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Selective Complexity Determination at Cost Based Alternatives to Re-manufacture 1

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IFIP WG 5.7 International conference of the Advances in Production Management Systems (APMS)

作者： Panagou, Sotirios La Cava, Giuseppe Fruggiero, Fabio Mancusi, Francesco Univ Basilicata Sch Engn Via Ateneo Lucano 10 I-85100 Potenza Italy

ISBN: (数字)9783031436888

ISBN: (纸本)9783031436901;9783031436888;9783031436871

The rise in demand and price for raw materials is pushing manufacturing industries to look for new ways to secure parts and products for their production while keeping the expenses low. Remanufacturing as the manifestation of circular paths can contribute towards sustainability (in terms of extension of use and reduction of waste). This work proposes a decision-support system to select, through adaptability, product and parts for remanufacture. It makes use of complexity analysis and production capacity (i.e., demand) to quantify costs. The complexity level was related with (i) characteristics of components and (ii) disassembly transitions. The decision system is conceived to assess, through inspection, the potential of a product/part for re-manufacturability based on failure pattern and recoverable rate. The re-manufacturability is evaluated, on cost alternatives, as per regeneration using additive or subtractive manufacturing, reuse of components/parts, recovery of materials, disposal. The additive alternative was analyzed over complexity (suggesting alternatives while estimating costs vs. complexity) which increases interest in the applicability to recover complex forms of limited (unplanned) demand. To demonstrate the applicability, authors quantified costs involving the remanufacturing of gear pumps parametrizing parts on a complexity amount after a relative product recyclability selection. Results evaluate (dis)assembly and regeneration across main feature assessment.

关键词： Remanufacturing design Complexity process Complexity Additive Manufacturing Subtractive Manufacturing

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ADDITivELY MANUFACTURED LIQUID-COOLED HEAT SINK: GYROID-BASED design, FABRICATION, AND TESTING

ADDITIVELY MANUFACTURED LIQUID-COOLED HEAT SINK: GYROID-BASE...

引用

ASME International Technical conference and Exhibition on Packaging and integration of Electronic and Photonic Microsystems (InterPACK)

作者： Jourdan, Adrian Sarvadi, Alexander Siller, Hector R. Bostanci, Huseyin Univ North Texas Dept Mech Engn Denton TX 76203 USA

ISBN: (纸本)9780791886557

This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based lattice structures for the practicality and flexibility (of varying topology parameters) of complicated structures to achieve high heat transfer performance. The design restrictions were set such that the heat sink would occupy a 25 mm x 25 mm x 8 mm space and attach on a matching size heater. A gyroid lattice structure with high cell volume allowing high fluid flow rate was chosen to test its printability and its effects on heat transfer. Using computational iterative routines to modify lattice structures allowed changing parameters including gyroid cell size, y-mapping, thickness of fins, overall dimensions, and other parameters. Prototype of the heat sink design was made of aluminum alloy (AlSi10Mg) by additive manufacturing process (laser powder bed fusion). Experimental investigation involved testing additively manufactured heat sink on a ceramic (AlN) heater at varying heat loads and flow rates, and measuring corresponding heater temperature to calculate thermal resistance. Results suggest that although further design and validation efforts are needed to fully assess the capabilities, the topology-based, additively manufactured liquid-cooled heat sinks would potentially offer a promising alternative in terms of heat transfer and fluid flow characteristics, as well as manufacturability, and reduced weight, material usage, and production cost.

关键词： topology-based design additive manufacturing heat sink cold plate liquid cooling

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Emotion GaRage Vol. iv: Creating Empathic In-Vehicle Interfaces with Generative AIs for Automated Vehicle Contexts 15

Emotion GaRage Vol. IV: Creating Empathic In-Vehicle Interfa...

