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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1416 条记录，以下是871-880 订阅

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Efficient and refined modeling of wireless sensor network nodes using SystemC-AMS

Efficient and refined modeling of wireless sensor network no...

引用

conference on PhD Research in microelectronics and Electronics

作者： Vasilevski, Michel Beilleau, Nicolas Aboushady, Hassan Pecheux, Francois Lab UPMC LIP6 SOC Paris France

ISBN: (纸本)9781424419838

The paper introduces a model of wireless sensor network (WSN) nodes with SystemC-AMS, a C++ based language for system-level description, then presents model refinements and simulation improvements of the system. Firstly the paper details the components of a WSN node : a sensor, an ADC, a microcontroller and a RF transceiver with some introduced impairements. Secondly, it presents the implementation of RF components refinements, for a designer closer model specifications, such as power gain, noise figure, IIP3 specifications. Finally, the third part shows the simulation improvements introduced by a baseband equivalent implementation made easier with a C++ based language.

关键词： Radio transceivers

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Fluid-electrostatic-mechanical modeling of the dynamic response of RF-MEMS capacitive switches

Fluid-electrostatic-mechanical modeling of the dynamic respo...

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EuroSimE 2008 - International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro-Systems

作者： Bielen, Jeroen Stulemeijer, Jiri Ganjoo, Deepak Ostergaard, Dale Noijen, Sander NXP Semiconductors Innovation Centre for RF Nijmegen Netherlands Ansys Inc. United States Philips Applied Technologies Eindhoven Netherlands

ISBN: (纸本)9781424421282

For predicting dynamic responses of electrostatically actuated RF-MEMS it is imperative to be able to include fluid squeeze film effects (air damping) in a directly coupled electrostatic-mechanical model, in an efficient and accurate way. This paper presents the modeling methodology to predict the dynamic response of a capacitive RF-MEMS obtained with implementation of a isothermal non-linear compressible Reynolds equation in a directly coupled fluid-structural element in a pre-release of the Ansys FE software. Multi-physics simulations of harmonic (AC) responses and transient switching cycles, in which the switch closes and non-linear contact is included, were validated with measurements. It is concluded that the presented multi-physics model is a powerful tool for virtual device design and indispensable for predicting functional performance of RF-MEMS. This model provides more accurate transient results than models based on the linearized Reynolds equations. ©2008 IEEE.

关键词： Forecasting

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Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA

Effects of detailed substrate modeling and solder layout des...

引用

EuroSimE 2008 - International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro-Systems

作者： Biswas, Kalyan Liu, Shiguo Zhang, Xiaowu Chai, T.C. IBIDEN Singapore Pte Ltd. 31 Kaki Bukit Road 3 #06-22 Techlink Singapore 417818 Singapore Singapore Singapore Science Park II 11 Science Park Road Singapore 117685 Singapore

ISBN: (纸本)9781424421282

This paper discusses the thermo-mechanical design and analysis of a large die FCBGA. This work focuses on co-design of the 1st level and 2 nd level solder joint reliability analysis of a flip chip package emphasizing the effect of details substrate modeling and solder layout design. Model with all the layered structures for the build up substrate is compared with the compact model of equivalent substrate. The fatigue life of the 2 nd level solder joint is estimated by the Darveaux's method. Inelastic strain energy density per cycle accumulated in the solder bumps during thermal cycling is used to predict the trend of fatigue life for the 1 st level bumps. Effects of die thickness, substrate thickness and heat spreader on solder fatigue life are analyzed. As the maximum inelastic strain energy density occurs at the solder ball near the die edge, different solder ball layouts are studied by changing the distance of the critical solder ball from die edge. In addition, to further improve the packaging design of large die FCBGA, the fatigue life of most critical solder ball is investigated by means of the design of experiment (DOE). The final results could be used as a design guideline to improve the fatigue life of both the 1st and 2nd level solder joints of the package. ©2008 IEEE.

关键词： Fatigue of materials

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Proceeding of the 15th International conference: Mixed design of Integrated Circuits and Systems MIXDES 2008

Proceeding of the 15th International Conference: Mixed Desig...

