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检索条件"任意字段=Conference on Design for Manufacturability through Design-Process Integration V"

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Physical Computational Models for Horizontal Learning in STEM 53

Physical Computational Models for Horizontal Learning in STE...

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53rd IEEE ASEE Frontiers in Education International conference, FIE 2023

作者： Liu, Ting Quek, Francis Hordemann, Glen Texas A&m University College StationTX United States

ISBN: (纸本)9798350336429

'What are we learning this for?' is a common refrain heard in education. Showing how engineering practices are relevant to everyday needs like building science models in K-12 classes may lead to greater motivation for students in STEM learning. This paper investigates how horizontal integration of different streams of learning may enable students to see why and how each element of knowledge is relevant to the whole. By combining microcontroller-based electronics, programming, and 3D design and fabrication to build science models, students may develop a stronger appreciation of how the component technologies interrelate (internal contextualization) and how these integrated computational models contribute to the enterprise of science (external contextualization). Furthermore, students in science classrooms see how computation can make physical models dynamic to represent changes and relationships more effectively. The implicit representational science models and the incorporation of technology and computation into a regular science curriculum make the knowledge transferable beyond an individual lesson. Students learn the component technologies cumulatively through a sustained process of engagement across multiple science modeling projects. The major challenges of this approach are how the science modeling projects may be designed and what factors have to be considered in the designs to realize this learning progression. To answer these questions, this paper describes a rigorous design process for the Physical Computational Models (PCMs) that incorporates science model correctness, progression of learning across all streams, pedagogical efficacy, classroom dynamics and manufacturability. In addition, we implemented a year-long project using our Horizontal Learning (HL) approach at two local public schools. This paper reports in detail two PCMs we developed for authentic 5th and 6th grade classrooms to illustrate the integration of the learning streams in science, compu

关键词： 5th and 6th grade classrooms Computation Engineering education Horizontal learning Leaning progression Science models STEM integration Sustained learning

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An Efficient Selection Gate Logic Based Ripple Carry Adder for Deep Learning Networks 2

An Efficient Selection Gate Logic Based Ripple Carry Adder f...

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2nd International conference on Recent Trends in Microelectronics, Automation, Computing, and Communications Systems, ICMACC 2024

作者： Chetana, Lakshmi Naga B. Purna Sai Sandeep, C. vasamth, K. Radha, S. Narasimhulu, C.v. Sai Krishna, K. Chaitanya Bharathi institute of Technology Department of ECE Hyderabad India

ISBN: (纸本)9798350366570

Full adders are fundamental components in digital circuit design, responsible for binary addition. Of late in Deep learning network architectures. Conventional full adder implementations often they are limited in terms of their speed, area, and power consumption. This study proposes a novel full adder architecture using multiplexers to overcome these challenges. This paper presents an enhanced vLSI (very-Large-Scale integration). A Ripple Carry Adder based multiplexer specially optimized for deep learning applications compared to traditional full Adder designs. Deep learning is a subset of artificial intelligence (AI) that teaches computers to mimic the human brain and process data. The introduction of this optimized RCA is expected to not only speed up the computation process but contributes to the overall efficiency of the deep learning network, making it more efficient in the design of the next Generation AI processor. The proposed design utilizes a structured approach leveraging multiplexers to minimize delay and improve overall performance. The design is implemented as a ripple carry adder and extended to 64 bits to demonstrate scalability. The static analysis and simulation results up to 64-bit implementation reveal substantial reductions in delay, area, and power, making this design a highly efficient solution for modern high-speed digital systems. © 2024 IEEE.

