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International conference on VLSI design

作者： I. Ghosh S. Bhawmik Department of Electrical Engineering Princeton University Princeton NJ USA Bell Laboratories Lucent Technologies Inc. Princeton NJ USA

This paper describes a method of flip-flop selection (for BIST or Partial Scan) where the selection process proceeds in a module by module basis. A complete circuit is assumed to be made up of different modules. The method uses the circuit graph of an individual module and uses the top level connectivity information in between modules to select flip-flops in that module. It then deletes the module from the top level graph, keeping only the combinational paths through that module to select flip-flops in the next module and so on until all modules are exhausted. The advantage of this process lies in the fact that partial scan or BIST can be inserted in a circuit on a module by module basis which is how circuits are designed usually. This means that test logic insertion need not wait for the availability of the complete circuit. This can reduce the turnaround time of a design. Also the redesign time after test logic insertion will go down as the design optimization can be carried out with the test logic already inserted. A number of experiments were conducted using different circuits which showed that the percentage of extra flip-flops selected by this method as opposed to selection over the global circuit, was quite small (around 3%). Also the processing time went down as the number of flip-flops increased.

关键词： Flip-flops Circuit testing Logic testing Built-in self-test design for testability Algorithm design and analysis Logic design Logic circuits design optimization Very large scale integration

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PARAGON: a paradigm for the specification, verification and testing of real-time systems

PARAGON: a paradigm for the specification, verification and ...

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IEEE conference on Aerospace

作者： H. Ben-Abdallah D. Clarke I. Lee O. Sokolsky Department of Electrical & Computer Engineering University of Waterloo Waterloo ONT Canada Department of Computer Science University of Kentucky Lexington KY USA Department of Computer & Information Science University of Pennsylvania Philadelphia PA USA Computer Command and Control Company Philadelphia PA USA

The PARAGON toolset provides an environment for the modular and hierarchical design of resource-bound, real-time systems. It offers well-integrated graphical and textual specification languages with formal semantics. Both languages are based on the Algebra of Communicating Shared Resources (ACSR), a process algebra with explicit notions of time, resources and priority. The integration of the three notions widens the applicability of the PARAGON formalisms to embedded systems, control systems, and fault-tolerant systems where run-time resource requirements must be considered during the design phase. To facilitate the design of complex systems, PARAGON allows a designer to describe a system incrementally through refinement steps that preserve system properties. To increase dependability of system models, PARAGON offers three types of analysis: automated verification of system requirements, interactive simulation, and testing. In this paper, we demonstrate the design methodology that PARAGON offers through examples.

关键词： Algebra Real time systems Specification languages Embedded system Control systems Fault tolerant systems Analytical models Automatic testing System testing design methodology

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Intrinsic area array ICs: what, why, and how

Intrinsic area array ICs: what, why, and how

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IEEE conference on Multi-Chip Module

作者： P. Dehkordi C. Tan D. Bouldin Department of Electrical Engineering University of Tennessee Knoxville TN USA

Area-array bonding technology (i.e. flip-chip, C4) was pioneered by IBM in the late 1960's as an alternative to periphery bonding technology (i.e. wire-bond). In recent years, several commercial companies have started offering bumping and flip-chip services. Flip-chip technology is expected to grow at at compound annual growth rate of 38% through the year 2001. The purpose of this paper is to address the IC design issues and alternatives that are presently being used for area-array bonding technology and show the impact of these design issues at the system level.

关键词： Bonding Assembly Integrated circuit packaging Flip chip Wires Costs Manufacturing process control Very large scale integration Multichip modules

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Optimal integration condition between the gas turbine air compressor and the air separation unit of IGCC power plant

Optimal integration condition between the gas turbine air co...

