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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是621-630 订阅

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Robust conservative parallel HDL simulation on multi-core CPUs

Robust conservative parallel HDL simulation on multi-core CP...

引用

International conference on High Performance Computing & simulation (HPCS)

作者： Lingfeng Wang Hong Chen Yangdong Steve Deng Institute of Microelectronics Tsinghua University Beijing China

Hardware description language (HDL) simulation is the fundamental means of IC verification. The complexity of modern VLSI is constantly posing serious challenges to HDL simulators. We developed a parallel HDL simulation framework in which Verilog HDL is translated into a multithreaded program for parallel execution on an ×86 multi-core processor by following a conservative parallel simulation protocol. We identified two essential problems, deterministic initialization and concurrent memory simulation, which are critical to robust logic simulation. Efficient solutions based on theoretic analysis are proposed to address the problems. Experimental results prove the effectiveness of our simulation framework.

关键词： Hardware design languages Integrated circuit modeling Algorithm design and analysis Computational modeling System recovery Protocols

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Wafer test probe burn modeling and characterization

Wafer test probe burn modeling and characterization

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Baha Zafer Mehdi H. Vishkasougheh Bahadır Tunaboylu Department of Mechanical Engineering İstanbul University Istanbul Turkey Department of Industrial Engineering İstanbul Şehir University Istanbul Turkey

This study investigates the wafer probe temperature distribution along a probe body in order to model probe burn phenomenon by using computational mechanics techniques. The finite volume software is used to study the effects of different materials and different geometrical factors on the temperature along a special design vertical/spring and cantilever probe. The computation shows higher temperatures towards the probe tip region as a result of Joule heating. The probe burn is also observed at the tip region of spring and cantilever probes in wafer testing. This is believed to be due to very low heat dissipation rates resulting from very small sizes compared to the probe body.

关键词： Probes Semiconductor device modeling Springs Semiconductor device measurement Abstracts Needles Artificial intelligence

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design, analysis, and modelling of a MEMS capacitive microphone for integration into CMOS circuits

Design, analysis, and modelling of a MEMS capacitive microph...

引用

Asia Pacific conference on Postgraduate Research in microelectronics & Electronics (PrimeAsia)

作者： Javad Ahmadnejad Bahram Azizollah Ganji Arash Nemati Electrical & Computer Engineering Department Babol Noshirvani University of Technology Babol Iran

A MEMS capacitive microphone with high mechanical sensitivity is presented. The microphone has a diaphragm thickness of 1 μm, 0.5 × 0.5 mm 2 dimension, and an air gap of 1.0 μm. Using the results from analysis and simulation, important features of MEMS capacitive microphone such as pull-in voltage, sensitivity and resonance frequency are respectively obtained as 3.8v, -43dbv/Pa, and 74 kHz. A model for this MEMS capacitive microphone is provided by using the relationship between capacitance of microphone and exerted pressure of acoustic wave. To study the accuracy of model, it is simulated in an RC circuit. The results from the simulations show that the proposed model has similar functions as a variable capacitor structure. simulations show that voltage signal in steady state operates according to exerted pressure and has swing around the bias point of microphone (2.3 V).

关键词： Microphones Micromechanical devices Sensitivity Integrated circuit modeling Capacitance Resonant frequency Semiconductor device modeling

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Distance computation using axis aligned bounding box (AABB) parallel distribution of dynamic origin point

Distance computation using axis aligned bounding box (AABB) ...

引用

Annual International conference on Emerging Research Areas and International conference on microelectronics, Communications and Renewable Energy (AICERA/ICMiCR)

作者： Hamzah Asyrani Sulaiman Mohd Azlishah Othman Mohd Muzafar Ismail Maizatul Alice Meor Said Azri Ramlee Mohamad Harris Misran Abdullah Bade Mohd Harun Abdullah CeTRi Universiti Teknikal Malaysia Melaka Durian Tunggal Malacca Malaysia School of Science and Technology Universiti Malaysia Sabah Kinabalu Sabah Malaysia