关键词： Adders

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design of a Modular Control System for an AGv 15

Design of a Modular Control System for an AGV

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15th International conference Elektro, ELEKTRO 2024

作者： Kekelak, Juraj Nemec, Dusan Ivan, Tomas Capak, Jan Kafkova, Julia Kuchar, Pavol FEIT University of Zilina Dpt. of Control and Information Systems Zilina Slovakia Research and Development Asseco-CEIT a.s. Zilina Slovakia

ISBN: (纸本)9798350372359

The application of automation technology in logistics aims to enhance efficiency and accelerate the material flow, whether it is from the warehouse to the production station or between multiple workstations in the production process. Automated guided vehicles (AG v s) are generally used to perform these tasks. This paper outlines the development of a software architecture to control AG v s via a programmable logic controller (PLC). The proposed software solution is characterized by a mod-ular structure, facilitating seamless integration and adaptability across various AG v types and their setups. Each functionality of the AG v is addressed through respective software modules, which are located within multiple organizational blocks (cyclic classes), based on the priority of their execution. The suggested software modules are categorized into six groups based on their functions. This article provides a detailed description of the 'Platform/Chassis' group, focusing on the movement of the AG v. © 2024 IEEE.

关键词： Automatic guided vehicles

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design and Implementation of an Open Daylight Event Management System through the integration of a Business process Management 5th

Design and Implementation of an Open Daylight Event Manageme...

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5th International conference on Applied Technologies, ICAT 2023

作者： Benavides Castillo, Luis E. Castro González, Christian X. Universidad Espíritu Santo Km 2 1/2 vía Samborondón Guayaquil Ecuador

ISBN: (纸本)9783031589492

The present research conducts an experimental study with a qualitative approach to the event management of an SDN network. To this end, a conceptual model of event monitoring in SDN networks is proposed that tests the usefulness of Camunda in the handling of multiple events in a network. Also, different scenarios are proposed where the event-driven architecture (EDA) intervenes through services to obtain information from the network and create instances of decision flows in the BPM. The results obtained show a dynamic, robust, and scalable solution for event handling. Camunda's tools make it easy to condition the flow, implement new processes in which different BPM instances are involved, and define the execution time of each event, among others. In addition, BPM scenarios allow you to add an integration layer that contains HTTP libraries for execution and XSLT Saxon API libraries for request and response transformations from external APIs. Finally, an integration interface is implemented capable of formatting the message according to an XSLT template that is then sent to another platform via API-Rest. This interface opens the possibility of new studies related to the definition and execution of multiple services through dynamic criteria, according to the information from an SDN event. © The Author(s), under exclusive license to Springer Nature Switzerland AG 2024.

关键词： integration

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Anime visage: Revealing Ingenuity with GAN-Assisted Character Development 4

Anime Visage: Revealing Ingenuity with GAN-Assisted Characte...

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4th International conference on Expert Clouds and Applications, ICOECA 2024

作者： Rakshitha, I. Nithin, Uppara Kareem, Shaik Mohammed Abdul Rahul, v Naga Sai Challa, Nagendra Panini Naseeba, Beebi School of Computer Science and Engineering VIT-AP University Andhra Pradesh Amaravati India

ISBN: (纸本)9798350385793

This research explores the fusion of creative ingenuity and machine learning, utilizing Generative Adversarial Networks (GANs) to revolutionize anime character creation. Collaborating with artists, the study employs cutting-edge GANs to automate the generation of diverse and aesthetically pleasing anime faces, addressing the intricate details unique to the art style. Initial findings indicate significant progress, showcasing the model's ability to capture fine nuances inherent in anime artistry. This research pioneers a comprehensive character design solution, streamlining the labor-intensive manual process. The integration of GAN s into the creative workflow accelerates production while preserving the anime aesthetic's integrity. 'Anime visage' marks a breakthrough, heralding a more efficient and diversified approach to anime character design. The study aims to introduce a mechanism for distinguishing real and generated faces, enhancing credibility. This collaboration between human creativity and automation holds immense promise for the future of anime character design in digital art and animation, ushering in a new era of innovation. Enhancing anime face generation through dataset curation: Losses are reduced and the crucial trade-off between dataset complexity and model performance is brought to light by limiting the size of the dataset. © 2024 IEEE.

关键词： Generative adversarial networks

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Enabling digitally integrated product design and production through digital continuity and feedback to design 34

Enabling digitally integrated product design and production ...

