检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

1,367 篇 会议
46 篇 期刊文献
6 册 图书

馆藏范围

1,419 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

615 篇 工学
- 387 篇 电气工程
- 246 篇 电子科学与技术（可...
- 221 篇 计算机科学与技术...
- 128 篇 材料科学与工程（可...
- 119 篇 软件工程
- 89 篇 机械工程
- 66 篇 动力工程及工程热...
- 59 篇 控制科学与工程
- 42 篇 化学工程与技术
- 35 篇 信息与通信工程
- 31 篇 仪器科学与技术
- 23 篇 力学（可授工学、理...
- 15 篇 冶金工程
- 15 篇 生物医学工程（可授...
- 10 篇 建筑学
- 9 篇 光学工程
- 9 篇 土木工程
- 8 篇 交通运输工程
- 8 篇 安全科学与工程
- 7 篇 生物工程
255 篇 理学
- 146 篇 物理学
- 116 篇 数学
- 45 篇 化学
- 22 篇 系统科学
- 10 篇 生物学
- 10 篇 统计学（可授理学、...
38 篇 管理学
- 37 篇 管理科学与工程(可...
8 篇 医学
- 7 篇 临床医学
- 6 篇 基础医学(可授医学...
- 5 篇 药学(可授医学、理...
4 篇 法学
4 篇 艺术学
2 篇 农学
1 篇 经济学
1 篇 教育学

主题

272 篇 computational mo...
230 篇 integrated circu...
190 篇 circuit simulati...
179 篇 microelectronics
126 篇 semiconductor de...
115 篇 analytical model...
107 篇 solid modeling
96 篇 mathematical mod...
65 篇 simulation
61 篇 silicon
58 篇 predictive model...
53 篇 hardware design ...
53 篇 micromechanical ...
50 篇 load modeling
50 篇 hardware
49 篇 cmos technology
47 篇 spice
45 篇 design automatio...
43 篇 logic gates
42 篇 finite element a...

机构

13 篇 institute of mic...
13 篇 institute of mic...
12 篇 institute of mic...
7 篇 institute of mic...
6 篇 department of mi...
6 篇 institute of mic...
6 篇 department of mi...
6 篇 school of softwa...
5 篇 school of microe...
5 篇 nxp semiconducto...
5 篇 national microel...
5 篇 school of microe...
5 篇 institute of mic...
5 篇 philips applied ...
5 篇 imec leuven
5 篇 institute of mic...
5 篇 amic angewandte ...
5 篇 agilent technol ...
5 篇 delft university...
4 篇 shanghai researc...

作者

10 篇 xiaowu zhang
10 篇 roca e.
9 篇 castro-lopez r.
9 篇 a. napieralski
8 篇 rodriguez r.
8 篇 nafria m.
7 篇 l.j. ernst
7 篇 g.q. zhang
7 篇 martin-martinez ...
7 篇 sven rzepka
7 篇 fernandez f. v.
7 篇 s. selberherr
7 篇 zhang gq
6 篇 andrzej napieral...
6 篇 m.k. iyer
6 篇 ru huang
6 篇 n. ranganathan
6 篇 k.m.b. jansen
5 篇 khaoula mbarek
5 篇 sami ghedira

语言

1,403 篇 英文
10 篇 中文
3 篇 德文
3 篇 其他

检索条件"任意字段=Conference on Design, Modeling, and Simulation in Microelectronics"

共 1419 条记录，以下是81-90 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Machine learning in charge: Automated behavioral modeling of charge pump circuits 16

Machine learning in charge: Automated behavioral modeling of...

引用

2021 International conference on Synthesis, modeling, Analysis and simulation Methods and Applications to Circuit design, SMACD 2021 and 16th conference on PhD Research in microelectronics and Electronics, PRIME 2021

作者： Grabmann, Martin Landrock, Christian Gläser, Georg Ilmenau Germany X-FAB Global Services GmbH Erfurt Germany

ISBN: (纸本)9783800755899

Behavior models of Analog/Mixed-Signal (AMS) components are used in today’s System-on-Chip (SoC) verification mainly for improving simulation speed. In addition, they can be used to enable verification scenarios including back-box intellectual properties (IP). Writing and maintaining such models is still time consuming and prevents widespread use. One class of essential building blocks are on-chip charge pumps (CP), which enable a variety of different features in SoCs e.g. embedded nonvolatile memory solutions. This contribution presents a novel concept for automating the generation of grey-box behavior models of charge pump circuits using a Machine Learning (ML) approach. Compared to classical modeling approaches, it is not necessary to formulate an analytic description specific to the used circuit topology. The applicability of the approach is presented in a case study using an industrial charge pump design. © VDE VERLAG GMBH.

