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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics"

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Femtosecond laser processing tailored for biomedical materials and laser power delivery through optical fibers

Femtosecond laser processing tailored for biomedical materia...

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conference on photon processing in microelectronics and photonics II

作者： Obara, M Ozono, K Kanai, M Sekita, H Atanasov, PA Keio Univ Dept Elect & Elect Engn Kohoku Ku Yokohama Kanagawa 2238522 Japan

ISBN: (纸本)0819447773

We have been working on the tailored ablation processing of advanced materials using femtosecond lasers. Here we would like to focus on the femtosecond laser processing tailored for hydroxyapatite. Hydroxyapatite is a key material of human tooth and human bone. The human bone is made of hydroxyapatite oriented along the collagen. The micromachining of human bone is highly required for medicine. The medical issue is how to preserve the chemical property of the laser-ablated surface. By use of pulsewidth tunable femtosecond laser (50fs - 2ps, 1.5mJ, 1kpps), we compared the relative content of calcium and phosphorus. The relative content of calcium and phosphorus is kept unchanged before and after laser ablation. For these medical applications, the intense femtosecond laser delivery through optical fibers is required. It is theoretically shown that it is possible to deliver the 900 fs pulses of 0.1 mJ/pulse through a I m-long graded index fiber with a 200 mum core diameter if the fiber has the optimum refractive index profile. We therefore conclude that graded index multimode fibers give better spatial distributions of the output transverse mode than hollow fibers or step index multimode fibers, and can deliver larger pulse energy than single mode fibers.

关键词： hard tissue ablation tooth bone plastic surgery fiber delivery femtosecond laser

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New developments in laser processing of silicon devices

New developments in laser processing of silicon devices

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conference on photon processing in microelectronics and photonics II

作者： Dirscherl, M Esser, G Kaufmann, S Geiger, M Bayer Laserzentrum BLZ gGmbH D-91052 Erlangen Germany Univ Erlangen Nurnberg Chair Mfg Technol D-91058 Erlangen Germany

ISBN: (纸本)0819447773

Silicon is the standard material for the production of integrated circuits and one of the most important substrates for micro systems technology. It can be produced with an extraordinarily high purity, homogeneity and crystal Perfection. Today, laser processing of silicon is becoming increasingly more interesting. This can be partly attributed to the evolution of frequency-converted solid state lasers which emit visible or ultraviolet radiation that is readily absorbed by silicon. Another reason for the growing interest in laser processing of silicon devices is that conventional technologies are approaching their limits. Especially laser cutting of thin silicon wafers as an alternative to mechanical sawing represents a very promising option for industrial applications. This paper shows current research results on laser processing of silicon. Besides laser cutting and ablation with frequency-tripled Nd:YAG lasers and Ti:Sapphire femtosecond lasers, laser welding of silicon with millisecond pulses is a focus of the presented work. When welding Si, the brittle behaviour of the material usually leads to thermally induced cracks. These cracks do typically not occur when cutting with short and ultrashort pulsed lasers. A controlled heating of the work piece can prevent cracks during welding with millisecond pulses as well. Together with laser cutting and welding, laser adjustment of silicon components by ultrashort pulse ablation of pre-stressed layer systems, which is also described in this paper, is another promising approach for high precision manufacturing of silicon micro devices.

关键词： silicon laser welding laser cutting laser adjustment

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New fiber lasers with temporal pulse shaping of nanosecond pulses for "Tailoring" flexible laser material processing

New fiber lasers with temporal pulse shaping of nanosecond p...

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conference on photon processing in microelectronics and photonics II

作者： Stock, ML Endert, H Patel, R IMRA Amer Inc Ann Arbor MI 48105 USA

ISBN: (纸本)0819447773

Using an innovative approach based on Yb:fiber amplifiers and pre-shaped pulsed diode seeders, a unique laser source with tunable pulse duration and rectangular pulse shape has been developed. Based on the patented use of multimode, fibers with single-mode output, the resultant system provides pulses adjustable between 4 and 20 ns duration with sharp rise times of <1.5 ns, at a repetition rate of up to 20 kHz. The output pulse energy of >15 microJoules can be maintained over the full tuning range. The high-quality output beam is coupled into a polarization-maintaining, single-mode delivery fiber for ease of integration into an application. With this "tailorable" pulse design, control of laser energy deposition in very confined laser interaction zones (by pulse shape), and of its dosage (by pulse duration) can be optimized by the user and adjusted in real-time from the laser controller in response to measured structural changes. Results of machining of materials such as Si, Cr on glass and drilling of Cu/Pl/Cu are presented, showing the unique capability of this laser and its advantageous use to ablate, structure, repair, or trim very small areas (down to sub-micron size) without damaging or influencing the underlying and/or neighboring structures.