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34th CIRP design conference, CIRP 2024

作者： Till, Tschiltschke Michael, Manoury Marvin Theresa, Riedelsheimer Kai, Lindow Fraunhofer Institute for Production Systems and Design Technology IPK Pascalstraße 8-9 Berlin10587 Germany

Due to global and political influence, resilient and versatile production systems are unavoidable. Based on existing Product Lifecycle Management (PLM) systems there is a growing need for a consistent communication between machines and product design to enable integrated product and production process design. Core aspects are integrating the product design information directly into the production equipment and their feedback into the product design as well as into other phases of the product creation and usage. Therefore, a generalized production description language as well as an architecture for the digital integrated product design and production need to be developed. This paper presents the first results of a use case in the automotive industry. The approach of developing the functional architecture is shown. Several feedback to X approaches were researched in literature and analyzed regarding functional requirements for integration in the developed architecture. The results are the main basis for further implementation within the automotive production. Moreover, the main challenges and next steps are discussed. © 2024 The Authors. Published by Elsevier B.v.

关键词： Automotive industry

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design of a Low-Power 4x4 Wallace Tree Multiplier Using Ripple Carry Adder at 10 MHz in 180nm CMOS Techology 23

Design of a Low-Power 4x4 Wallace Tree Multiplier Using Ripp...

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23rd International Symposium on Communications and Information Technologies, ISCIT 2024

作者： Balatero, Phoebe Nicole L. Galang, Jhanine J. Gonzales, Trisha Mae M. Salem-Diaz, Arcel University of Science and Technology of Southern Philippines Department of Electronics Engineering Cagayan de Oro City Philippines

ISBN: (纸本)9798350353952

The research focused on designing a low-power 4x4 Wallace Tree Multiplier for integration into wearable devices, driven by the growing prevalence of wearable technology and the demand for energy-efficient circuits. The use of the Wallace tree multiplier technique, which minimized partial products to reduce power consumption and multiplication delay, was proposed. The design employs the Wallace Tree multiplier technique, strategically minimizing partial products to curtail power consumption. Executed through the 180nm CMOS process, the design features a 4x4 bit configuration and operates with a supply voltage of 1.8 v, and its performance was assessed using Synopsys. A comparative analysis was conducted to evaluate the proposed multiplier against existing designs in terms of power consumption, measuring at 11.4480 μW at FF Corner, with 10 MHz as the operating at a frequency. This conspicuous enhancement in power efficiency underscores the substantial progress achieved by the proposed design, especially in the context of minimizing power consumption for applications in wearable technology © 2024 IEEE.

关键词： CMOS integrated circuits

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Development of Digital Twin Framework for design of Channapatna Handicraft Toys in the Digital Era 8

Development of Digital Twin Framework for Design of Channapa...

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8th IEEE International conference on Computational System and Information Technology for Sustainable Solutions, CSITSS 2024

作者： Meghasree, v. Guptha, C. K. Nagendra Rv College of Engineering Department of Industrial Engineering and Management India

ISBN: (纸本)9798331505462

The digital transformation era, emphasized by Industry 4.0, have transformed and globalized industries. This transformation is important for increasing the efficiency, traceability, and market reach, particularly in handicraft sectors. The COvID-19 pandemic further extends the need for innovative digital approaches signifying the limitations of conventional methods. This paper explores the digital integration in the handicraft toy manufacturing industry, particularly discussing on the design and implementation of digital twin. Despite the sector's rich cultural heritage and the increasing global market demand for Indian handicrafts, traditional artisanal methods face challenges from worldwide competition and continuously changing consumer requirements. Digital transformation, distinctively through digital twin, provides a solution by creating virtual representations of physical products that enable enhanced simulation, analysis, and optimization of design processes. The study features a tailored approach to digital twin framework for implementation in Channapatna's toy design process, which includes virtual modeling, data processing, and real-time interaction between physical and digital environments. The proposed framework aims to improve efficiency, enhance market responsiveness and preserve cultural heritage. Future recommendations include development of digital infrastructure in rural areas, implementing comprehensive continuous training programs for upskill, and fostering collaboration between artisans, designers, technologists, and policymakers. This research emphasizes the potential of digital transformation to drive sustainable growth and global competitiveness in the handicraft toy industry. © 2024 IEEE.