Performing accurate and precise collision detection method between objects in virtual environment application such as computer games and medical simulation is important in computer graphics research and development. Given pair of objects that near colliding, numerous mechanic has been developed by researchers in order to minimize computation time and increase accuracy of the detection. However, most of these techniques required a lot of computational cost, extra processing power and complex algebraic equations just to solve distance between near colliding objects. In this paper, we described an alternate technique, which is a theoretical framework of novel technique in order to find the optimum closest distance between two or more convex polyhedral in virtual environment application. Given pair of near colliding objects, we proposed an easy to implement mechanism using dynamic origin point by creating inner and middle Axis Aligned Bounding-Box just to find closest distance between objects. We believed that the technique is suitable to be used in any game engine tools for computer games and medical simulation.

关键词： Computational modeling Solid modeling Virtual environments Games Algorithm design and analysis Computer science conferences

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MCVP-NoC: Many-Core Virtual Platform with Networks-on-Chip support

MCVP-NoC: Many-Core Virtual Platform with Networks-on-Chip s...

引用

International conference on ASIC

作者： Dexue Zhang Xiaoyang Zeng Zongyan Wang Weike Wang Xinhua Chen State Key Lab. of ASIC & System Fudan University Shanghai China College of Information Science and Engineering Shandong University of Science and Technology Qingdao China Qingdao ShanHai Microelectronics Co. Ltd. Qingdao China

Many-core SoC (MCSoC) design is one of chip design trends and challenges. modeling and simulation for large scale MCSoC design is the key to get it right the first time. NoC is the most important component of future MCSoC. A novel modeling tool, MCVP-NoC (Many-Core Virtual Platform with Networks-on-Chip support) was designed for large scale MCSoC modeling, and can be used in design space exploration, early software development and system verification. MCVP-NoC was built on SystemC, OVP(Open Virtual Platform) and TLM2.0, integrated with Orion2.0 for power and area estimation. MCVP-NoC can run real software code, and can be used to evaluate the performance of the MCSoC design under real application load.

关键词： Decoding Software Computer architecture Analytical models System-on-chip Estimation Nickel

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Pmm: A Matlab toolbox for passive macromodeling in RF/mm-wave circuit design

Pmm: A Matlab toolbox for passive macromodeling in RF/mm-wav...

引用

International conference on ASIC

作者： Zuochang Ye Institute of Microelectronics Tsinghua University

Traditionally, CMOS RF/mm-wave circuit designers mostly rely on compact models provided by foundry for passive elements with given geometry. Nowadays, it is more of a trend that these elements are customized by circuit designers with the help of EM simulation. Thus a modeling tool is needed to convert the simulated data to a circuit level model that supports different types of simulations. pmm (Passive Macro-modeling) is an open-source Matlab toolbox that's provide this conversion. A collection of state-of-the-art modeling techniques have been implemented in pmm, and they can be arranged to work together. pmm is also designed to be extensible, i.e. new modeling methods can be integrated in the pmm flow with negligible effort.

关键词： Integrated circuit modeling Data models Noise Eigenvalues and eigenfunctions Vectors Scattering parameters Radio frequency

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Finite element analysis of fatigue cracks formation in power metallisation of a semiconductor device subjected to active cycling

Finite element analysis of fatigue cracks formation in power...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Grygoriy Kravchenko Balamurugan Karunamurthy Michael Nelhiebel Heinz E. Pettermann Institute for Lightweight Design and Structural Biomechanics Vienna University of Technology Vienna Austria Kompetenzzentrum Automobil-und Industrie-Elektronik GmbH Villach Austria Infineon Technologies Austria AG Villach Austria

This contribution presents a finite element method (FEM) study of fatigue crack formation in Cu metallisation of a power MOSFET device during active cycling using a shear strain based critical plane approach. After a short description of the fatigue model and the procedure for identification of the critical planes, a two-dimensional FEM model of a DMOS cell aimed at computation of detailed stress-strain fields resulting from temperature loading during electrical power pulses is presented. Accumulation of plastic strains, evolution of stresses during the cyclic loading and predictions of the fatigue model is discussed. The predicted most dangerous critical planes satisfactorily correspond to the experimentally observed crack locations in the Cu metallisation showing the potential of the selected methodology.

