检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

1,367 篇 会议
46 篇 期刊文献
6 册 图书

馆藏范围

1,419 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

615 篇 工学
- 387 篇 电气工程
- 246 篇 电子科学与技术（可...
- 221 篇 计算机科学与技术...
- 128 篇 材料科学与工程（可...
- 119 篇 软件工程
- 89 篇 机械工程
- 66 篇 动力工程及工程热...
- 59 篇 控制科学与工程
- 42 篇 化学工程与技术
- 35 篇 信息与通信工程
- 31 篇 仪器科学与技术
- 23 篇 力学（可授工学、理...
- 15 篇 冶金工程
- 15 篇 生物医学工程（可授...
- 10 篇 建筑学
- 9 篇 光学工程
- 9 篇 土木工程
- 8 篇 交通运输工程
- 8 篇 安全科学与工程
- 7 篇 生物工程
255 篇 理学
- 146 篇 物理学
- 116 篇 数学
- 45 篇 化学
- 22 篇 系统科学
- 10 篇 生物学
- 10 篇 统计学（可授理学、...
38 篇 管理学
- 37 篇 管理科学与工程(可...
8 篇 医学
- 7 篇 临床医学
- 6 篇 基础医学(可授医学...
- 5 篇 药学(可授医学、理...
4 篇 法学
4 篇 艺术学
2 篇 农学
1 篇 经济学
1 篇 教育学

主题

272 篇 computational mo...
230 篇 integrated circu...
190 篇 circuit simulati...
179 篇 microelectronics
126 篇 semiconductor de...
115 篇 analytical model...
107 篇 solid modeling
96 篇 mathematical mod...
65 篇 simulation
61 篇 silicon
58 篇 predictive model...
53 篇 hardware design ...
53 篇 micromechanical ...
50 篇 load modeling
50 篇 hardware
49 篇 cmos technology
47 篇 spice
45 篇 design automatio...
43 篇 logic gates
42 篇 finite element a...

机构

13 篇 institute of mic...
13 篇 institute of mic...
12 篇 institute of mic...
7 篇 institute of mic...
6 篇 department of mi...
6 篇 institute of mic...
6 篇 department of mi...
6 篇 school of softwa...
5 篇 school of microe...
5 篇 nxp semiconducto...
5 篇 national microel...
5 篇 school of microe...
5 篇 institute of mic...
5 篇 philips applied ...
5 篇 imec leuven
5 篇 institute of mic...
5 篇 amic angewandte ...
5 篇 agilent technol ...
5 篇 delft university...
4 篇 shanghai researc...

作者

10 篇 xiaowu zhang
10 篇 roca e.
9 篇 castro-lopez r.
9 篇 a. napieralski
8 篇 rodriguez r.
8 篇 nafria m.
7 篇 l.j. ernst
7 篇 g.q. zhang
7 篇 martin-martinez ...
7 篇 sven rzepka
7 篇 fernandez f. v.
7 篇 s. selberherr
7 篇 zhang gq
6 篇 andrzej napieral...
6 篇 m.k. iyer
6 篇 ru huang
6 篇 n. ranganathan
6 篇 k.m.b. jansen
5 篇 khaoula mbarek
5 篇 sami ghedira

语言

1,398 篇 英文
10 篇 中文
8 篇 其他
3 篇 德文

检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是881-890 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

2008 26th international conference on microelectronics

2008 26th international conference on microelectronics

引用

International conference on microelectronics, MIEL

The following topics are dealt: microelectronics; nanotechnologies; semiconductor device/circuit physics and modeling; opto and microwave devices and ICs; semiconductor processes and technologies; microsystem technologies; circuit design and testing; VLSI circuits; system design; circuit modeling and simulation; and device/circuit reliability physics.

关键词：

来源：评论

学校读者我要写书评

暂无评论

On the simulation performance of contemporary AMS hardware description languages

On the simulation performance of contemporary AMS hardware d...

