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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是701-710 订阅

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Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results

Determination of strength of interface in packages based on ...

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International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro Systems

作者： Weidmann, Diane Dubois, Guillaume Hertl, Michael Chauffleur, Xavier Insidix 24 rue du Drac 38130 Seyssins France Epsilon Technoparc 10 10 rue Jean Bart 31674 Labège France

ISBN: (纸本)9781457701078

The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties. © 2011 IEEE.

关键词： Joints Polymers SAM TDM Temperature dependence Temperature measurement Thermomechanical processes Time division multiplexing Time measurement acoustic microscopy debonding localisation deformation deformation history electronic packages electronics packaging interface strength determination package design scanning acoustic microscopy topography and deformation measurements

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A methodology for modeling embedded processors for architecture exploration

A methodology for modeling embedded processors for architect...

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2011 23rd International conference on microelectronics, ICM 2011

作者： Elhossini, Ahmed Areibi, Shawki Dony, Robert University of Guelph School of Engineering Guelph ON N1G 2W1 Canada

ISBN: (纸本)9781457722073

Architecture exploration for embedded systems is becoming an indispensable tool for System-on-Chip designers. This process requires the evaluation of many architectures that are generated during the exploration process. The evaluation process has a significant impact on the quality of the results and could consume a substantial amount of CPU time. Accordingly, the evaluation process should provide enough accuracy to guide the optimization process to promising points in the design space in reasonable time. In this paper an efficient approach for performance evaluation of embedded systems is proposed. Several cycle-accurate simulations are performed for commercial embedded processors used in our study. The simulation results are used to build Artificial Neural Network (ANN) models with accuracy up to 90% compared to cycle-accurate simulations with a very significant time saving. © 2011 IEEE.

关键词： Embedded systems

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System modeling and analysis of the IEEE 802.15.4 physical layer design

System modeling and analysis of the IEEE 802.15.4 physical l...

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2011 IEEE 9th International conference on ASIC, ASICON 2011

作者： Xia, Jikang Chen, Lan Li, Ying Zhou, Yinhao Institute of Microelectronics Chinese Academy of Sciences Beijing 100029 China

ISBN: (纸本)9781612841908

Physical layer structure usually is first considered to design a standard SoC in wireless sensor networks, while few practical works can be referenced. This paper presents detailed functional system modeling which obeys IEEE 802.15.4 protocol and performance analysis of three physical layer bands. Emphatically, the system includes a novel algorithm of de-spreading with minimum hamming distance and an implementation of half-sine pulse shaping filters. According to the simulation results, error control coding like BCH is recommended to use to enhance the data accuracy, and the low complexity filters can effectively improve the system performance. The contribution of this paper is providing valuable reference for the further design on wireless sensor network baseband chips. © 2011 IEEE.

关键词： Wireless sensor networks

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SET and SEU simulation toolkit for LabVIEW

SET and SEU simulation toolkit for LabVIEW

引用

12th European conference on Radiation and Its Effects on Component and Systems, RADECS 2011

作者： Bartra, Walter Calienes Reis, Ricardo Institute of Informatics Universidade Federal Do Rio Grande Do Sul Porto Alegre RS Brazil

ISBN: (纸本)9781457705878

Nowadays, the fault simulation is an important step in any IC design. Predicting the behavioral faults of any process step is essential to ensure that the design is well implemented. During the simulation various problems can be detected and corrected. It is presented a tool to simulate the effects that occur when a source of fault is inserted in a digital circuit, especially SEU faults. To model a fault, it was also developed a TMR method capable of verifying the existence of a fault and to not let it spread through the whole circuit. It was also developed a Voltage Controlled Oscillator (VCO) to view fault effects in analog circuits. LabVIEW tool is used to create a set of virtual instruments to simulate SEUs. It is efficient in modeling the Characteristics of SETs. It is possible with this toolkit to replicate the effects of SEUs and SETs described in the literature. © 2011 IEEE.

关键词： microelectronics

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Comprehensive material characterization and method of its validation by means of FEM simulation

Comprehensive material characterization and method of its va...

