In this paper, a die-level CMOS post-processing scheme for 3d integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the ...
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ISBN:
(纸本)9781509004935
In this paper, a die-level CMOS post-processing scheme for 3d integration using the via-last approach is presented for multi-layer stacking. The process includes TSV fabrication, chip-to-chip bonding, and finally the TSV filling with Cu electroplating. The proposed process flow is used to fabricate a 4-layer chip stack using homogeneous CMOS memory chips. Electrical measurements are carried out to determine the resistance value of the TSVs. Kelvin bridge method is used in order to eliminate the additional resistance introduced by the experimental setup, and the average resistance value of a single TSV is determined as 180 m Omega. The current carrying capability is also investigated for possible electrical failures. It is concluded that the TSVs can carry up to 1.5 A (dC) current values without any failure.
This paper presents a dC-coupled 27 MHz low noise amplifier (LNA) and automatic gain control (AGC) amplifier on a specially processed ultra-thin 0.5 mu m CMOS gate array for the RF receiver of a wireless and bendable ...
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ISBN:
(纸本)9781509004935
This paper presents a dC-coupled 27 MHz low noise amplifier (LNA) and automatic gain control (AGC) amplifier on a specially processed ultra-thin 0.5 mu m CMOS gate array for the RF receiver of a wireless and bendable sensor system-in-foil. As the receiver is made for amplitude shift keying (ASK) signals, it needs an AGC. An offset feedback (OSFB) control circuit is realized to compensate for offsets. As required for the application specific protocol, a short settling time is needed. Therefore a Manchester coded input signal is used. The ASK modulation is used because of circuit energy consumption reasons in the given technology. The RF receiver works without a local oscillator (LO).
This paper presents the development of a 10b AdC dedicated to the digitalization of a sensing current within advanced automotive applications. The presented AdC has been developed in a power optimized BCd technology, ...
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ISBN:
(纸本)9781509004935
This paper presents the development of a 10b AdC dedicated to the digitalization of a sensing current within advanced automotive applications. The presented AdC has been developed in a power optimized BCd technology, i.e. a process specifically optimized for power delivery and featuring signal processing capabilities. However it presents some limitations, i.e. highly non-linear capacitances, large mismatch, etc.. In this scenario a 10b AdC has been developed by means of a customized MATLAB model enabling the target performance achievements. The aim of this work is to study the effect of non-ideal components on the conversion performances focusing in particular on the technology limitations, like capacitors non-linearity and components mismatch. In order to achieve this, a Matlab model has been developed and then a demonstrator circuit has been designed at transistor level.
In this paper, a 3ddifferential delay line fabricated using a low temperature cofired ceramic (LTCC) technology is presented. The main feature of this component is its high value of delay density per unit area when c...
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new wide-input dynamic range, 64-channels current-to-frequency converter ASIC has been designed and is now under characterization. This chip, nicknamed TERA09, has been realized to equip the front-end readout electron...
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ISBN:
(纸本)9781509004935
new wide-input dynamic range, 64-channels current-to-frequency converter ASIC has been designed and is now under characterization. This chip, nicknamed TERA09, has been realized to equip the front-end readout electronics for the new generation of beam monitor chambers for particle therapy applications. In this field, the trend in the accelerator development is moving toward compact solutions providing high-intensity pulsed-beams. However, such a high intensity will saturate the present readout of the beam monitor chambers. In order to deal with the technology innovations in the particle therapy, the chip described in this work is able to cope with a higher maximum intensity while keeping high resolution by working on a six orders of magnitude conversion-linearity zone (hundreds of pA to hundreds of mu A), with a gain spread in the order of 1-3% (r.m.s.), with a 200fC charge resolution.
In this paper a reconfigurable implantable low noise amplifier for the recording of neural signals is presented. It is comprised by low-power and noise efficient current reuse OTAs in its direct path. The proposed arc...
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This paper presents a continuous-time (CT) quadrature bandpass (QBP) delta Sigma AdC which is reconfigurable in terms of quantizer resolution, bandwidth (BW) and IF. It is designed for use in a low power low-IF multi-...