关键词： Competition

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Room-Temperature and Compressive Force-Free Metal-Metal Direct Bonding for Heterogeneous integration of Micro-LED Array on 3D-IC

Room-Temperature and Compressive Force-Free Metal-Metal Dire...

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2024 International 3D Systems integration conference, 3DIC 2024

作者： Shen, Jiayi Liu, Chang Tanaka, Tetsu Fukushima, Takafumi Dept. Mechanical Systems Engineering Graduate School of Engineering Tohoku University Sendai Japan Dept. of Biomedical Engineering Graduate School of Biomedical Engineering Dept. Mechanical Systems Engineering Graduate School of Engineering Tohoku University Sendai Japan Dept. Mechanical Systems Engineering Graduate School of Engineering Dept. of Biomedical Engineering Graduate School of Biomedical Engineering Tohoku University Sendai Japan

ISBN: (纸本)9798331516505

This paper presents enhanced room-temperature bonding for micro-LEDs tailored to Smart Skin Display applications. While our prior work utilizing a Semi-Additive Plating (SAP) process achieved a micro-LED bonding yield of 90%, further advancements necessitate addressing challenges in sidewall GaN layer insulation deposition and complete seed layer removal. We propose an enhanced SAP (eSAP) process incorporating a novel micro-LED structure and a well-designed Cu seed pattern. Successful illumination of the fabricated micro-LEDs was demonstrated. Furthermore, we investigated the possibility of an advanced SAP (aSAP) with electroless Ni plating, eliminating the need for final seed layer removal, thereby simplifying the process and enhancing reliability. This approach represents a promising solution for room- or low-temperature micro-LED bonding. © 2024 IEEE.

关键词： III-v semiconductors

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RECYCLED CARBON FIBER REINFORCED POLYPHENYLENE SULPHIDE IN AEROSPACE

RECYCLED CARBON FIBER REINFORCED POLYPHENYLENE SULPHIDE IN A...

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SAMPE 2024 conference and Exhibition

作者： ten Bruggencate, I. van Hattum, F.W.J. Meuzelaar, J. de Bruijn, T. ThermoPlastic composites Application Centre Saxion University of Applied Sciences M.H. Tromplaan 28 Enschede7513 AB Netherlands GKN Fokker Aerostructures B.V. Edisonstraat 1 Hoogeveen7903 AN Netherlands

ISBN: (纸本)9781934551455

Thermoplastic composites are increasingly used in industries such as aerospace, partly due to their favorable properties, such as impact strength, chemical and heat resistance, excellent FST and fast processing times. They are claimed to be well-recyclable because of their option for multiple consolidation cycles. However, in practice the material is hardly recycled today. The ThermoPlastic composite Application Centre in the Netherlands, has developed a low shear recycling process that can process thermoplastic composite waste, while retaining the highest possible material properties. This paper describes the results of a joint research project aimed at increasing the knowledge on achievable material properties using this recycling process. For this, C/PPS material with varying batch compositions was shredded and processed with a low shear mixer to obtain plate material. Material data such as tensile strength and impact sensitivity were collected by means of mechanical and impact testing. integration of lightning strike protection during processing was studied, and subsequently tested for effectivity. Finally, based on above results, two complex-shaped fairing covers were developed and produced from recycled thermoplastic composites (rTPC), that will be flight tested on an experimental European rotorcraft. The research thus proved the successful use of recycled thermoplastic composites with functional integration in the development and production of complex-shaped aerospace part. © 2024 Soc. for the Advancement of Material and process Engineering. All rights reserved.

关键词： Tensile testing

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