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检索条件"任意字段=Conference on Design for Manufacturability through Design-Process Integration IV"
310 条 记 录,以下是41-50 订阅
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Data Acquisition and Quality Assurance integration Platform Based on DPM
Data Acquisition and Quality Assurance Integration Platform ...
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4th International conference on Frontiers of Manufacturing and design Science (ICFMD 2013)
作者: Wang, Jian He, Weiping He, Yanli Li, Xiashuang Guo, Gaifang Northwestern Polytech Univ Key Lab Contemporary Design & Integrated Mfg Tech Minist Educ Xian 710072 Peoples R China
Direct Part Marking (DPM) is used for part identification and tracking. In order to avoid discrete information caused by quality data incompleteness or disorder in each stage of a product life cycle, especially for a ... 详细信息
来源: 评论
Development of a model for evaluating the NPD process in SMEs: A Latin American experience  24
Development of a model for evaluating the NPD process in SME...
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24th CIRP design conference 2014: Mass Customization and Personalization
作者: Hernandez, María Cristina Montoya, Marcela Velásquez Martínez, Jose F. Design Engineering Research Group Universidad EAFIT Medellín Colombia
This article presents the findings resulting from a research project carried out in Medellin, Colombia, that was aimed at developing a model of diagnosis for the NPD process in manufacturing SMEs, adapted to the Latin... 详细信息
来源: 评论
design for manufacturability: a fabless perspective
Design for manufacturability: a fabless perspective
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conference on design for manufacturability through design-process integration VII
作者: Cain, Jason P. Adv Micro Devices Inc Austin TX 78739 USA
design for manufacturability (DFM) has become a key enabler of integrated circuit (IC) production over the past decade. In this paper a comprehensive DFM program for IC designs at the 28nm node and beyond is described... 详细信息
来源: 评论
Rethinking ASIC design with Next Generation Lithography and process integration
Rethinking ASIC Design with Next Generation Lithography and ...
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conference on design for manufacturability through design-process integration VII
作者: Vaidyanathan, Kaushik Liu, Renzhi Liebmann, Lars Lai, Kafai Strojwas, Andrzej Pileggi, Larry Carnegie Mellon Univ Pittsburgh PA 15213 USA
Given the deployment delays for EUV, several next generation lithography (NGL) options are being actively researched. Several cost-effective NGL solutions, such as self-aligned double patterning through sidewall image... 详细信息
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self-aligned Double Patterning Friendly Configuration for Standard Cell Library Considering Placement Impact
self-aligned Double Patterning Friendly Configuration for St...
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conference on design for manufacturability through design-process integration VII
作者: Gao, Jhih-Rong Yu, Bei Huang, Ru Pan, David Z. Univ Texas Austin ECE Dept Austin TX 78712 USA
self-aligned double patterning (SADP) has become a promising technique to push pattern resolution limit to sub-22nm technology node. Although SADP provides good overlay controllability, it encounters many challenges i... 详细信息
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Self-aligned Double Patterning Compliant Routing with In-design Physical Verification Flow
Self-aligned Double Patterning Compliant Routing with In-Des...
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conference on design for manufacturability through design-process integration VII
作者: Gao, Jhih-Rong Jawandha, Harshdeep Atkar, Prasad Walimbe, Atul Baidya, Bikram Rizzo, Olivier Pan, David Z. Univ Texas Austin ECE Dept Austin TX 78712 USA
Among double patterning techniques, Self-aligned double patterning (SADP) has the advantage of good mask overlay control, which has made SADP a popular double patterning method for sub-32nm technology nodes. However, ... 详细信息
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process Characteristics and Layout Decomposition of Self-aligned Sextuple Patterning
Process Characteristics and Layout Decomposition of Self-ali...
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conference on design for manufacturability through design-process integration VII
作者: Kang, Weiling Chen, Yijian Peking Univ Sch Elect & Comp Engn Shenzhen Grad Sch Shenzhen 518055 Guangdong Peoples R China
Self-aligned sextuple patterning (SASP) is a promising technique to scale down the half pitch of IC features to sub-10nm region. In this paper, the process characteristics and decomposition methods of both positive-to... 详细信息
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A novel methodology for building robust design rules by using design Based Metrology (DBM)
A novel methodology for building robust design rules by usin...
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conference on design for manufacturability through design-process integration VII
作者: Lee, Myeongdong Choi, Seiryung Choi, Jinwoo Kim, Jeahyun Sung, Hyunju Yeo, Hyunyoung Shim, Myoungseob Jin, Gyoyoung Chung, Eunseung Roh, Yonghan Sungkyunkwan Univ Sch Informat & Commun Engn Suwon 440746 South Korea
This paper addresses a methodology for building robust design rules by using design based metrology (DBM). Conventional method for building design rules has been using a simulation tool and a simple pattern spider mas... 详细信息
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Pattern matching for identifying and resolving non-decomposition-friendly designs for Double Patterning Technology (DPT)
Pattern matching for identifying and resolving non-decomposi...
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conference on design for manufacturability through design-process integration VII
作者: Wang, Lynn T. -N. Dai, Vito Capodieci, Luigi GLOBALFOUNDRIES Milpitas CA 95035 USA
A pattern matching methodology that identifies non-decomposition-friendly designs and provides localized guidance for layout-fixing is presented for double patterning lithography. This methodology uses a library of pa... 详细信息
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Model Based Hint for Litho Hotspot Fixing beyond 20nm node
Model Based Hint for Litho Hotspot Fixing beyond 20nm node
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conference on design for manufacturability through design-process integration VII
作者: Kang, Jae-hyun Kim, Byung-Moo Ha, Naya Choi, Hung Bok Kim, Kee Sup Mohamed, Sarah Madkour, Kareem ElManhawy, Wael Lee, Evan Brunet, Jean-Marie Kwan, Joe SAMSUNG Elect Co Ltd Yongin Gyeonggi Do 446711 South Korea
As technology nodes scale beyond 20nm node, design complexity increases and printability issues become more critical and hard for RET techniques to fix. It is now mandatory for designers to run lithography checks prio... 详细信息
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