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14th International scientific conference on Modern Building Materials, Structures and Techniques, MBMST 2023

作者： Popov, Vladimir Grigorjeva, Eva Grigorjeva, Tatjana Anciūtė, Alvyda Vilnius Gediminas Technical University Vilnius Lithuania

ISBN: (纸本)9783031446023

Building design is a broad and intensive collaborative process that involves a multitude of tasks and responsibilities that need to be accomplished in a timely and qualitative manner. The design process has a clearly expressed iterative nature - each solution is initially raised as a hypothesis, which is further discussed, analysed, calculated, checked, including compliance with normative requirements, and then final decisions are made after analysing several possible alternatives. This takes place in each team (discipline) of the project participants by comparing analysis results and anticipating the possible impact of decisions on the solutions and results of other design teams (disciplines). Therefore, it is very important to coordinate, synchronize, reconcile, and manage these decision making iterations in a collaborative environment. The Building Information Modelling (BIM) technology encourages the development of harmonized information production and management processes, creating preconditions for real collaboration between design partners in a unified model (the prototype of real building) environment and enables this model to be used for multivariate virtual testing. This feature is realized through the integration of modelling and analysis and computing systems, when the data transfer from one system to another system ensures the connection between the physical and the analysis model and the integrity of their data. The article deals with the integration levels and systemic directions of architectural and structural modelling and design computation programs. The problem of physical construction model creation and conversion into analysis model is defined and the stages of Computer-Aided design/Competer-Aidet Engineering (CAD/CAE) integrated design process are discussed. © The Author(s), under exclusive license to Springer Nature Switzerland AG. 2024.

关键词： Computer aided design

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Characterization and Mitigation of Conducted Emissions in a SiC Based Three-Level T-Type Motor Drive for Aircraft Propulsion

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IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS 2023年第3期59卷 3400-3412页

作者： Phukan, Ripun Zhao, Xingchen Chang, Che-Wei Dong, Dong Burgos, Rolando Debbou, Mustapha Platt, Arnaud Asfaux, Pascal Virginia Tech Ctr Power Elect Syst Blacksburg VA 24061 USA Airbus SAS F-31700 Blagnac Midi Pyrenees France

This paper presents the full-scale high power inverter design considerations that are needed for minimum conducted noise propagation throughout the system. Specifically, system design issues pertaining to high current and high altitude, high switching transients during commutation process, ribbon cables for highspeed signal transmission, strict conducted emissions requirements and motor side bearing/leakage currents are discussed. Based on the underlying deficits for high power motor drives, layout and circuit design methodologies are proposed to tackle such problems, while keeping costs at a bare minimum. Subsequently, modeling and prediction of common-mode (CM) and differential-mode (DM) noise is made possible using accurate lumped inverter and filter models, allowing for a better understanding of the sensitive components contributing to peak CM-DM noise. A high power (211 kW) rated three level T-type inverter prototype is used to demonstrate the viability of the proposed design techniques for reliable system operation and conducted electromagnetic interference (EMI) emissions mitigation.

关键词： Damping edge plating feed-through grounding magnetic integration silicon carbide

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BARRIERS AND DRIVERS FOR AN EFFICIENT integration OF ECO-design OF COMPLEX SYSTEMS: A CASE STUDY IN THE FRENCH MILITARY INDUSTRY 24

BARRIERS AND DRIVERS FOR AN EFFICIENT INTEGRATION OF ECO-DES...

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24th International conference on Engineering design, ICED 2023

作者： Dupont, Elise Cluzel, François Yannou, Bernard Laboratoire Genie Industriel CentraleSupélec Université Paris-Saclay Gif-sur-Yvette France

The defense industry tends to anticipate environmental issues through eco-design integration in the overall design process. This leads to focus on the impact of technological and design choices of complex systems while maximizing operational performance. Such development involves long and complex processes and is constrained in a project owner and industrial project manager context. In this context poorly described in the literature, the objective of this paper is to identify barriers and drivers to achieve an efficient application of eco-design. A comprehensive analysis of the interactions and the current design processes is performed in the context of the French defense industry. through internal documentation and semi-structured interviews with the key actors, the generic design process of a project owner is analysed (including relationships with industrial project manager). The failure modes that currently limit the integration of eco-design in projects are also identified. © The Author(s), 2023. Published by Cambridge University Press.

关键词： Ecodesign

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Research on Reliability integration Test Method for Civil Aircraft Airborne Systems Based on Fault Injection 14

Research on Reliability Integration Test Method for Civil Ai...

