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16th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 15th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Sari, Ahmet Batur, Okan Zafer Kirimli, Ceyhun Istanbul Bilgi Univ Dept Elect & Elect Engn TR-34060 Istanbul Turkey Acibadem Univ Dept Med Engn TR-34342 Istanbul Turkey

ISBN: (纸本)9781728112015

In this paper, we present a wireless and electrode-less Quartz Crystal Microbalance (WE-QCM) sensor measurement system. The QCM characteristics are measured using a network analyzer and microstrip antennas and the results are modeled by Butterworth Van Dyke (BVD) electrical equivalent circuit model. The WE-QCM model and the proposed energy detection transceiver based wireless measurement system are simulated using analog mixed signal (AMS) tools. The mixed signal simulations show that less than 0.5 kHz sensitivity in frequency variations can be achieved with the proposed system model.

关键词： Equivalent circuits

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An efficient modeling approach for large ring oscillator based ising machines 16

An efficient modeling approach for large ring oscillator bas...

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2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021

作者： Graber, Markus Angeli, Nico Hofmann, Klaus Integrated Electronic Systems Lab. Technical University of Darmstadt Darmstadt Germany

ISBN: (纸本)9783800755899

Using the Ising model for computation of optimization problems is getting more and more popular. A very promising approach is the use of electrical oscillators, often called Oscillator-based Ising machine (OIM), integrated on a single silicon die. A new modeling approach to handle the complexity of large networks during the design phase is proposed. The simulation runtime is significantly reduced while valuable design insight is provided. It helps to understand the relation between circuit level properties and Ising machine behaviour. It is easy to use and has minimal requirements on the circuit topology. All relevant properties used for the proposed modeling approach are extracted from a transistor-based implementation by a circuit simulator. Systems with large number of nodes can be fast and accurately analyzed and optimized for their computation ability. © VDE VERLAG GMBH.

关键词： Oscillators (electronic)

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Automated Method Using Finite Element simulation to Identify Microvia Stacks at Risk of Separation in Complex PCB designs 20

Automated Method Using Finite Element Simulation to Identify...

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20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Kalayeh, Kourosh Hernandez, Natalie Hillman, Craig Blattau, Nathan DfR Solut 9000 Virginia Manor RdSte 290 Beltsville MD 20705 USA

ISBN: (纸本)9781538680407

The electronic industry recently experienced a sudden increase in microvia failures in printed circuit boards during the reflow process. The failures occurred specifically on triple-stack microvias placed over a buried via. The failure mechanisms included separation of the microvia from the capture pad and ductile tearing of the copper flanges. The sudden onset of these failures was due to the electronics industry's over-reliance on design rules to avoid PCB issues. The flaw in design rules is their reliance on lessons learned from previous designs and the assumption that new designs are sufficiently similar to older designs. This pervasive failure mode across multiple industries and designs is evidence that a new, more robust technique based on reliability physics is required for future, high density electronic hardware designs. We propose a technique that takes advantage of finite element modeling and industry research to predict the reliability and manufacturability of microvias.

关键词： Copper Integrated circuit reliability Integrated circuit interconnections Stress Strain Integrated circuit modeling

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NUMERICAL modeling OF FLEXIBLE ACTUATOR FOR DYNAMIC LIGHTING

NUMERICAL MODELING OF FLEXIBLE ACTUATOR FOR DYNAMIC LIGHTING

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15th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems, (EuroSimE)

作者： Ma, Teng Li, Xueming Wei, Jia Zhang, G. Q. Sarro, P. M. Delft Univ Technol Elect Components Technol & Mat Lab ECTM Delft Netherlands

ISBN: (纸本)9781479947904

We presented the numerical modeling of flexible actuator in the application of dynamic lighting. In order to analyze the Lorentz force exerted on the actuator, we first modeled the surrounding magnetic flux of the magnet. With appropriate layout design, the Lorentz force density distribution was then analyzed. The modeling provides us the overview of the Lorentz force density distribution, and thus the movement of the actuator which is crucial for the dynamic lighting system.