关键词： micromachining microfabrication short-pulsed lasers fiber lasers fiber amplifiers nanosecond lasers

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High brightness solid-state laser systems with fiber phase conjugate mirrors for micro material processing

High brightness solid-state laser systems with fiber phase c...

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conference on photon processing in microelectronics and photonics II

作者： Riesbeck, T Eichler, HJ Risse, E Binder, A Ashkenasi, D Müller, G Tech Univ Berlin Inst Opt D-10623 Berlin Germany

ISBN: (纸本)0819447773

High beam quality is one of the most important properties for micro material processing with lasers. It facilitates slight focus diameters and due to high Raleigh length even at strong focusing drilling of holes with high aspect ratio. Together with high average output powers it allows fast processes with high quality. Another important point is the wavelength of the laser radiation. Many materials e.g. diamond or silicon show no sufficient absorption at fundamental wavelength of Nd based solid-state laser sources. Frequency conversation to the second and forth harmonic allows the efficient processing of these materials. At least flexible pulse peak power and repetition rate is necessary to optimize the process. Three laser systems which fulfill these requirements are investigated. A pulsed pumped Nd:YAP System which delivers an average output power of 315 W with M-2 = 2.6 at the fundamental wavelength and 124 W at the second harmonic. Another pulsed pumped System based on Nd:YAG with an average output power up to 125 W with M-2 = 2.2 at the fundamental wavelength, 49.5 W at the second harmonic and 4.75 W at 266 nm. Due to its active Q-switch the pulse peak power of this system is variable in a wide range. Furthermore-a continuously pumped amplifier arrangement with nearly diffraction limited output of 120 W average power has been Achieved at 10 kHz repetition rate.

关键词： solid state lasers beam quality phase conjugation optical fiber frequency conversation

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3D-MID and process monitoring for micro joining applications

3D-MID and process monitoring for micro joining applications

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conference on photon processing in microelectronics and photonics II

作者： Ostendorf, A Specker, W Stallmach, M Zeadan, J Laser Zentrum Hannover eV D-30419 Hannover Germany

ISBN: (纸本)0819447773

Nd:YAG solid-state lasers have been integrated in many seam welding applications. They provide a good ability of integration into existing manufacturing sequences and allow its easy automation. Appropriate process monitoring systems are needed to decrease necessary user intervention, to ensure a high machine availability and to realize a zero defect production. In the electronics industry, laser spot welding techniques using pulsed Nd:YAG-lasers have been established in mass production applications, for example in manufacturing of electron gun components for TV monitor tubes over the last 25 years. They require different strategies and methods for process monitoring systems [1]. Apart from these integrated laser spot welding applications, there is a current demand for new technologies to join micro components onto 3-dimensional (3-D) circuit substrates and to connect electrical plugs. In recent years, laser spot joining techniques have emerged as a viable option for packaging electrical and mechanical microparts, such as surface mounted devices (SMDs) and casings. Under most conditions, laser spot welding provides more durability as well as' thermal and mechanical stability compared to traditional packaging techniques, such as simultaneous soldering [2, 3]. Additionally, under less ideal conditions, the packaging quality can be inconsistent, resulting in the need for optimization and monitoring of the weld parameters under different conditions [4, 5]. In order to achieve a stable process during packaging of electrical components despite their weak absorption of laser radiation and different surface qualifies, a process monitoring system should be needed.

关键词： Signal processing Laser welding Metals Signal detection Laser processing Sensors Optical sensors Laser applications Packaging Pulsed laser operation

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Direct laser-assisted processing of polymers for micro-fluidic and micro-optical applications

Direct laser-assisted processing of polymers for micro-fluid...

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conference on photon processing in microelectronics and photonics II

作者： Pfleging, W Böhm, J Finke, S Gaganidze, E Hanemann, T Heidinger, R Litfin, K Forschungszentrum Karlsruhe Mat Res Inst D-76021 Karlsruhe Germany

ISBN: (纸本)0819447773

In the microscopic world the need of functional prototypes increases, e.g. as a precondition for a mould insert fabrication for micro-injection moulding. In this work the direct fabrication of prototypes made from polymers with an accuracy down to the micrometer range will be presented. For this purpose the direct patterning or modification of polymers with UV-Iaser radiation is performed for applications in fluidic and micro-optics. Different UV laser sources such as excimer and frequency-multiplied Nd:YAG were used. In the case of complex designs for fluidic applications it is powerful to use Nd:YAG laser radiation as patterning tool because of their high laser repetition rates: CAD data from complex fluidic designs were transmitted directly via CAM module into the polymeric surface. Because of the very small laser pulse duration of about 400-500 ps the thermal-induced damage during ablation decreases significantly. Process parameters, ablation rates and attainable surface qualifies for capillary-electrophoreses chips will be presented. With the aid-of a motorised aperture or a rotating mask system, excimer laser radiation is used to enable a well defined patterning of grooves with sharp edges and smooth sidewalls. The direct ablation of polymethylmethacrylate (PMMA), as well as the laser induced modification of the polymeric chemistry is used for the preparation of passive integrated-optical waveguides. Two types of concepts of waveguides are discussed: 1. Laser patterned grooves are filled with index matched materials which leads either to an increase or a decrease of the refractive index relative to pure PMMA. 2. Localised laser-induced polymer modification leads immediately to an integrated waveguide with higher refractive index. Both types of waveguides-concepts are characterised by their optical properties, which will be discussed in detail.

