检索结果-内蒙古大学图书馆

您好，读者！请登录

内蒙古大学图书馆

首页
概况
党建
资源
服务
科研支持
- 论文收录引用证明
- 科技查新
知识产权
档案馆
帮助

咨询与建议

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

您的常用邮箱：*

您的手机号码：*

问题描述：

当前已输入0个字，您还可以输入200个字

全部搜索
期刊论文
图书
学位论文
标准
纸本馆藏
外文资源发现
数据库导航
超星发现

高级检索

时间限定

出版年份：

文献类型

图书期刊文献学位论文多媒体

馆藏选择

电子馆藏纸本馆藏

核心期刊

全部期刊 SCI 收录期刊 SSCI 收录期刊 EI 收录期刊 CSCD 收录期刊 CSSCI 收录期刊

语言

中文英文

文献类型

期刊文献图书学位论文标准纸本馆藏

帮助

文字说明：

T=题名（书名、题名），A=作者（责任者），K=主题词，P=出版物名称，PU=出版社名称，O=机构（作者单位、学位授予单位、专利申请人），L=中图分类号，C=学科分类号，U=全部字段，Y=年（出版发行年、学位年度、标准发布年）

检索规则说明：

AND代表“并且”；OR代表“或者”；NOT代表“不包含”；(注意必须大写,运算符两边需空一格)

检索范例：

范例一：(K=图书馆学 OR K=情报学) AND A=范并思 AND Y=1982-2016
范例二：P=计算机应用与软件 AND (U=C++ OR U=Basic) NOT K=Visual AND Y=2011-2016

分类表

所选分类

>> <<

限定检索结果

文献类型

4,839 篇 会议
299 篇 期刊文献
11 篇 学位论文
3 册 图书

馆藏范围

5,152 篇 电子文献
0 种 纸本馆藏

日期分布

学科分类号

3,455 篇 工学
- 1,655 篇 计算机科学与技术...
- 1,014 篇 软件工程
- 894 篇 机械工程
- 826 篇 电气工程
- 424 篇 控制科学与工程
- 353 篇 土木工程
- 342 篇 材料科学与工程（可...
- 295 篇 电子科学与技术（可...
- 268 篇 建筑学
- 253 篇 化学工程与技术
- 237 篇 动力工程及工程热...
- 235 篇 信息与通信工程
- 166 篇 航空宇航科学与技...
- 148 篇 石油与天然气工程
- 137 篇 环境科学与工程（可...
- 123 篇 力学（可授工学、理...
- 106 篇 冶金工程
- 98 篇 仪器科学与技术
- 93 篇 安全科学与工程
- 88 篇 生物工程
1,262 篇 理学
- 578 篇 物理学
- 437 篇 数学
- 158 篇 化学
- 143 篇 系统科学
- 103 篇 生物学
1,174 篇 管理学
- 1,087 篇 管理科学与工程(可...
- 510 篇 工商管理
- 166 篇 图书情报与档案管...
299 篇 教育学
- 297 篇 教育学
200 篇 经济学
- 194 篇 应用经济学
91 篇 法学
89 篇 医学
22 篇 艺术学
19 篇 农学
15 篇 文学
11 篇 军事学
1 篇 历史学

主题

160 篇 process design
156 篇 very large scale...
124 篇 process control
121 篇 silicon
121 篇 product design
98 篇 design
90 篇 integration
89 篇 design for manuf...
85 篇 manufacturing
84 篇 optimization
78 篇 costs
71 篇 lithography
71 篇 dfm
69 篇 through-silicon ...
67 篇 students
61 篇 packaging
59 篇 testing
58 篇 computer archite...
57 篇 design engineeri...
56 篇 real-time system...

机构

19 篇 cadence design s...
14 篇 mentor graph cor...
7 篇 aiaa
6 篇 appl mat inc san...
6 篇 synopsys inc aus...
6 篇 carnegie mellon ...
6 篇 univ calif berke...
5 篇 mit cambridge ma...
5 篇 cadence design s...
5 篇 ibm corp thomas ...
5 篇 globalfoundries ...
4 篇 shanghai aircraf...
4 篇 singapore univer...
4 篇 college of mecha...
4 篇 mentor graphics ...
4 篇 samsung elect co...
4 篇 adv micro device...
4 篇 globalfoundries ...
4 篇 stmicroelectroni...
4 篇 institute of mic...