关键词： Biological system modeling Abstracts Silicon Vectors microelectronics

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Development, simulation and construction of cost-effective GTEM cells

Development, simulation and construction of cost-effective G...

引用

International conference on Radioelektronika

作者： Tinus Stander Saurabh Sinha Carl & Emily Fuchs Institute for Microelectronics Department of Electrical Electronic and Computer Engineering University of Pretoria Pretoria South Africa

Gigahertz transverse electromagnetic (GTEM) cells are used extensively in industry for testing the impact of defined E-fields on devices sensitive to electromagnetic interference. Compared to anechoic chambers, GTEM cells are small, inexpensive and require less powerful amplifiers to achieve the same field strength. This paper presents the design, simulation and qualification of a compact GTEM cell capable of generating field strengths in excess of 600 V/m over a 20 × 20 × 15 cm test cavity, whilst being less than 2.2 × 1.3 × 1 m in total size. Specific hybrid FEM-MLFMM simulation strategies are provided to examine high power device characteristics prior to manufacturing, including accurate modelling of absorber materials. Practical notes on manufacturing and qualification are also presented.

关键词： TEM cells Solid modeling Reflection Materials Resistors Finite element analysis Computational modeling

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Enabling technologies for system-level simulation of MEMS

Enabling technologies for system-level simulation of MEMS

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Tamara Bechtold Gabriele Schrag Lihong Feng Linstitute for Microsystems Engineering-IMTEK Freiburg University Germany Institute for Physics of Electro technology Technische Universitat Munchen Germany Max Planck Institute for Dynamics of Complex Technical Systems Magdeburg Germany

The rapid progress in microelectromechanical systems (MEMS) and the evolution from a limited set of well-established applications, examples, in automotive industry, print heads, and digital light projection, to other fields mainly driven by consumer applications (such as image stabilization, smart phones, game consoles, etc.) opens a new market for these devices. It simultaneously creates the need for fast, efficient, and adequate design and optimization tools not only for stand-alone devices, but also for entire multiphysics microsystems comprising the MEMS component, the attached control and read-out circuitry and the package, while additionally considering environmental impacts potentially affecting the system functionality. This paper provides an overview of system-level modelling methodologies and tools.

关键词： Micromechanical devices Sensors Heating Resistors Atmospheric modeling Abstracts Thermal expansion

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Novel quick predict approach for identification of critical loadings in electronic components on PCB under vibration realized as design support tool

Novel quick predict approach for identification of critical ...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Mike Roellig René Metasch Angelika Schingale Andreas Schießl Karsten Meier Norbert Meyendorf Fraunhofer Institute for Non-Destructive Tcstina Dresden Branch (IZFP-D) Dresden Germany Fraunhofer Institute for Non-Destructive Testing Dresden Germany Continental Automotive GmbH Rezensbura Dresden Germany Dresden University of Technology Electronics Packaging Laboratory (IAVT) Dresden Germany

The paper presents an approach to bring numerical simulation and electronic design engineering closer together. In focus is the development of a design support tool, based on Finite Element Analysis as an automated running system behind an engineer adapted Graphical User Interface platform. The Quick Predict tool will have the capability to fast calculated mechanical stresses on PCB and electronic components, which are loaded by vibration. Vibration loading usually occurs in mobile transportation systems or mechanical motion systems. The paper presents the solution of the easy and quick input of geometry variations, material variation and different vibration scenarios reflected on the example of an Electronic Control Unit (ECU). The automated generation of the virtual model is based on the available general design parameter. A set of material data was determined experimentally. A suitable way to insert material data variations for PCB with low effort on measurements was developed and integrated. The engineers target to achieve, with the approach, is to improve vibration resistivity of electronic components or to design new configurations of PCB with vibration critical components with very low time consumption.

关键词： Load modeling Deformable models Abstracts Libraries Fixtures Vibrations Reliability

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