引用

International conference on microelectronics, ICM

作者： Rajeev Narayanan Naeem Abbasi Mohamed Zaki Ghiath Al Sammane Sofiène Tahar Dept. of ECE Concordia University Montreal Quebec Canada

Mixed-Signal extensions to VHDL, Verilog, and SystemC languages have been developed in order to provide a unifying environment for the modeling and verification of Analog and Mixed Signal (AMS) designs at different levels of abstraction. In this paper, we model the behavior of a set of benchmark designs in VHDL-AMS, Verilog-AMS and SystemC-AMS and compare the simulation performance with HSPICE. The various experimental results observed for the benchmark circuits show the superiority of VHDL-AMS and Verilog-AMS against SystemC-AMS and HSPICE in terms of simulation runtimes at lower level of abstraction.

关键词： Hardware design languages Circuit simulation Runtime Mathematical model Computational modeling Signal design SPICE Circuits and systems Analytical models design automation

来源：评论

学校读者我要写书评

暂无评论

EKV MOSFET model implementation in Matlab and Verilog-A

EKV MOSFET model implementation in Matlab and Verilog-A

引用

International conference on microelectronics, MIEL

作者： G. Angelov I. Panayotov M. Hristov Department of Microelectronics Faculty of Electronic Engineering and Technology Technical University of Sofia Sofia Bulgaria

The present paper presents a straightforward yet effective approach to implementing a MOS transistor compact model (EKV v.2.6) in two different environments - Matlab and Verilog-A. This is useful for circuit-level design purposes enabling the designer to manipulate open-source models having direct access to model equation sets and program structure. EKV v.2.6 is selected for its simple model core and efficiency in describing device behaviors. A comparison of the simulation results between the two model implementations as well as a comparison to a reference model (BSIM3v3) has been illustrated in details.

关键词： MOSFET circuits Mathematical model Hardware design languages Semiconductor device modeling Circuit simulation CMOS technology Context modeling Computational modeling microelectronics Equations

来源：评论

学校读者我要写书评

暂无评论

An approach for simulating magnetic microactuators

An approach for simulating magnetic microactuators

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： D. Dinulovic Hans H. Gatzen Institute for Microtechnology Leibniz Universitaet Hannover Garbsen Germany

Micro electro-mechanical systems (MEMS) are fabricated by combining deposition and etching techniques in conjunction with photo lithography for patterning. Due to this complex fabrication approach it is nearly impossible to easily fabricate prototypes. As a result modeling and simulation techniques are applied in the design process for such devices. This paper pinpoints an approach for modeling and simulating an electromagnetic microactuator. Establishing analytical model allows coming up with a cursory design, while a finite element method (FEM) analysis allows furthering optimum design features.

关键词： Micromagnetics Micromechanical devices Etching Lithography Fabrication Prototypes Process design Electromagnetic modeling Microactuators Analytical models

来源：评论

学校读者我要写书评

暂无评论

Lead-free solder material characterization for thermo-mechanical modeling

Lead-free solder material characterization for thermo-mechan...

引用

EuroSimE 2008 - International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Micro-Systems

作者： Poh, Edith S. W. Zhu, W.H. Zhang, X.R. Wang, C.K. Sun, Anthony Y.S. Tan, H.B. Packaging Analysis and Design Center 5 Serangoon North Ave 5 Singapore 554916 Singapore