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15th International conference on Mixed design of Integrated Circuits and Systems, MIXDES 2008

ISBN: (纸本)8392263278

The proceedings contain 108 papers. The topics discussed include: high performance computing in nanoscale electro-thermal modeling and simulations;LTCC in microelectronics, microsystems, and sensors;the HiSIM compact model family for integrated devices containing a surface-potential MOSFET core;analytical modeling of the electrostatic potential in MOS devices by conformal mapping;development of multi-gate MOSFET models for circuit simulation with a compact modeling platform;electrical characterization of FinFETs;electrical characterization of MOSFETs with ultrathin SiON gate dielectric;modeling of high-voltage NMOS transistors using extended BSIM3 model;noise optimization of fast charge sensitive amplifier in submicron technology for low power application;TCAD modeling and characterization of short-range variations in multiple-gate devices and circuit blocks;and a novel approach for real time neutron radiation monitoring based on the bubble dosimeter.

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modeling and simulation for on-chip power grid networks by locally dominant krylov subspace method

Modeling and simulation for on-chip power grid networks by l...

引用

2008 International conference on Computer-Aided design, ICCAD

作者： Yan, Boyuan Tan, Sheldon X.-D. Chen, Gengsheng Wu, Lifeng Department of Electrical Engineering University of California Riverside CA 92521 United States ASIC and System State-Key-Lab Microelectronics Dept. Fudan Univeristy Shanghai 200433 China Cadence Design Systems Inc. San Jose CA 95134 United States

ISBN: (纸本)9781424428205

Fast analysis of power grid networks has been a challenging problem for many years. The huge size renders circuit simulation inefficient and the large number of inputs further limits the application of existing Krylov-subspace macromodeling algorithms. However, strong locality has been observed that two nodes geometrically far have very small electrical impact on each other because of the exponential attenuation. However, no systematic approaches have been proposed to exploit such locality. In this paper, we propose a novel modeling and simulation scheme, which can automatically identify the dominant inputs for a given observed node in a power grid network. This enables us to build extremely compact models by projecting the system onto the locally dominant Krylov subspace corresponding to those dominant inputs only. The resulting simulation can be very fast with the compact models if we only need to view the responses of a few nodes under many different inputs. Experimental results show that the proposed method can have at least 100X speedup over SPICE-like simulations on a number of large power grid networks up to 1M nodes.

关键词： Circuit simulation

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Stochastic Finite Element modeling of thermoelastic quality factor of micro-beams

Stochastic Finite Element modeling of thermoelastic quality ...

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EuroSimE 2008 - International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro-Systems

作者： Lepage, Severine Weickum, Gary Maute, Kurt Beckman Institute University of Illinois at Urbana-Champaign 405 N. Mathews Ave. Urbana IL 61801 United States Center for Aerospace Structures Department of Aerospace Engineering Sciences Colorado University at Boulder Boulder CO 80309 United States

ISBN: (纸本)9781424421282

In the design of micro-electromechanical systems (MEMS) such as micro-resonators, one of the major dissipation phenomena to consider is thermoelastic damping. The performance of such MEMS is directly related to their thermoelastic quality factor which has to be predicted accurately. Moreover, the performance of MEMS depends on manufacturing processes which cause substantial uncertainty in the geometry and in the material properties of the device. The aim of this paper is to provide a framework to account for uncertainties in the finite element analysis of thermoelastic damping in MEMS. Four stochastic methods are investigated: perturbation Stochastic Finite Element Method (SFEM), spectral SFEM, projection method and Monte-Carlo method. Due to the nature of the thermoelastic problem, these stochastic methods are extended to the resolution of non-symmetric damped eigenproblems. The methods are applied on the analysis of the thermoelastic quality factor of a micro-beam whose elastic modulus is considered as random. ©2008 IEEE.

