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检索条件"任意字段=Conference on Design for Manufacturability through Design-Process Integration"
5165 条 记 录,以下是391-400 订阅
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Investigation into the Comfort of Automotive Seating through the integration of Affective Engineering design  7
Investigation into the Comfort of Automotive Seating through...
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7th IEEE Information Technology and Mechatronics Engineering conference, ITOEC 2023
作者: Zhang, Chunxu Duan, Yingwen Pan, Haizhu Chen, Shuxin Beijing Yingdian Technology Development Co. Ltd Beijing City102600 China Qiqihar University Heilongjiang Province Qiqihar City161006 China Foton Motor Automobile Co. Ltd Beijing City102206 China Tianjin Renai College School of Intelligent Computing Engineering Tianjin City301636 China
Applying ergonomics theories to analyze the postures of vehicle occupants and leveraging the principles of affective engineering and Analytic Hierarchy process (AHP), we design the form of comfortable car seats to mee... 详细信息
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Development and Validation of Integral Algorithms Based on Data Resampling Techniques  9
Development and Validation of Integral Algorithms Based on D...
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9th International conference on Intelligent Computing and Signal processing, ICSP 2024
作者: Ma, Xiang Wu, Yongshun Yu, Haoliang Wang, Donghui Yang, Sujun Shen, Song Shanghai Haixun Mechanical & Electrical Engineering Co. Ltd Shanghai China Marine Design & Research Institute of China Shanghai China Shanghai Key Laboratory of Ship Engineering Shanghai China Laboratory of Science and Technology on Water Jet Shanghai China China Orient Institute of Noise & Vibration Beijing China
Accurate acquisition of displacement signals is of great importance in the field of engineering research, but displacement transducers have harsh requirements for testing conditions, which cannot be implemented in man... 详细信息
来源: 评论
integration of Machining process Digital Twin in Early design Stages of a Portable Robotic Machining Cell  31st
Integration of Machining Process Digital Twin in Early Desig...
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31st International conference on Flexible Automation and Intelligent Manufacturing, FAIM 2022
作者: Stavropoulos, Panagiotis Manitaras, Dimitris Bikas, Harry Souflas, Thanassis Department of Mechanical Engineering and Aeronautics University of Patras Rio Patras26504 Greece
Industrial robots have been getting a more important role in manufacturing processes during the last decades, due to the flexibility they can provide in terms of reachability, size of working envelope and workfloor fo... 详细信息
来源: 评论
Development of Digital Twin Framework for design of Channapatna Handicraft Toys in the Digital Era  8
Development of Digital Twin Framework for Design of Channapa...
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8th IEEE International conference on Computational System and Information Technology for Sustainable Solutions, CSITSS 2024
作者: Meghasree, V. Guptha, C. K. Nagendra Rv College of Engineering Department of Industrial Engineering and Management India
The digital transformation era, emphasized by Industry 4.0, have transformed and globalized industries. This transformation is important for increasing the efficiency, traceability, and market reach, particularly in h... 详细信息
来源: 评论
ADVANCING GROUND VEHICLE DYNAMICS: DYNAMIC MORPHING TECHNOLOGY integration AND ANALYSIS FOR THE AUTONOMOUS UTILITY TRUCK IN HIGH-CROSSWIND CONDITIONS
ADVANCING GROUND VEHICLE DYNAMICS: DYNAMIC MORPHING TECHNOLO...
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ASME 2024 International design Engineering Technical conferences and Computers and Information in Engineering conference, IDETC-CIE 2024
作者: Patel, Parth Y. Koomullil, Roy Zhang, Siyuan Moradi, Lee Vantsevich, Vladimir Autonomous Vehicle Mobility Institute Worcester Polytechnic Institute WorcesterMA United States University of Alabama at Birmingham BirminghamAL United States
Initially pioneered in aircraft design to optimize maneuverability and aerodynamic efficiency, dynamic morphing technology is now revolutionized in ground vehicles to address the stability and maneuverability challeng... 详细信息
来源: 评论
Intelligent Detection Technology of Over-Under Excavation in Mining Tunnel Based on 3D Laser Scanning
Intelligent Detection Technology of Over-Under Excavation in...
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2023 International conference on Smart Transportation and City Engineering, STCE 2023
作者: Qi, Chenglong Li, Yan Zhuo, Yi Li, Yao Zheng, Rongzheng China Railway Design Corporation Tianjin300308 China
To improve the level of over-under excavation detection in construction process of mining tunnels, scholars demostic and abroad have combined 3D laser scanning with other information technology to achieve certain rese... 详细信息
来源: 评论
14th European conference on Product and process Modelling, ECPPM 2022
14th European Conference on Product and Process Modelling, E...
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14th European conference on Product and process Modelling, ECPPM 2022
The proceedings contain 100 papers. The special focus in this conference is on Product and process Modelling. The topics include: Integrating Level(s) LCA in BIM: A tool for estimating LCA and LCC impacts in a case st...
来源: 评论
Application of Machine Learning for Anticipating Chip Failure Rates in VLSI design
Application of Machine Learning for Anticipating Chip Failur...
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2024 International conference on System, Computation, Automation and Networking, ICSCAN 2024
作者: Srihari, T. Umamaheswari, P. Sockkalingam, Seenuvasamurthi Bodne, Nilesh P. Patel, Charushila Axay Babu, S. B G Tilak Saveetha University Department of Electrical and Electronic Engineering Tamil Nadu Chennai India Srm Institute of Science and Technology Department of Ece Tamil Nadu Kattakulathur603203 India Raak College of Engineering & Technology Department of Electronics and Communication Engineering Pondicherry605 110 India Dbatu Head of Department Elections and Communication Engineering 441203 India Affiliated with Gujarat Technological University Surat394345 India Aditya University Department of Ece Andhra Pradesh Kakinada India
The purpose of this research is to investigate the incorporation of machine literacy techniques for the prediction of chip failure rates in the design of veritably Large Scale integration (VLSI) systems. The complexit... 详细信息
来源: 评论
design and Reliability Analysis of Spaceborne Microsystem SiP  6
Design and Reliability Analysis of Spaceborne Microsystem Si...
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6th International conference on Electronics and Electrical Engineering Technology (EEET)
作者: Yang, Zheng Zu, Ruohan Li, Shenglong Yang, Yongcong Gao, Yingke China Acad Space Technol Beijing Inst Control Engn Beijing Peoples R China Harbin Inst Technol Shenzhen Peoples R China
System-in-Package (SiP) is a technology that integrates multiple functional chips into a single substrate through micro-assembly, offering advantages such as compact size, high packaging efficiency, compatibility, and... 详细信息
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Matrix-variate Gaussian processes with Structured Kernels for Multi-step-ahead Driving Behavior Prediction
Matrix-variate Gaussian Processes with Structured Kernels fo...
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2024 Society of Instrument and Control Engineers Festival with Annual conference
作者: Takano, Seiya Jimbo, Tomohiko Toyota Motor Co Ltd R Frontier Div Toyota Aichi Japan
The increased integration of renewable energy, which is known to fluctuate owing to weather conditions, has necessitated power supply-demand adjustments using virtual power plants (VPPs) that utilize vehicle batteries... 详细信息
来源: 评论