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检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"
1419 条 记 录,以下是81-90 订阅
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Machine learning in charge: Automated behavioral modeling of charge pump circuits  16
Machine learning in charge: Automated behavioral modeling of...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Grabmann, Martin Landrock, Christian Gläser, Georg Ilmenau Germany X-FAB Global Services GmbH Erfurt Germany
Behavior models of Analog/Mixed-Signal (AMS) components are used in today’s System-on-Chip (SoC) verification mainly for improving simulation speed. In addition, they can be used to enable verification scenarios incl... 详细信息
来源: 评论
A mixed time-frequency RF simulation technique based on numerical time-slot partitioning  16
A mixed time-frequency RF simulation technique based on nume...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Oliveira, Jorge F. School of Technology and Management Polytechnic of Leiria Leiria Portugal Instituto de Telecomunicações University of Aveiro Aveiro Portugal
The increasing complexity of radio frequency (RF) architectures and the continuous push to profit from digital signal-processing techniques, have been addressing new challenges to circuit-level simulation. This paper ... 详细信息
来源: 评论
Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solder Balls
Nonlinear Superelement for the Reliability Assessment of Vis...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Mike Feuchter Hanna Baumgartl Martin Hanke Sven Rzepka CADFEM Germany GmbH Germany CADFEM Germany GmbH Berlin Germany Fraunhofer ENAS Chemnitz Germany
The paper proposes a novel approach to the modeling of the thermo-mechanical behavior of ball grid array (BGA) packages on printed circuit boards in the metal housing of electronic control units, which is needed for o... 详细信息
来源: 评论
Frequency-limited reduction of RLCK circuits via second-order balanced truncation  16
Frequency-limited reduction of RLCK circuits via second-orde...
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Axelou, Olympia Garyfallou, Dimitrios Floros, George Department of Electrical and Computer Engineering University of Thessaly Volos Greece
Second-order formulation using susceptance elements has become very effective in modeling on-chip inductive couplings. Several prior works have proposed model order reduction techniques for RLCK circuits, mostly based... 详细信息
来源: 评论
Waveguide Directional Coupler design Method  3
Waveguide Directional Coupler Design Method
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3rd IEEE KhPI Week on Advanced Technology, KhPI Week 2022
作者: Zaichenko, Olga Zaichenko, Nataliia Khoroshailo, Iurii Kharkiv National University of Radioelectronics Dept. of Design and Operation of Electronic Devices Kharkov Ukraine Kharkiv National University of Radioelectronics Electronic Devices and Appliances Dept. of Microelectronics Kharkov Ukraine
This work is devoted to directional couplers parameter calculation and verification by simulation in HFSS. The contradiction between the results 0 calculations and modeling is the problem of this research. A simplifie... 详细信息
来源: 评论
modeling Ni/ß-Ga2O3 SBD interface properties  16
Modeling Ni/ß-Ga2O3 SBD interface properties
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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021
作者: Labed, Madani Sengouga, Nouredine Meftah, Afak Park, Jun Hui Kyoung, Sinsu Kim, Hojoong Rim, You Seung Laboratory of Semiconducting Mettalic Materials University of Biskra 07000 Algeria Department of Intelligent Mechatronics Engineering and Convergence Engineering for Intelligent Drone Sejong University Seoul05006 Korea Republic of Research and Development Powercubesemi Inc. Sujeong-gu Seongnam-si Gyeonggi-do13449 Korea Republic of
In this work, Ni/ß-Ga2O3 Schottky diode deposited by electron-beam evaporation was studied. A detailed numerical simulation is carried out to reproduce the current-voltage measurement of Ni/ß- Ga2O3 Schottky... 详细信息
来源: 评论
Applying Machine Learning Methods to Signal Integrity Analysis
Applying Machine Learning Methods to Signal Integrity Analys...
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Ivannikov ISPRAS Open conference (ISPRAS)
作者: Alexey Zhigulin Mikhail Rogozhinskiy Roman Solovyev Dmitriy Telpukhov Nikolay Levchenko Alexander Stempkovskiy Leonid Pereverzev Dept. of automation of design of integrated circuits AlphaCHIP LLC Moscow Russia Dept. of design of integrated circuits AlphaCHIP LLC Moscow Russia Deputy General Director for Innovation Activities AlphaCHIP LLC Moscow Russia Deputy General Director for Research AlphaCHIP LLC Moscow Russia Department for Design Problems in Microelectronics NRC “Kurchatov institute” Moscow Russia General Director AlphaCHIP LLC Moscow Russia Deputy General Director AlphaCHIP LLC Moscow Russia
Voltage spikes caused by signal switching in adjacent circuits can lead to false switching and failures in integrated circuits. To identify such risks, signal integrity (SI) analysis is performed by extracting parasit... 详细信息
来源: 评论
Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions
Physics-of-Failure based Lifetime Prediction for Power Elect...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Albrecht Jain Horn Tobias Daniel Leonhard Hertenstein Rzepka Sven Fraunhofer ENAS Technologie Chemnitz Zentrum für Mikrotechnologien Technische Universität Chemnitz Chemnitz Germany Mercedes-Benz AG Boeblingen Germany
This study emphasizes the use of experimental and simulation methodologies to analyze the thermo-mechanical reliability of electronic components used in power electronics, particularly focusing on the Infineon 1200 V ... 详细信息
来源: 评论
SPICE modeling of Memristive Devices-Based Neural Networks
SPICE Modeling of Memristive Devices-Based Neural Networks
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International conference on microelectronics, MIEL
作者: F. L. Aguirre J. Suñé E. Miranda Dept. D’Enginyeria Electrònica Universitat Autònoma de Barcelona Cerdanyola del Vallès Spain
This paper reports a SPICE-based framework for circuit-level simulation of hybrid memristor/CMOS neural networks. By relying on ex-situ training, our approach systematizes the circuital representation of a neural netw...
来源: 评论
Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
Double-sided heat dissipation numerical modeling of an embed...
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Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE
作者: Wenyu Li Wei Chen Jing Jiang Wenbo Wang Xuejun Fan Guoqi Zhang Jiajie Fan Academy for Engineering & Technology Shanghai Engineering Technology Research Center of SiC Power Device Fudan University Shanghai China Yongjiang Laboratory Ningbo China Department of Mechanical Engineering Lamar University Beaumont USA EEMCS Faculty Delft University of Technology Delft the Netherlands Research Institute of Fudan University in Ningbo Ningbo China
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal mod...
来源: 评论