关键词： Lorentz force

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Improving ICs reliability with high speed thermal mapping

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INTEGRATION-THE VLSI JOURNAL 2018年 63卷 342-350页

作者： Panarello, S. Triolo, C. Garesci, F. Patane, S. Denaro, R. Univ Messina Messina Italy Univ Messina Appl Mech Messina Italy ST Microelect Catania Italy

The power elements are the weak parts of integrated circuits (ICs), in fact, through these elements the power is usually dissipated as heat with unavoidable thermal and mechanical stress. On the contrary the logic parts of ICs stay at lower temperatures. This gives rise to two effects: the non-uniform generation of the heat across the die and the temperature gradients. Understanding these phenomena is very important to choose the right location of sensitive components, like thermal sensors, in order to improve reliability. As a consequence, the knowledge of the temporal evolution of the temperature distribution plays a very important role to improve both design and lifetime. Here we show how a single IR sensor based experimental setup is suitable to catch very fast thermal events performing high spatial resolution. We demonstrate the effectiveness of the method maps for three IC samples where an accurate thermal modeling for reliability has been obtained and validated, greatly improving the overall quality.

关键词： Power and thermal modeling Thermal analysis Reliability Fault modeling Failure analysis Analysis of aging and thermal stress Thermography Voltage regulators

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Bringing Analog design Tools to Security: modeling and Optimization of a Low Area Probing Detector 15

Bringing Analog Design Tools to Security: Modeling and Optim...

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15th International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design (SMACD) / 14th conference on PhD Research in microelectronics and Electronics (PRIME)

作者： Hermann, Andreas Weiner, Michael Pehl, Michael Graebl, Helmut Tech Univ Munich Chair Elect Design Automat Munich Germany Tech Univ Munich Chair Secur Informat Technol Munich Germany

ISBN: (纸本)9781538651537

In this paper a probing detector consisting of digital gates is optimized. Probing attempt detectors are a solution for on-chip protection against probing of interconnects. They measure a wire and raise an alarm if an additional capacitance is recognized. The required additional circuitry for such detectors introduce area overhead. It copes with the tradeoff between low area overhead, low number of false alarms, and detectability of probes with very small capacitances. A simulation-based optimization of a specific probing detector architecture results in an improvement in probing sensitivity from 40fF to 20fF at low area overhead and with a low probability of false alarms.

关键词： Optimization methods applied to circuit and system design Synthesis methods of multi-domain circuits and systems Security

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design and modeling of One-port SAW Resonator at 2.45 GHz for Wireless Application Base on GaPO₄

Design and Modeling of One-port SAW Resonator at 2.45 GHz fo...

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International conference microelectronics (ICM 2008)

作者： Mousavi, Sayed Alireza Ali, Aidy Hamidon, Mohd Nizar Rahimi, M. Sidek, Roslina Khabbazi, M. R. Bayat, M. Univ Putra Malaysia Dept Elect & Elect Engn Serdang 43300 Malaysia Univ Putra Malaysia Dept Mech & Mfg Syst Engn Serdang Malaysia

ISBN: (纸本)9781424423699

This paper presents the full design, operational principle, structure and frequency response simulation of one-port Surface Acoustic Wave (SAW) Resonator using Micro Wave Office (MWO) and MATLAB used for passive wireless sensing of various measurands. Since SAW Resonators are widely used in radio frequency sensing application, the development and evolution of present day SAW devices has been possible only due to simultaneous efforts to simulate these devices and also it is desirable to evaluate the device prior to fabrication especially in cases where the characteristic of device material and dimensions have a major influence on the performance of the overall system. The equivalent circuit model approach has been used to simulate the frequency response of one-port SAW resonator base on gallium orthophosphate (GaPO4) with 5 degrees cut-angle at 2.45 GHz under ISM band frequency for high temperature wireless application and it appears that this modeling is suitable for near resonance frequency, also measuring dielectric permittivity of GaPO4 at this frequency for use of modeling.

