Schematic Interactions Visualization (SIV) is a new innovative educational paradigm generated in the reform of university education, which generates an interactive mode of education in specific learning situations acc...
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ISBN:
(纸本)9798400708732
Schematic Interactions Visualization (SIV) is a new innovative educational paradigm generated in the reform of university education, which generates an interactive mode of education in specific learning situations according to the thinking characteristics of different disciplines. The teaching process adopts the structural model of "five education fusion, five senses interaction", following the law of cognitive development of brain science, from the aspects of attention, memory, emotion, motivation, etc., which are closely related to learning, teachers and students invest in more creative, emotional and artistic interactive educational activities, so as to effectively decode and visualize the hidden thinking of disciplines through the orderly Schematic Interactive technology. Effective decoding and manifestation of implicit disciplinary thinking through orderly diagrammatic interactive technology, while promoting teaching innovation, achieving teaching and learning to reduce pressure, increase efficiency and deepen memory. SIV intelligent instructional design emphasizes the Schematic decoding of disciplinary bottlenecks to promote teachers' and students' deep understanding of core concepts, the creation of a SIV model of multiple interactions between teachers and students on higher education practical activities, and the use of thematic concept maps to provide an operational and formative model throughout the teaching and learning process. throughout the teaching process to provide actionable formative work evaluation, to provide practical guidelines for teachers to implement disciplinary matter in-depth learning. In this paper, we take the five senses SIV model of medicinal botany as an example to reflect the design paradigm of SIV intelligent education.
A challenge in product realisation, involving several functions and individuals with various specialisation, is knowledge integration. The purpose of this paper is to advance the understanding of how and when boundary...
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This article deals with the integration of modern approaches such as augmented reality and IoT technologies into the field of Maintenance 4.0. It describes the design of an algorithm and the subsequent implementation ...
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As the demand for advanced semiconductor packaging technology continues to rise, achieving precise control of the wafer bonding process becomes increasingly critical for optimal performance. This research paper focuse...
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ISBN:
(纸本)9798350338812;9798350338829
As the demand for advanced semiconductor packaging technology continues to rise, achieving precise control of the wafer bonding process becomes increasingly critical for optimal performance. This research paper focuses on the development of a fine-pitch hybrid wafer bonding technique specifically designed for heterogeneous integration applications. The objective is to enable high -density interconnections and enhance electrical performance through the bonding of Cu and SiO2 wafers featuring 15 mu m spaced Cu pads. The experimental section provides a comprehensive account of the study, covering various aspects such as layout design, preparation, and the bonding process. This includes the fabrication of Cu pads and SiO2 passivation layers, chemical mechanical polishing (CMP), and alignment bonding. Furthermore, the research also investigates Cu -Cu die-to -die bonding utilizing a (100) -oriented single-crystal Cu top die paired with a Si substrate. Microstructure analysis demonstrates a well-fused bonding interface characterized by a highly preferred (100) -oriented Cu film The insights obtained from this study contribute to the advancement of wafer-level hybrid bonding techniques for three-dimensional integration technology. This research serves as a valuable contribution to the ongoing development and refinement of advanced semiconductor packaging methods.
The rapid integration of Artificial Intelligence (AI) in educational systems has revolutionized teaching and learning methodologies, mainly through the advancement of Generative AI (GAI). This study evaluates the effi...
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A well-designed cooling system is crucial in construction machines for efficient heat dissipation from vital components, including the Radiator(RAD), Oil Cooler (OC) and Intercooler (IC). The radiator ensures optimal ...
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Due to global and political influence, resilient and versatile production systems are unavoidable. Based on existing Product Lifecycle Management (PLM) systems there is a growing need for a consistent communication be...
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This Work-In-Progress (WIP) paper presents the design, implementation, and preliminary impact of a simultaneous curricular intervention in first-year design and senior capstone design courses at an undergraduate Mecha...
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In light of the accelerated growth of e-commerce, the generation of high-quality and efficient content has emerged as a pivotal factor in enhancing user experience and business value. However, conventional methods of ...
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As an important role in electromagnetic interference (EMI) solving of switching power supply, the EMI filter's performance and integrated design are of great significance to improve the power density of switching ...
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