引用

15th International conference on Automotive User Interfaces and Interactive Vehicular Applications

作者： Choe, Mungyeong Bosch, Esther Dong, Jiayuan Alvarez, Ignacio Oehl, Michael Jallais, Christophe Alsaid, Areen Nadri, Chihab Jeon, Myounghoon Virginia Tech Grado Dept Ind & Syst Engn Blacksburg VA 24061 USA German Aerosp Ctr DLR Inst Transportat Syst Braunschweig Germany Intel Corp Intel Labs Portland OR USA Univ Gustave Eiffel Lyon France Univ Michigan Dearborn Dearborn MI USA

ISBN: (纸本)9798400701122

This workshop aims to design advanced empathic user interfaces for in-vehicle displays, particularly for high-level automated vehicles (SAE level 3 or higher). Incorporating model-based approaches for understanding human emotion regulation, it seeks to enhance the user-vehicle interaction. A unique aspect of this workshop is the integration of generative artificial intelligence (AI) tools in the design process. The workshop will explore generative AI's potential in crafting contextual responses and its impact on user experience and interface design. The agenda includes brainstorming on various driving scenarios, developing emotion-oriented intervention methods, and rapid prototyping with AI tools. The anticipated outcome includes practical prototypes of affective user interfaces and insights on the role of AI in designing human-machine interactions. through this workshop, we hope to contribute to making automated driving more accessible and enjoyable.

关键词： empathic vehicles emotions affective computing interaction design ChatGPT

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Physical Computational Models for Horizontal Learning in STEM 53

Physical Computational Models for Horizontal Learning in STE...

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53rd IEEE ASEE Frontiers in Education International conference, FIE 2023

作者： Liu, Ting Quek, Francis Hordemann, Glen Texas A&m University College StationTX United States

ISBN: (纸本)9798350336429

'What are we learning this for?' is a common refrain heard in education. Showing how engineering practices are relevant to everyday needs like building science models in K-12 classes may lead to greater motivation for students in STEM learning. This paper investigates how horizontal integration of different streams of learning may enable students to see why and how each element of knowledge is relevant to the whole. By combining microcontroller-based electronics, programming, and 3D design and fabrication to build science models, students may develop a stronger appreciation of how the component technologies interrelate (internal contextualization) and how these integrated computational models contribute to the enterprise of science (external contextualization). Furthermore, students in science classrooms see how computation can make physical models dynamic to represent changes and relationships more effectively. The implicit representational science models and the incorporation of technology and computation into a regular science curriculum make the knowledge transferable beyond an individual lesson. Students learn the component technologies cumulatively through a sustained process of engagement across multiple science modeling projects. The major challenges of this approach are how the science modeling projects may be designed and what factors have to be considered in the designs to realize this learning progression. To answer these questions, this paper describes a rigorous design process for the Physical Computational Models (PCMs) that incorporates science model correctness, progression of learning across all streams, pedagogical efficacy, classroom dynamics and manufacturability. In addition, we implemented a year-long project using our Horizontal Learning (HL) approach at two local public schools. This paper reports in detail two PCMs we developed for authentic 5th and 6th grade classrooms to illustrate the integration of the learning streams in science, compu

关键词： 5th and 6th grade classrooms Computation Engineering education Horizontal learning Leaning progression Science models STEM integration Sustained learning

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Trends in Research Related to Product design for Rural Teaching from 2012 to 2022: A Bibliometric and Knowledge Mapping Analysis 12th

Trends in Research Related to Product Design for Rural Teach...

引用

12th International conference on design, User Experience, and Usability (DUXU) Held as Part of the 25th International conference on Human-Computer Interaction (HCII)

作者： Yuan, Xing Zhao, Yang Xie, Yixin Wu, Liuyi Wang, Tiantian Kyiv Natl Univ Technol & Design UA-01011 Kiev Ukraine Hezhou Univ Sch Culture & Media Hezhou 542899 Peoples R China Shaanxi Univ Sci & Technol Coll Design & Art Xian 710021 Shaanxi Peoples R China Guangxi Normal Univ Sch Design Guilin 541006 Peoples R China

ISBN: (纸本)9783031357077;9783031357084

Aim: To retrospect the global trends in and explore hotspots of Product design for rural teaching research. Methods: Therefore, a bibliometric analysis was conducted using the Web of Science Core Collection to examine the publication trends of Product design for Rural Teaching in various academic journals. The data was analyzed using the VOSviewer version 1.6.14 software, generating an information map which incorporated keywords, journals, countries, international collaborations, authors, research hotspots, and the focus area of Product design for Rural Teaching. Results: A thorough examination of the Web of Science Core Collection database revealed that there were a total of 211 publications in the realm of product design for rural education published between the years 2012 and 2022. The number of publications in 2012 was 10, while in 2022, it rose to 29, indicating a remarkable growth in the volume of research output in this area over the past decade. China emerged as the leading country in terms of publication numbers, followed by the United States and Brazil. Conclusion: Based on a review of the latest trends in Web of Science Core Collection data, it was found that the "Attitude", "Student", "Concern", and "Growth" are prominent themes in the field of rural education product development. The aim of rural education product design is to enhance teaching effectiveness and learning motivation through optimized and upgraded methods and instructional materials. These findings can provide valuable insights and guidance for education researchers and designers in improving the product design process in rural education.