ISBN: (纸本)9781424421282

Systematic mechanical characterization has been done on lead-free solder alloys, i.e., SAC105, SAC205, SAC305, SAC105Ni0.02, and SAC105Ni0.05 as promising alternatives of SnPb solder. Solder joints in service stay in high homologous temperatures that have profound effects on mechanical properties such as creep and the apparent elastic modulus. Mechanical deformation behaviors of bulk solder alloys at temperatures between 298K and 398K, as well as strain rates between 10-5 to 10-1 under isothermal conditions, have been studied for the above 5 solder alloys with a designed bulk test vehicle. Isostress loading conditions on the solders were also conducted to study creep behaviour. Based on substantial experimental measurement results, the elastic modulus, yield stress and UTS of the various SAC solder alloys show direct relationships with Ag content at temperatures between 298K and 398K. The relationships of strain rate, temperature, Ag content and material properties were developed and material constants are presented. Basic material parameters with viscoplastic constitutive relations for solders encompassing temperature and strain rate dependence have been obtained through curve fitting with experimental data. The creep constitutive model has also been established. By implementing the developed creep or viscoplastic constitutive models of solders into FEA models, the life of an electronic package under thermal cycling and drop performance in board level tests can be evaluated. Material compositions such as Ag content and Ni dopant effect are also studied for their influence on mechanical properties. It was reported that Ni dopant could improve solder joint drop performance by changing the microstructure of the material. ©2008 IEEE.

关键词： Strain rate

来源：评论

学校读者我要写书评

暂无评论

CMOS SOI technology for WPAN. Application to 60 GHz LNA

CMOS SOI technology for WPAN. Application to 60 GHz LNA

引用

IEEE International conference on Integrated Circuit design and Technology (ICICDT)

作者： A. Siligaris C. Mounet B. Reig P. Vincent A. Michel CEA LETI MINATEC Grenoble France Ansoft Corporation Buc France

This paper discusses the design of a 60 GHz low noise amplifier (LNA) using a standard low power SOI CMOS process from ST microelectronics. First, we outline the technology as well as the mm-wave design challenges. Using recent work on coplanar waveguide (CPW) modeling, we describe how it's possible to use parametric, 3D electromagnetic simulation to complete or replace analytical models of on-chip passive devices. A short description of the transistor model is also provided. Finally, we discuss the details of the LNA design and show how the simulation results compare to the measurements.

关键词： CMOS technology Electromagnetic waveguides Coplanar waveguides Analytical models Low-noise amplifiers CMOS process microelectronics Semiconductor device modeling Electromagnetic modeling Electromagnetic scattering

来源：评论

学校读者我要写书评

暂无评论

Parameter extraction, optimization, and simulation of EKV model using MATLAB

Parameter extraction, optimization, and simulation of EKV mo...

引用

International conference on microelectronics, MIEL

作者： Katya Asparuhova George Angelov Marin Hristov Department of Electronics Faculty of Electronic Engineering and Technology Technical University of Sofia Sofia Bulgaria Department of Microelectronics Faculty of Electronic Engineering and Technology Technical University of Sofia Sofia Bulgaria

An implementation of the EKV model in MATLAB is presented. Modules for output characteristics, transfer characteristics, transconductances, and parameter extraction are developed. They enable simulations of the respective characteristics under various conditions and provide user-friendly interface. Very good agreement between simulation results (EKV) and reference model (BSIM3v3) is demonstrated. The numerical calculation of the EKV model equations and the transconductances are optimized using appropriate mathematical techniques.

关键词： Parameter extraction Mathematical model MATLAB Circuit simulation Equations microelectronics design optimization Context modeling Open source software Availability

来源：评论

学校读者我要写书评

暂无评论

Effects of detailed substrate modeling and solder layout design on the 1st and 2nd level solder joint reliability for the large die FCBGA

Effects of detailed substrate modeling and solder layout des...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Kalyan Biswas Shiguo Liu Xiaowu Zhang T. C. Chai IBIDEN Singapore Private Limited Singapore Singapore Science Park II Institute of Microelectronics Singapore