作者

21 篇 hurat philippe
16 篇 capodieci luigi
11 篇 liebmann lars
10 篇 mavris dimitri n...
8 篇 lucas kevin
8 篇 verghese nishath
7 篇 li li
7 篇 chen yijian
7 篇 pan david z.
7 篇 madhavan sriram
7 篇 yang jie
7 篇 pileggi larry
7 篇 butterfield j.
6 篇 zhang lei
6 篇 liu jun
6 篇 kye jongwook
6 篇 spanos costas j.
6 篇 inoue soichi
6 篇 jhaveri tejas
5 篇 strojwas andrzej

语言

4,900 篇 英文
191 篇 其他
56 篇 中文
3 篇 法文
2 篇 西班牙文
1 篇 阿拉伯文
1 篇 德文
1 篇 葡萄牙文
1 篇 俄文
1 篇 泰文

检索条件"任意字段=Conference on Design for Manufacturability through Design-Process Integration"

共 5152 条记录，以下是121-130 订阅

全选清除本页清除全部题录导出标记到"检索档案"

详细简洁

排序：

Review of RF microsystem packaging process technology 25

Review of RF microsystem packaging process technology

引用

25th Annual conference and 14th International conference of the Chinese-Society-of-Micro-Nano-Technology (CSMNT)

作者： Cui, Jing Cui, Suning Yuan, Xiaoming Kang, Nan Liu, Dexi Shi, Lei Liu, Yawei China Aerosp Sci & Technol Corp Beijing Res Inst Telemetry 1 Fengying East Rd Beijing 100089 Peoples R China

The 3-D heterogeneous integration technology of microsystem is the best technical means to achieve higher integration, higher performance and higher working frequency of radio frequency ( RF) electronic *** microsystem integration technology is categorized into three main types based on the packaging substrate: silicon-based,ceramic-based,and resin-based. In this work, the principle of RF microsystem integration technology is demonstrated in detail, and the process routes and characteristics of different packaging structures are clarified. Moreover, through the multi-dimensional comparison of different packaging structures, the application conditions of specific packaging structures are obtained. According to the comprehensive evaluation, the resin-based embedded chip package shows outstanding potentials in RF performance, integration capability, batch production capability and process cost. However, there are three shortcomings that limit its application in RF microsystems: Firstly, in terms of the universality of RF chips, metal grounding on the back of RF chips cannot be realized by this packaging, and special design of RF chips is required. At present, however, the universal chip with gold back grounding on the market cannot meet the requirements of the packaging process. Secondly, because of the high cost of customized chips, this packaging process is not suitable for small-scale production. Thirdly, the resin-based package does not have the sealing function, thus reliability of the product still needs to be verified. Ceramic-based RF microsystems do not require customized chips and have advantages in chip versatility compared to resin-based systems, with integration capabilities comparable to resin-based systems. However, its batch production capacity is much lower than resin based. In contrast, the silicon-based embedded chip package is as excellent as the resin-based products in chip versatility, RF performance, integration capability, batch production

关键词： Resins

来源：评论

学校读者我要写书评

暂无评论

Splitting process integration for 2.5D/3D Packaging 26

Splitting Process Integration for 2.5D/3D Packaging

引用

26th Electronics Packaging Technology conference, EPTC 2024

作者： Li, Hongyu Sekhar, Vasarla Nagendra Schwarzenbach, Walter Besnard, Guillaume Lim, Sharon Benmohamed, Nadia Nguyen, Bich-Yen 2 Fusionopolis Way Innovis #08-02 Singapore138634 Singapore SOITEC Parc Technologique des Fontaines - Chemin des Franques Bernin38190 France

ISBN: (纸本)9798331522001

To reduce packaging cost, 300mm Si wafer transferred on molding material was evaluated and demonstrated through splitting approach. Chip to wafer stacking, molding and splitting with dummy HBM and CPU/GPU were achieved after process optimization. Metal lines fabricated by damascene approach were used to study the splitting process effect. © 2024 IEEE.