关键词： Product design for rural teaching Ten-year trends bibliometric analysis VOSviewer

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Electronics - A First Course for Printed Circuit Board design 129

Electronics - A First Course for Printed Circuit Board Desig...

引用

129th ASEE Annual conference and Exposition: Excellence through Diversity, ASEE 2022

作者： Liu, Cheng Chang, Jian

The design of printed circuit board (PCB) is an essential aspect in learning circuits and systems in the electrical and computer engineering (ECE) curricula. In fact, many institutions have allowed for this opportunity in 3D printing labs for students to rapidly prototype their circuit designs and other 3-D printed projects. Further, we see a high importance for students to learn practical aspects of circuit design in the sophomore year, and to retain ECE students who feel a greater level of accomplishment in computer science courses or plan to drop out. In this article we discuss what can be done in an electronics course to possibly retain students in ECE programs. Microprocessors, field programmable gate arrays (FPGAs), and microcontrollers are all essential components in electronic systems. The electronics course offers two levels of design experiences to students: 1) circuits and electronics and 2) PCB designs for manufacturability. These two experiences incorporate microcontroller and environmental sensor interfaces, in addition to Bluetooth connectivity and motor driver integration. As a result, this allows students to use the circuit interfaces on their PCB to build complex systems for smart home, automation, mobile, and industrial applications. Herein, we detail the incorporation of PCB development in the electronics course offered in year-two of the ECE curriculum. The course is organized in a 15-week schedule that covers traditional circuit designs with diodes, transistors, operational amplifiers, but also includes electronic circuits design in schematic capture, PCB layout, soldering electronic components and microcontroller programming on a custom PCB. This paper also describes an upload process of the Arduino bootloader to a custom PCB and the use of the Arduino IDE to write code and upload it to the PCB. The approach used for soldering training to students and challenges of teaching the printed circuit design are also presented. © American Society for

关键词： Printed circuit boards

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design of a High Jitter Harmonic Injected Ring Oscillator for Entropy Sources

Design of a High Jitter Harmonic Injected Ring Oscillator fo...

引用

IEEE International conference on Integrated Circuits, Technologies and Applications (ICTA)

作者： Ziyang Ye Makoto Ikeda University of Tokyo Tokyo Japan

ISBN: (数字)9798331530723

ISBN: (纸本)9798331530730

in the field of modern cryptography and-information security, the generation of random numbers is crucial, with the quality of the entropy source being paramount. This study explores the design of Ring Oscillator (RO)-based entropy sources, noted for their high manufacturability and ease of integration. However, the jitter produced by naive ROs is insufficient for high-quality entropy. We propose a design that significantly enhances jitter performance through the introduction of a harmonic injection path. This approach maintains high synthesizability while incurring only modest increases in area and power consumption. Experimental results demonstrate that the modified RO,fa bricated using a 180 nm process, elevated the average min-entropy from $0.058 / \mathrm{bit}$ to 0.351/bit, offering new insights and substantial support for the development of high-quality random number generators.

关键词： Ring oscillators Integrated circuit technology Power demand Jitter Harmonic analysis Entropy Generators Cryptography

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integration of Soft System Methodology and Scrum for Housing Administration System 4

Integration of Soft System Methodology and Scrum for Housing...

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4th International conference on Electrical Engineering and Computer Science, ICECOS 2024

作者： Lewenusa, Irvan Handhavani, Teny Universitas Tarumanagara Fakultas Teknologi Informasi Jakarta Indonesia