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Intersociety conference on Energy Conversion Engineering (IECEC)

作者： Chan Lee Hyung Taek Kim Yongseung Yun Department of Mechanical Engineering University of Suwon South Korea Department of Energy Ajou University Suwon South Korea Electric Power System LaboratoryInstitute for Advanced Engineering Energy System Research Center Ajou University Suwon South Korea

Parametric studies are conducted for optimizing the integration design between gas turbine compressor and air separation unit (ASU) of integrated gasification combined cycle (IGCC) power plant. The ASU is assumed as low pressure double-distillation column process which is integrated at the interstage location of the compressor, and integration design criteria of air extraction and reversing heat exchanger are defined and mathematically formulated. With the performance prediction of compressor by through-flow analysis, the effects of pinch-point temperature difference (PTD) in the reversing heat exchanger, the amount and the pressure of extracted air are quantitatively examined. As the extraction air amount or the PTD is increased. the power consumption is increased. The compressor efficiency deteriorates as the increase of the flow rate of air extracted at higher pressure while improving at lower pressure air extraction. Furthermore, optimal integration condition for compressor efficiency maximization is found by generating the compressor characteristic curve.

关键词： Turbines Nitrogen Power generation Temperature Energy consumption Distillation equipment Fault location Mechanical engineering Power engineering and energy Systems engineering and theory

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A model-based engineering process for increasing productivity in discrete manufacturing

A model-based engineering process for increasing productivit...

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International conference and Workshop on Engineering of Computer-Based Systems

作者： E. Long A. Misra Saturn Corporation Springhill USA Measurement and Computing Systems Laboratory Vanderbilt University Nashville TN USA

In a competitive market, manufacturing enterprises require a process of continuous on-going improvement in order to maintain and enhance productivity and a competitive edge. The use of Information Systems (IS) has been increasingly playing a critical role in any such engineering process. The primary drivers are efficiency and quality increase through automation facilitation of better business processes and improved decision making. The engineering process involves use of an IS for collection of relevant production data, visualization, analysis and decision making. Many problems and issues relating to the design, development, integration, evolution and maintenance of ISs in large-scale and complex plants have become apparent which are not adequately addressed by the traditional process Monitoring and Control (PM&C) systems. Model Integrated Computing (MIC) offers a feasible approach towards providing cost-effective development, integration, evolution and maintenance of ISs through the extensive use of models during the life cycle. This paper describes the application of MIC in the engineering process for improving productivity in the context of discrete manufacturing operations at Saturn. The Saturn Site Production Flow (SSPF) system is a client-server application, designed to provide an integrated problem-solving environment. It presents consistent and pertinent information, provides analysis and decision support services that are needed for informed decision making by the team members and leaders within Saturn.

关键词： Productivity Maintenance engineering Decision making Saturn Manufacturing processes Microwave integrated circuits Information systems Manufacturing automation Data engineering Production

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A model-integrated information system for increasing throughput in discrete manufacturing

A model-integrated information system for increasing through...

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International conference and Workshop on Engineering of Computer-Based Systems

作者： A. Misra G. Karsai J. Sztipanovits A. Ledeczi M. Moore E. Long Department of Electrical and Computer Engineering Vanderbilt University Nashville TN USA Saturn Corp. Spring Hill TN

The use of information systems (IS) has been increasingly playing a critical role towards enhancing productivity and throughput in manufacturing enterprises. The primary drivers are efficiency and quality increase through automation, facilitation of better business processes and improved decision making. Many problems and issues relating to the design, development, integration, evolution and maintenance of ISs in large-scale and complex plants have become apparent which are not adequately addressed by the traditional process Monitoring and Control (PM&C) systems. Model-Integrated Computing (MIC) offers a feasible approach towards providing cost-effective development, integration, evolution and maintenance of ISs through the extensive use of plant models. This paper describes an application of MIC in providing a problem-solving environment and decision support tool in the context of discrete manufacturing operations at Saturn. The Saturn Site Production Flow (SSPF) system is a client-server application, designed to provide consistent and pertinent information, analysis and decision support services that are needed for informed decision making.

