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116 篇 会议

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检索条件"任意字段=Conference on Photon Processing in Microelectronics and Photonics"

共 116 条记录，以下是41-50 订阅

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Integration challenge of silicon photonics with microelectronics

Integration challenge of silicon photonics with microelectro...

引用

2nd IEEE International conference on Group IV photonics

作者： Paniccia, M Liu, AS Izhaky, N Barkai, A Intel Corp Photon Technol Lab Santa Clara CA 95054 USA

In this presentation we discuss some practical issues and challenges associated with processing silicon photonic devices in a high volume CMOS manufacturing environment and the challenges of integrating the photonic d... 详细信息

ISBN: (纸本)0780390709

关键词： Optical communication equipment

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Laser material processing in microelectronics manufacturing: status and near-term opportunities

Laser material processing in microelectronics manufacturing:...

引用

conference on photon processing in microelectronics and photonics IV

作者： Dunsky, CM Coherent Inc Santa Clara CA 95054 USA

ISBN: (纸本)081945687X

Lasers continue to gain ground in materials processing applications for microelectronics manufacturing. Printed circuit boards, IC wafers, substrates for blue/green LEDs, and various components in flat panel displays are all being processed with lasers. Some of these operations, such as microvia drilling in high-density circuit boards, are well established;others are under evaluation or in early stages of development. This paper summarizes the status of a number of key applications that currently or potentially add value to the complex manufacturing processes for state-of-the-art microelectronic devices. Particular attention is paid to flat panel display manufacturing, where the worldwide massproduction ramp currently underway is demanding innovative techniques that provide the speed, quality, or flexibility needed to reduce manufacturing costs.

关键词： lasers microelectronics manufacturing semiconductor flat panel display manufacturing silicon laser micromachining laser materials processing

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Femtosecond versus picosecond laser ablation

Femtosecond versus picosecond laser ablation

引用

conference on photon processing in microelectronics and photonics IV

作者： Ostendorf, A Kamlage, G Klug, U Korte, F Chichkov, BN Laser Zentrum Hannover eV D-30419 Hannover Germany

ISBN: (纸本)081945687X

Results of ablation of different materials by femtosecond and picosecond laser pulses are compared. Advantages and disadvantages of both laser systems are discussed. Two most important criteria, processing speed and quality of the fabricated structures, are addressed. High repetition rate picosecond lasers allow high speed cutting of thin metal foils and silicon wafers, whereas for micro-drilling it is more advantageous to use femtosecond laser systems.

关键词： ultrashort laser pulses material processing

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Laser micromachining techniques for industrial MEMS applications

Laser micromachining techniques for industrial MEMS applicat...

引用

conference on photon processing in microelectronics and photonics IV

作者： Booth, HJ Abbott, CE Allott, RM Boehlen, KL Fieret, J Greuters, J Trimble, P Pedder, J Exitech Ltd Oxford OX5 1QU England

ISBN: (纸本)081945687X

Pulsed laser sources are widely used for the micro-processing of materials from the structuring and patterning of surfaces to the direct machining of devices. This paper discusses laser micro-processing techniques for the fabrication of microstructures with high accuracy and precision. Techniques discussed include laser mask projection techniques and direct beam micromachining using galvo-scanners and high precision motion stages, with a variety of different lasers. Examples of the application of these techniques to the manufacture of MEMS and MOEMS devices are discussed.

关键词： laser micromachining high precision processing MEMS MOEMS micro-optical devices

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Hybrid light-laser welding for microelectronics

Hybrid light-laser welding for microelectronics

引用

conference on photon processing in microelectronics and photonics IV

作者： Alekseev, GM Sysoev, VK Bulkin, YN Lavochkin Assoc Chimki Moscow Region Russia

ISBN: (纸本)081945687X

High monochromaticity, coherence and low divergence of the laser are the properties thanks to which it has become possible to build a promising high-concentration kind of heat energy emitter. As a source of welding energy, the laser beam has provided welding practices with new features. At present, the laser is the only available energy source that reaches power densities of more than 106 W/cm(2) thus maintaining deep welding requirements. The laser welding evolution has further developed in hybrid welding methods, such as two-beam, laser-arc, laser-induction, laser-plasma, lighting laser processing procedures that, due to their high technical and economical efficiency, find ever multiplying applications in industry.

关键词： lasers laser welding polychrome emission sources synergetics

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Industrial applications of ultrahigh precision short-pulse laser processing

Industrial applications of ultrahigh precision short-pulse l...

引用

conference on photon processing in microelectronics and photonics IV

作者： Liu, XB Panasonic Technol Co Panasonic Boston Lab Cambridge MA 02142 USA

ISBN: (纸本)081945687X

Short-pulse lasers of femtosecond and picosecond durations are used in ultrahigh precision processing of optical, electronic, and micro-mechanical devices. In this paper we discuss the fabrication of high quality photonic crystal bandpass filters with femtosecond laser pulses. We also discuss the parallel processing of inkjet nozzles with a picosecond laser. A laser milling algorithm and a high accuracy beam scanner allows the formation of precisely shaped holes as inkjet nozzles, and an efficient diffractive beam splitter allows the simultaneous drilling of many hundreds of holes for low cost manufacturing.