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ISBN:
(纸本)9781509004935
This paper presents a continuous-time (CT) quadrature bandpass (QBP) delta Sigma AdC which is reconfigurable in terms of quantizer resolution, bandwidth (BW) and IF. It is designed for use in a low power low-IF multi-band transceiver system. In simulations the presented implementation in a 130nm RF CMOS process achieves a resolution of 10.5 bit. Additionally, a total power consumption of 2.3mW from an 1.2V supply voltage is simulated. The BW of the 3rd order QBP filter can be set to 0.5, 1.0 or 2.0MHz together with the IF. Likewise the loop quantizer is capable of single anddual-bit analog to digital conversion. Separate digital to analog converters (dAC) for both modes are used in the feedback of the delta Sigma loop. Furthermore an improveddata weighted averaging (dWA) algorithm is presented to control the dual-bit dAC unity cells and cope with the dACs I/Q mismatch.
This paper presents two on-off-keying millimetre-wave modulator ICs working with measureddata rates of up to 30 Gb/s fabricated on 28nm low-power digital CMOS. The first circuit is a switched cross-coupled oscillator...
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ISBN:
(纸本)9781509004935
This paper presents two on-off-keying millimetre-wave modulator ICs working with measureddata rates of up to 30 Gb/s fabricated on 28nm low-power digital CMOS. The first circuit is a switched cross-coupled oscillator with oscillation frequency of 54 GHz and measureddata rates of up to 6 Gb/s. The power-up time of the oscillator is minimized by generating and introducing a pulse signal into the oscillator core enabling multi-Gb/s data rate operation. Proper power-down behaviour is achieved by shortcut the LC-tank in the off-state. The circuit consumes 10mA from a 1.2 V-source. The second circuit is a compensated modulator working with carrier frequencies of up to 60GHz and measureddata rates of up to 30 Gb/s while consuming 6mA from a 1.2 V-source. Both circuits compare well with the state-of-the-art.
A high dynamic range true RMS power detector is designed for broadband frequency agile applications like Cognitive Radio. The RF bandwidth of the Power detector covers 0.5 GHz - 3 GHz with a dynamic range of 50 dB and...
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ISBN:
(纸本)9781509004935
A high dynamic range true RMS power detector is designed for broadband frequency agile applications like Cognitive Radio. The RF bandwidth of the Power detector covers 0.5 GHz - 3 GHz with a dynamic range of 50 dB and a minimum detectable power of -50dBm (50 Omega). Its architecture is differential employing a pseudo-differential squaring circuit and it has a high input impedance enabling it to be placed on high impedance as well as on 50 Omega lines. Particularly the noise behaviour of the circuit is investigateddue to the inherently strong low-frequency noise of the squaring stage. Preamplifier stages, automatic offset cancellation, calibration and oversampling are employed to reach high sensitivity. Logarithmic amplifier stages after the squaring unit care for a linear-in-dB conversion. The power detector has been designed in a commercial UMC 130nm CMOS technology in order to provide easier integration with other mixed-signal blocks and low-cost production.
In this paper, we present a modified class-O power amplifier (PA) which employs floating-body technique to achieve high linearity. Class-O is a new PA topology which incorporates two sub-amplifiers working in parallel...
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ISBN:
(纸本)9781509004935
In this paper, we present a modified class-O power amplifier (PA) which employs floating-body technique to achieve high linearity. Class-O is a new PA topology which incorporates two sub-amplifiers working in parallel to achieve high linearity and efficiency. The two sub-amplifiers are operated in common drain (Cd) and common source (CS) configuration. The proposed floating-body technique is verified with on-wafer measurements on single power transistors. The simulation results of overall class-O amplifier show a 2.3 dB improvement in output 1 dB compression point (P-out1dB) over the conventional body shorted to source version of the amplifier. The power added efficiency (PAE) of proposed class-O is 33.3% as compared to 24% for conventional version. Hence, enabling the proposed amplifier to transmit higher linear output power with more efficiency. The operating frequency of both the amplifiers 960 MHz and the technology used is UMC 130nm standard RFCMOS.
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