关键词： Silicon wafers

来源：评论

学校读者我要写书评

暂无评论

A MBD-based bidirectional data-driven 3D CAPP Platform 5

A MBD-based bidirectional data-driven 3D CAPP Platform

引用

5th International conference on Mechatronics and Computer Technology Engineering, MCTE 2022

作者： Wang, Xiaogang Bai, Yuewei Zeng, Fenfang Mu, Hua Qiu, Jianping College of Intelligent Manufacturing and Control Engineering Shanghai Polytechnic University Jinhai Road 2360 Pudong New Distrtict Shanghai China Wuhan KAIMU Information Technology Co. Ltd Building A5 Software New Town 1# New Technology Development Zone Hongshan District Hubei Wuhan China Co. Ltd No. 1 Xifei Avenue Yanliang District Shaanxi Xi'an China

ISBN: (纸本)9781510661073

For a full three-dimensional process design manufacturing technology platform for product collaborative design and process design requirements, this paper introduces a kind of MBD based 3 d technology platform, platform based on MBD technology and knowledge base system, build the information processing technology and the mapping relationship between information modeling, and design the grouping based on the characteristics of the process of the full three-dimensional design process. Under the support of a knowledge base, the platform realizes the optimization of product design and manufacturability inspection analysis and drawing compliance inspection, found that as early as possible in the design of manufacturing related problems, to avoid disconnection between design and manufacturing in the traditional design method and make the design of the products meet the requirements of the product's functionality, manufacturability, etc. It is of great significance for enterprises to implement 3D digital process design and integration technology. © 2022 SPIE.

关键词： Product design

来源：评论

学校读者我要写书评

暂无评论

Breaking Down Barriers with Knowledge Graphs: Data integration for Cross-Organizational process Mining 5th

Breaking Down Barriers with Knowledge Graphs: Data Integrati...

引用

5th International conference on process Mining (ICPM)

作者： Rott, Julian Dorsch, Rene Freund, Michael Boehm, Markus Harth, Andreas Krcmar, Helmut Munich Airport Munich Germany Tech Univ Munich Garching Germany Fraunhofer IIS Nurnberg Germany Univ Appl Sci Landshut Landshut Germany

ISBN: (纸本)9783031561061;9783031561078

Cross-organizational process mining (coPM) with data from at least two organizations assists cooperating organizations in optimizing their operations by enabling an in-depth and continuous process analysis. As coPM faces unique challenges and is rarely applied, we followed a design science-based approach and developed a three-step extension to the PM project methodology to integrate data across organizational boundaries. Each organization first creates a local event data knowledge graph (KG). Second, a trusted third party integrates all local KGs into a global KG. Third, a federated event log and process knowledge are retrieved for coPM analysis. Overall, we present the first version of a methodology to support data integration for coPM, thereby assisting researchers and practitioners in unlocking value potentials from coPM analysis.

关键词： Cross-organizational process mining Data integration Knowledge graphs Methodology

来源：评论

学校读者我要写书评

暂无评论

Understanding Human-AI Collaboration in Music Therapy through Co-design with Therapists 24

Understanding Human-AI Collaboration in Music Therapy Throug...

引用

ACM CHI conference on Human Factors in Computing Sytems (CHI)

作者： Sun, Jingjing Yang, Jingyi Zhou, Guyue Jin, Yucheng Gong, Jiangtao Tsinghua Univ Inst AI Ind Res Beijing Peoples R China Hong Kong Baptist Univ Dept Comp Hong Kong Peoples R China

ISBN: (纸本)9798400703300

The rapid development of musical AI technologies has expanded the creative potential of various musical activities, ranging from music style transformation to music generation. However, little research has investigated how musical AIs can support music therapists, who urgently need new technology support. This study used a mixed method, including semi-structured interviews and a participatory design approach. By collaborating with music therapists, we explored design opportunities for musical AIs in music therapy. We presented the co-design outcomes involving the integration of musical AIs into a music therapy process, which was developed from a theoretical framework rooted in emotion-focused therapy. After that, we concluded the benefits and concerns surrounding music AIs from the perspective of music therapists. Based on our findings, we discussed the opportunities and design implications for applying musical AIs to music therapy. Our work offers valuable insights for developing human-AI collaborative music systems in therapy involving complex procedures and specific requirements.

关键词： music therapy human-AI collaboration co-design

来源：评论

学校读者我要写书评

暂无评论

designing a Wastewater Screening System Based on the TRIZ Theory Contradiction Matrix 4

Designing a Wastewater Screening System Based on the TRIZ Th...

引用

4th International conference on Innovative Research in Applied Science, Engineering and Technology, IRASET 2024

作者： Hmina, Khadija Bouyarmane, Houda El Amine, Mehdi Sallaou, Mohammed Mechanical And Integrated Engineering Team ENSAM-Meknès Meknès Morocco

ISBN: (纸本)9798350309508

Product design is a dynamic and interdisciplinary activity that often requires the use of solution analysis tools, supported by various innovation methods and frameworks. The Theory of Inventive Problem Solving (TRIZ), recognized as a highly effective innovation approach, has demonstrated its effectiveness in fostering innovation through extensive research. Within this framework, we have investigated its integration into the product design process for engineering students. This article introduces a TRIZ-based solution developed by a team of engineering students for a wastewater filtration system. © 2024 IEEE.