关键词： ultrafast lasers femtosecond lasers picosecond lasers laser processing parallel processing

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Laser processing of dental hard tissues

Laser processing of dental hard tissues

引用

conference on photon processing in microelectronics and photonics IV

作者： Fried, D Univ Calif San Francisco San Francisco CA 94143 USA

ISBN: (纸本)081945687X

In addition to their use for the painless removal of dental decay, lasers are also well suited to modify the chemical composition of the mineral phase of dental hard tissues in order to render the tissues more resistant to acid dissolution and for the modification of the hard tissue morphology for better adhesion to restorative materials. In this paper the principal applications of lasers for the processing of dental hard tissues are discussed with an emphasis on the influence of an externally applied layer of water. The presence of an optically thick layer of water profoundly influences the phase composition of the laser irradiated tissue surface and the morphology resulting in more efficient ablation, better adhesion and improved resistance to acid dissolution.

关键词： laser ablation dental enamel CO2 laser Er : YAG laser and Er : YSGG laser

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Scope for electric field assisted removal of ablated debris from laser machined features in silicon

Scope for electric field assisted removal of ablated debris ...

引用

conference on photon processing in microelectronics and photonics IV

作者： Coyne, E Mannion, P O'Connor, GM Favre, S Glynn, TJ Analog Devices Inc Limerick Ireland

ISBN: (纸本)081945687X

The problem created by the re-deposition of ablated material when laser machining structures in silicon wafers is investigated. The study focuses on the specific case of machining wafer grade silicon with femtosecond pulses centered at a wavelength of 775 nm. Based on the evidence that a highly ionised plasma state exists immediately after laser ablation, this work explores the potential of using electric fields to channel the debris out of the laser machined feature before it becomes deposited. To this extent the work discusses the step-by-step development of different experimental arrangements, by first evaluating its effects, then identifying its limitations and finally by proposing and investigating potential solutions. It is found that a reduction in the amount of re-deposited debris is observed when a carrier-depleted region is generated in silicon materials.

关键词： laser ablation silicon debris extraction damage throughput electric characterisation assisted processing

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Two-dimensional hexagonally arrayed nanohole fabrication on silicon substrate using a femtosecond laser pulse

Two-dimensional hexagonally arrayed nanohole fabrication on ...

引用

conference on photon processing in microelectronics and photonics IV

作者： Takada, H Obara, M Keio Univ Fac Sci & Technol Dept Elect & Elect Engn Kohoku Ku Yokohama Kanagawa 2238522 Japan

ISBN: (纸本)081945687X

We report a nanohole array fabrication with a particle light enhancement effect using a femtosecond laser pulse. Two-dimensional (2-D) arrayed polystyrene (PS) nanoparticles are deposited on silicon (Si) substrates. Polystyrene spherical particles with diameters of 200, 450, and 820 run are used. We investigated the fabricated nanohole profiles in terms of the particles diameter and irradiated laser fluence. The morphology of the nanoholes is characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The nanohole diameter and depth became larger and deeper as the diameter of used particle or the irradiated laser fluence is increased. The intensity enhancement factor is obtained from the experimental data by comparing the nanohole depths to the ablation rate of the Si surface without particles. The enhanced light intensity between a PS particle and a Si substrate is calculated by the finite difference time domain (FDTD) method. The calculated optical enhancement factor is consistent with the experimental value.

关键词： near-field optics nanostructuring femtosecond laser laser processing ablation Mie scattering

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Pulse duration and energy density influence on laser processing of metals with short and ultra-short pulses

Pulse duration and energy density influence on laser process...

引用

conference on photon processing in microelectronics and photonics IV

作者： Le Harzic, R Breitling, D Sommer, S Föhl, C Valette, S König, K Dausinger, F Audouard, E Univ Stuttgart IFSW D-70569 Stuttgart Germany

ISBN: (纸本)081945687X

Influence of pulse duration on microprocessing of Al is studied. Results show noticeable differences in terms of quality, burr height and remolten or recast matter into micromachined grooves at high fluence regime for 120fs and 4,5 ps pulse duration. At 120 fs experimental results of penetration depth are found to be 2 or 3 times higher than the theoretical optical penetration depth and is lowered to this value with increasing pulse duration. At high fluence regime up to 2 J/cm(2), ablation thresholds are found to be in the range 10 times higher than for the case of 1 J/cm(2). Penetration depths are higher by a factor 10 to 20 than the theoretical optical penetration depth. The ablation rate is nearly constant until 1 ps and then falls down to 2 times lower values and decreases regularly until 4,5 ps. This time is supposed to correspond to a critical pulse width between ultrashort and short regime.

关键词： laser femtosecond picosecond ablation pulse duration energy heat penetration thermal effects

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