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International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro Systems

作者： Gromala, P. Duerr, J. Dressler, M. Jansen, K.M.B. Hawryluk, M. De Vreugd, J. Robert Bosch GmbH Automotive Electronics Tuebinger Str 123 72762 Reutlingen Germany Robert Bosch GmbH Corporate Research Waiblingen Germany Delft University of Technology Faculty of Mechanical Maritime and Materials Engineering Netherlands Cracow University of Technology Faculty of Mechanical Engineering Poland Delft Netherlands

ISBN: (纸本)9781457701078

Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of thermal expansion were measured and implemented into commercially available FEM code Ansys. Fringe pattern technique has been used to measure warpage of bimaterial strips. Then FEM simulation of bimaterial strips were done and compared with experimental results. Curing shrinkage has been modeled in an effective way. Its accuracy has been checked on one of the materials by creating bimaterial strips with three different geometrical dimensions, that is varied thickness of mold and copper substrate. © 2011 IEEE.

关键词： Finite element method

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modeling, filtering and optimization for AFM arrays

Modeling, filtering and optimization for AFM arrays

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International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro Systems

作者： Hui, H. Yakoubi, Y. Lenczner, M. Cogan, S. Meister, A. Favre, M. Couturier, R. Domas, S. School of Mechatronic Northwestern Polytechnical University 127 Youyi Xilu 710072 Xi'an Shaanxi China FEMTO-ST Time Frequency Department University of Franche-Comté 26 Chemin de l'Epitaphe 25030 Besançon Cedex France FEMTO-ST Time Frequency Department University of Technology at Belfort and Montbéliard 26 Chemin de l'Epitaphe 25030 Besançon Cedex France FEMTO-ST Applied Mechanics Department CNRS 26 Chemin de l'Epitaphe 25030 Besançon Cedex France CSEM Rue Jaquet-Droz 1 CH-2002 Neuchtel Switzerland University of Franche-Comte LIFC IUT Belfort-Montbliard Rue Engel Gros 90000 Belfort France

ISBN: (纸本)9781457701078

In this paper, we present new tools and results developed for Arrays of Microsystems and especially for Atomic Force Microscope (AFM) array design. For modeling, we developed a two-scale model of cantilever arrays in elastodynamics. A robust optimization toolbox is interfaced to aid for design before the microfabrication process. A model based algorithm of static state estimation using measurement of mechanical displacements by interferometry is stated. Quantization of interferometry data processing is analyzed for FPGA implementation. A robust H∞ filtering problem of the coupled cantilevers is solved for time-invariant system with random noise effects. Our solution allows semi-decentralized computing based on functional calculus that can be implemented by networks of distributed electronic circuits as shown in a previous paper. © 2011 IEEE.

关键词： Optimization

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design of athermalized proximity coupled (APC) synthetic green laser opto-electronic package for microprojector displays: Numerical modeling and experiments

Design of athermalized proximity coupled (APC) synthetic gre...

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International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro Systems

作者： Chaparala, S. Bhagavatula, V. Himmelreich, J. Science and Technology Corning Incorporated Corning NY 14831 United States

ISBN: (纸本)9781457701078

Micro-projector based displays are proposed for information display for a number of consumer devices. These displays would provide larger images than existing fixed Liquid crystal displays. The two major components of micro-projector technology are the Light source and the Imaging technology. Three primary colors, red, blue and green are required to create full color images. The light sources in the projection technology would be semiconductor devices that emit these colors. These devices could be either light emitting diodes (LEDs) or lasers. To enable the laser based projection technology, red and blue lasers are commerically available. Native semiconductor green lasers are still in development. As an alternative, synthetic green light can be produced by passing 1060nm infra-red light emitted from a GaAs based semiconductor laser diode (LD) through second harmonic generation (SHG) crystal, thereby emitting the green light at 530 nm. The current research work proposes bringing the SHG structure in close proximity to the LD, thereby eliminating the use of any optics in between. The proximity coupling approach promises to reduce the number of package components and process cost significantly. This paper presents the mechanical package design, coefficient of thermal expansion based displacement estimates, thermal analysis wherein the thermal impedance is predicted and measured, thermo-mechanical analysis wherein the thermo-mechanical stresses and strains are predicted. Shock modeling has been done to understand the displacements of the waveguides during the shock event. Optical modeling is performed to estimate the coupling efficiency change as a function of lateral and longitudinal offset between the LD and SHG waveguides. Finally, an assembled package that generated green light using this design is presented. © 2011 IEEE.

关键词： Harmonic generation

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Numerical modeling of thermal performance: Natural convection and radiation of solid state lighting

Numerical modeling of thermal performance: Natural convectio...