关键词： Information systems throughput Decision making Microwave integrated circuits Saturn Productivity Manufacturing automation Large scale integration Monitoring Automatic control

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A knowledge-based system for the automatic generation of PCB alternative designs

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JOURNAL OF MATERIALS processING TECHNOLOGY 1996年第1-2期61卷 7-11页

作者： Castillo, C Malave, CO Department of Industrial Engineering Texas A&M University College Station Texas USA

The motivation for this research is the need to enhance the performance of the PCB environment with a system that will provide the designers with the opportunity to take manufacturing into consideration in the early design stages. The model proposed here will consist of a knowledge based system for the automatic generation of PCB alternative designs. This system will decompose an existing design and provide other possible design alternatives equivalent to the design under consideration. This will serve a dual purpose. First, different, but equivalent, PCB designs can be evaluated for manufacturability in order to aid the designer in making the final PCB design decision. Second, a PCB design-specific module can be created and kept on hand to be utilized in cases were there is a need to find a replacement board or a spare without going through the entire design process. This work contributes to the design for manufacturability, a concurrent engineering strategy,in the electronic industry with a setting that provides for the integration of design and manufacturing that can lead to cost and lead time reductions.

关键词： PCB design for manufacture concurrent engineering knowledge based system

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Intelligent concurrent manufacturability evaluation of design for electrochemical machining

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JOURNAL OF MATERIALS processING TECHNOLOGY 1996年第1-2期61卷 130-139页

作者： Amalnik, MS McGeough, JA UNIV EDINBURGH DEPT MECH ENGNEDINBURGH EH8 9YLMIDLOTHIANSCOTLAND UNIV PAISLEY DEPT MECH & MFG ENGNPAISLEY PA1 2BERENFREWSCOTLAND

An intelligent knowledge-based system (IKBS) for evaluating electrochemical machining, in a concurrent engineering (CE) environment and based on object oriented techniques, is introduced. The design specification is acquired through a feature-based approach. Ten different classes of design features are interactively obtained. The attributes of 72 workpiece material types, eight tool-electrode metals, two electrolyte solutions, and seven different sizes and types of electrochemical machines are stored in a database. For each design feature, information needed in manufacturing, such as the machining cycle time and cost, penetration rate, efficiency and effectiveness, costs for electricity consumed, machine installation and depreciation are estimated. Finally, for the same design specification, machining times are compared and ordered, for alternative unconventional processes of electrochemical, electrodischarge and electrochemical are machining.

关键词： design feature ECM EDM ECAM CE intelligent knowledge-based system

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Knowledge-based design for manufacture system

Knowledge-based design for manufacture system

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Proceedings of the 1996 IEEE International conference on Systems, Man and Cybernetics

作者： Yuyin, Song Bopeng, Zhang Fuzhi, Cai Qingguo, Meng Tsinghua Univ Beijing China

design for manufacture (DFM) is one important activity of Concurrent Engineering (CE). The essence of the DFM is the integration of product design and process planning into one common activity. In this paper, a knowledge-based design for manufacture system is provided. Product manufacturability can be evaluated based on product model and manufacturing knowledge in each design period, so product design can be optimized. Product information model is the information source of plenty of design activities (conceptual design, structure design, detail design and process planning). Product information can be shared by CAD and CAPP, concurrent design of product can be implemented based on product information, so the function and information integration of product design can be realized. Product and its design process can be optimized.

关键词： Concurrent engineering

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Information processing for mechatronic systems

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ROBOTICS AND AUTONOMOUS SYSTEMS 1996年第2期19卷 117-134页

作者： Isermann, R Institute of Automatic Control Laboratory for Control Engineering and Process Automation Technical University of Darmstadt Landgraf-Georg-Str. 4 D-64283 Darmstadt Germany

The integration of mechanical systems and microelectronics opens many new possibilities for process design and automatic functions. After discussing the mutual interrelations between mechanical and electronic design the different ways of integration within mechatronic systems and the resulting properties are described. The information processing can be organized in multilevels, ranging from low-level control, through supervision to general process management. In connection with knowledge bases and inference mechanisms intelligent control systems result. The design of control systems for mechanical systems is described, from modeling, identification to adaptive control for nonlinear systems. This is followed by solving supervision tasks with fault diagnosis. Then design tools for mechatronic systems are considered and examples of applications are given, like intelligent control of an electromechanical throttle actuator and force and torque reconstruction for a robot.

关键词： mechatronic systems intelligent control nonlinear control adaptive control supervision fault diagnosis hardware-in-the-loop simulation intelligent automobile actuators torque reconstruction robot control

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