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14th IEEE Global Reliability and Prognostics and Health Management conference, PHM-Hangzhou 2023

作者： Ma, Biao Hu, Xuan System Integration Department Shanghai Aircraft Design and Research Institute Shanghai China Electrical Integration Department Shanghai Aircraft Design and Research Institute Shanghai China

ISBN: (纸本)9798350301359

Reliability integration test is a kind of system integration tests which conducted on test benches such as iron bird to verify the safety and reliability design of civil aircraft airborne systems. It is necessary to inject faults into the tested airborne system through a fault injection system when conducting reliability integration test. By observing the status of the tested system and the changes in detection signals after injection of faults, and evaluating the impact of faults to verify the safety and reliability design of the airborne system. This paper studies the reliability integration test and fault injection technology of airborne systems, proposes a testing system and process for reliability integration testing based on fault injection. through application cases, the operational methods and implementation effectiveness of the testing system and process were demonstrated. © 2023 IEEE.

关键词： airborne systems fault injection reliability integration test validation

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Women in STEAM through the Lens of an Immersive-Based Storytelling design 18th

Women in STEAM Through the Lens of an Immersive-Based Storyt...

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18th Colombian conference on Computing

作者： Avila-Garzon, Cecilia Bacca-Acosta, Jorge Rodriguez-Rojas, Ivan Fdn Univ Konrad Lorenz Fac Math & Engn Bogota Colombia

ISBN: (纸本)9783031752353;9783031752360

This paper explores the co-creation and co-design of a virtual reality application using Unity 3D and Meta Quest 2, aimed at representing, through a storytelling process, the life of Ada Lovelace who is a recognized woman in STEAM disciplines. The immersive-based storytelling design was represented through an interactive escape room. Beginning with ideation and research, the project employed digital narrative techniques to highlight key aspects of Ada's contributions to mathematics and computing. Scene creation utilized Unity's assets andXRcapabilities, ensuring immersive environments aligned with historical contexts. Feedback from stakeholders informed needed improvements which could enhance narrative coherence and user experience. Moreover, the integration of VR hardware facilitated realistic interactions, highlighting the potential of VR in educational storytelling. This study underscores the technical and creative challenges of VR development while showcasing its application in the design and development of an immersive narrative experience.

关键词： STEAM Virtual Reality Storytelling Women Co-creation Co-design

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Research on Reliability Risk-Based Microstructure Evaluation Method for Integrated Circuits 25

Research on Reliability Risk-Based Microstructure Evaluation...

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25th International conference on Electronic Packaging Technology (ICEPT)

作者： Chen, Mian-Zhi Cai, Jin-Bao He, Sheng-Zong Liang, He Yong, Wang Kong, Ling-Ming Jun, Chen Wu, Jing-Xi Guangzhou Power Supply Bur Guangzhou Peoples R China CEPREI Lab Guangzhou Peoples R China

ISBN: (纸本)9798350353808

The reliability of design, process, inner microstructure and material used in integrated circuit is the key to determining the inherent reliability level of the device itself. With the continuous updating and iteration of integrated circuit manufacturing processes, the size of process microstructure is getting smaller and the integration degree is getting higher. As a result, issues related to circuit design layout, manufacturing process, packaging process, and material reliability have gradually become key influencing factors affecting the reliability level of integrated circuits themselves. How to conduct quality inspection and reliability evaluation on newly developed integrated circuits, effectively identify defects and weak links that affect device quality and application reliability, and fully verify the true reliability level of devices, has very important practical significance. This study proposes a reliability risk based integrated circuit microstructure evaluation method, which analyzes the key elements that affect device reliability in advance and establishes corresponding testing and evaluation items. through physical testing and verification of the device, the real reliability risks of the device can be identified and provide a basis for device design, process improvement, selection, and application design. This method aims to provide integrated circuit users with an effective means of quality inspection and reliability evaluation to ensure the inherent reliability of microelectronic devices.

关键词： integrated circuits microstructure reliability risks reliability assessments failure mechanisms process issues

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integration OF design DATA INTO AUTOMATED FIBER PLACEMENT process PLANNING METRICS

INTEGRATION OF DESIGN DATA INTO AUTOMATED FIBER PLACEMENT PR...

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SAMPE 2023 conference and Exhibition

作者： Brasington, Alex Halbritter, Joshua Noevere, August Harik, Ramy McNair Center University of South Carolina ColumbiaSC United States Collier Aerospace Newport News VA United States

ISBN: (纸本)9781934551431

With the ever-expanding aviation industry, a need is arising for more rapid production of composite aircraft to meet increasing demand. State-of-the-art aircraft such as the Boeing 787 showcase 50% composite material usage by weight, highlighting this emerging industry-wide adoption of the material system. Currently, many of the large structures associated with these aircraft are manufactured additively via Automated Fiber Placement (AFP). The AFP process shows great potential for efficient manufacturing, however unavoidable defects still occur because of tool surface geometry, placement errors, or poor process planning, resulting in decreased quality and throughput. Due to such effects, it is critical to incorporate design for manufacturing (DFM) principles to achieve the optimal manufacturing plan and resulting structure. This work will develop a methodology for incorporating design information into process planning metrics in an automated fashion to achieve an optimal set of process inputs. The analysis incorporates HyperX, Computer Aided process Planning (CAPP) and Vericut Composite Programming (VCP). Safety margins from HyperX are imported into CAPP where AFP defects are mapped to the values. The resulting margins are then incorporated into the CAPP manufacturability algorithms, creating a design informed process planning analysis. © 2023 Soc. for the Advancement of Material and process Engineering. All rights reserved.