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International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro Systems

作者： Ye, H. Gielen, A.W.J. VanZeijl, H.W. Werkhoven, R.J. Zhang, G.Q. Delft University of Technology Mekelweg 6 2628CD Delft Netherlands Mekelweg 2 2628 CD Delft Netherlands De Rondom 1 5612 AP Eindhoven Netherlands

ISBN: (纸本)9781457701078

The increased electrical currents used to drive light emitting diode (LED) cause significant heat generation in the solid state lighting (SSL) system. As the temperature will directly affect the maximum light output, quality, reliability and the life time of the SSL system, thermal management is a key design aspect in terms of cost and performance. Particularly for consumer SSL system, natural convection cooling is cheaper and more reliable than the forced air cooling heat sinks. Although with less efficiency, natural convection heat sink is a good compromise between economy and thermal performance of SSL systems. In this work, the thermal performance of two geometrically different passive heat sink designs for consumer SSL applications is numerically simulated. The heat sink performance is simulated for two orientations: LED up and LED down orientation. simulation runs for the two designs at the two orientations, in order to investigate the thermal performance of the heat sinks with natural convection cooling. Meanwhile, the radiation effect is considered. With passive cooling, the natural convection plays an important role, and results show that if free ambient air flow is blocked by the heat sink design and the performance reduces considerably. Furthermore, the volume of free air in the luminaire is expected to have significant impact to the heat sink thermal performance. Therefore, the thermal performance for different volumes of luminaire enclosures is also investigated in this work. To analyze the modeling results, a straightforward calculation of the thermal resistance between the LED junction and the environment is applied. In the results, the thermal resistances of LED junction to environment decreases but the air velocity gradually increases with the increasing luminaire volume. In conclusion, although more study is needed for validation of the optimal volume and shape for natural convection, the results in this work can already be used to guide the design

关键词： Natural convection

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Macro-modeling of analog blocks for SystemC-AMS simulation: A chemical sensor case-study

Macro-modeling of analog blocks for SystemC-AMS simulation: ...

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17th IFIP International conference on Very Large Scale Integration, VLSI-SoC 2009

作者： Cenni, Fabio Simeu, Emmanuel Mir, Salvador TIMA Laboratory CNRS UJF France

ISBN: (纸本)9781457702365

SystemC-AMS allows the simulation of complex heterogeneous systems, including software and hardware, in particular Analogue and Mixed-Signal (AMS) or radio-frequency (RF) blocks. These blocks require specific Models of Computation (MoC) to model the analog behavior. This paper presents techniques for the generation of analog macro-models that can be simulated using these MoCs. Both static and dynamic analog behavior are considered. While modeling the static behavior is straightforward, the modeling of the dynamic case requires a linearization of the block behavior. The approach proposed in this work consists of exploiting the frequency response of the focused component in order to obtain a fitted transfer function in the bandwidth of operation of the target block. The Laplace transfer function obtained is next modified in order to be described using the syntax and the primitive libraries offered by the current SystemC-AMS release. This resulting model is de facto a SystemC-AMS module that uses the Synchronous multi-rate Data Flow (SDF) MoC supported by the 0.15RC5 release of SystemC-AMS. We will illustrate these techniques for the case of a chemical sensor that uses a Surface Acoustic Wave (SAW) and a Phase-Locked-Loop (PLL) microelectronics interface. © 2009 IEEE.

关键词： Frequency response

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Dynamic compact thermal model for electrothermal modeling and design optimization of automotive power devices

Dynamic compact thermal model for electrothermal modeling an...

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International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro Systems

作者： Azoui, T. Tounsi, P. Pasquet, G. Dupuy, Ph. Dorkel, J.M. CNRS LAAS 7 avenue du colonel Roche F-31077 Toulouse France Université de Toulouse UPS LAAS F-31077 Toulouse France Freescale Semiconductor Inc. Avenue du Général Eisenhower 31023 Toulouse France

ISBN: (纸本)9781457701078

In this paper we present a simple methodology for generating dynamic compact thermal model (CTM) of electronics components. Several innovations generating accurate dynamic Compact Thermal Models (CTMs) are proposed in this paper. This makes possible providing customers (automotive systems suppliers) with extended datasheets, including CTMs, without publishing any confidential information about technology, device structures nor materials. The proposed model takes into account the 3D effects of the heat transfer, it considers the effect of the nonlinearity of parameters like thermal conductivity and the dependence of dissipated power on temperature. Moreover, the total number of boundary conditions allowing the generation of boundary condition independent (BCI) compact thermal models is considerably reduced. The method presented in this paper is applied to the extraction of dynamic CTM for automotive power device. © 2011 IEEE.

关键词： Boundary conditions

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