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检索条件"任意字段=Conference on Optical Modeling and System Alignment at SPIE Optics Photonics Conference"

共 474 条记录，以下是411-420 订阅

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Simulation and experimental verification of model based opto-electronic packaging automation

Simulation and experimental verification of model based opto...

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conference on Optomechantronic Sensors, Actuators and Control

作者： Bhat, SK Kurzweg, TP Guez, A Drexel Univ ECE Dept Philadelphia PA 19104 USA

ISBN: (纸本)0819455555

In this paper, we present our most recent theory and the experimental setup to verify our research into an advanced automation technique that yields high performance, low cost optoelectronic alignment and packaging, through the use of intelligent control theory and system-level modeling. Our approach is to build an a priori knowledge based model, specific to the assembled package's optical power propagation characteristics. From this model, a piece-wise linear inverse model is created and used in the "feed-forward" loop. If accurate models are determined, perfect tracking can be achieved. In addition to this feed-forward model, our controller is designed with feedback components, along with the inclusion of a built-in optical power sensor. We will also introduce the test bed that we have developed to verify our control loop algorithm and present initial results.

关键词： photonic automation optical microsystems alignment model based control

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MEMS micromirrors for optical switching in multi-channel spectrophotometers

MEMS micromirrors for optical switching in multi-channel spe...

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conference on Device and Process Technologies for MEMS, Microelectronics, and photonics III

作者： Tuantranont, A Lomas, T Bright, VM NECTEC MEMS Lab Klongluang 12120 Pathumthani Thailand

ISBN: (纸本)081945169X

This paper reports for the first time that a novel MEMS-based micromirror switch has successfully demonstrated for optical switching in a multi-channel fiber optics spectrophotometer system. The conventional optomechanical fiber optic switches for multi-channel spectrophotometers available in market are bulky, slow, low numbers of channels and expensive. Our foundry MEMS-based micromirror switch designed for integrating with commercially available spectrophotometers offers more compact devices, increased number of probing channels, higher performance and cheaper. Our MEMS-based micromirror switch is a surface micromachined mirror fabricated through MUMPs foundry. The 280 mum x 280 mum gold coated mirror is suspended by the double-gimbal structure for X and Y axis scanning. Self-assembly by solders is used to elevate the torsion mirror 30 pm over the substrate to achieve large scan angle. The solder self-assembly approach dramatically reduces the time to assembly the switch. The scan mirror is electrostatically controlled by applying voltages. The individual probing signal from each probing head is guided by fibers with collimated lenses and incidents on the center of the mirror. The operating scan angle is in the range of 3.5 degrees with driving voltage of 0-100 V. The fastest switching time of 4 millisecond (I ins rise time and 3 ins fall time) is measured corresponding to the maximum speed of the mirror of 0.25 kHz when the mirror is scanning at +/- 1.5 degrees. The micromirror switch is packaged with a multi-mode fiber bundle using active alignment technique. A centered fiber is the output fiber that is connected to spectrophotometer. Maximum insertion loss of 5 dB has been obtained. The accuracy of measured spectral data is equivalent to the single channel spectrophotometer with a small degradation on probing signal due to fiber coupling.

关键词： MEMS MOEMS micromirror optical switching spectrophotometer

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Evaluation of laser based alignment algorithms under additive random and diffraction noise

Evaluation of laser based alignment algorithms under additiv...

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conference on Photonic Devices and Algorithms for Computing VI

作者： McClay, WA Awwal, A Jones, H Wilhelmsen, K Ferguson, W McGee, M Miller, M Lawrence Livermore Natl Lab Livermore CA 94551 USA

ISBN: (纸本)081945494X

The purpose of the automatic alignment algorithm at the National Ignition Facility (NIF) is to determine the position of a laser beam based on the position of beam features from video images. The position information obtained is used to command motors and attenuators to adjust the beam lines to the desired position, which facilitates the alignment of all 192 beams. One of the goals of the algorithm development effort is to ascertain the performance, reliability, and uncertainty of the position measurement. This paper describes a method of evaluating the performance of algorithms using Monte Carlo simulation. In particular we show the application of this technique to the LM1_LM3 algorithm, which determines the position of a series of two beam light sources. The performance of the algorithm was evaluated for an ensemble of over 900 simulated images with varying image intensities and noise counts, as well as varying diffraction noise amplitude and frequency. The performance of the algorithm on the image data set had a tolerance well beneath the 0.5-pixel system requirement.