关键词： Timing circuits

来源：评论

学校读者我要写书评

暂无评论

A mixed time-frequency RF simulation technique based on numerical time-slot partitioning 16

A mixed time-frequency RF simulation technique based on nume...

引用

作者： Oliveira, Jorge F. School of Technology and Management Polytechnic of Leiria Leiria Portugal Instituto de Telecomunicações University of Aveiro Aveiro Portugal

ISBN: (纸本)9783800755899

The increasing complexity of radio frequency (RF) architectures and the continuous push to profit from digital signal-processing techniques, have been addressing new challenges to circuit-level simulation. This paper describes the most relevant details of a time-frequency simulation technique specially conceived for the efficient numerical simulation of circuits whose stimuli are turned on and off for unknown periods of time, as is the case of RF circuits managing signals coded in some on-off digital scheme. The proposed technique is based on a time-slot partition stratagem with automatic switching between different numerical schemes (multitime envelope transient harmonic balance and time-step integration) along the simulation process, according to the on-off state of the circuits’ stimuli. simulation tests performed in an illustrative application example, an on-off amplitude shift keying (ASK/OOK) transmitter used in low-power applications, as radio frequency identification (RFID) or biomedical imaging, revealed significant gains in computational speed over commercial computer-aided design tools. © VDE VERLAG GMBH.

关键词： Timing circuits

来源：评论

学校读者我要写书评

暂无评论

Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solder Balls

Nonlinear Superelement for the Reliability Assessment of Vis...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Mike Feuchter Hanna Baumgartl Martin Hanke Sven Rzepka CADFEM Germany GmbH Germany CADFEM Germany GmbH Berlin Germany Fraunhofer ENAS Chemnitz Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

The paper proposes a novel approach to the modeling of the thermo-mechanical behavior of ball grid array (BGA) packages on printed circuit boards in the metal housing of electronic control units, which is needed for optimizing the design for reliability. The new approach reduces the computational effort significantly without compromising the result accuracy. The method is based on a modular system of reduced-order models (ROMs). Specifically, the energy-conserving sampling and weighting method (ECSW) for capturing complex material behavior is discussed as a key enabler. After introducing the method for a single solder ball, it is extended to the representation of all solder balls of the BGA by the same ROM in order to enable its application for practical cases. The results obtained with this 'Combined ROM' are compared with those of regular FEA in terms of accuracy and computational effort.

关键词： Micromechanical devices Accuracy Thermomechanical processes Printed circuits Metals Reliability engineering Reduced order systems microelectronics Integrated circuit reliability Read only memory

来源：评论

学校读者我要写书评

暂无评论

Frequency-limited reduction of RLCK circuits via second-order balanced truncation 16

Frequency-limited reduction of RLCK circuits via second-orde...

引用

作者： Axelou, Olympia Garyfallou, Dimitrios Floros, George Department of Electrical and Computer Engineering University of Thessaly Volos Greece

ISBN: (纸本)9783800755899

Second-order formulation using susceptance elements has become very effective in modeling on-chip inductive couplings. Several prior works have proposed model order reduction techniques for RLCK circuits, mostly based on balanced truncation (BT) and moment matching, providing reduced-order models (ROMs) that can be simulated over the whole frequency range. However, in most applications, the ROMs are simulated only at specific frequency windows, which means that established methods usually provide models that may become unnecessarily large to achieve approximation over all frequencies. In this paper, we present a second-order frequency-limited approach for RLCK circuits, which may be combined with efficient low-rank Lyapunov solvers, leading to ROMs which are either smaller or exhibit better accuracy compared to an established second-order BT method. Experimental results on interconnect bus structures demonstrate the advantages of the proposed method. © VDE VERLAG GMBH.

