fault current limiter in smart grid applications;an image representation scheme by hybrid compressive sensing;effect of particles and contaminants on the static response of a rectangular MEMS diaphragm due to adverse clean room environment - simulation studies;and design of programmable op-amps with minimized DC variations at output.

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Internet-based electrical engineering lab integrates real and virtual experiments

Internet-based electrical engineering lab integrates real an...

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8th International conference on Computer Science and Education, ICCSE 2013

作者： Zhang, Huan Zhu, Shanan College of Electrical Engineering Zhejiang University Hangzhou 310027 China

ISBN: (纸本)9781467344623

This paper describes the application of an internet-based electrical engineering lab (iEELab) integrated with both real and virtual experiments. The real experiments are based on authentic physical devices, while the virtual ones based on simulation models using Modelica for unified modeling. The unique lab offers combination of real and virtual experiments, which has built a bridge between theoretical lessons and laboratory classes. The productive lab provides distance education students with six courses in electrical engineering and automation, including circuit theory, analog electronic technique, digital electronic technique, microelectronics, DSP and MCU. The instructive lab enables users to design and check their own circuit diagram. Also users can get real physical experiment results and virtual simulation results simultaneously, so they can make a clear parallel between the two results from different backstage calculation module. The whole system has good expansibility and new experiment modules can be flexibly added. © 2013 IEEE.

关键词： microelectronics

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Novel Reliability Assessment Concept based on an accelerated de-rated Strength Approach

Novel Reliability Assessment Concept based on an accelerated...

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14th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Veninga, E. P. Kregting, R. van der Waal, A. Gielen, A. W. J. TNO Tech Sci Mat Integrated Prod NL-5600 HE Eindhoven Netherlands

ISBN: (纸本)9781467361392;9781467361385

The introduction of new materials or technologies can have an enormous impact on the Time to Market (TTM) of new products. Preferably, the performance of new materials or technologies is known before these are designed into a product. This paper presents a reliability assessment approach which has been developed with the aim to reduce the so called Time to Technology (TTT). The method which is based on an accelerated de-rated strength approach has been expanded to a concept which could also include health monitoring and prognostics during lifetime. In this part of the work a combination of modelling and statistical techniques was used to explore the feasibility and potential of the concept. Ball Grid Array (BGA) designs were used as a vehicle with solder fatigue as the selected failure mechanism. Finite Element Modelling (FEM) together with design of Experiments (DoE) revealed that the (package) substrate thickness, stand-off, (package) substrate size and the final solder ball diameter are the statistical significant factors with respect to fatigue life of SnAgCu BGA balls. Simplified linear models obtained from regression analyses were used to design de-rated strength variants and estimate test times. simulations using a strain based lifetime model of Engelmaier together with a Monte Carlo method were used to generate lifetime distributions based on induced variations. A statistical analysis showed a significant difference in lifetime performance between the simulated de-rated strength designs.

关键词： Advanced materials Ball grid arrays reliability evaluation Monte Carlo technique lifetime performance SLITRK1 wt Allele statistical techniques New products linear models modeling simulating regression analysis

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Thermo-Mechanical Modelling and design of SiGe-based Thermo-Electric Modules for High Temperature Applications

Thermo-Mechanical Modelling and Design of SiGe-based Thermo-...

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14th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Edwards, Michael Brinkfeldt, Klas Swerea IVF AB SE-43153 Molndal Sweden

ISBN: (纸本)9781467361392;9781467361385

Thermal electric modules (TEMs) utilise the Seebeck effect that occurs in thermally-insulating semiconductors to generate electricity from a sufficient thermal gradient. This has specific applications in the automotive industry where TEMs can be used as energy harvesters in vehicle engines, exhaust systems and large scale industrial applications, leading to lower greenhouse emissions and fuel consumption [1]. In this work, the proposed thermoelectric (TE) material for the TEM is nanostructured SiGe, designed to enhance TE performance. The TEM needs to ultimately be able to operate from similar to 40 degrees C on the cold side of the device up to a maximum of at least 650 degrees C on the hot side. Using the thermo-mechanical models developed, thermo-mechanical loads have been modelled. The modelling results have then been used to select the packaging materials to ensure that the thermo-mechanical stresses on the TEM are manageable. The thermomechanical simulations were used to determine the best combination materials used for packaging and found that using WI AIN/W substrates on both the hot side and cold side of the module produces a maximum stress of similar to 130 MPa when 650 degrees C is applied to the hot side and 45 degrees C is applied to the cold side, which is below the AIN flexural stress of 600 MPa [2]. This indicates that it may be possible to produce a high temperature TEM that does not crack at the first instance when a large thermal gradient is applied.

关键词： Transmission electron microscopy thermo-mechanical High temperature applications MECHANICAL MODEL geophysical surveys Seebeck effect temperature gradients maximum stress greenhouse emissions modeling

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Bluetooth Transceiver modeling Using SystemC-AMS

Bluetooth Transceiver Modeling Using SystemC-AMS

引用

conference on Ph.D. Research in microelectronics and Electronics

作者： Fangyan Li Rémi Butaud Eric Dekneuvel Gilles Jacquemod Biomedical Implants Project Team (EPIB) Université de Nice Sophia Antipolis France RivieraWaves Sophia Antipolis France

ISBN: (纸本)9781467345798

This paper presents the high-level modeling and simulation of a GFSK RF transceiver for a Bluetooth Low Energy (BLE) system. This model, written in SystemC-AMS (SCAMS) permits a simple integration within the existing system digital environment written in SystemC-TLM, which enables a global system simulation to obtain the system performance (e.g. Bit-Error-Rate (BER) or Packet-Error-Rate (PER)) related to the power and energy consumption.

关键词： BT SystemC-AMS RF system design

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design and implementation of Direct Torque Control of induction machine on FPGA

Design and implementation of Direct Torque Control of induct...

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International conference on modeling, simulation and Applied Optimization (ICMSAO)

作者： Soufien Gdaim Abdellatif Mtibaa Mohamed Faouzi Mimouni Laboratory of Electronics and Microelectronics of the FSM National Engineering School of Monastir Monastir Tunisia Research Unit | Réseaux et Machines Electriques| National Engineering School of Monastir Monastir Tunisia

ISBN: (纸本)9781467358125

This work, presents a design method of Direct Torque Control (DTC) of induction machine. Then a hardware description based on VHDL hardware description language of the design is presented and discussed. The techniques of parallel architecture, direct computation and modular architecture are adopted for the design of the controller. The Direct Torque Control is designed using Xilinx ISE software tool in addition to a Modelsim 6.5 software tool which is used for simulation purposes. The same algorithm is designed and simulated using MATLAB software tool to make a comparison with the proposed design on FPGA.

关键词： Field programmable gate arrays Mathematical model Stators MATLAB Torque Torque control Computer architecture

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