关键词： Equivalent circuits

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Advanced modeling Methodology for expedient RF SoC Verification and Performance Estimation 15

Advanced Modeling Methodology for expedient RF SoC Verificat...

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作者： Speicher, Fabian Meier, Jonas Beyerstedt, Christoph Wunderlich, Ralf Heinen, Stefan Rhein Westfal TH Aachen Integrated Analog Circuits & RF Syst Aachen Germany

ISBN: (纸本)9781538651537

While the complexity of modern RF systems on chip grows significantly, the methods for functional verification can not hold pace. Powerful tools, that are available for the verification of purely digital systems are missing for analog/mixed-signal systems. This paper proposes a method to improve the capabilities of a high level programming language to verify an AMS system design covering RF performance issues. This is done in Cadence using SystemVerilog HDL and a direct programming interface to C++. As an example, a signal representation and signal processing in the spectral domain to handle the issues of nonlinear frequency conversion is presented.

关键词： C++ languages Radio frequency Harmonic analysis Mixers Analog circuits Hardware design languages"

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Board level drop reliability study and orthotropic PCB material property test methodology 19

Board level drop reliability study and orthotropic PCB mater...

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19th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Li, Jue Myllykoski, Pirkka Huang, Cong Hussa, Esa Hu, Dongmin Kou, Dahe Huawei Technol Oy Finland Co Ltd Finland R&D Ctr Reliabil Competence Ctr Helsinki Finland Huawei Technol Co Ltd Consumer BG Simulat Lab Shenzhen Peoples R China

ISBN: (纸本)9781538623596

Board-level drop reliability including BGA solder joint failure, PCB cratering and Cu-trace cracking, etc., has been challenges to the whole industry for decades. The trend of consumer electronics is moving towards higher density and thinner PCB design, which raises a strong need for drop durability design. In this work, the focus is placed on board-level relaiblity of portable consumer electronics such as mobile phones. Compared to homogeneous material model, orthotropic model is a more realistic representative of a multilayer composite material like PCB. For better simulation accuracy, a novel method has been used for testing orthotropic PCB material property through acoustic vibration, laser vibrometer, and material property fitting via Hyperstudy optimization tool. A Johnson-Cook material model for solder has been used, which gives more accurate simulation results when the material is subjected to high strain rates during a drop impact. In additional, a-submodeling approach is employed for detailed solder bump and Cu pad/trace stress and strain distribution. As a conclusion, the simulation accuracy has been significantly improved by adopting the orthotropic PCB material property, J-C solder model, and sub-modeling technology, which provides a solid foundation for the lifetime prediction of various BGA and PCB failures.

关键词： Strain Load modeling Stress Material properties Computational modeling Iron Vibrometers

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Numerical simulation of Reflow Soldering 20

Numerical Simulation of Reflow Soldering

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20th International conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in microelectronics and Microsystems (EuroSimE)

作者： Stadler, Michael Infineon Technol AG Campeon 1-15 D-85579 Neubiberg Germany

ISBN: (纸本)9781538680407

To guarantee a high level of solder joint durability for soft solder die attach, a uniform bond line thickness is crucial. In addition, for high electrical performance, a low void concentration is desirable. However, these goals arc difficult to achieve during reflow soldering. The die tilt and the formation of voids are mainly controlled by fluid forces. We develop a fluid dynamical model to better understand these mechanisms. The model is validated using experimental data. In order to use the model for design improvement, the simulation model is coupled with a genetic optimization algorithm. This arrangement can help to develop designs which lead to (a) uniform bond line thickness and (b) minimal void concentration. Furthermore, advanced search strategies act as an enabler for the generation of innovative design features. They may in turn foster the formulation of new intellectual property. To illustrate the spectrum of possible application scenarios, we show three industrial use cases.

关键词： Semiconductor device modeling Liquids Optimization Mathematical model Reflow soldering

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