关键词： centroiding automatic alignment image processing Monte Carlo simulation noise modeling uncertainty estimation algorithm reliability performance of algorithm optical alignment

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Study on optical measurement conditions for non-invasive blood glucose sensing

Study on optical measurement conditions for non-invasive blo...

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conference on Complex Dynamics, Fluctuations, Chaos, and Fractals in Biomedical photonics

作者： Xu, KX Chen, WL Jiang, JY Qiu, QJ Tianjin Univ Coll Precis Instrument & Optoelect Engn Tianjin 300072 Peoples R China

ISBN: (纸本)0819452386

Utilizing Near-infrared Spectroscopy for non-invasive glucose concentration sensing has been a focusing topic in biomedical optics applications. In this paper study on measuring conditions of spectroscopy on human body is carried out and a series of experiments on glucose concentration sensing are conducted. First, Monte Carlo method is applied to simulate and calculate photons' penetration depth within skin tissues at 1600nm. The simulation results indicate that applying our designed optical probe, the detected photons can penetrate epidermis of the palm and meet the glucose sensing requirements within the dermis. Second, we analyze the influence of the measured position variations and the contact pressure between the optical fiber probe and the measured position on the measured spectrum during spectroscopic measurement of a human body. And, a measurement conditions reproduction system is introduced to enhance the measurement repeatability. Furthermore, through a series of transmittance experiments on glucose aqueous solutions sensing from simple to complex we found that though some absorption variation information of glucose can be obtained from measurements using NIR spectroscopy, while under the same measuring conditions and with the same modeling method, choices toward measured components reduce when complication degree of components increases, and this causes a decreased prediction accuracy. Finally, OGTT experiments were performed, and a PLS (Partial Least Square) mathematical model for a single experiment was built. We can easily get a prediction expressed as RMSEP (Root Mean Square Error of Prediction) with a value of 0.5-0.8mmol/dl. But the model's extended application and reliability need more investigation.

关键词： non-invasive blood glucose near-infrared spectroscopy measurement conditions

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optical I/O technology for digital VLSI

Optical I/O technology for digital VLSI

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conference on photonics Packaging and Integration IV

作者： Mohammed, EM Thomas, TP Lu, D Braunisch, H Towle, S Barnett, BC Young, IA Vandentop, G Intel Corp Portland OR 97124 USA

ISBN: (纸本)0819452661

We describe the development of a high-speed, 12-channel (8-data, 2-clock and 2-alignment channels), parallel optical link with a unique packaging concept. The package is used to demonstrate the viability of chip-to-chip optical I/O in very large scale integration (VLSI) circuits. However, for implementation of optical systems in high performance computing applications, the cost of components and packaging has to come down significantly from the traditional optical communication distances. In the current work we attempted to realize such a system by using power efficient optical and electronic components together with a potentially low cost packaging solution compatible with the electronics industry. Vertical Cavity Surface Emitting Lasers (VCSEL), positive-intrinsic-negative (PIN) photodetectors, polymer waveguide arrays as well as CMOS transceiver chip were heterogeneously integrated on a standard microprocessor flip-chip pin grid array (FCPGA) substrate. The CMOS transceiver chip from 0.18mum processing technology contains VCSEL drivers, transimpedance and limiting amplifiers and on-chip self-testing circuits. A self-test circuit in such high-speed systems will be highly beneficial to reduce the testing cost in real products. For fully assembled packages we measured a 3 Gb/s optical eye for the transmitter (24Gb/s aggregate data rate) and a transmission over the complete link was achieved at 1 Gb/s (8 Gb/s aggregate data rate).