关键词： excimer Nd : YAG rapid manufacturing polymer ablation polymer modification polymer waveguides refractive index variation micro fluidic micro optics

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Physical and chemical aspects of laser-materials interactions relevant to laser processing

Physical and chemical aspects of laser-materials interaction...

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conference on photon processing in microelectronics and photonics

作者： Dickinson, JT Washington State Univ Dept Phys Surface Dynam Lab Pullman WA 99164 USA

ISBN: (纸本)081944376X

The use of lasers in packaging and materials processing is an increasingly attractive choice for high technology manufacturing. As we push for more demanding materials processing tasks and smaller dimensions, an understanding of the underlying physical and chemical aspects of problems becomes important. Here we discuss some of these issues relevant to materials processing.

关键词： Laser processing Absorption Polymers Laser applications Metals Materials processing Chemical lasers Electrons Packaging Silicon

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Laser material processing: An industrial view of packaging applications

Laser material processing: An industrial view of packaging a...

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conference on photon processing in microelectronics and photonics

作者： Brannon, J IBM Storage Technol Div San Jose CA 95193 USA

ISBN: (纸本)081944376X

In the past two decades, laser applications in the packaging of microelectronics and photonics have clearly made a mark in industrial processing. With the commercial availability of reliable UV and IR lasers, a wealth of techniques and methods have evolved: generation of vias, high resolution patterning of materials by etching and ablation, laser bonding and microwelding, stripping of insulation and cladding, deposition of conductors, creation of surface microstructures, cleaning of sensitive surfaces, and a variety of drilling, slicing, and dicing processes. The list goes on and on, and what new techniques may evolve is limited only by human ingenuity. In this presentation I will review several of these applications with particular emphasis on those that are industrially useful. Many interesting concepts in laser processing fill the pages of scientific and engineering journals, but few of these ideas are seriously considered for a manufacturing environment. In concluding this talk, I will attempt to answer just what makes an industrially successful laser process.

关键词： laser processing lasers microelectronics packaging material processing

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Overview and future prospects of the use of lasers for packaging by microelectronics and photonics industry in japan

Overview and future prospects of the use of lasers for packa...

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conference on photon processing in microelectronics and photonics

作者： Washio, K Kouta, H NEC Corp Ltd Control Syst Operat Unit Minato Ku Tokyo 1088001 Japan

ISBN: (纸本)081944376X

This paper presents an overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan. Various kinds of lasers and material processing technologies have been developed and applied for manufacturing electronic and photonic devices to meet the strong demands for high-performance, lightweight, low energy-consumption mobile digital consumer electronics, broadband optical fiber communications, low-emission and fuel-efficient, easy-to-steer smart cars, etc. This paper emphasizes solid-state lasers as convenient and versatile light sources for packaging advanced compact devices with sensitive passive or active components having small feature sizes. Some of the representative material processing applications using solid-state lasers for electronic and photonic devices are, opaque and clear defects repairing of LCDs, trimming of functional modules, fine-tuning of optical characteristics of photonic devices, forming of various micro-vias for high-density interconnection circuits, laser patterning of amorphous solar-cells, and high-precision laser welding of electronic components such as optical modules, miniature relays and lithium ion batteries. The recent progress in high-power ultra-short pulse solid-state lasers seems to be rapidly increasing their processing capabilities such as for fine adjustment of optical filters, etc.

关键词： packaging welding trimming drilling patterning marking annealing repairing photonic devices lasers

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Integrated tool for fabrication of electronic components by laser direct write

Integrated tool for fabrication of electronic components by ...

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conference on photon processing in microelectronics and photonics

作者： Mathews, SA Zhang, CP Kegresse, T Liu, D Potomac Photon Inc Lanham MD 20706 USA

ISBN: (纸本)081944376X

A prototype workstation has been developed that allows the fabrication of passive electronic components at low temperatures using a laser direct-write process. The work station combines a variety of laser processing techniques onto a single, integrated platform. These techniques include material deposition, laser micromachining, laser sintering, and laser trimming. One particular process, referred to as "mill and fill", combines the laser micromachining ability of the tool with "off-the-shelf" conductor pastes to allow the fabrication of high density metallization at very low temperatures (200degreesC). The present work-describes the details of the "mill and fill" process and shows examples of prototype devices fabricated using this technique.

关键词： Laser sintering Silver Polymers Electronic components Micromachining Optical lithography Laser processing Prototyping Dielectrics Integration

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