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检索条件"任意字段=Conference on Design for Manufacturability through Design-Process Integration"
5165 条 记 录,以下是4981-4990 订阅
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A tiered approach to design for environment
A tiered approach to design for environment
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International conference on Clean Electronics Products and Technology, 1995. (CONCEPT)
作者: W.F. Hoffman Motorola USA
There has been much discussion about environmental issues in manufacturing and the design of new products. The challenge is to integrate environmental considerations into the design and manufacturing operations so tha... 详细信息
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AN ADVANCED MULTI-DSP PLATFORM FOR SPEECH TECHNOLOGY integration IN COMPUTER TELEPHONY APPLICATIONS  4
AN ADVANCED MULTI-DSP PLATFORM FOR SPEECH TECHNOLOGY INTEGRA...
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4th European conference on Speech Communication and Technology, EUROSPEECH 1995
作者: Rohwer, E. LINKON Corporation 2 Greville Drive Edgbaston BirminghamB15 2UU United Kingdom
This paper presents an advanced platform for commercial use of speech technology products in multimedia applications. It covers the general concept of the hardware and software design of a powerful multi DSP communica... 详细信息
来源: 评论
Realisation of an integrated software engineering environment through heterogeneous CASE-tool integration  7
Realisation of an integrated software engineering environmen...
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7th Software Engineering Environments conference, SEE 1995
作者: Bosua, R. Brinkkemper, S. P.O. Box 392 Pretoria0001 South Africa Department of Computer Science University of Mente PO. Box 217 Enschede7500 AE Netherlands
The development of large software systems needs appropriate automated support in the form of an integrated software engineering environment (ISEE) to support the system development process. This paper describes an app... 详细信息
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conference on Flight Simulation Technologies, 1995
Conference on Flight Simulation Technologies, 1995
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Flight Simulation Technologies conference, 1995
The proceedings contain 33 papers. The special focus in this conference is on Flight Simulation Technologies. The topics include: Flight simulation software at NASA dryden flight research center;aircraft modeling and ...
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design issues for through-wafer optoelectronic multicomputer interconnects
Design issues for through-wafer optoelectronic multicomputer...
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International conference on Massively Parallel processing Using Optical Interconnections
作者: P. May S.T. Wilkinson N.M. Jokerst D.S. Wills M. Lee O. Vendier S.W. Bond Z. Hou G. Dagnall M.A. Brooke A. Brown School of Electrical and Computer Engineering Microelectronics Research Center Georgia Institute of Technology Atlanta GA USA
The paper presents several design issues associated with the implementation of a three dimensional optically interconnected parallel processing system. A technique for improving bit error rate in low power multistage ... 详细信息
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integration of costing, yield and performance metrics into the TCAD environment through the combination of DOE and RSM
Integration of costing, yield and performance metrics into t...
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1995 IEEE/UCS/SEMI International Symposium on Semiconductor Manufacturing, ISSM 1995
作者: Fallon, M. Walton, A.J. Newsam, M.L. Axelradt, V. Granikt, Y. Department of Electrical Engineering Kings Buildings University of Edinburgh EdinburghEH9 3JL United Kingdom TTechnology Modeling Associates Palo AltoCA United States
This paper details a procedure that uses a Total TCAD framework for producing costing and yield response surfaces in addition to the normal performance related information. It mental design software into the same envi... 详细信息
来源: 评论
14th International conference on Object-Oriented and Entity-Relationship Modeling, OOER 1995
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14th International conference on Object-Oriented Entity-Relationship, OOER 1995
The proceedings contain 45 papers. The special focus in this conference is on Object design, Modeling, Models and Languages. The topics include: Modeling and system maintenance;adaptive schema design and evaluation in...
来源: 评论
The integration of software engineering into a computer science curriculum  8th
The integration of software engineering into a computer scie...
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8th conference on Software Engineering Education, CSEE 1995
作者: Hilbum, Thomas B. Hirmanpour, Iraj Kornecki, Andrew Department of Computer Science Embry-Riddle Aeronautical University Daytona BeachFL32114 United States
This paper discusses ideas and techniques for integrating software engineering concepts and practices into an undergraduate computer science curriculum. Discussion is focused on concepts that are related to the follow... 详细信息
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Integrated interconnect circuit modeling for VLSI design
Integrated interconnect circuit modeling for VLSI design
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Asia and South Pacific design Automation conference
作者: Won-Young Jung Ghun-Up Cha Young-Bae Kim Jun-Ho Baek Choon-Kyung Kim D.A. Center LG Semicon Company Limited Seoul South Korea
An integrated interconnect modelling system, SIMS, is developed with parametrized modeling of interconnect and an interface with schematic capture and editor. SIMS automatically drives numerical interconnect simulatio... 详细信息
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Low power and high speed multiplication design through mixed number representations
Low power and high speed multiplication design through mixed...
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IEEE International conference on Computer design: VLSI in Computers and processors, (ICCD)
作者: Menghui Zheng A. Albicki Department of Electrical Engineering University of Rochester Rochester NY USA
A low power multiplication algorithm and its VLSI architecture using a mixed number representation is proposed. The reduced switching activity and low power dissipation are achieved through the Sign-Magnitude (SM) not... 详细信息
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