关键词： Circuit simulation

来源：评论

学校读者我要写书评

暂无评论

Waveguide Directional Coupler design Method 3

Waveguide Directional Coupler Design Method

引用

3rd IEEE KhPI Week on Advanced Technology, KhPI Week 2022

作者： Zaichenko, Olga Zaichenko, Nataliia Khoroshailo, Iurii Kharkiv National University of Radioelectronics Dept. of Design and Operation of Electronic Devices Kharkov Ukraine Kharkiv National University of Radioelectronics Electronic Devices and Appliances Dept. of Microelectronics Kharkov Ukraine

ISBN: (数字)9798350399202

ISBN: (纸本)9798350399202

This work is devoted to directional couplers parameter calculation and verification by simulation in HFSS. The contradiction between the results 0 calculations and modeling is the problem of this research. A simplified method is proposed for calculating the radii of the holes of a directional coupler, which consists in central hole radii calculating, on the basis of the parameter of required coupling, which differs by using the Newton binomial coefficient, so the radius of the current hole is calculated as the radius of the central hole which is divided by coefficient. The coefficient is the cube root of the of the binomial polynomial numbers ratio, where polynomial numbers correspond to central and current hole. The cube root of number is a value which when multiplied by itself thrice or three times produces the original value. © 2022 IEEE.

关键词： Directional couplers

来源：评论

学校读者我要写书评

暂无评论

modeling Ni/ß-Ga2O3 SBD interface properties 16

Modeling Ni/ß-Ga2O3 SBD interface properties

引用

作者： Labed, Madani Sengouga, Nouredine Meftah, Afak Park, Jun Hui Kyoung, Sinsu Kim, Hojoong Rim, You Seung Laboratory of Semiconducting Mettalic Materials University of Biskra 07000 Algeria Department of Intelligent Mechatronics Engineering and Convergence Engineering for Intelligent Drone Sejong University Seoul05006 Korea Republic of Research and Development Powercubesemi Inc. Sujeong-gu Seongnam-si Gyeonggi-do13449 Korea Republic of

ISBN: (纸本)9783800755899

In this work, Ni/ß-Ga2O3 Schottky diode deposited by electron-beam evaporation was studied. A detailed numerical simulation is carried out to reproduce the current-voltage measurement of Ni/ß- Ga2O3 Schottky diode and extract the Ni/ß- Ga2O3 interface properties. For more agreement between simulation and measurement the effect of Ni workfunction, Si-doped ß-Ga2O3 surface electron affinity and traps concentration were studied. © VDE VERLAG GMBH.

关键词： Gallium compounds

来源：评论

学校读者我要写书评

暂无评论

Applying Machine Learning Methods to Signal Integrity Analysis

Applying Machine Learning Methods to Signal Integrity Analys...

引用

Ivannikov ISPRAS Open conference (ISPRAS)

作者： Alexey Zhigulin Mikhail Rogozhinskiy Roman Solovyev Dmitriy Telpukhov Nikolay Levchenko Alexander Stempkovskiy Leonid Pereverzev Dept. of automation of design of integrated circuits AlphaCHIP LLC Moscow Russia Dept. of design of integrated circuits AlphaCHIP LLC Moscow Russia Deputy General Director for Innovation Activities AlphaCHIP LLC Moscow Russia Deputy General Director for Research AlphaCHIP LLC Moscow Russia Department for Design Problems in Microelectronics NRC “Kurchatov institute” Moscow Russia General Director AlphaCHIP LLC Moscow Russia Deputy General Director AlphaCHIP LLC Moscow Russia

ISBN: (数字)9798331526023

ISBN: (纸本)9798331526030

Voltage spikes caused by signal switching in adjacent circuits can lead to false switching and failures in integrated circuits. To identify such risks, signal integrity (SI) analysis is performed by extracting parasitic RC networks, followed by SPICE simulation or application of analytical methods. However, this process is time-consuming. This research proposes using machine learning methods to rapidly and accurately predict the results of SI analysis without the need for computationally expensive modeling. It accelerates SI analysis a lot with low accuracy losses. Also, this paper introduces new reduction model for victim-aggressor pair that is more accurate than previously used.