This paper discusses the thermo-mechanical design and analysis of a large die FCBGA. This work focuses on co-design of the 1 st level and 2 nd level solder joint reliability analysis of a flip chip package emphasizing the effect of details substrate modeling and solder layout design. Model with all the layered structures for the build up substrate is compared with the compact model of equivalent substrate. The fatigue life of the 2 nd level solder joint is estimated by the Darveaux's method. Inelastic strain energy density per cycle accumulated in the solder bumps during thermal cycling is used to predict the trend of fatigue life for the 1 st level bumps. Effects of die thickness, substrate thickness and heat spreader on solder fatigue life are analyzed. As the maximum inelastic strain energy density occurs at the solder ball near the die edge, different solder ball layouts are studied by changing the distance of the critical solder ball from die edge. In addition, to further improve the packaging design of large die FCBGA, the fatigue life of most critical solder ball is investigated by means of the design of experiment (DOE). The final results could be used as a design guideline to improve the fatigue life of both the 1 st and 2 nd level solder joints of the package.

关键词： Soldering Fatigue Flip chip Electronics packaging Thermal conductivity Capacitive sensors Conducting materials Finite element methods Solid modeling microelectronics

来源：评论

学校读者我要写书评

暂无评论

Graphical model validation methods for analog and mixedsignal electronic circuits design

Graphical model validation methods for analog and mixedsigna...

引用

International conference on microelectronics, ICM

作者： Husam Hamad Adnan Al-Smadi Abdallah Ijjeh Biomedical Engineering Department College of Engineering Jordan University of Science and Technology Jordan Electronic Engineering Department Hijjawi College of Engineering Technology Yarmauk University Irbid Jordan Communication Engineering Department Hijjawi College of Engineering Technology Yarmauk University Irbid Jordan

Simplified models are used to replace SPICE-based simulation models in analog and mixed-signal electronic circuits design for increased computational efficiency. The increase in computational efficiency usually comes at the expense of reduced model accuracies by comparison to simulation models. Graphical model validation methods can be used to display model and simulation data to complement validation statistics such as root mean square (RMS) error. In this paper, we present three plot types to display data to validate models in analog integrated circuits. These are the so-called circle plots, acceptance-score-distribution (ASD) plots, and ordinal plots. These plots are general and easy to generate using the same validation sample used to calculate other statistics, e.g., RMS errors; no extra simulation expenses are incurred. Furthermore, unlike quantitative statistics used for model validation, the methods presented require no statistical assumptions for the data that can be displayed.

关键词： Graphical models Electronic circuits Circuit simulation Computational modeling Computational efficiency Displays Error analysis Root mean square Integrated circuit modeling Analog integrated circuits

来源：评论

学校读者我要写书评

暂无评论

A study of advanced modeling methodology of CMOS-compatible RF-MEMS devices for integrated circuit design

A study of advanced modeling methodology of CMOS-compatible ...

引用

International conference on Solid-State and Integrated Circuit Technology

作者： Wenzheng Wu Mengjun Jia Xinxin Li Yilong Hao Xing Zhang Yuhua Cheng School of Software and Microelectronics Peking University Shanghai China Shanghai Research Institute of Microelectronics (SHRIME) Peking University Shanghai China Shanghai Institute of Microsystem and Information Technology (SIMIT) Chinese Academy and Sciences Shanghai China School of Software and Microelectronics Peking University Beijing China

ISBN: (纸本)9781424421855

With the rapid development of CMOS-compatible MEMS technology, it has been used to improve the performance of monolithic integrated RF circuits. To take advantages of the MEMS devices in RF circuits, accurate models are needed, with the considerations of important effects that impact the electrical behavior of the devices. In this paper, we explore the modeling methodology for CMOS-compatible MEMS inductors, which are fabricated with two different process approaches. Based on device simulation results for mechanical and electrical behavior, we propose a SPICE-like model for CMOS-compatible RF-MEMS inductors used for integrated circuit design.

关键词： Integrated circuit modeling Radiofrequency microelectromechanical systems Integrated circuit synthesis Micromechanical devices Radio frequency Inductors CMOS technology Integrated circuit technology Microelectromechanical devices Circuit simulation

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共142页 << < 85 86 87 88 89 90 91 92 93 94 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：