关键词： Aircraft

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The Fernstudent. A User-Centered design Case Study on Improvements of Hybrid Teaching through A Physical Avatar in the Classroom.

The Fernstudent. A User-Centered Design Case Study on Improv...

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CHI conference on Human Factors in Computing Sytems (CHI)

作者： Ullrich, Daniel Butz, Andreas Diefenbach, Sarah Ludwig Maximilians Univ Munchen Dept Comp Sci Munich Germany Ludwig Maximilians Univ Munchen Dept Psychol Munich Germany

ISBN: (纸本)9798400703317

Hybrid formats have become a common approach in university teaching. Typically, there is a synchronous live session which students can join either in the physical classroom or digitally/remotely with interaction through textual chat. While this has many advantages in terms of inclusivity and sustainability, it also poses problems such as increased attention requirements for teachers and a lacking social integration of remote and on-site students. Based on a user-centered design approach, we developed the concept of the "Fernstudent". A physical avatar represents remote students collectively in the classroom, creating a communication channel based on the same modalities as for on-site communication. The present case study describes the iterative design process, from the first idea via explorative interviews and state of the art analysis, concept development, potential analysis, exploration of different design variants, a first functional prototype, a pilot field test, and finally lessons learnt and planned future steps of development.

关键词： Fernstudent hybrid teaching user-centered design concept development prototype pilot field test

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Supporting Educators to Co-design Interdisciplinary Projects Integrating Educational Robotics and Arts 23

Supporting Educators to Co-Design Interdisciplinary Projects...

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23rd European conference on e-Learning

作者： Zalavra, Eleni Papanikolaou, Kyparissia Tzelepi, Maria Asensio-Perez, Juan I. Dimitriadis, Yannis Saban, Mohamed Pappa, Nafsika Univ West Attica Athens Greece Sch Pedag & Technol Educ Athens Greece Univ Valladolid Valladolid Spain

ISBN: (纸本)9781917204217;9781917204224

The growing call to foster interdisciplinary learning has found educators struggling to co-design learning across disciplinary boundaries. Aiming to contribute to the area of interdisciplinary learning design, we explored how to support educators in co-designing interdisciplinary projects integrating Educational Robotics (ER) and Arts, hereafter called Artful ER projects. Our research included developing the "FERTILE" Learning design methodology as a conceptual tool scaffolding the integration of discipline-oriented viewpoints while educators co-design. Acknowledging that one of the challenges in interdisciplinary collaboration derives from educators' different intentions for students' learning outcomes, the "FERTILE" methodology introduces Computational Thinking (CT) skills as an Artful ER project's primary learning outcome. In this line, the "FERTILE" methodology adapts the Creative Computational problem-solving model, which has been reported to cultivate CT skills through its staged process. Furthermore, we developed the "FERTILE" Community Platform as an online environment providing two-fold support to educators as designers of interdisciplinary learning. The "FERTILE" Community Platform incorporates community functionalities that address collaboration practicalities while educators co-design. Additionally, it integrates authoring functionalities scaffolding educators in designing Artful ER projects based on the "FERTILE" Learning design methodology. This paper explores how the authoring functionalities of the "FERTILE" Community Platform support educators in designing interdisciplinary learning. We report on a pilot study conducted with Greek and Spanish educators. In this study, we applied a mixed-method research design with a quantitative strand adopting indicators from the Usability Metric for User Experience (UMUX) model and a qualitative strand providing insights into participants' perceptions. The findings indicate that scaffolding disciplinary elaboratio

关键词： Interdisciplinary learning design Community platform Educational robotics Arts education Computational thinking

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High Speed D2D Interface design and Analysis on Advanced Package 25

High Speed D2D Interface Design and Analysis on Advanced Pac...

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25th International conference on Electronic Packaging Technology (ICEPT)

作者： Jhong, Ming Fong Kuo, Hung Chun Lai, Chung Hung Huang, Hung Hsien Huang, Chih Yi Wang, Chen Chao Adv Semicond Engn Prod Design Div Kaohsiung Taiwan

ISBN: (纸本)9798350353808

The research and discussion in this paper, there are package design with the structure of FOCoS (Fan Out Chip on Substrate) for an actual high-performance computing IC device with ASIC (Application Specific Integrated Circuit) chips and HBM (High Bandwidth Memory) chips. In the process of this study, the die-to-die (D2D) interconnection between ASIC chip to ASIC chip is used UCIe (Universal Chiplet Interconnect Express) interface for high speed signal transmission and HBM3/HBM3e is applied on data transfer between ASIC chip and high bandwidth memories. through electrical analysis, the suitable RDL (Re-Distribution Layer) structure and routing topology are applied on various interface.

关键词： Chiplets UCIe HBM3 FOCoS heterogeneous integration

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