关键词： Analytical models Accuracy Computational modeling Machine learning Predictive models SPICE Data models Integrated circuit modeling Signal integrity Switching circuits

来源：评论

学校读者我要写书评

暂无评论

Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions

Physics-of-Failure based Lifetime Prediction for Power Elect...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Albrecht Jain Horn Tobias Daniel Leonhard Hertenstein Rzepka Sven Fraunhofer ENAS Technologie Chemnitz Zentrum für Mikrotechnologien Technische Universität Chemnitz Chemnitz Germany Mercedes-Benz AG Boeblingen Germany

ISBN: (数字)9798350393002

ISBN: (纸本)9798350393019

This study emphasizes the use of experimental and simulation methodologies to analyze the thermo-mechanical reliability of electronic components used in power electronics, particularly focusing on the Infineon 1200 V SiC halfbridge module under WLTP (Worldwide Harmonized Light Vehicles Test Procedure) driving cycle conditions. The paper highlights the discrepancies in traditional design studies which often overlook the interaction of load sequences during a component's lifetime. By employing a computational efficient approach that includes coupled simulations and validated lifetime models, the study provides a more realistic assessment of component degradation, which is crucial for ensuring the reliability of power modules in variable operational conditions. The results of the study validate the computational models against experimental data and demonstrate the potential for using these methods in future design for Reliability studies based on mission profiles, as well as providing a basis for the development of surrogate models towards a digital twin representation.

关键词： Analytical models Computational modeling Thermomechanical processes Multichip modules Predictive models Power electronics Data models Transient analysis Stress Load modeling

来源：评论

学校读者我要写书评

暂无评论

SPICE modeling of Memristive Devices-Based Neural Networks

SPICE Modeling of Memristive Devices-Based Neural Networks

引用

International conference on microelectronics, MIEL

作者： F. L. Aguirre J. Suñé E. Miranda Dept. D’Enginyeria Electrònica Universitat Autònoma de Barcelona Cerdanyola del Vallès Spain

This paper reports a SPICE-based framework for circuit-level simulation of hybrid memristor/CMOS neural networks. By relying on ex-situ training, our approach systematizes the circuital representation of a neural network given a set of high-level design parameters. As a key element of simulations, we put special emphasis on the use of a recently developed compact model to represent the electrical characteristics of memristors. The model is called the Dynamic Memdiode Model (DMM) and is based on L. Chua’s theory for memristive devices. The model comprises two equations: one equation for the electron transport and one equation for the displacement of metal ions or oxygen vacancies caused by the application of the external electric field. We show how the proposed simulation framework allows to assess the influence of the circuit parasitics as well as the device non-idealities on the performance metrics of neural networks.

关键词：

来源：评论

学校读者我要写书评

暂无评论

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Double-sided heat dissipation numerical modeling of an embed...

引用

Thermal, Mechanical and Multiphysics simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

作者： Wenyu Li Wei Chen Jing Jiang Wenbo Wang Xuejun Fan Guoqi Zhang Jiajie Fan Academy for Engineering & Technology Shanghai Engineering Technology Research Center of SiC Power Device Fudan University Shanghai China Yongjiang Laboratory Ningbo China Department of Mechanical Engineering Lamar University Beaumont USA EEMCS Faculty Delft University of Technology Delft the Netherlands Research Institute of Fudan University in Ningbo Ningbo China

Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numerical models, which are computationally fast and accurate, has rarely been investigated for double-sided heat dissipation scenarios. This paper proposes a numerical heat conduction model of a double-sided heat dissipation power module with multiple chips embedded. The model was developed by solving Laplace’s equation for the temperature distribution of steady state heat transfer using the separated variable method. The individual chip placement, two-chip distance and orientation, and four-chip placement were discussed through this modeling approach. The optimal layout was found. Then, a half-bridge topology module that consisted of two chips was investigated. To verify the accuracy of the numerical model, Finite Element Analysis (FEA) of the model was performed using the same boundary conditions. The experiments were applied on the power cycling tester to extract the junction temperature and case temperature. The numerical methods show good temperature prediction accuracy compared to both FEA and experiments.

关键词：

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共142页 << < 5 6 7 8 9 10 11 12 13 14 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：