关键词： Product design

来源：评论

学校读者我要写书评

暂无评论

Voltage Reference and Zero Current Detector Monolithically Integrated on p-GaN Technology designed for process Corners Compensation 38

Voltage Reference and Zero Current Detector Monolithically I...

引用

IEEE Applied Power Electronics conference and Exposition (APEC)

作者： Bau, Plinio Gavira-Duque, Sebastian Rothan, Frederic Reymond, Cedric Bergogne, Dominique Wise Integrat F-38240 Meylan France Univ Grenoble Alpes CEA LETI F-38000 Grenoble France

ISBN: (纸本)9781665475396

This work describes two designed and fabricated circuits for power device integration in 650 V e-mode GaN-on-Si technology and gives their main measured characteristics. The first circuit is a voltage reference designed to compensate process, voltage and temperature (PVT). The advantage of this circuit over state-of-the-art circuits is its performance of regulation, low current consumption and surface required (only 100 mu m x 60 mu m in the first prototype built). The second circuit is a zero-crossing current detector that is also designed to be insensitive to process variations. It exhibits stable static characteristics and bandwidth observed in simulation of more than 10 MHz. The convenience of this circuit is its simplicity because no differential amplifier is used to make a comparison. Both circuits are designed to be integrated with power transistors in GaN technology to be used in ACF or other topologies capable of switching at 650 V.

关键词： GaN Power Transistors p-Gate AlGaN/GaN HEMTs Voltage Reference Current Detector design for manufacturability

来源：评论

学校读者我要写书评

暂无评论

design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization 73

Design and Analysis of 3D Heterogeneous Chiplet Stack for RF...

引用

IEEE 73rd Electronic Components and Technology conference (ECTC)

作者： Rotaru, Mihai Dragos Tiwari, Shashank Castillon, Paul Chong, Chai Tai Jien, Chui King ASTAR Inst Microelect IME Singapore Singapore GlobalFoundries Bangalore Karnataka India Qorvo San Jose CA USA

ISBN: (纸本)9798350334982

This paper presents the design, simulation, analysis and characterization of a heterogenous 3D integration approach for miniaturization of RF front-end modules. The 3D integrated stack consists of two dies using different technologies. The first die is a low-noise amplifier (LNA), designed and fabricated in 130nm 8SW RF SOI Global Foundries technology. The second die is a duplexer built using Qorvo's BAW technology. The first die is used as a base on which the second die is mounted. To achieve this integration a redistribution layer (RDL) has been designed and built on the backside of the first die. through silicon vias (TSV) have also been designed and built to allow the top die to be routed and interconnected to the bottom die as well as to the outside world. The final size of the integrated module is 1x1.4x0.45 mm(3). This paper discusses in detail the design process of the module, the simulation models with the associated simulation results. It also presents measurement results obtained from a test vehicle design to extract the parasitics and equivalent circuit of the TSV through the SOI wafer. The signal losses measured through the test structures, that emulates the 3D stack environments, are below 0.2dB at 2GHz. These results are promising and give us confidence for the final functional module testing.

关键词： RDL SiP RF Front End heterogenous integration SOI TSV

来源：评论

学校读者我要写书评

暂无评论

Advanced Packaging design Platform for Chiplets and Heterogeneous integration 73

Advanced Packaging Design Platform for Chiplets and Heteroge...

引用

IEEE 73rd Electronic Components and Technology conference (ECTC)

作者： Cao, Lihong Wang, Chen-Chao Huang, Chih-Yi Kou, Hung-Chun Adv Semicond Engn Inc Engn & Tech Promot Austin TX 78704 USA Adv Semicond Engn Inc Corp R&D Ctr Kaohsiung Taiwan