关键词： optical I/O VCSEL arrays photodetector arrays polymer waveguides hybrid packaging flip-chip

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Cost-effective packaging of laser modules using LTCC substrates

Cost-effective packaging of laser modules using LTCC substra...

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conference on photonics Packaging and Integration IV

作者： Keränen, A Mäkinen, JT Heilala, J Väätäinen, O Kautio, K Ollila, J Petäjä, J Karppinen, M Heikkinen, V Karioja, P VTT Elect Oulu 90571 Finland

ISBN: (纸本)0819452661

The modeling, realization and characterization of photonic module based on the use of Low Temperature Co-fired Ceramics (LTCC) technology is reported. The 3D modeling of the system provides possibility to optimize structures, materials and components in order to achieve optimal performance for the final product and still maintain reasonably low fabrication costs. The cost-effectiveness in the product can be further optimized using an iterative optimization process, in which the effect of module manufacturing tolerances and assembly process tolerances is simulated by a VisVSA Monte-Carlo simulation. The tolerance distributions produced by a VisVSA simulation are used as input parameters together with optical component tolerances in an ASAP Monte-Carlo simulation, in which the final module optical performance distribution in simulated production is obtained. The module cost, performance and optical performance limited yield is possible to define with this iterative process. As an example of this kind of packaging modeling, we present a demonstrator module having a high-power multimode laser diode with a 1mum x 100mum emitting area coupled to a 62.5/125mum graded-index (NA=0.275) multimode fiber. The tolerance modeling results are verified by experimental characterization of the packaged prototypes. Measured coupling efficiencies were in good agreement with simulated ones, when the fiber NA was 0.2 or larger. The measured coupling efficiency, however, was 38% lower than simulated, when the fiber NA was 0.12. This was probably due to the laser mode structure difference between simulation model and reality. Coupling efficiency of 0.46 was obtained in a passively aligned demonstrator module, when the nominal value was 0.48.

关键词： photonic module LTCC substrate laser diode multimode fiber Monte-Carlo simulation tolerance modeling optimization yield

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Error modeling of multi-baseline optical truss, part II: Application to SIM metrology truss field dependent error

Error modeling of multi-baseline optical truss, part II: App...

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conference on Space systems Engineering and optical alignment Mechanisms

作者： Zhang, LD Milman, M Korechoff, R CALTECH Jet Prop Lab Pasadena CA 91109 USA

ISBN: (纸本)0819454664

The current design of the Space Interferometry Mission (SIM) employs a 19 laser-metrology-beam system (also called L19 external metrology truss) to monitor changes of distances between the fiducials of the flight system's multiple baselines. The function of the external metrology truss is to aid in the determination of the time-variations of the interferometer baseline. The largest contributor to truss error occurs in SIM wide-angle observations when the articulation of the siderostat mirrors (in order to gather starlight from different sky coordinates) brings to light systematic errors due to offsets at levels of instrument components (which include corner cube retro-reflectors, etc.). This is the external metrology wide-angle field-dependent error. Physics-based model of field-dependent error at single metrology gauge level is developed and linearly propagated to errors in interferometer delay. General formulation of delay error sensitivity to various error parameters is developed. The essence of the linear error model is contained in an error-mapping matrix. A corresponding Zernike component matrix approach is developed in parallel with its advantages discussed. As a first example, dihedral error model is developed for the corner cubes (CC) attached to the siderostat mirrors. Average and worst case residual errors are computed when various orders of field-dependent terms are removed from the delay error. These serve as guidelines for arriving at system requirements given the error budget allocation. Highlights of the non-common vertex error (NCVE) model are shown as a second example followed by discussions.

关键词： modeling interferometer metrology corner cube retro-reflector instrument systematic error

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Thermal modeling of a GaAs-based Mach-Zehnder modulator integrated with a MMIC broad-band driver amplifier

Thermal modeling of a GaAs-based Mach-Zehnder modulator inte...

