process technology scaling and hardware architecture specialization have vastly increased the need for chip design space exploration, while optimizing for power, performance, and area. Hammer is an open-source, reusab...
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ISBN:
(纸本)9781450391429
process technology scaling and hardware architecture specialization have vastly increased the need for chip design space exploration, while optimizing for power, performance, and area. Hammer is an open-source, reusable physical design (PD) flow generator that reduces design effort and increases portability by enforcing a separation among design-, tool-, and process technology-specific concerns with a modular software architecture. In this work, we outline Hammer's structure and highlight recent extensions that support both physical chip designers and hardware architects evaluating the merit and feasibility of their proposed designs. This is accomplished through the integration of more tools and process technologies-some open-source-and the designer-driven development of flow step generators. An evaluation of chip designs in process technologies ranging from 130nm down to 12nm across a series of RISC-V-based chips shows how Hammer-generated flows are reusable and enable efficient optimization for diverse applications.
Industry 5.0 emphasizes human-centric approaches in technological advancement, particularly crucial in healthcare applications such as prosthetics development. While individual technologies like additive manufacturing...
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Recent advancements in autonomous underwater vehicles (AUV) have made ocean exploration a key future frontier. This study addresses the complex challenge of adaptive coverage path planning with multi-sensors (ACPPMS) ...
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ISBN:
(纸本)9798350373707;9798350373691
Recent advancements in autonomous underwater vehicles (AUV) have made ocean exploration a key future frontier. This study addresses the complex challenge of adaptive coverage path planning with multi-sensors (ACPPMS) in marine environments, aiming to optimize AUV's area coverage under strict time and energy constraints. We propose a novel approach that integrates considerations of energy consumption, information acquisition, and spatial coverage, assessing the intricate trade-offs between extending area coverage and enhancing data collection. Our methodology extends traditional adaptive information path planning by incorporating the decision-making dilemma of balancing coverage with information gain, which we tackle through a tree-based sequential decision-making framework, specifically a partially observable Markov decision process. Utilizing an online planning solution, we validate our approach through rigorous simulation in a search and rescue scenario. The results affirm ACPPMS's adaptability and its superior performance in environments with medium to low reward densities, although it falls short in highly rewarding settings compared to conventional full-coverage strategies. Notably, employing multiple sensors not only elevates path efficiency but also contributes to significant energy savings, showcasing the practical benefits of our multi-sensor integration strategy in adaptive maritime exploration.
The transition to higher education presents challenges for incoming students. In a demanding academic environment, autonomy emphasizes fostering collaboration within the student community. This approach enhances inter...
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ISBN:
(数字)9783031832079
ISBN:
(纸本)9783031832062;9783031832079
The transition to higher education presents challenges for incoming students. In a demanding academic environment, autonomy emphasizes fostering collaboration within the student community. This approach enhances interaction and integrates experienced students' knowledge to support peers, aiming to improve academic performance. The study is centered on developing software prototypes for a digital platform to facilitate the intermediation of contacts among students, primarily for scheduling tutoring services. An Action Research strategy was employed, using focus group techniques to actively involve participants in the project. This method, supported by design Thinking, utilized iterative phases that generated valuable insights, leading to the creation of several prototypes tailored to the real needs of users. This iterative process not only highlights the significance of each phase but also explores how they collectively enhance product software development, focusing on ideating and refining concepts based on the perspective of future users. The testing of these prototypes met user expectations, demonstrating the effectiveness of the design Thinking approach. This contributed to satisfying user needs and promoting collaboration through interaction with the focus group. Moreover, adopting the Kanban project management method allowed for practical and efficient workflow management. Consequently, this article not only promotes methodologies that facilitate the ideation of a digital product designed to address a real-world need but also underscores how project management can be an integral ally in development, ensuring effective integration.
In order to enable all users of the examination management system to access the system through the Internet, in order to access the data in the examination management system in multiple regions and at any time period ...
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through silicon vias (TSVs) remains a critical technology for enabling 2.5D and 3D packaging [1], The TSVs process can be considered successful only when it is void-free. There are many factors that may affect the gap...
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The increasing demands for high-quality and high-aspect-ratio through-Silicon Vias (TSVs) in three-dimensional integrated circuits (3D-IC) have made Si process technologies a significant challenge. Long-throw ionized ...
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ISBN:
(纸本)9798350311372
The increasing demands for high-quality and high-aspect-ratio through-Silicon Vias (TSVs) in three-dimensional integrated circuits (3D-IC) have made Si process technologies a significant challenge. Long-throw ionized Physical Vapor Deposition (iPVD) is widely used for barrier/seed layer deposition prior to Cu filling by electroplating for TSV. However, a micro-scale shadowing effect in deep Si holes with high aspect ratios results in failed filling. Bosch etching process can form the high-aspect-ratio deep Si holes but it leaves nuisance scallop features that further increase another submicron-scale shadowing effect. This study aims to explore the impact of super long-throw iPVD with low-frequency RF substrate bias to form high-aspect-ratio TSVs and compares the Cu coverages with a standard magnetron sputtering of non-ionized PVD for 3D-IC rapid prototyping.
The coal cutter is one of the key equipment for comprehensive mechanized coal mining in modern mines. In the production and use stage, the main factors that directly affect the safe operation of the coal cutter and th...
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Abstract : This paper addresses the underutilization of Business Intelligence (BI) in Higher Education Institutions (HEIs) for data-driven decision-making. Despite the abundance of data across various university domai...
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Since the arrival of a new active period of scientific and technological innovation, society and industry have proposed higher requirements for engineering education. To meet the current needs of engineers through the...
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