ISBN: (纸本)9798350368253

The development of Information Technology (IT) affects all aspects of activities. Fast and accurate information is crucial in the service delivery process. The limitations in conveying user needs information during the development to developers become an obstacle that causes software development projects to fail. A method is needed that can bridge the communication of user needs to developers. Soft System Methodology (SSM) is a qualitative approach used to address complex, unstructured problems in social and organizational contexts. SSM is expected to bridge the communication of needs from users who are still unfamiliar with IT. SSM consists of flexible and iterative stages to adapt to field conditions in order to understand new user problems. The Scrum method is an agile framework commonly used to manage projects iteratively, allowing development teams to adapt quickly and effectively. The use of multi-platform applications is becoming increasingly important. Applications that can be accessed through various platforms such as mobile devices, tablets, and computers can provide convenience and enhance operational. The challenges of developing multi-platform are high development costs and the different programming languages used on each application platform. Progressive web technology can be an alternative choice for developing. This study proposes integrating SSM with Scrum to improve the housing administration system. with a case study of the Taman Paris Lippo Karawaci housing using progressive web technology. The Taman Paris Lippo Karawaci housing complex is situated in Tangerang. We hope this study can increase the efficiency of resident service management and significantly reduce project management's development cycle time. These results indicate that this method has great potential for application in other housing projects. © 2024 IEEE.

关键词： Software design

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Improving student outcomes through transdisciplinary curriculum design in biomedical engineering 9

Improving student outcomes through transdisciplinary curricu...

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9th Research in Engineering Education Symposium and 32nd Australasian Association for Engineering Education conference: Engineering Education Research Capability Development, REES AAEE 2021

作者： Lam, Lionel Cochrane, Thomas Davey, Catherine John, Sam Shaktivesh, Shaktivesh Ganesan, Saampras Rajagopal, Vijay University of Melbourne Australia

ISBN: (纸本)9781713862604

CONTEXT The boundaries between traditional engineering disciplines are breaking down. It is increasingly important for engineering students to be equipped with the ability to integrate complex concepts across disciplines to tackle real world problems. Biomedical engineering is a discipline that marries concepts from mechanical, electrical, and chemical engineering, as well as computer science to develop technologies that improve human health. Most existing biomedical engineering curricula, however, do not reflect this transdisciplinary integration. These concepts are typically introduced to students in separate subjects with minimal or no cross-curricular references. PURPOSE OR GOAL Prior to 2021, the undergraduate Bioengineering Systems Majojr at the University of Melbourne featured a traditional structure with engineering mechanics, electrical engineering, chemical engineering and programming concepts sequestered into separate subjects. This has unintentionally resulted in students over-compartmentalising these concepts: they are often unable to appreciate how the different pieces fit together synergistically to form a coherent whole. To tackle this issue, we launched a curriculum redesign project centred around the student-led collaborative design of a bionic limb. This redesign has allowed us to link four core subjects across the major, covering key concepts in programming and modelling, biomechanics, electronics, and the engineering design process. APPROACH OR METHODOLOGY/METHODS A design-based research methodology was applied to form a team consisting of academics, educational technology researchers, and technology designers. We followed a four-stage iterative model involving: (i) initial problem analysis and identification of design principles;(ii) the prototyping of curriculum design solutions;(iii) evaluation and iterative redesign;(iv) and the refinement and sharing of design principles. This led to the design of a prototype bionic limb and associated teac

关键词： Biomechanics

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Re-examining VLSI Manufacturing and Yield through the Lens of Deep Learning : (Invited Talk)

Re-examining VLSI Manufacturing and Yield through the Lens o...

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IEEE International conference on Computer-Aided design

作者： Mohamed Baker Alawieh Wei Ye David Z. Pan University of Texas at Austin

ISBN: (数字)9781665423243

The continued scaling of integrated circuit technologies, along with the increased design complexity, has exacerbated the challenges associated with manufacturability and yield. In today's semiconductor manufacturing, lithography plays a fundamental role in printing design patterns on silicon. However, the growing complexity and variation of the manufacturing process have tremendously increased the lithography modeling and simulation cost. Besides, both the role and cost of resolution enhancement techniques (RETs) - now indispensable in the design process - have increased. Parallel to these developments are the recent advancements in Machine Learning (ML) which have provided a far-reaching data-driven perspective for problem solving. In this work, we shed light on the recent Deep Learning (DL) based approaches that have provided a new lens to examine traditional manufacturability and yield challenges. We present lithography modeling and simulation techniques, leveraging advanced learning paradigms, which have demonstrated unprecedented efficiency. Moreover, we demonstrate the role DL can play in advancing RETs by presenting its successful application in assist feature generation. Also critical to yield is the post fabrication wafer map defect analysis step which our work tackles using a novel confidence-aware deep learning scheme. This paper further discusses the future prospects of DL-based approaches in the scope of circuits manufacturability and yield.

关键词： Lithography Computational modeling Resists Very large scale integration Generative adversarial networks Task analysis Predictive models

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