ISBN: (纸本)9798350334982

Chiplets integration offers a compelling value proposition for yield improvement, IP reuse, performance and cost optimization. Various advanced packaging technologies such as 2.5D Si TSV interposer, Fanout RDL organic interposer and 3D hybrid bonding have been deployed for chiplets and system heterogeneous integrations. Meanwhile, integrating multiple chiplets with diverse functions into a single package has also created a demand for advanced packages with higher den sity interconnects and larger footprint body sizes. How to optimize the layout to get the optimal performance among th e chiplets has become very critical. In addition, high density and complex connectivity in advanced packaging cause more challenges by using traditional EDA tools for packaging design and assembly manufacturing valid ation. Furthermore, the die-to-die interconnects for chiplets integration are usually proprietary links from different customers, thu s also create more design boundaries and limit the adoption of advanced packaging technology. In this paper, a new chip-to-package hybrid design platform for chiplets integration using advanced packaging technology was introduced. The design platform was utilized to complete the routings of ultra-high density I/O in 2.5D Si interposer and Fan-Out RDL organic interposer. Compared with the traditional package level design platform, the new hybrid design platform had reduced the design cycle time and improved design accuracy. Additionally, this platform had leveraged and validated the open standard Die-to-Die interconnects through the UCle (Universal Chiplet Interconnect Express) ecosystem. Good electrical performance was achieved and met the requirements under the pin speed of 32Gbps for both fanout RDL organic interposer and 2.5D Si TSV advanced packaging technologies. Furthermore, a new packaging process design kit (PDK) had been developed to provide IC and system designers with advanced packaging design rule s. Finally, this paper elaborated

关键词： Chiplets integration Chip-to-package hybrid design platform Fanout RDL organic interposer 2.5D Si TSV interposer FOCoS (Fanout Chip on Substrate) UCle

来源：评论

学校读者我要写书评

暂无评论

Research on the Product Reliability Index Identification Method Based on Axiomatic design 5

Research on the Product Reliability Index Identification Met...

引用

5th International conference on System Reliability and Safety Engineering, SRSE 2023

作者： Yang, Meiyu Wang, Wei Zhang, Yihao Li, Tongfei Zhang, Yuting Beihang University School of Reliability and System Engineering Beijing China

ISBN: (纸本)9798350305944

Users not only focus on functional performance requirements in equipment development, but also emphasize the importance of reliability requirements. It is crucial to adopt scientific and reasonable indicators to measure the level of product reliability, guide design improvements, and support test verification. Currently, the comprehensive trade-off method is commonly used to determine reliability indices. However, there are issues with the unclear mapping relationship between reliability use requirements and the characterization of reliability indices in this process. The main problems include the transformation from abstract reliability indices to manufacturability indices and the multi-level decomposition of reliability indices for the system, components, and units. These shortcomings result in the abstraction of the reliability index concept, unclear responsibilities between users and researchers, and poor correlation of indices at each system level. Axiomatic design, which aims to systematically and clearly express the solving process from high-level abstract design concepts to low-level detailed specifics, addresses these challenges. Therefore, this paper introduces the theory of axiomatic design and constructs a product reliability index identification model based on axiomatic design principles. The model facilitates the transfer process from task requirements to reliability indices through domain mapping, enhancing the rationality and comprehensiveness of index types. Furthermore, the study uses a gas turbine as an example to determine its reliability index types. The findings of this research are expected to provide a useful reference for the systematic and clear development of the gas turbine reliability index identification process. © 2023 IEEE.

关键词： Gas turbines

来源：评论

学校读者我要写书评

暂无评论

没有更多数据了...

全选清除本页清除全部题录导出标记到“检索档案”

共500页 << < 9 10 11 12 13 14 15 16 17 18 > >>

检索报告对象比较合并检索0

隐藏清空

合并搜索

回到顶部

执行限定条件

内容：

评分：

请选择保存的检索档案：

请选择收藏分类：

订阅名称：

通借通还

温馨提示：

图书名称：

借书校区：

取书校区：

手机号码：

邮箱地址：

一卡通帐号：

电话和邮箱必须正确填写，我们会与您联系确认。

联系人：

所在院系：

联系邮箱：

联系电话：

内蒙古自治区呼和浩特市赛罕区大学西街235号邮编: 010021

建议与咨询 留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

时间限定

文献类型

馆藏选择

核心期刊

语言

文献类型

帮助

文字说明：

检索规则说明：

检索范例：

分类表

所选分类

限定检索结果

文献类型

馆藏范围

日期分布

学科分类号

主题

机构

作者

语言

请选择保存的检索档案： 新增检索档案 确定 取消

请选择收藏分类： 新增自定义分类 确定 取消

通借通还

建议与咨询留下您的常用邮箱和电话号码，以便我们向您反馈解决方案和替代方法

请选择保存的检索档案：

请选择收藏分类：