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International conference on Applications of photonics Technology

作者： Celo, D Smy, T Guo, X Romo, G Roy, L Carleton Univ Dept Elect Ottawa ON K1S 5B6 Canada

ISBN: (纸本)0819455288

This paper presents a thermo-mechanical analysis of an optoelectronic system including a Mach-Zehnder (MZ) optical modulator integrated with a broad-band GaAs driver amplifier, forming a module which then is placed into a low temperature co-fired ceramic (LTCC) substrate. All module connections such as voltage supply, RF signals and fiber optic input/output are realized through the LTCC. Thermal analysis of this integrated system shows elevated temperatures in the optical component caused by the heat generated in the power amplifier and dissipated into the substrate-carrier and from there into the LTCC. Temperature profiles along the MZ modulator reveal a strong non-uniformity, reaching a 26degreesC temperature difference between the optical component input and output. A stress-strain analysis is also performed. Preliminary results show significant physical distortion of the optical component. which could cause optical misalignments and additional coupling losses. These findings indicate a need for thermal consideration in early design stages.

关键词： Mach-Zehnder modulator thermal model parametrized model reduction MMIC power amplifier LTCC packaging

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optical properties and carrier dynamics of InP quantum dots embedded in GaP

Optical properties and carrier dynamics of InP quantum dots ...

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conference on Ultrafast Phenomena in Semiconductors and Nanostructure Materials VIII

作者： Hatami, F Schrottke, L Tomm, JW Talalaev, V Kristukat, C Goñi, AR Masselink, WT Humboldt Univ Inst Phys D-12489 Berlin Germany

ISBN: (纸本)0819452602

The optical properties and associated carrier dynamics of self-organized InP quantum dots embedded in a GaP matrix are presented and discussed, together with their growth and structural properties. InP deposited on GaP (001) using gas-source molecular-beam epitaxy forms Stranski-Krastanow quantum dots for an InP coverage greater than 1.8 monolayers. The size of dots is dependent on the growth conditions;supercritical InP deposition under a sufficiently high phoshine flux results in relatively small (approximate to 20 nm) and dense (approximate to 5 x 10(9) dots/cm(2)) dots with intense optical emission;photoluminescence from the strained two-dimensional InP wetting layer peaks at about 2.2 eV. modeling based on the "model-solid theory" as well as time-resolved photoluminescence indicate that the band alignment for the InP wetting layer is indirect and probably type II;this emission results from spatially indirect recombination of electrons in the GaP X valley with holes in the InP and their phonon replicas. The band alignment of InP quantum dots, however, is type I. Whereas low-temperature time-resolved photoluminescence measurements indicate a rather long carrier lifetime of about 25 ns for the wetting layer, the carrier lifetime in the quantum dots is about 2 ns, typical for type-I quantum dots. Pressure-dependent photoluminescence measurements provide further evidence for a type-I band alignment for InP/GaP QDs at normal pressure, but indicate that they become type H under hydrostatic pressures of about 1.2 GPa and are consistent with an energy difference between the lowest InP and GaP states of about 31 meV. Exploiting the visible direct-bandgap transition in the GaP system could lead to an increased efficiency of light emission in GaP-based light emitters.

关键词： quantum dots InP/GaP photoluminescence GSMBE

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Direct integration diffraction-based analysis and synthesis algorithms for laser optical systems

Direct integration diffraction-based analysis and synthesis ...

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conference on optics and photonics Technologies and Applications

作者： Karapetyan, K BMSTU Laser & Optoelect Syst Dept RL2 Moscow 107005 Russia

ISBN: (纸本)0819446572

An algorithm for diffraction-based modeling of optical systems for laser devices has been developed. The direct integration is used for the Rayleigh-Sommerfeld formula throughout the system, so optical elements with non-plane surfaces may be adequately treated. The integration is based on the modified Cotes quadrature formula and ensures both high accuracy and speed. A method for the diffraction-based search for an initial scheme for optimization is also proposed. Thus the whole synthesis procedure for a laser optical system may be performed on the basis of diffraction theory.

关键词： beam propagation diffraction theory laser optical system modeling software synthesis

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