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检索条件"任意字段=Conference on Design for Manufacturability through Design-Process Integration"
5152 条 记 录,以下是1-10 订阅
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Optimizing profiled ring preforms for enhanced deformation uniformity using the isothermal field method
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THIN-WALLED STRUCTURES 2024年 202卷
作者: Han, Yan Wang, Menghan He, Yu Zheng, Yuanyuan Li, Xin Chongqing Univ Sch Mat Sci & Engn Chongqing 400030 Peoples R China AVIC Guizhou ANDA Aviat Forging Co Ltd Anshun 561000 Peoples R China
One of the main challenges faced by the profiled ring rolling (PRR) process is to ensure the deformation uniformity of the ring, which is closely related to the design of the ring preform. The paper explores the appli... 详细信息
来源: 评论
Pre-AI and post-AI design: Balancing human Creativity and AI Tools in the Industrial design process  24
Pre-AI and post-AI design: Balancing human Creativity and AI...
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2024 International conference on Artificial Intelligence and Future Education, AIFE 2024
作者: Tang, Xilin Windham, Jerrod Bush, Benjamin School of Industrial and Graphic Design Auburn University AuburnAL United States
The advancement of Artificial Intelligence (AI) is reshaping industrial design by enhancing creativity and productivity. This study explores the integration of AI tools-specifically ChatGPT, DALL·E, Midjourney, a... 详细信息
来源: 评论
IMVR: ENABLING IMMERSIVE design EXPLORATION AND process integration FOR ADDITIVE MANUFACTURING OF COMPLEX ORGANIC GEOMETRIES  19
IMVR: ENABLING IMMERSIVE DESIGN EXPLORATION AND PROCESS INTE...
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ASME 19th International Manufacturing Science and Engineering conference (MSEC) held jointly with the 52nd North American Research conference (NAMRC)
作者: Aryall, Manish Raj Deshpandel, Sourabh Aurisano, Jillian Anand, Sam Univ Cincinnati Ctr Global Design & Mfg Dept Mech & Mat Engn Cincinnati OH 45221 USA Univ Cincinnati Smart Mfg Lab Digital Futures Cincinnati OH 45206 USA Univ Cincinnati Dept Comp Sci DaVInCi Lab Cincinnati OH 45221 USA
Evaluating and representing intricate design, simulation, and process outcomes for organic geometries can present limitations on traditional computing devices (computers, phones, and tablets) and remains a formidable ... 详细信息
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INCLUSION OF manufacturability CONSIDERATIONS ON design OPTIMIZATION OF A COMPOSITE ROTOR BLADE
INCLUSION OF MANUFACTURABILITY CONSIDERATIONS ON DESIGN OPTI...
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ASME 2024 International Mechanical Engineering Congress and Exposition, IMECE 2024
作者: Wall, Emily S. Haehnel, Robert B. Sharma, Gehendra S. Dalton, Larry McCall, Tonya G. Dettwiller, Ian Huberty, Wayne Center for Advanced Vehicular Systems Mississippi State University StarkvilleMS United States US Army Engineer Research and Development Center HanoverNH United States Institute for Systems Engineering Research Mississippi State University StarkvilleMS United States Center for Advanced Vehicular Systems Extension Mississippi State University CantonMS United States US Army Engineer Research and Development Center VicksburgMS United States Advanced Composites Institute Mississippi State University StarkvilleMS United States
The optimization of rotor blade aerodynamic and structural design is pivotal for enhancing overall rotorcraft performance in terms of, e.g., reduced power requirements and energy consumption, and increased range and c... 详细信息
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design of a High Jitter Harmonic Injected Ring Oscillator for Entropy Sources
Design of a High Jitter Harmonic Injected Ring Oscillator fo...
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2024 IEEE International conference on Integrated Circuits, Technologies and Applications, ICTA 2024
作者: Ye, Ziyang Ikeda, Makoto University of Tokyo Tokyo Japan
in the field of modern cryptography and-information security, the generation of random numbers is crucial, with the quality of the entropy source being paramount. This study explores the design of Ring Oscillator (RO)... 详细信息
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Co-design of Structural Timber Components through Automated Model Generation for Manufacturing Simulation of Reconfigurable Manufacturing Systems  29
Co-Design of Structural Timber Components through Automated ...
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29th International conference on Mechatronics and Machine Vision in Practice (M2VIP)
作者: Kaiser, Benjamin Verl, Alexander Univ Stuttgart Inst Control Engn Machine Tools & Mfg Units Stuttgart Germany
Manufacturing of products with high variability and small batch sizes, such as prefabricated timber building components, presents significant manufacturing challenges. In urban areas, the construction industry's r... 详细信息
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integration of Structural Analysis and Manufacturing process Planning for Global Optimization with Automated Fiber Placement
Integration of Structural Analysis and Manufacturing Process...
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SAMPE 2024 conference and Exhibition
作者: Noevere, August Jamora, Von Harik, Ramy Collier Research Corporation Newport NewsVA23606 United States University of South Carolina ColumbiaSC29208 United States
design of mass-efficient composite structures intended for Automated Fiber Placement (AFP) requires close interaction between structural analysis and manufacturing process planning. Tools exist for each of these disci... 详细信息
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Automated IC design Flow Using Open-Source Tools and 180 nm PDK  67
Automated IC Design Flow Using Open-Source Tools and 180 nm ...
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67th IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
作者: Jaramillo-Toral, Uriel Carlos Garcia-Lopez, Juan Ortega-Cisneros, S. Isaac Baungarten-Leon, Emilio Tones-Gonzalez, Cristian Sandoval-Ibarra, F. CINVESTAV GDL Zapopan Jalisco Mexico
This paper presents an academic project leveraging open-source tools, particularly OpenLane, in conjunction with the 180 nm process design Kit (PDK) provided by GlobalFoundries, for automating Integrated Circuit (IC) ... 详细信息
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A New Era of DFM Solution for Yield Enhancement Using Machine Learning (ML)  3
A New Era of DFM Solution for Yield Enhancement Using Machin...
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conference on DTCO and Computational Patterning III
作者: Kim, Namjae Kang, Jae-Hyun Jung, SangWoo Jang, DeaHyun Kim, ByungMoo Jeon, JoongWon Ku, Ja-Hum Madkour, Kareem Kwan, Joe SAMSUNG Elect Co Ltd Hwaseong Si Gyeonggi Do South Korea Siemens EDA Cairo Egypt Siemens EDA Fremont CA USA
The yield of the deep sub-micron semiconductor is secured by the process capability as well as the yield-friendly design capability. Yield-friendly design capabilities can be equipped with conventional design for Manu... 详细信息
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A process design Method for Multichip Module using Model Based Definition  23
A Process Design Method for Multichip Module using Model Bas...
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23rd International conference on Electronic Packaging Technology (ICEPT)
作者: Li, Yang Wu, Yilong Chen, Chunmei Zhang, Yanming Hou, Qifeng Zeng, Ce 29th Res Inst CETC Dept Microwave Integrat Ctr Chengdu Peoples R China
Benefit from high performance, high integration density, high heat dissipation and relatively low cost, the application of MCM (multichip module) has spread from military, aerospace and mainframe computers to electron... 详细信息
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