关键词： Monte Carlo methods

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design, Automation, and Test in Europe 2008

引用

2008年

作者： Rudy Lauwereins Jan Madsen

ISBN: (数字)9781402064883

ISBN: (纸本)9781402064876

The design, Automation and Test in Europe (DATE) conference celebrated in 2007 its tenth anniversary. As a tribute to the chip and system-level design and design technology community, this book presents a compilation of the three most influential papers of each year. This provides an excellent historical overview of the evolution of a domain that contributed substantially to the growth and competitiveness of the circuit electronics and systems industry. The papers were grouped in six sections: System Level design; Networks on Chip; modeling, simulation and Run-Time Management; Digital Systems in CMOS and Beyond; Physical design and Validation; and Test and Verification. The winners of the prestigious EDAA Lifetime Achievement Award as well as other recognized experts in their field wrote an introduction to each section, summarizing the history in their domain and indicating how the selected DATE papers contributed to it.

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modeling of smart compliant electro-active polymer actuator

Modeling of smart compliant electro-active polymer actuator

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EuroSimE 2008 - International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro-Systems

作者： Soulimane, S. Al Ahmad, M. Matmat, M. Camon, H. LAAS-CNRS 7 avenue du Colonel Roche F-31077 Toulouse France Université de Toulouse UPS INSA INP ISAE F-31077 Toulouse France

ISBN: (纸本)9781424421282

The electro-active polymers smart materials are typically characterized by their large strain, low modulus, and high compliance which make them suitable and of efficient use in area of actuation. Dielectric electroactive polymer (DEAP) actuators combine high energy density with large displacements, low power consumption and fast response time, which make them very attractive for a wide variety of applications, both on the macro- and micro-scale. The design and fabrication of a proper actuator for micro pump and micro mirror applications requires an explicit knowledge of the involving materials as well as the miniaturizations techniques. The prediction of the mechanical behavior when dc bias is applied is often performed thought the help of suitable multi-physics tools. These tools generally based on the finite element analysis algorithms. The results of these simulations will provide quantitative characterizations concerning the actuation spatial resolution, and also allows optimizing the fabrication process in terms of materials and integrations steps. The scope of this work is to shows how a multi-physics tool such as CoventorWare is used to anticipate the electromechanical behaviour of micro actuator comprising a PDMS material for actuation. The simulation investigates the electromechanical coupling in the dielectric elastomer actuators. ©2008 IEEE.

关键词： Finite element method

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The stabilization controller design for a tripod type parallel manipulator used for active suspension of a delicate device

The stabilization controller design for a tripod type parall...

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17th IEEE International conference on Control Applications, CCA

作者： Atesoglu, Özgür Özgören, M. Kemal Aselsan Inc. METU Microelectronics Guidance and Electro-Optics Division Aselsan Inc. Akyurt Ankara Turkey Mechanical Engineering Dept. Middle East Technical University Ankara Turkey

ISBN: (纸本)9781424422234

This paper focuses on the nonlinear modeling of a tripod type parallel manipulator and the stabilization controller design for base disturbance attenuation. The active tripod is designed to isolate a delicate device, carried by a host vehicle, from the disturbing vibrations coming from the chassis of this host vehicle. For that purpose, a controller is designed and the tripod is used for vibration attenuation as an active suspension system. A detailed simulation model including the nonlinear model of the tripod type parallel manipulator, the models of the stabilization controller, the linear actuators, i.e. the legs of the tripod, the inertial sensors, i.e. the inertial navigation system (INS) on the active platform, and the linear encoder integrated between the moving and stationary parts of the tripod are built and used in the study. This simulation model is used to evaluate the performance of the designed controller for the real-time data acquisitioned from an INS, which is mounted on the vehicle chassis, during a rough off-road cruise of the host vehicle. The data gathered from the vehicle is fed through the simulation model and the performance of the designed controller is examined and discussed under the real conditions of the desired application. © 2008 IEEE.

关键词： Controllers

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2008 26th international conference on microelectronics

2008 26th international conference on microelectronics

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International conference on microelectronics, MIEL

The following topics are dealt: microelectronics; nanotechnologies; semiconductor device/circuit physics and modeling; opto and microwave devices and ICs; semiconductor processes and technologies; microsystem technologies; circuit design and testing; VLSI circuits; system design; circuit modeling and simulation; and device/circuit reliability physics.

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